ON LC75812PT-8565-H Duty dot matrix lcd controller / driver Datasheet

LC75812PT
1/8, 1/9-Duty Dot Matrix
LCD Controller / Driver
with Key Input Function
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Overview
The LC75812PT is 1/8, 1/9 duty dot matrix LCD display controllers/drivers
that support the display of characters, numbers, and symbols. In addition to
generating dot matrix LCD drive signals based on data transferred serially
from a microcontroller, the LC75812PT also provide on-chip character
display ROM and RAM to allow display systems to be implemented easily.
These products also provide up to 3 general-purpose output ports and
incorporate a key scan circuit that accepts input from up to 35 keys to reduce
printed circuit board wiring.
Features
Key input function for up to 35 keys
(A key scan is performed only when a key is pressed.)
Controls and drives a 57 or 58 dot matrix LCD.
Supports accessory display segment drive (up to 65 segments)
Display technique: 1/8 duty 1/4 bias drive (57 dots)
1/9 duty 1/4 bias drive (58 dots)
Display digits: 13 digits1 line (57 dots), 12 digits1 line (58 dots)
Display control memory
CGROM: 240 characters (57 or 58 dots)
CGRAM: 16 characters (57 or 58 dots)
ADRAM: 135 bits
DCRAM: 528 bits
Instruction function
Display on/off control
Display shift function
Sleep mode can be used to reduce current drain.
Built-in display contrast adjustment circuit
Switching between key scan output and general-purpose output ports can be
controlled with instructions.
PWM output for adjusting the LED backlight brightness
The frame frequency of the common and segment output waveforms can be
controlled by instructions.
Serial data control of switching between the RC oscillator operating mode
and external clock operating mode.
Independent LCD driver block power supply VLCD
A voltage detection type reset circuit is provided to initialize the IC and
prevent incorrect display.
The INH pin is provided. This pin turns off the display, disables key
scanning, and forces the general-purpose output ports to the low level.
RC oscillator circuit
TQFP100 14x14 / TQFP100
* Computer Control Bus (CCB) is an ON Semiconductor’s original bus format and
the bus addresses are controlled by ON Semiconductor.
ORDERING INFORMATION
See detailed ordering and shipping information on page 55 of this data sheet.
© Semiconductor Components Industries, LLC, 2017
June 2017 - Rev. 1
1
Publication Order Number :
LC75812PT/D
LC75812PT
Specifications
Absolute Maximum Ratings at Ta = 25C, VSS = 0 V
Parameter
Maximum supply voltage
Symbol
Conditions
Ratings
Unit
VDD max
VDD
0.3 to +4.2
VLCD max
VLCD
0.3 to +11.0
VIN1
CE, CL, DI, INH
Input voltage
V
0.3 to +4.2
CE, CL, DI, INH
0.3 to +6.5
VDD=2.7 to 3.6V
V
0.3 to VDD +0.3
0.3 to VLCD +0.3
VIN2
OSC, KI1 to KI5, TEST
VIN3
VLCD1, VLCD2, VLCD3, VLCD4
VOUT1
VOUT2
OSC, KS1 to KS7, P1 to P3
VOUT3
VLCD0, S1 to S65, COM1 to COM9
IOUT1
S1 to S65
IOUT2
COM1 to COM9
3
IOUT3
KS1 to KS7
1
IOUT4
P1 to P3
5
Allowable power
dissipation
Pd max
Ta = 85C
Operating temperature
Topr
40 to +85
C
Storage temperature
Tstg
55 to +125
C
Output voltage
Output current
DO
-0.3 to +6.5
0.3 to VDD +0.3
V
0.3 to VLCD +0.3
300
200
A
mA
mW
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Allowable Operating Range at Ta = 40C to +85C, VSS = 0 V
Parameter
Supply voltage
Symbol
Conditions
VDD
VDD
VLCD
Output voltage
VLCD0
VLCD
When the display contrast adjustment
circuit is used.
VLCD
When the display contrast adjustment
circuit is not used.
VLCD0
Input voltage
VLCD1
VLCD1
VLCD2
VLCD3
Input high level voltage
Input low level voltage
VLCD4
VIH1
VIH2
VIH3
VIL1
VIL2
Ratings
min
typ
max
2.7
3.6
7.0
10.0
unit
V
4.5
10.0
VLCD4
+4.5
VLCD
VLCD2
VLCD3
3/4
(VLCD0
VLCD4)
VLCD0
2/4
(VLCD0
VLCD4)
VLCD0
1/4
(VLCD0
VLCD4)
VLCD0
VLCD4
CE, CL, DI, INH
0
0.8VDD
1.5
CE, CL, DI, INH
VDD = 2.7 to 3.6 V
OSC external clock operating mode
KI1 to KI5
0.8VDD
5.5
0.8VDD
0.6VDD
VDD
VDD
CE, CL, DI, INH, KI1 to KI5
OSC external clock operating mode
0
0.2VDD
0
0.2VDD
V
V
3.6
V
V
Continued on next page.
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LC75812PT
Continued from preceding page.
Parameter
Symbol
Output pull-up voltage
Recommended external
resistor for RC oscillation
Recommended external
capacitor for RC
oscillation
Guaranteed range of RC
oscillation
External clock operating
frequency
External clock duty cycle
Data setup time
Data hold time
CE wait time
CE setup time
CE hold time
High level clock pulse
width
Low level clock pulse
width
DO output delay time
VOUP
Rosc
DO
OSC RC oscillator operating mode
Cosc
OSC RC oscillator operating mode
Ratings
typ
min
0
fosc
OSC RC oscillator operating mode
fCK
OSC external clock operating mode [Figure 4]
DCK
tds
tdh
tcp
tcs
tch
tH
OSC external clock operating mode [Figure 4]
CL, DI
[Figure 2],[Figure 3]
CL, DI
[Figure 2],[Figure 3]
CE, CL
[Figure 2],[Figure 3]
CE, CL
[Figure 2],[Figure 3]
CE, CL
[Figure 2],[Figure 3]
CL
[Figure 2],[Figure 3]
tL
CL
tdc
DO RPU = 4.7 kΩ CL = 10 pF *1
[Figure 2],[Figure 3]
DO RPU = 4.7 kΩ CL = 10 pF *1
[Figure 2],[Figure 3]
tdr
DO rise time
Conditions
[Figure 2],[Figure 3]
max
5.5
unit
V
10
kΩ
470
pF
150
300
600
kHz
100
300
600
kHz
30
160
160
160
160
160
50
70
%
ns
ns
ns
ns
ns
160
ns
160
ns
1.5
s
1.5
s
Note: *1. Since the DO pin is an open-drain output, these times depend on the values of the pull-up resistor RPU and the
load capacitance CL.
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
Electrical Characteristics for the Allowable Operating Ranges
Parameter
Symbol
Hysteresis
VH
Power-down
detection voltage
Input high level
current
VDET
IIH1
Pins
Conditions
Ratings
typ
min
CE, CL, DI, INH,
KI1 to KI5
0.1VDD
2.0
CE, CL, DI, INH
VI = 3.6 V
VI = 5.5 V
VDD = 2.7 to 3.6 V
VI = VDD external
clock operating mode
VI = 0 V
2.4
5.0
OSC
Input low level
current
IIL1
IIL2
CE, CL, DI, INH
OSC
Input floating
voltage
Pull-down
resistance
Output off leakage
current
Output high level
voltage
VIF
KI1 to KI5
RPD
KI1 to KI5
VDD = 3.3 V
IOFFH
DO
VO = 5.5 V
VOH1
S1 to S65
IO = 20 A
VOH2
COM1 to COM9
IO = 100 A
VLCD00.6
VLCD00.6
VOH3
KS1 to KS7
IO = 250 A
VDD0.8
VOH4
VOL1
P1 to P3
IO = 1 mA
VDD0.9
S1 to S65
IO = 20 A
VOL2
COM1 to COM9
IO = 100 A
VOL3
KS1 to KS7
VOL4
VOL5
P1 to P3
DO
IO = 12.5 A
IO = 1 mA
IO = 1 mA
VI = 0 V external clock
operating mode
2.2
V
V
5.0
IIH2
Output low level
voltage
unit
max
A
5.0
5.0
A
5.0
50
100
VDD0.4
0.05VDD
V
250
kΩ
6.0
A
VDD0.1
V
VLCD4+0.6
VLCD4+0.6
0.1
0.4
1.2
0.1
0.9
0.3
V
Continued on next page.
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LC75812PT
Continued from preceding page.
Parameter
Output middle level
voltage *2
Symbol
Pins
Conditions
VMID1
S1 to S65
IO = 20 A
VMID2
COM1 to COM9
IO = 100 A
COM1 to COM9
IO = 100 A
Oscillator frequency
fosc
OSC
Current drain
IDD1
IDD2
VDD
VDD
ILCD1
ILCD2
VLCD
VLCD
Rosc = 10 k,
Cosc = 470 pF
sleep mode
VDD = 3.6 V, output open,
fosc = 300 kHz
sleep mode
VLCD = 10.0 V, output
open,
fosc = 300 kHz, When the
display contrast
adjustment circuit is used.
VLCD = 10.0 V, output
open,
fosc = 300 kHz, When the
display contrast
adjustment circuit is not
used.
VLCD
Ratings
typ
2/4
(VLCD0
VLCD4)
0.6
3/4
(VLCD0
VLCD4)
0.6
1/4
(VLCD0
VLCD4)
0.6
VMID3
ILCD3
min
210
unit
max
2/4
(VLCD0
VLCD4)
+0.6
3/4
(VLCD0
VLCD4)
+0.6
1/4
(VLCD0
VLCD4)
+0.6
300
390
V
kHz
100
500
1000
15
450
900
200
400
A
Note: *2. Excluding the bias voltage generation divider resistor built into the VLCD0, VLCD1, VLCD2, VLCD3, and
VLCD4. (See Figure 1.)
VLCD
CONTRAST
ADJUSTER
VLCD0
VLCD1
To the common and segment drivers
VLCD2
VLCD3
VLCD4
Excluding these resistors
[Figure 1]
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
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LC75812PT
(1) When CL is stopped at the low level
    
tcs
tcp
 
DI VIH1
VIL1
tdc
tdh
tds
VIL1
 
tL
tH
VIH1
CL 50%
VIL1

VIH1
CE
DO
tdr
D1

D0
tch
[Figure 2]

