Diodes DMTH43M8LPS-13 N-channel enhancement mode mosfet Datasheet

DMTH43M8LPS
Green
40V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET
PowerDI5060-8
Product Summary
Features
BVDSS
RDS(ON) Max
40V
3.3mΩ @ VGS = 10V
5.0mΩ @ VGS = 5V

ID
TC = +25°C
(Note 9)
100A
95A








Description
This new generation N-Channel Enhancement Mode MOSFET is
designed to minimize RDS(ON), yet maintain superior switching
performance.
Mechanical Data
Applications



Rated to +175°C – Ideal for High Ambient Temperature
Environments
100% Unclamped Inductive Switching – Ensures More Reliable
And Robust End Application
Low RDS(ON) – Minimizes On-State Losses
Low Input Capacitance
Fast Switching Speed
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
An Automotive-Compliant Part is Available Under Separate
Datasheet (DMTH43M8LPSQ)


BLDC Motors
DC-DC Converters
Loadswitch



®
Case: PowerDI 5060-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Finish – Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)
PowerDI5060-8
Pin1
Top View
Internal Schematic
Bottom View
S
D
S
D
S
D
G
D
Top View
Pin Configuration
Ordering Information (Note 4)
Part Number
DMTH43M8LPS-13
Notes:
Case
PowerDI5060-8
Packaging
2,500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
D
D
D
PowerDI5060-8
D
D
D
D
D
TH4008LS
TH43M8LS
YY WW
YY WW
S
S
S
G
S
S
S
= Manufacturer’s Marking
TH43M8LS or TH4008LS = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 18 = 2018)
WW = Week Code (01 to 53)
G
PowerDI is a registered trademark of Diodes Incorporated.
DMTH43M8LPS
Document number: DS38751 Rev. 5 - 2
1 of 7
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February 2018
© Diodes Incorporated
DMTH43M8LPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, VGS = 10V (Note 5)
TA = +25°C
TA = +100°C
TC = +25°C
TC = +100°C
Value
40
±20
22
15.5
ID
Unit
V
V
A
Maximum Continuous Body Diode Forward Current (Note 6)
IDM
IS
100
82
350
69
Pulsed Body Diode Forward Current (10µs Pulse, Duty Cycle = 1%)
ISM
350
A
Avalanche Current, L = 1mH
Avalanche Energy, L = 1mH
IAS
EAS
13.2
87
A
mJ
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
Value
2.7
55
83
1.8
-55 to +175
Unit
W
°C/W
W
°C/W
°C
Continuous Drain Current, VGS = 10V (Note 6) (Note 9)
ID
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
A
A
A
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics
TA = +25°C
TC = +25°C
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
40
—
—
—
—
—
—
1
±100
V
μA
nA
VGS = 0V, ID = 1mA
VDS = 32V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
—
2.7
3.6
—
2.5
3.3
5.0
1.2
V
Static Drain-Source On-Resistance
1
—
—
—
VDS = VGS, ID = 250μA
VGS = 10V, ID = 20A
VGS = 5V, ID = 15A
VGS = 0V, IS = 20A
CISS
COSS
CRSS
RG
QG
QG
QGS
QGD
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2,693
1,172
52
2.54
38.5
17.6
6.9
6.9
5.2
5.7
23.5
11
35.4
32.9
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 10V)
Total Gate Charge (VGS = 4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
mΩ
V
Test Condition
pF
VDS = 30V, VGS = 0V,
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDS = 30V, ID = 20A
ns
VDD = 30V, VGS = 10V,
ID = 20A, RG = 3Ω
ns
nC
IF = 20A, di/dt = 100A/μs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.
6. Thermal resistance from junction to soldering point (on the exposed drain pad).
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
9. Package limit.
DMTH43M8LPS
Document number: DS38751 Rev. 5 - 2
2 of 7
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February 2018
© Diodes Incorporated
DMTH43M8LPS
30
50
V GS = 10V
45
40
25
V GS = 4V
V GS = 3.5V
35
ID , DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
)A
(
T
N
E
R
R
U
C
N
I
A
R
D
,D
I
VDS = 5.0V
V GS = 5V
V GS = 3.0V
30
25
20
15
10
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
V GS = 5V
V GS = 10V
R
5
10
15
20
25
I D, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
TA = 125°C
T A = -55°C
6
)D
E
E Z
C IL
R A
U M
O R
S O
-N N
(
I E
A
R C
D N
A
, )N T
OS
I
(S S
D
R E
R
N
O
5
T A = 150°C
TA = 175°C
T A = 125°C
4
T A = 85°C
3.5
3
T A = 25°C
2.5
T A = -55°C
2
1.5
1
0.5
00
5
10
15
20
25
ID , DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DMTH43M8LPS
Document number: DS38751 Rev. 5 - 2
5
25
20
15
I D = 20A
ID = 15A
10
5
4
6
8
10
12 14
16
18
20
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Drain-Source On-Resistance
vs. Gate-Source Voltage
2.2
VGS = 10V
4.5
1
2
3
4
V GS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
30
02
30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( )
TA = 25°C
TA = 85°C
0
0
3
RD S(ON ), DRAIN-SOURCE ON-RESISTANCE ( )
0.5
1
1.5
2
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
S
D
5.5
10
T A = 150°C
V GS = 2.5V
5
)