(2) When CL is stopped at the high level
VIH1
VIL1

CE

VIH1
50%
VIL1
tcp
tcs
VIH1
DI
VIL1
tds
tdh
DO
D0
D1
tdc
tch
   
tH
    
tL
CL
tdr
[Figure 3]
(3) OSC pin clock timing in external clock operating mode
OSC
VIH2
50%
VIL2
tCKH
tCKL
fCK=
1
tCKH + tCKL
DCK=
t
[Figure 4]
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5
[kHz]
tCKH
100[%]
CKH + tCKL
LC75812PT
Package Dimensions
unit : mm
TQFP100 14x14 / TQFP100
CASE 932AY
ISSUE A
0.50.2
16.00.2
16.00.2
100
14.00.1
14.00.1
1 2
0.5
0.125
0.2
0.10
(1.0)
0 to 10 
0.10.1
1.2 MAX
(1.0)
0.10
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
15.40
XXXXXXXX
YMDDD
15.40
(Unit: mm)
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
0.50
0.28
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
LC75812PT
KS2/P2
KS1/P1
COM1
COM2
COM3
COM4
COM5
COM6
COM7
COM8
S65/COM9
S64
S63
S62
S61
S60
S59
S58
S57
S56
S55
S54
S53
S52
S51
Pin Assignments
75
50
LC75812PT
(TQFP100)
100
26
1
S50
S49
S48
S47
S46
S45
S44
S43
S42
S41
S40
S39
S38
S37
S36
S35
S34
S33
S32
S31
S30
S29
S28
S27
S26
25
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
S17
S18
S19
S20
S21
S22
S23
S24
S25
KS3
KS4
KS5
KS6
KI1
KI2
KI3
KI4
KI5
P3/KS7
VDD
VLCD
VLCD0
VLCD1
VLCD2
VLCD3
VLCD4
VSS
TEST
OSC
INH
DO
CE
CL
DI
51
76
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Top view
LC75812PT
VDD
VDET
S1
S63
S64
S65/COM9
COM8
COM1
Block Diagram
COMMON
DRIVER
SEGMENT DRIVER
LATCH
VSS
TEST
INSTRUCTION
DECODER
ADRAM
65
bits
INSTRUCTION
REGISTER
ADDRESS
COUNTER
VLCD
CONTRAST
ADJUSTER
VLCD0
CGRAM
5816
bits
CGROM
58240
bits
DCRAM
528
bits
VLCD1
ADDRESS
REGISTER
VLCD2
VLCD3
VLCD4
SHIFT REGISTER
CCB INTERFACE
KEY BUFFER
TIMING
GENERATOR
GENERAL
PURPOSE
PORT
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P1/KS1
P2/KS2
KS4
KS3
KS5
KS6
P3/KS7
KI1
KI2
KI3
KI4
KI5
CE
CL
DO
DI
KEY SCAN
INH
OSC
CLOCK
GENERATOR
LC75812PT
Pin Functions
Pin
Pin No.
S1 to S64
1 to 64
S65/COM9
65
Function
Handling
Active
I/O
-
O
OPEN
-
O
OPEN
-
O
OPEN
H
I
GND
-
I/O
VDD
H
I
when unused
Segment driver outputs.
S65/COM9 can be used as common driver output pin under the
"set display technique" instruction.
COM1 to COM8
73 to 66
Common driver outputs.
KS1/P1
74
Key scan outputs. Although normal key scan timing lines require
KS2/P2
75
diodes to be inserted in the timing lines to prevent shorts, since
KS3 to KS6
76 to 79
these outputs are unbalanced CMOS transistor outputs, these
KS7/P3
85
outputs will not be damaged by shorting when these outputs are
used to form a key matrix.
KS1/P1, KS2/P2, and KS7/P3 can be used as general-purpose
output ports under the "set key scan output port/general-purpose
output port state" instruction.
KI1 to KI5
80 to 84
Key scan inputs.
These pins have built-in pull-down resistors.
OSC
95
Oscillator connections. An oscillator circuit is formed by
connecting an external resistor and capacitor to this pin.
This pin can also be used as the external clock input pin with the
"set display technique" instruction.
CE
98
CL
99
DI
100
DO
97
INH
96
Serial data interface connections to the controller. Note that DO,
being an open-drain output, requires a pull-up resistor.
I
CE: Chip enable
CL: Synchronization clock
GND
-
I
-
O
OPEN
L
I
VDD
-
I
-
-
O
OPEN
-
I
OPEN
-
I
OPEN
DI: Transfer data
DO: Output data
Input that turns the display off, disables key scanning, and
forces the general-purpose output ports low.
When INH is low (VSS):
Display off
S1 to S64=”L” (VLCD4)
S65/COM9=”L” (VLCD4)
COM1 to COM8=”L” (VLCD4)
General-purpose output ports P1 to P3=low (VSS)
Key scanning disabled: KS1 to KS7=low (VSS)
All the key data is reset to low.
When INH is high (VDD):
Display on
The state of the pins as key scan output pins or
general-purpose output ports can be set with the
"set key scan output port/general-purpose output
port state" instruction.
Key scanning is enabled.
However, serial data can be transferred when the INH pin is low.
TEST
94
This pin must be connected to ground.
VLCD0
88
LCD drive 4/4 bias voltage (high level) supply pin. The level on this
pin can be changed by the display contrast adjustment circuit.
However, (VLCD0 - VLCD4) must be greater than or equal to 4.5V.
Also, external power must not be applied to this pin since the pin
circuit includes the display contrast adjustment circuit.
VLCD1
89
LCD drive 3/4 bias voltage (middle level) supply pin. This pin can
be used to supply the 3/4 (VLCD - VLCD4) voltage level externally.
VLCD2
90
LCD drive 2/4 bias voltage (middle level) supply pin. This pin can
be used to supply the 2/4 (VLCD0 - VLCD4) voltage level
externally.
Continued on next page.
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9
LC75812PT
Continued from preceding page.
Pin
Pin No.
VLCD3
91
Function
Handling
Active
I/O
-
I
OPEN
-
I
GND
-
-
-
-
-
-
-
-
-
when unused
LCD drive 1/4 bias voltage (middle level) supply pin. This pin can
be used to supply the 1/4 (VLCD0 - VLCD4) voltage level
externally.
VLCD4
92
LCD drive 0/4 bias voltage (low level) supply pin. Fine
adjustment of the display contrast can be implemented by
connecting an external variable resistor to this pin.
However, (VLCD0 - VLCD4) must be greater than or equal to 4.5V,
and VLCD4 must be in the range 0V to 1.5V, inclusive.
VDD
86
Logic block power supply connection. Provide a voltage of
between 2.7 to 3.6V.
VLCD
87
LCD driver block power supply connection. Provide a voltage of
between 7.0 to 10.0V when the display contrast adjustment circuit
is used and provide a voltage of between 4.5 to 10.0V when the
circuit is not used.
VSS
Power supply connection. Connect to ground.
93
Block Functions
AC (address counter)
AC is a counter that provides the addresses used for DCRAM and ADRAM.
The address is automatically modified internally, and the LCD display state is retained.
DCRAM (data control RAM)
DCRAM is RAM that is used to store display data expressed as 8-bit character codes. (These character codes are
converted to 57 or 58 dot matrix character patterns using CGROM or CGRAM.) DCRAM has a capacity of
528 bits, and can hold 52 characters. The table below lists the correspondence between the 6-bit DCRAM address
loaded into AC and the display position on the LCD panel.
When the DCRAM address loaded into AC is 00H.
Display digit
1
2
3
4
5
6
7
8
9
10
11
12
13
DCRAM address (hexadecimal)
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
However, when the display shift is performed by specifying MDATA, the DCRAM address shifts as shown below.
Display digit
1
2
3
4
5
6
7
8
9
10
11
12
13
DCRAM address (hexadecimal)
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
Display digit
1
2
3
4
5
6
7
8
9
10
11
12
13
DCRAM address (hexadecimal)
33
00
01
02
03
04
05
06
07
08
09
0A
0B
Note: *3. The DCRAM address is expressed in hexadecimal.
Most significant bit

MSB
Least significant bit

LSB
DCRAM address
DA0
DA1
DA2
DA3
Hexadecimal
DA4
DA5
Hexadecimal
Example: When the DCRAM address is 2EH.
DA0
DA1
DA2
DA3
DA4
DA5
0
1
1
1
0
1
Note: *4. 57 dots ·········· 13th digit display 57 dots
58 dots ·········· 13th digit display 48 dots
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10
(shift left)
(shift right)
LC75812PT
ADRAM (Additional data RAM)
ADRAM is RAM that is used to store the ADATA display data. ADRAM has a capacity of 135 bits, and the stored
display data is displayed directly without the use of CGROM or CGRAM. The table below lists the correspondence
between the 4-bit ADRAM address loaded into AC and the display position on the LCD panel.
When the ADRAM address loaded into AC is 0H. (Number of digit displayed: 13)
Display digit
1
2
3
4
5
6
7
8
9
10
11
12
13
ADRAM address (hexadecimal)
0
1
2
3
4
5
6
7
8
9
A
B
C
However, when the display shift is performed by specifying ADATA, the ADRAM address shifts as shown below.
Display digit
1
2
3
4
5
6
7
8
9
10
11
12
13
ADRAM address (hexadecimal)
1
2
3
4
5
6
7
8
9
A
B
C
0
Display digit
1
2
3
4
5
6
7
8
9
10
11
12
13
ADRAM address (hexadecimal)
C
0
1
2
3
4
5
6
7
8
9
A
B
(shift left)
(shift right)
Note: *5. The ADRAM address is expressed in hexadecimal.
Least significant bit

LSB
ADRAM address
RA0
RA1
Most significant bit

MSB
RA2
RA3
Hexadecimal
Example: When the ADRAM address is AH.
RA0
RA1
RA2
RA3
0
1
0
1
Note: *6. 57 dots ··········· 13th digit display 5 dots
58 dots ··········· 13th digit display 4 dots
CGROM (Character generator ROM)
CGROM is ROM that is used to generate the 240 kinds of 57 or 58 dot matrix character patterns from the
8-bit character codes. CGROM has a capacity of 24040 bits. When a character code is written to DCRAM, the
character pattern stored in CGROM corresponding to the character code is displayed at the position on the LCD
corresponding to the DCRAM address loaded into AC.
CGRAM (Character generator RAM)
CGRAM is RAM to which user programs can freely write arbitrary character patterns. Up to 16 kinds of 57 or 58
dot matrix character patterns can be stored. CGRAM has a capacity of 1640 bits.
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11
LC75812PT
Serial Data Input
(1) When CL is stopped at the low level
CE
CL
DI
0
1
0
0
0
0
1
0
B0
B1
B2
B3
A0
A1
A2
A3
D0
D1 D2 D3 D4
D118 D119
Instruction data (Up to 120 bits)
DO
(2) When CL is stopped at the high level
CE
CL
DI
0
B0
1
B1
0
B2
0
B3
0
A0
0
A1
1
A2
0
A3
D0 D1 D2 D3 D4
D118 D119
Instruction data (Up to 120 bits)
DO
B0 to B3, A0 to A3: CCB address 42H
D0 to D119: Instruction data
The data is acquired on the rising edge of the CL signal and latched on the falling edge of the CE signal. When
transferring instruction data from the microcontroller, applications must assure that the time from the transfer of one set
of instruction data until the next instruction data transfer is significantly longer than the instruction execution time.
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12
13
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Notes:
… CD1…CD16
D0…D56…D71
W10…W15 W20 W21
CD17 … CD24
D72…D77 D78 D79
W22…W25…W33
CD25 … CD32
D80…D85 D86 D87
W34 W35 PC10…PC31
CD33 … CD40
D88…D93 D94 D95
X
X
X
X
X
X
X
X
X
X
PC32 PF0 PF1 PF2 PF3 KC1 KC2 KC3
X
AD1 AD2 AD3 AD4 AD5
AC0 AC1 AC2 AC3 AC4 AC5 AC6 AC7
DG1 DG2 DG3 DG4 DG5 DG6 DG7 DG8
D96 D97 D98 D99 D100 D101 D102 D103
X
X
X
X
X
X
X
X
X
X
X
X
X
X
KC4 KC5 K C6 K C7 KP1 KP 2 KP3
CT0 CT1 CT2 CT3
X
X
CA0 CA1 CA2 CA3 CA4 CA5 CA6 CA7
RA0 RA1 RA2 RA3
DA0 DA1 DA2 DA3 DA4 DA5
DA0 DA1 DA2 DA3 DA4 DA5
DG9 DG10 DG11 DG12 DG13
0
X
X
X
CTC X
X
IM1 IM2
IM1 IM2
X
X
X
X
X
X
X
X
X
X
1
1
0
0
0
0
SP
RA0 RA1 RA2 RA3
R/L
SC
0
A
A
0
0
0
1
1
1
1
0
0
0
1
0
1
0
1
0
1
0
1
27s
300
= 39s, 108s 300 = 155s, tis 300 = ti1.43s
210
210
210
0s
0s
27s
*10
27s/tis
*9
27s/tis
27s
27s
*8
0s/27s
108s *7
0s/
*11
Execution time
X: don't care
0
0
1
1
0
0
1
1
0
D116 D117 D118 D119
X
M
M
DT FC0 FC1 OC
D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115
*7. Be sure to execute the "set display technique" instruction first after power-on (VDET-based system reset). Note that the execution time of this first instruction is 108s
(fosc=300kHz, fCK=300kHz).
*8.When the sleep mode (SP = 1) is set, the execution time is 27s (when fosc = 300kHz, fCK = 300kHz).
*9. The data format differs when the DCRAM data write instruction is executed in the normal increment mode (IM1=1, IM2=0) or in the super increment mode (IM1=0, IM2=1).
Note that the execution time for the DCRAM data write instruction executed in the super increment mode is tis (fosc=300kHz, fCK=300kHz).
(See the detailed descriptions.)
*10. The data format differs when the ADRAM data write instruction is executed in the normal increment mode (IM1=1, IM2=0) or in the super increment mode
(IM1=0, IM2=1). Note that the execution time for the ADRAM data write instruction executed in the super increment mode is tis (fosc=300kHz, fCK=300kHz).
(See the detailed descriptions.)
*11. The execution times listed here apply when fosc=300kHz, fCK=300kHz. The execution times differ when the oscillator frequency fosc or the external
clock frequency fCK differs.
Example: When fosc = 210kHz, fCK = 210kHz
Set key scan output port/
general-purpose
output port state
contrast
Set display
write
CGRAM data
write *10
ADRAM data
write *9
DCRAM data
address
Set AC
Display shift
Display on/off
control
*7
Set display technique
Instruction
Instruction Table
LC75812PT
LC75812PT
Detailed Instruction Descriptions
Set display technique ... <Sets the display technique>
(Display technique)
Note: Be sure to execute the "set display technique"
instruction first after power-on (VDET-based
system reset).
Code
D112
D113 D114
D115
DT
FC0 FC1
OC
D116 D117 D118 D119
0
0
0
1
X: don’t care
DT: Sets the display technique
Output pins
DT
Display technique
0
1/8 duty, 1/4 bias drive
S65
1
1/9 duty, 1/4 bias drive
COM9
S65/COM9
Note: *12. S65: Segment output
COM9: Common output
FC0, FC1: Sets the frame frequency of the common and segment output waveforms
Frame frequency
FC0
FC1
1/8 duty, 1/4 bias drive
1/9 duty, 1/4 bias drive
f8[Hz]
f9[Hz]
0
0
fosc/3072, fCK/3072
fosc/3456, fCK/3456
1
0
fosc/1536, fCK/1536
fosc/1728, fCK/1728
0
1
fosc/768, fCK/768
fosc/864, fCK/864
OC: Sets the RC oscillator operating mode and external clock operating mode.
OC
OSC pin function
0
RC oscillator operating mode
1
External clock operating mode
Note: *13. When selecting the RC oscillator operating mode, be sure to connect an external resistor Rosc and an
external capacitor Cosc to the OSC pin.
Display on/off control ... <Turns the display on or off>
(Display ON/OFF control)
Code
D96 D97 D98 D99 D100 D101 D102 D103 D104 D105 D106 D107 D108
DG1 DG2 DG3 DG4 DG5
DG6
DG7
DG8
D109 D110 D111 D112 D113 D114 D115
DG9 DG10 DG11 DG12 DG13
X
X
X
M
A
SC
D116 D117 D118 D119
SP
0
0
1
0
X: don’t care
M, A: Specifies the data to be turned on or off
M
A
Display operating state
0
0
Both MDATA and ADATA are turned off (The display is forcibly turned off regardless of the DG1 to DG13 data.)
0
1
Only ADATA is turned on (The ADATA of display digits specified by the DG1 to DG13 data are turned on.)
1
0
1
1
Only MDATA is turned on (The MDATA of display digits specified by the DG1 to DG13 data are turned on.)
Both MDATA and ADATA are turned on
(The MDATA and ADATA of display digits specified by the DG1 to DG13 data are turned on.)
Note: *14. MDATA, ADATA
57 dot matrix display
----- ADATA
--- MDATA
58 dot matrix display
----- ADATA
--- MDATA
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14
LC75812PT
DG1 to DG13: Specifies the display digit
Display digit
1
2
3
4
5
6
7
8
9
10
11
12
13
Display digit data
DG1
DG2
DG3
DG4
DG5
DG6
DG7
DG8
DG9
DG10
DG11
DG12
DG13
For example, if DG1 to DG7 are 1, and DG8 to DG13 are 0, then display digits 1 to 7 will be turned on, and display
digits 8 to 13 will be turned off (blanked).
SC: Controls the common and segment output pins
SC
Common and segment output pin states
0
Output of LCD drive waveforms
1
Fixed at the VLCD4 level (all segments off)
Note: *15. When SC is 1, the S1 to S65 and COM1 to COM9 output pins are set to the VLCD4 level,
regardless of the M, A, and DG1 to DG13 data.
SP: Controls the normal mode and sleep mode
SP
Mode
0
Normal mode
Sleep mode
The common and segment pins go to the VLCD4 level and the oscillator on the OSC pin is stopped (although it operates during
key scan operations) in RC oscillator operating mode (OC="0") and reception of the external clock is stopped (external clock is
received during key scan operations) in external clock operating mode (OC="1"), to reduce current drain.
Although the "display on/off control", "set display contrast" and "set key scan output port/general-purpose output port state"
1
(disallowed to set pins P1 to P3 for PWM signal output and pin P3 for clock signal output) instructions can be executed in this
mode, applications must return the IC to normal mode to execute any of the other instruction setting. When the IC is in external
clock operating mode, be sure to stop the external clock input after the lapse of the instruction execution time (27s:
fCK=300kHz).
Display shift ... <Shifts the display>
(Display shift)
Code
D112
D113
D114
D115
D116
D117
D118
D119
M
A
R/L
X
0
0
1
1
X: don’t care
M, A: Specifies the data to be shifted
M
A
0
0
Shift operating state
Neither MDATA nor ADATA is shifted
0
1
Only ADATA is shifted
1
0
Only MDATA is shifted
1
1
Both MDATA and ADATA are shifted
R/L: Specifies the shift direction
R/L
Shift direction
0
Shift left
1
Shift right
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15
LC75812PT
Set AC address... <Specifies the DCRAM and ADRAM address for AC>
(Set AC)
Code
D104
D105
D106
D107
D108
D109
D110
D111
D112
D113
D114
D115
D116
D117
D118
D119
DA0
DA1
DA2
DA3
DA4
DA5
X
X
RA0
RA1
RA2
RA3
0
1
0
0
X: don’t care
DA0 to DA5: DCRAM address
DA0
DA1
DA2
DA3
DA4
LSB

Least significant bit
DA5
MSB

Most significant bit
RA0 to RA3: ADRAM address
RA0
RA1
RA2
LSB

Least significant bit
RA3
MSB

Most significant bit
This instruction loads the 6-bit DCRAM address DA0 to DA5 and the 4-bit ADRAM address RA0 to RA3 into the AC.
DCRAM data write ... <Specifies the DCRAM address and stores data at that address>
(Write data to DCRAM)
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AC0
AC1
AC2
AC3
AC4
AC5
AC6
AC7
DA0
DA1
DA2
DA3
DA4
DA5
X
X
IM1
IM2
X
X
0
1
0
X: don’t care
DA0 to DA5: DCRAM address
DA0
DA1
DA2
DA3
LSB

Least significant bit
DA4
DA5
MSB

Most significant bit
AC0 to AC7: DCRAM data (character code)
AC0
AC1
AC2
LSB

Least significant bit
AC3
AC4
AC5
AC6
AC7
MSB

Most significant bit
This instruction writes the 8 bits of data AC0 to AC7 to DCRAM. This data is a character code, and is converted to a
57 or 58 dot matrix display data using CGROM or CGRAM.
IM1, IM2: Sets the method of writing data to DCRAM
IM1
IM2
0
0
Normal DCRAM data write (Specifies the DCRAM address and writes the DCRAM data.)
DCRAM data write method
1
0
Normal increment mode DCRAM data write (Increments the DCRAM address by +1 each time data is written to DCRAM.)
0
1
Super increment mode DCRAM data write (Writes 2 to 13 characters of DCRAM data in single operation.)
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16
1
LC75812PT
Notes: *16.
DCRAM data write method when IM1 = 0, IM2 = 0
CE
CCB address
CCB address
DI
CCB address
CCB address
(1)
(1)
(1)
(1)
24 bit
24 bit
24 bit
24 bit
DCRAM
Instruction
Instruction
Instruction
execution time
execution time
execution time
(27s)
DCRAM data (27s)
DCRAM data (27s)
write finishes
write finishes
Instruction
execution time
(27s)
DCRAM data
DCRAM data
write finishes
write finishes
DCRAM data write method when IM1 = 1, IM2 = 0
(Instructions other than the “DCRAM data write” instruction cannot be executed.)
CE
CCB address
DI
CCB address
CCB address
CCB address
CCB address
(2)
(3)
(3)
(3)
24 bit
8 bit
8 bit
8 bit
CCB address
(4)
(3)
8 bit
16 bit
DCRAM
Instruction
execution time
(27s)
DCRAM data
write finishes
Instruction
Instruction
Instruction
Instruction
Instruction
execution time
execution time
execution time
execution time
execution time
(27s)
(27s)
(27s)
(27s)
(27s)
DCRAM data
DCRAM data
DCRAM data
DCRAM data
write finishes
write finishes
write finishes
write finishes
DCRAM data
write finishes
Instructions other than the “DCRAM data write” instruction
cannot be executed.
DCRAM data write method when IM1 = 0, IM2 = 1
CE
CCB address
DI
CCB address
CCB address
(5)
(5)
(5)
n bit
n bit
n bit
DCRAM
Instruction
execution time
(tis)
DCRAM data
write finishes
Instruction
execution time
(tis)
DCRAM data
write finishes
Instruction
execution time
(tis)
DCRAM data
write finishes
ti=13.5s×( n -1)
8
(n=8m+16, m is an integer between 2 and 13 that is the number of characters written as DCRAM data.)
For example
When n= 32 bits (m=2): ti= 40.5s (fosc=300kHz, fCK=300kHz)
When n= 80 bits (m=8) : ti=121.5s (fosc=300kHz, fCK=300kHz)
When n=120 bits (m=13): ti=189.0s (fosc=300kHz, fCK=300kHz)
Note that the instruction execution time of 27s and ti values in s apply when fosc=300kHz and fCK=300kHz, and
that these execution times will differ when the CR oscillator frequency fosc and external clock frequency fCK differ.
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17
LC75812PT
Data format at (1) (24 bits)
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AC0
AC1
AC2
AC3
AC4
AC5
AC6
AC7
DA0
DA1
DA2
DA3
DA4
DA5
X
X
0
0
X
X
0
1
0
1
X: don’t care
Data format at (2) (24 bits)
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AC0
AC1
AC2
AC3
AC4
AC5
AC6
AC7
DA0
DA1
DA2
DA3
DA4
DA5
X
X
1
0
X
X
0
1
0
1
X: don’t care
Data format at (3) (8 bits)
Code
D112 D113 D114 D115 D116 D117 D118 D119
AC0
AC1
AC2
AC3
AC4
AC5
AC6
AC7
Data format at (4) (16 bits)
Code
D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AC0
AC1
AC2
AC3
AC4
AC5
AC6
AC7
0
0
X
X
0
1
0
1
Data format at (5) (n bit)
Code
Dz+1 Dz+2 Dz+3 Dz+4 Dz+5 Dz+6 Dz+7