(
E
C 4.5
N
A
T
S
4
IS
E
R
-N 3.5
O
E
C 3
R
U
O
S 2.5
-N
I
A
R 2
D
, )N
O 1.5
(
1
0
TA = 175°C
15
5
5
0
0
20
30
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2
1.8
1.6
1.4
1.2
VGS = 10V
I D = 20A
VGS = 5V
I D = 15A
1
0.8
0.6
0.4
-50 -25 0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (C)
Figure 6 On-Resistance Variation with Temperature
February 2018
© Diodes Incorporated
2.5
8
VGS(th ), GATE THRESHO LD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMTH43M8LPS
7
6
VGS = 5V, ID = 15A
5
4
3
2
VGS = 10V, ID = 20A
1
2
I D = 1mA
1.5
ID = 250µA
1
0.5
0
-50
-25
0
25
50
75
0
-50
100 125 150 175
-25 0
25 50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (C)
Figure
8 Gate
Variation
vs. Ambient
Temperature
Figure
8 Threshold
Gate Threshold
Variation
vs. Temperature
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
10000
30
f = 1MHz
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
I S, SOURCE CURRENT (A)
25
20
T A = 175°C
15
T A = 150°C
T A = 25°C
T A = 125°C
10
T A = -55°C
TA = 85°C
Ciss
Coss
1000
100
Crss
5
10
00
0
5
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
10
15
20
25
30
35
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
1000
10
RDS(ON) LIMITED
9
ID, DRAIN CURRENT (A)
8
7
VGS (V)
6
5
4
VDS = 20V, ID = 20A
3
100
PW=1µs
PW=100µs
PW=1ms
1
2
1
0.1
0
0
5
10
15
20
25
30
35
40
Document number: DS38751 Rev. 5 - 2
TJ(MAX)=175℃
TC=25℃
Single Pulse
DUT on infinite
heatsink
VGS=10V
0.1
PW=10ms
PW=100ms
PW=1s
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
Qg (nC)
Figure 11. Gate Charge
DMTH43M8LPS
PW=10µs
10
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DMTH43M8LPS
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
0.001
0.000001
D = 0.01
D = 0.005
D = Single Pulse
R JC(t) = r(t) * RJC
R JC = 1.8°C/W
Duty Cycle, D = t1/ t2
0.00001
DMTH43M8LPS
Document number: DS38751 Rev. 5 - 2
0.0001
0.001
0.01
0.1
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
5 of 7
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10
February 2018
© Diodes Incorporated
DMTH43M8LPS
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
D
Detail A
D1
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
M1
Detail A
L1
G
b3 (4X)
PowerDI5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
—
b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51
—
—
L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
θ
10°
12°
11°
θ1
6°
8°
7°
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
DMTH43M8LPS
Document number: DS38751 Rev. 5 - 2
G
Y(4x)
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Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
February 2018
© Diodes Incorporated
DMTH43M8LPS
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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Copyright © 2018, Diodes Incorporated
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DMTH43M8LPS
Document number: DS38751 Rev. 5 - 2
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February 2018
© Diodes Incorporated
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