AC01 AC11 AC21 AC31 AC41 AC51 AC61 AC71

Dz
D88
D89
D90
D91
D92
D93
D94
D95
AC0m-1 AC1m-1 AC2m-1 AC3m-1 AC4m-1 AC5m-1 AC6m-1 AC7m-1
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AC0m AC1m AC2m AC3m AC4m AC5m AC6m AC7m DA0 1 DA11 DA21 DA31 DA41 DA51
X
X
0
1
X
X
0
1
0
1
X: don’t care
Here, n=8m+16, z=104-8m (m is an integer between 2 and 13 that is the number of characters written as DCRAM data.)
Correspondence between the DCRAM address and the DCRAM data
DCRAM address
DCRAM data
DA01 to DA51
AC01 to AC71
(DA01 to DA51)+1
AC02 to AC72
(DA01 to DA51)+2
AC03 to AC73
(DA01 to DA51)+(m-3)
AC0m-2 to AC7m-2
(DA01 to DA51)+(m-2)
AC0m-1 to AC7m-1
(DA01 to DA51)+(m-1)
AC0m to AC7m
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18
LC75812PT
Example 1: When n=32 bits (m=2: 2 characters DCRAM data write operation)
Code
D88
D89
D90
D91
D92
D93
D94
D95
D96
D97
D98
D99
D100 D101 D102 D103
AC01 AC11 AC21 AC31 AC41 AC51 AC61 AC71 AC02 AC12 AC22 AC32 AC42 AC52 AC62 AC72
Code
D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
DA0 1 DA11 DA21 DA31 DA41 DA51
X
X
0
1
X
X
0
1
0
1
X: don’t care
Correspondence between the DCRAM address and the DCRAM data
DCRAM address
DCRAM data
DA0 1 to DA5 1
AC0 1 to AC7 1
(DA0 1 to DA5 1)+1
AC0 2 to AC72
Example 2: When n=80 bits (m=8: 8 characters DCRAM data write operation)
Code
D40
D41
D42
D43
D44
D45
D46
D47
D48
D49
D50
D51
D52
D53
D54
D55
AC0 1 AC11 AC21 AC31 AC41 AC51 AC61 AC71 AC02 AC12 AC22 AC32 AC42 AC52 AC62 AC72
Code
D56
D57 D58
D59
D60
D61
D62
D63
D64
D65
D66
D67
D68
D69
D70
D71
AC03 AC13 AC23 AC33 AC43 AC53 AC63 AC73 AC04 AC14 AC24 AC34 AC44 AC54 AC64 AC74
Code
D72
D73
D74
D75
D76
D77
D78
D79
D80
D81
D82
D83
D84
D85
D86
D87
AC05 AC15 AC25 AC35 AC45 AC55 AC65 AC75 AC06 AC16 AC26 AC36 AC46 AC56 AC66 AC76
Code
D88
D89
D90
D91
D92
D93
D94
D95
D96
D97
D98
D99 D100 D101 D102 D103
AC07 AC17 AC27 AC37 AC47 AC57 AC67 AC77 AC08 AC18 AC28 AC38 AC48 AC58 AC68 AC78
Code
D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
DA01 DA11 DA21 DA31 DA41 DA51
X
X
0
1
X
X
0
1
0
1
X: don't care
Correspondence between the DCRAM address and the DCRAM data
DCRAM address
DCRAM data
DA01 to DA51
AC01 to AC71
(DA01 to DA51)+1
AC02 to AC72
(DA01 to DA51)+2
AC03 to AC73
(DA01 to DA51)+3
AC04 to AC74
(DA01 to DA51)+4
AC05 to AC75
(DA01 to DA51)+5
AC06 to AC76
(DA01 to DA51)+6
AC07 to AC77
(DA01 to DA51)+7
AC08 to AC78
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19
LC75812PT
Example 3: When n=120 bits (m=13: 13 characters DCRAM data write operation)
Code
D0
D1
D2
D3
D4
D5
D6
D7
D8
AC01 AC11 AC21 AC31 AC41 AC51 AC61 AC71
D9
D10
D11
D12
D13
D14
D15
AC02 AC12 AC22 AC32 AC42 AC52 AC62 AC72
Code
D16
D17
D18
D19
D20
D21
D22
D23
AC03 AC13 AC23 AC33 AC43 AC53 AC63 AC73
D24
D25
D26
D27
D28
D29
D30
D31
AC04 AC14 AC24 AC34 AC44 AC54 AC64 AC74
Code
D32
D33
D34
D35
D36
D37
D38
D39
AC05 AC15 AC25 AC35 AC45 AC55 AC65 AC75
D40
D41
D42
D43
D44
D45
D46
D47
AC06 AC16 AC26 AC36 AC46 AC56 AC66 AC76
Code
D48
D49
D50
D51
D52
D53
D54
D55
AC07 AC17 AC27 AC37 AC47 AC57 AC67 AC77
D56
D57
D58
D59
D60
D61
D62
D63
AC08 AC18 AC28 AC38 AC48 AC58 AC68 AC78
Code
D64
D65
D66
D67
D68
D69
D70
D71
D72
D73
D74
D75
D76
D77
D78
D79
AC09 AC19 AC29 AC39 AC49 AC59 AC69 AC79 AC010 AC110 AC210 AC310 AC410 AC510 AC610 AC710
Code
D80
D81
D82
D83
D84
D85
D86
D87
D88
D89
D90
D91
D92
D93
D94
D95
AC011 AC111 AC211 AC311 AC411 AC511 AC611 AC711 AC012 AC112 AC212 AC312 AC412 AC512 AC612 AC712
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111
AC013 AC113 AC213 AC313 AC413 AC513 AC613 AC713 DA01 DA11 DA21 DA31 DA41 DA51
X
X
Code
D112 D113 D114 D115 D116 D117 D118 D119
0
1
X
X
0
1
0
1
X: don't care
Correspondence between the DCRAM address and the DCRAM data
DCRAM address
DCRAM data
DCRAM address
DCRAM data
DA01 to DA51
AC01 to AC71
(DA01 to DA51)+7
AC08 to AC78
(DA01 to DA51)+1
AC02 to AC72
(DA01 to DA51)+8
AC09 to AC79
(DA01 to DA51)+2
AC03 to AC73
(DA01 to DA51)+9
AC010 to AC710
(DA01 to DA51)+3
AC04 to AC74
(DA01 to DA51)+10
AC011 to AC711
(DA01 to DA51)+4
AC05 to AC75
(DA01 to DA51)+11
AC012 to AC712
(DA01 to DA51)+5
AC06 to AC76
(DA01 to DA51)+12
AC013 to AC713
(DA01 to DA51)+6
AC07 to AC77
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20
LC75812PT
ADRAM data write ... <Specifies the ADRAM address and stores data at that address>
(Write data to ADRAM)
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AD1 AD2 AD3 AD4 AD5
X
X
X
RA0 RA1 RA2 RA3
X
X
X
X
IM1
IM2
X
X
0
1
1
0
X: don’t care
RA0 to RA3:ADRAM address
RA0
RA1
RA2
LSB

Least significant bit
RA3
MSB

Most significant bit
AD1 to AD5: ADATA display data
In addition to the 57 or 58 dot matrix display data (MDATA), this IC supports direct display of the five
accessory display segments provided in each digit as ADATA. This display function does not use CGROM or CGRAM.
The figure below shows the correspondence between the data and the display. When ADn = 1(where n is an integer
between 1 and 5) the segment corresponding to that data will be turned on.
S5m+1
S5m+5 (m is an integer
between 0 and 12)
ADATA
Corresponding output pin
AD1
S5m+1 (m is an integer between 0 and 12)
AD2
S5m+2
AD3
S5m+3
AD4
S5m+4
AD5
S5m+5
IM1, IM2: Sets the method of writing data to ADRAM
IM1
IM2
0
0
ADRAM data write method
Normal ADRAM data write (Specifies the ADRAM address and writes the ADRAM data.)
1
0
Nomal increment mode ADRAM data write (Increments the ADRAM address by +1 each time data is written to ADRAM.)
0
1
Super increment mode ADRAM data write (Writes 2 to 13 digits of ADRAM data in single operation.)
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21
LC75812PT
Notes: *17.
ADRAM data write method when IM1 = 0, IM2 = 0
CE
CCB address
CCB address
CCB address
CCB address
(6)
(6)
(6)
(6)
24 bit
24 bit
24 bit
24 bit
Instruction
Instruction
Instruction
execution time
execution time
execution time
(27s)
ADRAM data (27s)
ADRAM data (27s)
write finishes
write finishes
Instruction
execution time
(27s)
DI
ADRAM
ADRAM data
write finishes
ADRAM data
write finishes
ADRAM data write method when IM1 = 1, IM2 = 0
(Instructions other than the “ADRAM data write” instruction cannot be executed.)
CE
CCB address
DI
CCB address
CCB address
CCB address
CCB address
CCB address
(7)
(8)
(8)
(8)
(8)
(9)
24 bit
8 bit
8 bit
8 bit
8 bit
16 bit
Instruction
execution time
(27s)
Instruction
execution time
(27s)
ADRAM
Instruction
execution time
(27s)
Instruction
execution time
(27s)
ADRAM data
write finishes
Instruction
execution time
(27s)
ADRAM data
write finishes
Instruction
execution time
(27s)
ADRAM data
write finishes
ADRAM data
write finishes
ADRAM data
write finishes
ADRAM data
write finishes
Instructions other than the “ADRAM data write” instruction
cannot be executed.
ADRAM data write method when IM1 = 0, IM2 = 1
CE
CCB address
DI
CCB address
CCB address
(10)
(10)
n bit
n bit
(10)
n bit
ADRAM
Instruction
execution time
(tis)
ADRAM data
write finishes
Instruction
execution time
(tis)
ADRAM data
write finishes
Instruction
execution time
(tis)
ADRAM data
write finishes
n
ti=13.5s×( -1)
8
(n=8m+16, m is an integer between 2 and 13 that is the number of characters written as ADRAM data.)
For example
When n= 32 bits (m=2): ti= 40.5s (fosc=300kHz, fCK=300kHz)
When n= 80 bits (m=8): ti=121.5s (fosc=300kHz, fCK=300kHz)
When n=120 bits (m=13): ti=189.0s (fosc=300kHz, fCK=300kHz)
Note that the instruction execution time of 27s and ti values in μs apply when fosc=300kHz and fCK=300kHz, and
that these execution times will differ when the CR oscillator frequency fosc and external clock frequency fCK differ.
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22
LC75812PT
Data format at (6) (24 bits)
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AD1
AD2
AD3
AD4
AD5
X
X
X
RA0
RA1
RA2
RA3
X
X
X
X
0
0
X
X
0
1
1
0
X: don’t care
Data format at (7) (24 bits)
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AD1
AD2
AD3
AD4
AD5
X
X
X
RA0
RA1
RA2
RA3
X
X
X
X
1
0
X
X
0
1
1
0
X: don’t care
Data format at (8) (8 bits)
Code
D112 D113 D114 D115 D116 D117 D118 D119
AD1
AD2
AD3
AD4
AD5
X
X
X
Data format at (9) (16 bits)
Code
D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AD1
AD2
AD3
AD4
AD5
X
X
X
0
0
X
X
0
1
1
0
X: don’t care
Data format at (10) (n bit)
Code
Dz
Dz+1 Dz+2 Dz+3 Dz+4 Dz+5 Dz+6 Dz+7
AD11 AD21 AD31 AD41 AD51
X
X

D88

X
D89
D90
D91
D92
AD1m-1 AD2m-1 AD3m-1 AD4m-1 AD5m-1
D93
D94
D95
X
X
X
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
AD1m AD2m AD3m AD4m AD5m
X
X
X
RA0 1 RA11 RA21 RA31
X
X
X
X
0
1
X
X
0
1
1
0
X: don’t care
Here, n=8m+16, z=104-8m
(m is an integer between 2 and 13 that is the number of characters written as ADRAM data.)
Correspondence between the ADRAM address and theADRAM data
ADRAM address
ADRAM data
RA01 to RA31
AD11 to AD51
(RA01 to RA31)+1
AD12 to AD52
(RA01 to RA31)+2
AD13 to AD53
(RA01 to RA31)+(m-3)
AD1m-2 to AD5m-2
(RA01 to RA31)+(m-2)
AD1m-1 to AD5m-1
(RA01 to RA31)+(m-1)
AD1m to AD5m
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LC75812PT
Example 1: When n=32 bits (m=2: 2 characters ADRAM data write operation)
Code
D88
D89
D90
D91
D92
AD11 AD21 AD31 AD41 AD51
D93
D94
D95
X
X
X
D96
D97
D98
D99
D100 D101 D102 D103
AD12 AD22 AD33 AD44 AD55
X
X
X
Code
D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
RA0 1 RA11 RA21 RA31
X
X
X
X
0
1
X
X
0
1
1
0
X: don’t care
Correspondence between the ADRAM address and the ADRAM data
ADRAM address
ADRAM data
RA0 1 to RA3 1
AD1 1 to AD5 1
(RA0 1 to RA3 1)+1
AD1 2 to AD52
Example 2: When n=80 bits (m=8: 8 characters ADRAM data write operation)
Code
D40
D41
D42
D43
D44
AD11 AD21 AD31 AD41 AD51
D45
D46
D47
X
X
X
D48
D49
D50
D51
D52
D53
D54
D55
X
X
X
D69
D70
D71
X
X
X
D85
D86
D87
X
X
X
AD12 AD22 AD32 AD42 AD52
Code
D56
D57 D58
D59
D60
AD13 AD23 AD33 AD43 AD53
D61
D62
D63
X
X
X
D77
D78
D79
X
X
X
D93
D94
D95
X
X
X
D64
D65
D66
D67
D68
AD14 AD24 AD34 AD44 AD54
Code
D72
D73
D74
D75
D76
AD15 AD25 AD35 AD45 AD55
D80
D81
D82
D83
D84
AD16 AD26 AD36 AD46 AD56
Code
D88
D89
D90
D91
D92
AD17 AD27 AD37 AD47 AD57
D96
D97
D98
D99 D100 D101 D102 D103
AD18 AD28 AD38 AD48 AD58
X
X
X
Code
D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
RA0 1 RA11 RA21 RA31
X
X
X
X
0
1
X
X
0
1
1
0
X: don't care
Correspondence between the ADRAM address and the ADRAM data
ADRAM address
ADRAM data
RA01 to RA31
AD11 to AD51
(RA01 to RA31)+1
AD12 to AD52
(RA01 to RA31)+2
AD13 to AD53
(RA01 to RA31)+3
AD14 to AD54
(RA01 to RA31)+4
AD15 to AD55
(RA01 to RA31)+5
AD16 to AD56
(RA01 to RA31)+6
AD17 to AD57
(RA01 to RA31)+7
AD18 to AD58
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24
LC75812PT
Example 3: When n=120 bits (m=13: 13 characters ADRAM data write operation)
Code
D0
D1
D2
D3
D4
AD11 AD21 AD31 AD41 AD51
D5
D6
D7
X
X
X
D8
D21
D22
D23
X
X
X
D37
D38
D39
X
X
X
D9
D10
D11
D12
D13
D14
D15
X
X
X
D29
D30
D31
X
X
X
D45
D46
D47
X
X
X
D61
D62
D63
X
X
X
D77
D78
D79
X
X
X
D93
D94
D95
X
X
X
AD12 AD22 AD32 AD42 AD52
Code
D16
D17
D18
D19
D20
AD13 AD23 AD33 AD43 AD53
D24
D25
D26
D27
D28
AD14 AD24 AD34 AD44 AD54
Code
D32
D33
D34
D35
D36
AD15 AD25 AD35 AD45 AD55
D40
D41
D42
D43
D44
AD16 AD26 AD36 AD46 AD56
Code
D48
D49
D50
D51
D52
AD17 AD27 AD37 AD47 AD57
D53
D54
D55
X
X
X
D56
D57
D58
D59
D60
AD18 AD28 AD38 AD48 AD58
Code
D69
D70
D71
AD19 AD29 AD39 AD49 AD59
D64
D65
D66
D67
D68
X
X
X
D80
D85
D86
D87
X
X
X
D72
D73
D74
D75
D76
AD110 AD210 AD310 AD410 AD510
Code
D81
D82
D83
D84
AD111 AD211 AD311 AD411 AD511
D88
D89
D90
D91
D92
AD112 AD212 AD312 AD412 AD512
Code
D96
D97
D98
D99
D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111
AD113 AD213 AD313 AD413 AD513
X
X
X
RA0 1 RA11 RA21 RA31
X
X
X
X
Code
D112 D113 D114 D115 D116 D117 D118 D119
0
1
X
X
0
1
1
0
X: don't care
Correspondence between the ADRAM address and the ADRAM data
ADRAM address
ADRAM data
ADRAM address
ADRAM data
RA01 to RA31
AD11 to AD51
(RA01 to RA31)+7
AD18 to AD58
(RA01 to RA31)+1
AD12 to AD52
(RA01 to RA31)+8
AD19 to AD59
(RA01 to RA31)+2
AD13 to AD53
(RA01 to RA351)+9
AD110 to AD510
(RA01 to RA31)+3
AD14 to AD54
(RA01 to RA31)+10
AD111 to AD511
(RA01 to RA31)+4
AD15 to AD55
(RA01 to RA31)+11
AD112 to AD512
(RA01 to RA31)+5
AD16 to AD56
(RA01 to RA31)+12
AD113 to AD513
(RA01 to RA31)+6
AD17 to AD57
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25
LC75812PT
CGRAM data write ... <Specifies the CGRAM address and stores data at that address>
(Write data to CGRAM)
Code
D56
D57
D58
D59
D60
D61
D62
D63
D64
CD1
CD2
CD3
CD4
CD5
CD6
CD7
CD8
CD9 CD10 CD11 CD12 CD13 CD14 CD15 CD16
D65
D66
D67
D68
D69
D70
D71
Code
D72
D73 D74
D75
D76
D77
D78
D79
D80
D81
D82
D83
D84
D85
D86
D87
CD17 CD18 CD19 CD20 CD21 CD22 CD23 CD24 CD25 CD26 CD27 CD28 CD29 CD30 CD31 CD32
Code
D88
D89
D90
D91
D92
D93
D94
D95
D96
D97
D98
X
X
X
CD33 CD34 CD35 CD36 CD37 CD38 CD39 CD40
D99 D100 D101 D102 D103
X
X
X
X
X
Code
D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
CA0 CA1 CA2 CA3 CA4 CA5 CA6 CA7
X
X
X
X
0
1
1
1
X: don’t care
CA0 to CA7: CGRAM address
CA0
CA1
CA2
CA3
CA4
LSB

Least significant bit
CA5
CA6
CA7
MSB

Most significant bit
CD1 to CD40: CGRAM data (57 or 58 dot matrix display data)
The bit CDn (where n is an integer between 1 and 40) corresponds to the 57 or 58 dot matrix display data.
The figure below shows that correspondence. When CDn is 1 the dots which correspond to that data will be turned on.
CD1
CD2
CD3
CD4
CD5
CD6
CD7
CD8
CD9
CD10
CD11
CD12
CD13
CD14
CD15
CD16
CD17
CD18
CD19
CD20
CD21
CD22
CD23
CD24
CD25
CD26
CD27
CD28
CD29
CD30
CD31
CD32
CD33
CD34
CD35
CD36
CD37
CD38
CD39
CD40
Note: *18. CD1 to CD35: 57 dot matrix display data
CD1 to CD40: 58 dot matrix display data
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26
LC75812PT
Set display contrast… <Sets the display contrast>
(Set display contrast)
Code
D104
D105 D106
D107
D108
D109
CT0
CT1
CT3
X
X
CT2
D110 D111
X
X
D112
D113 D114 D115
CTC
X
X
X
D116 D117
1
0
D118
D119
0
0
X: don’t care
CT0 to CT3: Sets the display contrast (11 steps)
CT0
CT1
CT2
CT3
0
0
0
0
0.94VLCD=VLCD-(0.03VLCD2)
LCD drive 4/4 bias voltage supply VLCD0 level
1
0
0
0
0.91VLCD=VLCD-(0.03VLCD3)
0
1
0
0
0.88VLCD=VLCD-(0.03VLCD4)
1
1
0
0
0.85VLCD=VLCD-(0.03VLCD5)
0
0
1
0
0.82VLCD=VLCD-(0.03VLCD6)
1
0
1
0
0.79VLCD=VLCD-(0.03VLCD7)
0
1
1
0
0.76VLCD=VLCD-(0.03VLCD8)
1
1
1
0
0.73VLCD=VLCD-(0.03VLCD9)
0
0
0
1
0.70VLCD=VLCD-(0.03VLCD10)
1
0
0
1
0.67VLCD=VLCD-(0.03VLCD11)
0
1
0
1
0.64VLCD=VLCD-(0.03VLCD12)
CTC: Sets the display contrast adjustment circuit state
CTC
Display contrast adjustment circuit state
0
The display contrast adjustment circuit is disabled, and the VLCD0 pin level is forced to the VLCD level.
1
The display contrast adjustment circuit operates, and the display contrast is adjusted.
Note that although the display contrast can be adjusted by operating the built-in display contrast adjustment circuit, it is
also possible to apply fine adjustments to the contrast by connecting an external variable resistor to the VLCD4 pin and
modifying the VLCD4 pin voltage. However, the following conditions must be met: VLCD0-VLCD44.5V, and
1.5VVLCD4 0V.
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LC75812PT
Set key scan output port/general-purpose output port state
... <Sets the key scan output port and general-purpose output port states>
(Key scan output port and General-purpose output port control)
Code
D73
D74
D75
D76
D77
D78
D79
D80
D81
D82
D83
D84
D85
D86
W10 W11
D72
W12
W13
W14
W15
W20
W21
W22
W23
W24
W25
W30
W31
W32 W33 W34 W35 PC10 PC11 PC20 PC21 PC30 PC31
D87
D88
D89
D90
D91
D92
D93
D94
D95
Code
D97
D98
D99 D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110 D111 D112 D113 D114 D115 D116 D117 D118 D119
PC32 PF0
D96
PF1
PF2
PF3
KC1
KC2
KC3
KC4
KC5
KC6
KC7
KP1
KP2
KP3
X
X
X
X
X
1
0
0
1
X: don’t care
KP1 to KP3: Set the output pins KS1/P1, KS2/P2, and KS7/P3 as either key scan output ports or general-purpose output ports.
General-
Output pin
KP1
KP2
KP3
KS1/P1
KS2/P2
Max. Key
purpose
Input
Output
KS7/P3
Port
Number
Number
0
0
0
KS1
KS2
KS7
35
0
1
0
0
P1
KS2
KS7
30
1
0
1
0
KS1
P2
KS7
30
1
0
0
1
KS1
KS2
P3
30
1
1
1
0
P1
P2
KS7
25
2
0
1
1
KS1
P2
P3
25
2
1
0
1
P1
KS2
P3
25
2
1
1
1
P1
P2
P3
20
3
*19) KSn(n=1,2,7): Key scan output port
Pn(n=1 to 3): General-purpose
output port
KC1 to KC7: Sets the key scan output pin KS1 to KS7 state
Output pin
KS1
KS2
KS3
KS4
KS5
KS6
KS7
Key scan output state setting data
KC1
KC2
KC3
KC4
KC5
KC6
KC7
If, for example, the output pins KS1/P1, KS2/P2, and KS7/P3 are set as key scan output ports, the output pins KS1 to
KS3 will go high (VDD) and KS4 to KS7 go low (VSS) in the key scan standby state when KC1 to KC3 are set to 1 and
KC4 to KC7 are set to 0. Note that key scan output signals are not output from output pins that are set to the low level.
PC10, PC11: Sets the general-purpose output port P1 state
PC20, PC21: Sets the general-purpose output port P2 state
PC10
PC11
Output pin (P1) state
PC20
PC21
Output pin (P2) state
0
0
“L”(VSS)
0
0
“L”(VSS)
1
0
“H”(VDD)
1
0
“H”(VDD)
0
1
PWM signal output
0
1
PWM signal output
PC30 to PC32: Sets the general-purpose output port P3 state
PC30
PC31
PC32
Output pin (P3) state
0
0
0
“L”(VSS)
1
0
0
“H”(VDD)
0
1
0
PWM signal output
1
1
0
Clock signal output (fosc/2, fCK/2)
0
0
1
Clock signal output (fosc/8, fCK/8)
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28
LC75812PT
PF0 to PF3: Set the frame frequency of the PWM output waveforms.
(when general-purpose outout ports P1 to P3 are set to select the PWM signal generation function.)
PF0
PF1
PF2
PF3
PWM Output Waveform Frame Frequency fp[Hz]
0
0
0
0
fosc/1536, fCK/1536
1
0
0
0
fosc/1408, fCK/1408
0
1
0
0
fosc/1280, fCK/1280
1
1
0
0
fosc/1152, fCK/1152
0
0
1
0
fosc/1024, fCK/1024
1
0
1
0
fosc/896, fCK/896
0
1
1
0
fosc/768, fCK/768
1
1
1
0
fosc/640, fCK/640
0
0
0
1
fosc/512, fCK/512
1
0
0
1
fosc/384, fCK/384
0
1
0
1
fosc/256, fCK/256
W10 to W15, W20 to W25, W30 to W35: Set the pulse width of the PWM output waveforms.
(when general-purpose outout ports P1 to P3 are set to select the PWM signal generation function.)
Wn0
Wn1
Wn2
Wn3
Wn4
Wn5
0
0
0
0
0
0
1
0
0
0
0
0
1
0
0
1
1
0
0
0
0
1
1
0
0
1
1
PWM Signal Pn
PWM Signal Pn
Wn0
Wn1
Wn2
Wn3
Wn4
Wn5
(1/64) Tp
0
0
0
0
0
1
(33/64) Tp
0
(2/64) Tp
1
0
0
0
0
1
(34/64) Tp
0
0
(3/64) Tp
0
1
0
0
0
1
(35/64) Tp
0
0
(4/64) Tp
1
1
0
0
0
1
(36/64) Tp
0
0
0
(5/64) Tp
0
0
1
0
0
1
(37/64) Tp
1
0
0
0
(6/64) Tp
1
0
1
0
0
1
(38/64) Tp
1
0
0
0
(7/64) Tp
0
1
1
0
0
1
(39/64) Tp
1
1
0
0
0
(8/64) Tp
1
1
1
0
0
1
(40/64) Tp
0
0
0
1
0
0
(9/64) Tp
0
0
0
1
0
1
(41/64) Tp
1
0
0
1
0
0
(10/64) Tp
1
0
0
1
0
1
(42/64) Tp
0
1
0
1
0
0
(11/64) Tp
0
1
0
1
0
1
(43/64) Tp
1
1
0
1
0
0
(12/64) Tp
1
1
0
1
0
1
(44/64) Tp
0
0
1
1
0
0
(13/64) Tp
0
0
1
1
0
1
(45/64) Tp
1
0
1
1
0
0
(14/64) Tp
1
0
1
1
0
1
(46/64) Tp
0
1
1
1
0
0
(15/64) Tp
0
1
1
1
0
1
(47/64) Tp
1
1
1
1
0
0
(16/64) Tp
1
1
1
1
0
1
(48/64) Tp
0
0
0
0
1
0
(17/64) Tp
0
0
0
0
1
1
(49/64) Tp
1
0
0
0
1
0
(18/64) Tp
1
0
0
0
1
1
(50/64) Tp
0
1
0
0
1
0
(19/64) Tp
0
1
0
0
1
1
(51/64) Tp
1
1
0
0
1
0
(20/64) Tp
1
1
0
0
1
1
(52/64) Tp
0
0
1
0
1
0
(21/64) Tp
0
0
1
0
1
1
(53/64) Tp
1
0
1
0
1
0
(22/64) Tp
1
0
1
0
1
1
(54/64) Tp
0
1
1
0
1
0
(23/64) Tp
0
1
1
0
1
1
(55/64) Tp
1
1
1
0
1
0
(24/64) Tp
1
1
1
0
1
1
(56/64) Tp
0
0
0
1
1
0
(25/64) Tp
0
0
0
1
1
1
(57/64) Tp
1
0
0
1
1
0
(26/64) Tp
1
0
0
1
1
1
(58/64) Tp
0
1
0
1
1
0
(27/64) Tp
0
1
0
1
1
1
(59/64) Tp
1
1
0
1
1
0
(28/64) Tp
1
1
0
1
1
1
(60/64) Tp
0
0
1
1
1
0
(29/64) Tp
0
0
1
1
1
1
(61/64) Tp
1
0
1
1
1
0
(30/64) Tp
1
0
1
1
1
1
(62/64) Tp
0
1
1
1
1
0
(31/64) Tp
0
1
1
1
1
1
(63/64) Tp
1
1
1
1
1
0
(32/64) Tp
1
1
1
1
1
1
(64/64) Tp
Pulse Width
Pulse Width
Note: *20. Wn0 to Wn5 (n=1 to 3): PWM data for the PWM output waveforms at general-purpose output ports
Pn (n=1 to 3).
1
Tp= fp
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29
LC75812PT
Serial Data Output
(1) When CL is stopped at the low level
CE
CL
DI
1
1
0
0
0
0
1
0
B0
B1
B2
B3
A0
A1
A2
A3
DO
X
KD34 KD35 SA
KD1 KD2
X
X
X
Output data
X: don’t care
(2) When CL is stopped at the high level
CE
CL
DI
1
1
0
0
0
0
1
0
B0
B1
B2
B3
A0
A1
A2
A3
DO
X KD1 KD2 KD3
KD35 SA
X
X
X
X
Output data
X: don’t care
B0 to B3, A0 to A3: CCB address 43H
KD1 to KD35: Key data
SA: Sleep acknowledge data
Note: *21. When key data read operation is executed with DO set high (no key data read request present), the key data
(KD1 to KD35) and sleep acknowledge data (SA) are invalid.
Output Data
(1) KD1 to KD35: Key data
When a key matrix of up to 35 keys is formed from the KS1 to KS7 output pins and the KI1 to KI5 input pins and
one of those keys is pressed, the key output data corresponding to that key will be set to 1. The table shows the
relationship between those pins and the key data bits.
KI1
KI2
KI3
KI4
KI5
KS1/P1
KD1
KD2
KD3
KD4
KD5
KS2/P1
KD6
KD7
KD8
KD9
KD10
KS3
KD11
KD12
KD13
KD14
KD15
KS4
KD16
KD17
KD18
KD19
KD20
KS5
KD21
KD22
KD23
KD24
KD25
KS6
KD26
KD27
KD28
KD29
KD30
KS7/P3
KD31
KD32
KD33
KD34
KD35
KD1 to KD10 are all set to 0 when the output pins KS1/P1 and KS2/P2 are set as general-purpose output ports with
the "set key scan output port/general-purpose output port state" instruction and a key matrix of maximum 25 keys is
formed from the output pins KS3 to KS6 and KS7/P3 and the input pins KI1 to KI5.
(2) SA: Sleep acknowledge data
This output data bit is set to the state when the key was pressed. Also, while DO will be low in this case, if serial
data is input and the mode is set (to normal or sleep mode) during this period, that mode will be set. SA will be 1 in
Sleep mode and 0 in normal mode.
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LC75812PT
Key Scan Operation Functions
(1) Key scan timing
The key scan period is 2296T(s). To reliably determine the on/off state of the keys, the LC75812PT scans the keys
twice and determines that a key has been pressed when the key data agrees. It outputs a key data read request (a low
level on DO) 4800T(s) after starting a key scan. If the key data dose not agree and a key was pressed at that point, it
scans the keys again. Thus the LC75812PT cannot detect a key press shorter than 4800T(s).
KS1
*22
KS2
*22
KS3
*22
KS4
*22
KS5
*22
KS6
*22
KS7
*22
1
*22
1
2
*22
2
3
*22
3
4
1
fosc
T=
1
fCK
*22
4
5
T=
*22
5
6
*22
6
7
7
*22
4592T[s]
Key on
Note: *22. Not that the high/low states of these pins are determined by the "set key scan output port/general-purpose
output port state" instruction, and that key scan output signals are not output from pins that are set to low.
(2) In normal mode
The pins KS1 to KS7 are set to high or low with the "set key scan output port/general-purpose output port state"
instruction.
If a key on one of the lines corresponding to a KS1 to KS7 pin which is set high is pressed, a key scan is started
and the keys are scanned until all keys are released. Multiple key presses are recognized by determining whether
multiple key data bits are set.
If a key is pressed for longer than 4800T(s) (Where T=1/fosc, T=1/fCK) the LC75812PT outputs a key data
read request (a low level on DO) to the controller. The controller acknowledges this request and reads the key data.
However, if CE is high during a serial data transfer, DO will be set high.
After the controller reads the key data, the key data read request is cleared (DO is set high) and the LC75812PT
performs another key scan. Also note that DO, being an open-drain output, requires a pull-up resistor (between
1k and 10k).
Key input 1
Key input 2
Key scan
4800T[s]
4800T[s]
4800T[s]
CE
Serial data transfer Serial data transfer Key address
(43H)
Serial data transfer
Key address
Key address
DI
DO
Key data read
Key data read
Key data read request
Key data read request
Key data read
Key data read request
T=
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31
1
fosc
T=
1
fCK
LC75812PT
(3) In sleep mode
The pins KS1 to KS7 are set to high or low with the "set key scan output port/general-purpose output port state"
instruction.
If a key on one of the lines corresponding to a KS1 to KS7 pin which is set high is pressed in the RC oscillator
operating mode, the oscillator on the OSC pin is started (the IC starts receiving the external clock in external clock
operating mode) and a key scan is performed . Keys are scanned until all keys released. Multiple key presses are
recognized by determining whether multiple key data bits are set.
If a key is pressed for longer than 4800T(s) (Where T=1/fosc, T=1/fCK) the LC75812PT outputs a key data
read request (a low level on DO) to the controller. The controller acknowledges this request and reads the key data.
However, if CE is high during a serial data transfer, DO will be set high.
After the controller reads the key data, the key data read request is cleared (DO is set high) and the
LC75812PT performs another key scan. However, this dose not clear sleep mode. Also note that DO, being an
open-drain output, requires a pull-up resistor (between 1k and 10k).
Sleep mode key scan example
Example: When a "display on/off control (SP=1)" instruction and a "set key scan output port/general-purpose
output port state (KP1 to KP3=0, KC1 to KC6= 0, KC7=1)" instruction are executed. (i.e. sleep mode with
only KS7 high.)
“L” KS1
“L” KS2
“L” KS3
When any one of these keys is pressed in RC
oscillator operating mode, the oscillator on the OSC
pin is started (the IC starts receiving the external
clock in external clock operating mode) and the keys
are scanned.
“L” KS4
“L” KS5
“L” KS6
“H” KS7
*23
KI1
KI2
KI3
KI4
KI5
Note: *23. These diodes are required to reliably recognize multiple key presses on the KS7 line when sleep mode state
with only KS7 high, as in the above example.
That is, these diodes prevent incorrect operations due to sneak currents in the KS7 key scan output signal
when keys on the KS1 to KS6 lines are pressed at the same time.
Key input
(KS7 line)
Key scan
4800T[s]
4800T[s]
CE
Serial data transfer
Serial data transfer Key address Serial data transfer Key address
(43H)
DI
T=
1
fosc
T=
1
fCK
DO
Key data read
Key data read request
Key data read
Key data read request
Multiple Key Presses
Although the LC75812PT is capable of key scanning without inserting diodes for dual key presses, triple key presses on
the KI1 to KI5 input pin lines, or multiple key presses on the KS1 to KS7 output pin lines, multiple presses other than
these cases may result in keys that were not pressed recognized as having been pressed.
Therefore, a diode must be inserted in series with each key. Applications that do not recognize multiple key presses of
three or more keys should check the key data for three or more 1 bits and ignore such data.
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32
LC75812PT
1/8 Duty, 1/4 Bias Drive Technique
VLCD0
VLCD1
COM1
VLCD2
VLCD3
VLCD4
VLCD0
VLCD1
COM2
VLCD2
VLCD3
VLCD4
VLCD0
VLCD1
COM8
VLCD2
VLCD3
VLCD4
VLCD0
LCD driver output when all
LCD segments
corresponding to COM1 to
COM8 are turned off
VLCD1
VLCD2
VLCD3
VLCD4
VLCD0
LCD driver output when
only LCD segments
corresponding to COM1
are turned on
VLCD1
LCD driver output when
only LCD segments
corresponding to COM2
are turned on
VLCD1
VLCD2
VLCD3
LCD driver output when all
LCD segments
corresponding to COM1 to
COM8 are turned on
VLCD1
VLCD2
VLCD3
VLCD4
VLCD0
VLCD4
VLCD0
VLCD2
VLCD3
VLCD4
T8
8
T8
T8=
1
f8
f
When a "set display technique" instruction with FC0 = 0, FC1 = 0 are executed: f8 = fosc , f8 = CK
3072
3072
fCK
fosc
When a "set display technique" instruction with FC0 = 1, FC1 = 0 are executed: f8 =
, f8 =
1536
1536
fCK
fosc
When a "set display technique" instruction with FC0 = 0, FC1 =1 are executed: f8 =
, f8 =
768
768
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33
LC75812PT
1/9 Duty, 1/4 Bias Drive Technique
VLCD0
VLCD1
COM1
VLCD2
VLCD3
VLCD4
VLCD0
VLCD1
COM2
VLCD2
VLCD3
VLCD4
VLCD0
VLCD1
VLCD2
COM9
VLCD3
VLCD4
VLCD0
LCD driver output when all
LCD segments
corresponding to COM1 to
COM9 are turned off
VLCD1
VLCD2
VLCD3
VLCD4
VLCD0
LCD driver output when
only LCD segments
corresponding to COM1
are turned on
VLCD1
VLCD2
VLCD3
VLCD4
VLCD0
LCD driver output when
only LCD segments
corresponding to COM2
are turned on
VLCD1
VLCD2
VLCD3
VLCD4
VLCD0
LCD driver output when all
LCD segments
corresponding to COM1 to
COM9 are turned on
VLCD1
VLCD2
VLCD3
VLCD4
T9
9
T9
T9=
1
f9
f
When a "set display technique" instruction with FC0 = 0, FC1 = 0 are executed: f9 = fosc , f9 = CK
3456
3456
fCK
fosc
When a "set display technique" instruction with FC0 = 1, FC1 = 0 are executed: f9 =
, f9 =
1728
1728
fCK
fosc
When a "set display technique" instruction with FC0 = 0, FC1 =1 are executed: f9 =
, f9 =
864
864
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34
LC75812PT
PWM Output Waveform
VDD
P1
VDD
P2

VSS
(56/64)  Tp
(56/64)  Tp
(48/64)  Tp
(48/64)  Tp
VSS
VDD
P3
(40/64)  Tp
(40/64)  Tp
VSS
VDD
P1
(8/64)  Tp
VSS
(8/64)  Tp
VDD
P2

VSS
(16/64)  Tp
(16/64)  Tp
VDD
P3
VSS
(24/64)  Tp
(24/64)  Tp
VDD
P1
VSS
(32/64)  Tp
(32/64)  Tp
VDD
P2

VSS
(32/64)  Tp
(32/64)  Tp
VDD
P3
VSS
(32/64)  Tp
(32/64)  Tp
Tp
1
Tp= fp
Tp
PWM Output
"Set key scan output port/general-purpose output port state" Instruction Data
Waveform of
General-purpose
W10
W11
W12
W13
W14
W15
W20
W21
W22
W23
W24
W25
W30
W31
W32
W33
W34
W35
1
1
1
0
1
1
1
1
1
1
0
1
1
1
1
0
0
1

1
1
1
0
0
0
1
1
1
1
0
0
1
1
1
0
1
0

1
1
1
1
1
0
1
1
1
1
1
0
1
1
1
1
1
0

Output Ports P1 to
P3
"Set key scan output port/general-purpose output port state" Instruction Data
PWM Output Waveform
Frame Frequency
PF0
PF1
PF2
PF3
0
0
0
0
fosc/1536, fCK/1536
1
0
0
0
fosc/1408, fCK/1408
0
1
0
0
fosc/1280, fCK/1280
1
1
0
0
fosc/1152, fCK/1152
0
0
1
0
fosc/1024, fCK/1024
1
0
1
0
fosc/896, fCK/896
0
1
1
0
fosc/768, fCK/768
1
1
1
0
fosc/640, fCK/640
0
0
0
1
fosc/512, fCK/512
1
0
0
1
fosc/384, fCK/384
0
1
0
1
fosc/256, fCK/256
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35
fp[Hz]
LC75812PT
Clock Signal Output Waveform
P3
Tc/2
Tc=
1
fc
Tc
"Set Key Scan Output Port/
General-purpose port P3
General-purpose Port State"
clock signal frequency
Instruction Data
fc (=1/Tc) [Hz]
PC30
PC31
PC32
1
1
0
Clock signal output (fosc/2, fCK/2)
0
0
1
Clock signal output (fosc/8, fCK/8)
Voltage Detection Type Reset Circuit (VDET)
This circuit generates an output signal and resets the system when logic block power is first applied and when the
voltage drops, i.e., when the logic block power supply voltage is less than or equal to the power down detection
voltage VDET,which is 2.2 V, typical. To assure that this function operates reliably, a capacitor must be added to the
logic block power supply line so that the logic block power supply voltage VDD rise time when the logic block power
is first applied and the logic block power supply voltage VDD fall time when the voltage drops are both at least 1ms.
(See Figure 5.)
Power Supply Sequence
The following sequences must be observed when power is turned on and off. (See Figure 5.)
Power on: Logic block power supply(VDD) on LCD driver block power supply (VLCD) on
Power off: LCD driver block power supply(VLCD) off Logic block power supply (VDD) off When 5 V signal is
applied to the CE, CL, DI, and INH pins which are to be connected to the controller and if the logic block power
supply (VDD) is off, set the input voltage at the CE, CL, DI, and INH pins to 0 V and apply the 5 V signal to these
pins after turning on the logic block power supply (VDD).
System Reset
1. Reset function
The LC75812PT performs a system reset with the VDET. When a system reset is applied, the display is turned off,
key scanning is disabled, the key data is reset, and the general-purpose output ports are set to and held at the low level
(VSS).
These states that are created as a result of the system reset can be cleared by executing the instruction described below.
(See Figure 5.)
Clearing the display off state
Display operation can be enabled by executing a “display on/off control” instruction. However, since the contents of
the DCRAM, ADRAM, and CGRAM are undefined, applications must set the contents of these memories before
turning on display with the “display on/off control” instruction. That is, applications must execute the following
instructions.
Set display technique (The "set display technique" instruction must be executed first.)
DCRAM data write
ADRAM data write (If the ADRAM is used.)
CGRAM data write (If the CGRAM is used.)
Set AC address
Set display contrast (If the display contrast adjustment circuit is used.)
After executing the above instructions, applications must turn on the display with a “display on/off control”
instruction.
Note that when applications turn off in the normal mode, applications must turn off the display with a “display on/off
control” instruction or the INH pin.
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LC75812PT
Clearing the key scan disable and key data reset states
By executing the following instructions not only create a state in which key scanning can be performed, but also clear
the key data reset.
 Set display technique (The "set display technique" instruction must be executed first.)
Set key scan output port/general-purpose output port state
Clearing the general-purpose output ports locked at the low level (VSS) state
By executing the following instructions clear the general-purpose output ports locked at the low level (VSS) state and
set the states of the general-purpose output ports.
Set display technique (The "set display technique" instruction must be executed first.)
Set key scan output port/general-purpose output port state
t3 t4
t1 t2
VDD
VDET
VDET
VLCD
Instruction
execution
Key scan
General-purpose
output ports
Display state
Initial state settings
Execution enabled
Disabled
Fixed at the low level (VSS)
Can be set to such states as high (VDD), or low (VSS) level
Display off
“Set display technique” and
“Set key scan output port/
general-purpose output port
state” instruction execution
Display on
“Display on/off control”
instruction execution
(Turning the display on)
Display off
”Display on/off control“
instruction execution
(Turning the display off)
t1  1 [ms] (Logic block power supply voltage VDD rise time)
t2  0
t3  0
t4  1 [ms] (Logic block power supply voltage VDD fall time)
Initial state settings
Set display technique (The "set display technique" instruction must be executed first.)
DCRAM data write
ADRAM data write (If the ADRAM is used.)
CGRAM data write (If the CGRAM is used.)
Set AC address
Set display contrast (If the display contrast adjustment circuit is used.)
[Figure 5]
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37
LC75812PT
2. Block states during a system reset
(1) CLOCK GENERATOR,TIMING GENERATOR
When a reset is applied, these circuits are forcibly initialized internally. Then, when the "set display technique"
instruction is executed, oscillation of the OSC pin starts in RC oscillator operating mode (the IC starts receiving
the external clock in external clock operating mode), execution of the instruction is enabled.
(2) INSTRUCTION REGISTER, INSTRUCTION DECODER
When a reset is applied, these circuits are forcibly initialized internally. Then, when instruction execution starts,
the IC operates according to those instructions.
(3) ADDRESS REGISTER, ADDRESS COUNTER
When a reset is applied, these circuits are forcibly initialized internally. Then, the DCRAM and the ADRAM
addresses are set when “Set AC address” instruction is executed.
(4) DCRAM, ADRAM, CGRAM
Since the contents of the DCRAM, ADRAM, and CGRAM become undefined during a reset, applications must
execute “DCRAM data write”, “ADRAM data write (If the ADRAM is used.)”, and “CGRAM data write (If the
CGRAM is used.)” instructions before executing a “display on/off control” instruction.
(5) CGROM
Character patterns are stored in this ROM.
(6) LATCH
Although the value of the data in the latch is undefined during a reset, the ADRAM, CGROM, and CGRAM data
is stored by executing a “display on/off control” instruction.
(7) COMMON DRIVER, SEGMENT DRIVER
These circuits are forced to the display off state when a reset is applied.
(8) CONTRAST ADJUSTER
Display contrast adjustment circuit operation is disabled when a reset is applied. After that, the display contrast
can be set by executing a “set display contrast” instruction.
(9) KEY SCAN, KEY BUFFER
When a reset is applied, these circuits are forcibly initialized internally, and key scan operation is disabled. Also,
the key data is all set to 0. After that, key scanning can be performed by executing a "set key scan output
port/general-purpose output port state" instruction.
(10) GENERAL PURPOSE PORT
When a reset is applied, the general-purpose output port state is locked at the low level (VSS).
(11) CCB INTERFACE, SHIFT REGISTER
These circuits go to the serial data input wait state.
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38
VDD
VDET
S1
S63
S64
S65/COM9
COM8
COM1
LC75812PT
COMMON
DRIVER
SEGMENT DRIVER
LATCH
VSS
TEST
INSTRUCTION
DECODER
ADRAM
65
bits
INSTRUCTION
REGISTER
ADDRESS
COUNTER
VLCD
CONTRAST
ADJUSTER
VLCD0
CGRAM
5816
bits
CGROM
58240
bits
DCRAM
528
bits
VLCD1
ADDRESS
REGISTER
VLCD2
VLCD3
VLCD4
SHIFT REGISTER
CCB INTERFACE
KEY BUFFER
TIMING
GENERATOR
GENERAL
PURPOSE
PORT
P1/KS1
KS3
P2/KS2
KS5
KS4
KS6
P3/KS7
KI1
KI2
KI3
KI4
KI5
CE
CL
DO
OSC
DI
KEY SCAN
INH
CLOCK
GENERATOR
Blocks that are reset
(3) Output pin states during the reset period
Output pin
State during reset
S1 to S64
L (VLCD4)
S65/COM9
L (VLCD4)
L (VLCD4)
*24
COM1 to COM8
KS1/P1, KS2/P2
L (VSS)
*25
KS3 to KS6
L (VSS)
KS7/P3
L (VSS)
*25
OSC
Z (high-impedance)
*26
DO
H
*27
*24 This output pin is forcibly set to the segment output function and held low (VLCD4). If the "set display technique"
instruction is executed, however, either segment output or common output is selected according to the instruction.
*25 This output pin is forcibly set to general-purpose output port and held low (VSS). If the “set display technique” and
the "set key scan output port/general-purpose output port state" instructions are executed, however, either key scan
output port or general-purpose output port is selected according to the instructions.
*26 This I/O pin is forcibly set to the high-impedance state.
*27 Since this output pin is an open-drain output, a pull-up resistor (between 1 k and 10 k) is required. This pin is
held at the high level even if a key data read operation is performed before executing the "set display technique" or
"set key scan output port/general-purpose output port state" instruction.
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39
LC75812PT
OSC Pin Peripheral Circuit
(1) RC oscillator operating mode (when the "set display technique (OC=0)" instruction is executed)
When RC oscillator operating mode is selected, an external resistor Rosc and an external capacitor Cosc must be
connected between the OSC pin and GND.
OSC
Rosc
Cosc
(2) External clock operating mode (when the "set display technique (OC=1)" instruction is executed)
When selecting the external clock operating mode, connect a current protection resistor Rg (2.2 to 22 k) between
the OSC pin and external clock output pin (external oscillator). Determine the value of the resistance according to
the maximum allowable current value at the external clock output pin. Also make sure that the waveform of the
external clock is not heavily distorted.
External clock output pin
OSC
Rg
External oscillator
Note: *28. Allowable current value at external clock output pin >
VDD
Rg
Pins P1 to P3 peripheral circuit
It is recommended that the following circuit be used when adjusting the brightness of the LED backlight in PWM mode
using the general-purpose output ports P1 to P3 (when PWM signal output function is selected with the general-purpose
output ports P1 to P3 under the "set key scan output port/general-purpose output port state" instruction):
VCC
LED
P1 to P3
Note when applying a 5 V signal to the CE, CL, DI, and INH pins
When applying a 5V signal to the CE, CL, DI, and INH pins which are to be connected to the controller, set the input
voltage to the CE, CL, DI, and INH pins to 0 V if the logic block power supply (VDD) is off, and apply the 5 V signal
to those pins after turning on the logic block power supply (VDD).
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40
LC75812PT
Sample Application Circuit 1
1/8 duty, 1/4 bias drive technique (for use with normal panels)
LCD panel
+3.3V
*29
VDD
COM1
TEST
COM2
COM3
COM4
COM5
COM6
COM7
COM8
VSS
+8V
VLCD
OPEN
C
C
VLCD0
VLCD1
VLCD2
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
VLCD3
C
VLCD4 *30
C0.047F
OSC *31
*34
From the
controller
To the controller
To the controller
power supply
*33
INH *32
CE
CL
DI
DO
KKKKK
I I I I I
5 4 3 2 1
S61
S62
S63
S64
COM9/S65
P
3
/
KK K K K
SS S S S
76 5 4 3
P
2
/
K
S
2
P
1
/
K
S
1
General-purpose output ports
used with the backlight controller
or other circuit
Key matrix
(up to 35 keys)
Note *29. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise
time when power is applied and the logic block power supply voltage VDD fall time when power drops are
both at least 1 ms, as the LC75812PT is reset by the VDET.
*30. If a variable resistor is not used for display contrast fine adjustment, the VLCD4 pin must be connected to
ground.
*31. In RC oscillator operating mode, an external resistor, Rosc, and an external capacitor, Cosc, must be
connected between the OSC pin and ground. When selecting the external clock operating mode, connect a
current protection resistor Rg (2.2 to 22 k) between the OSC pin and the external clock output pin (external
oscillator). (See the “OSC Pin Peripheral Circuit” section.)
*32. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD.
*33. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 k and 10
k) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.
*34 When applying a 5 V signal to the CE, CL, DI, and INH pins, set the input voltage to 0 V if the logic block
power supply (VDD) is off and apply the 5 V signal to those pins after turning on the logic block power
supply (VDD).
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41
LC75812PT
Sample Application Circuit 2
1/8 duty, 1/4 bias drive technique (for use with large panels)
LCD panel
+3.3V
*29
+8V
VDD
COM1
TEST
VSS
COM2
COM3
COM4
COM5
COM6
COM7
COM8
VLCD
VLCD0
R
R
R
C
C
C
R
VLCD1
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
VLCD2
VLCD3
VLCD4 *30
C0.047F
10kR2.2k
OSC *31
*34
From the
controller
To the controller
To the controller
power supply
*33
INH *32
CE
CL
DI
DO
KKKKK
I I I I I
5 4 3 2 1
S61
S62
S63
S64
COM9/S65
PP
P
2 1
3
/ /
/
K K K K KK K
S S S S SS S
7 6 5 4 32 1
General-purpose output ports
used with the backlight controller
or other circuit
Key matrix
(up to 35 keys)
Note *29. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise
time when power is applied and the logic block power supply voltage VDD fall time when power drops are
both at least 1 ms, as the LC75812PT is reset by the VDET.
*30. If a variable resistor is not used for display contrast fine adjustment, the VLCD4 pin must be connected to
ground.
*31. In RC oscillator operating mode, an external resistor, Rosc, and an external capacitor, Cosc, must be
connected between the OSC pin and ground. When selecting the external clock operating mode, connect a
current protection resistor Rg (2.2 to 22 k) between the OSC pin and the external clock output pin (external
oscillator). (See the “OSC Pin Peripheral Circuit” section.)
*32. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD.
*33. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 k and 10
k) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.
*34 When applying a 5 V signal to the CE, CL, DI, and INH pins, set the input voltage to 0 V if the logic block
power supply (VDD) is off and apply the 5 V signal to those pins after turning on the logic block power
supply (VDD).
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42
LC75812PT
Sample Application Circuit 3
1/9 duty, 1/4 bias drive technique (for use with normal panels)
LCD panel
VDD
+3.3V
*29
COM1
TEST
VSS
COM2
COM3
COM4
COM5
COM6
COM7
COM8
S65/COM9
VLCD
+8V
OPEN
VLCD0
VLCD1
VLCD2
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
VLCD3
C
C
C
VLCD4 *30
C0.047F
OSC *31
*34
From the
controller
To the controller
To the controller
power supply
*33
INH *32
CE
CL
DI
DO
KKKKK
I I I I I
5 4 3 2 1
S61
S62
S63
S64
PP
P
2 1
3
/ /
/
KKKKKKK
SSSSSSS
7 6 5 4 3 2 1
General-purpose output ports
used with the backlight controller
or other circuit
Key matrix
(up to 35 keys)
Note *29. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise
time when power is applied and the logic block power supply voltage VDD fall time when power drops are
both at least 1 ms, as the LC75812PT is reset by the VDET.
*30. If a variable resistor is not used for display contrast fine adjustment, the VLCD4 pin must be connected to
ground.
*31. In RC oscillator operating mode, an external resistor, Rosc, and an external capacitor, Cosc, must be
connected between the OSC pin and ground. When selecting the external clock operating mode, connect a
current protection resistor Rg (2.2 to 22 k) between the OSC pin and the external clock output pin (external
oscillator). (See the “OSC Pin Peripheral Circuit” section.)
*32. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD.
*33. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 k and 10
k) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.
*34 When applying a 5 V signal to the CE, CL, DI, and INH pins, set the input voltage to 0 V if the logic block
power supply (VDD) is off and apply the 5 V signal to those pins after turning on the logic block power
supply (VDD).
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43
LC75812PT
Sample Application Circuit 4
1/9 duty, 1/4 bias drive technique (for use with large panels)
LCD panel
+3.3V
VDD
*29
COM1
TEST
VSS
COM2
COM3
COM4
COM5
COM6
COM7
COM8
S65/COM9
VLCD
+8V
VLCD0
R
R
R
C
C
C
R
VLCD1
VLCD2
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
VLCD3
VLCD4 *30
C0.047F
10kR2.2k
OSC *31
*34
From the
controller
To the controller
To the controller
power supply
*33
INH *32
CE
CL
DI
DO
KKKKK
I I I I I
5 4 3 2 1
S61
S62
S63
S64
PP
P
2 1
3
/ /
/
KKKKKKK
SSSSSSS
7 6 5 4 3 2 1
General-purpose output ports
used with the backlight controller
or other circuit
Key matrix
(up to 35 keys)
Note *29. Add a capacitor to the logic block power supply line so that the logic block power supply voltage VDD rise
time when power is applied and the logic block power supply voltage VDD fall time when power drops are
both at least 1 ms, as the LC75812PT is reset by the VDET.
*30. If a variable resistor is not used for display contrast fine adjustment, the VLCD4 pin must be connected to
ground.
*31. In RC oscillator operating mode, an external resistor, Rosc, and an external capacitor, Cosc, must be
connected between the OSC pin and ground. When selecting the external clock operating mode, connect a
current protection resistor Rg (2.2 to 22 k) between the OSC pin and the external clock output pin (external
oscillator). (See the “OSC Pin Peripheral Circuit” section.)
*32. If the function of INH pin is not used, the INH pin must be connected to the logic block power supply VDD.
*33. The DO pin, being an open-drain output, requires a pull-up resistor. Select a resistance (between 1 k and 10
k) appropriate for the capacitance of the external wiring so that signal waveforms are not degraded.
*34 When applying a 5 V signal to the CE, CL, DI, and INH pins, set the input voltage to 0 V if the logic block
power supply (VDD) is off and apply the 5 V signal to those pins after turning on the logic block power
supply (VDD).
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44
LC75812PT
Sample Correspondence between Instructions and the Display (When the LC75812PT-8565 is used)
LSB
No.
Instruction (hexadecimal)
D100 to
D104 to
D108 to
D112 to
D116 to
D99
D103
D107
D111
D115
D119
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
The display is in the off state.
Sets to 1/8 duty 1/4 bias display drive
0
technique
8
DCRAM data write (normal increment mode)
0
2
0
0
1
Writes the display data “ ” to DCRAM
address 00H
A
DCRAM data write (normal increment mode)
3
Writes the display data “S” to DCRAM
address 01H
5
DCRAM data write (normal increment mode)
1
Writes the display data “A” to DCRAM
address 02H
4
DCRAM data write (normal increment mode)
E
Writes the display data “N” to DCRAM
address 03H
4
DCRAM data write (normal increment mode)
9
Writes the display data “Y” to DCRAM
address 04H
5
DCRAM data write (normal increment mode)
F
Writes the display data “O” to DCRAM
address 05H
4
DCRAM data write (normal increment mode)
0
Writes the display data “ ” to DCRAM
address 06H
2
DCRAM data write (normal increment mode)
C
Writes the display data “L” to DCRAM
address 07H
4
DCRAM data write (normal increment mode)
3
Writes the display data “S” to DCRAM
address 08H
5
DCRAM data write (normal increment mode)
9
Writes the display data “I” to DCRAM
address 09H
4
DCRAM data write (normal increment mode)
0
Writes the display data “ ” to DCRAM
address 0AH
2
DCRAM data write (normal increment mode)
C
Writes the display data “L” to DCRAM
address 0BH
4
DCRAM data write (normal increment mode)
3
Writes the display data “C” to DCRAM
address 0CH
4
DCRAM data write (normal increment mode)
7
Writes the display data “7” to DCRAM
address 0DH
3
DCRAM data write (normal increment mode)
5
Writes the display data “5” to DCRAM
address 0EH
3
DCRAM data write (normal increment mode)
8
Writes the display data “8” to DCRAM
address 0FH
3
DCRAM data write (normal increment mode)
1
Writes the display data “1” to DCRAM
address 10H
3
DCRAM data write (normal increment mode)
2
Writes the display data “2” to DCRAM
address 11H
3
DCRAM data write (normal increment mode)
0
2
Operation
Initializes the IC.
Set display technique
2
4
Display
Power application
(Initialization with the VDET)
1
3
MSB
D96 to
0
Writes the display data “ ” to DCRAM
address 12H
A
Continued on next page.
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45
LC75812PT
Continued from preceding page.
LSB
No.
Instruction (hexadecimal)
D100 to
D104 to
D108 to
D112 to
D116 to
D99
D103
D107
D111
D115
D119
0
2
1
4
1
C
1
C
1
C
1
C
1
C
1
C
8
4
1
4
0
2
0
F
F
1
ADRAM address 0H into AC
SANYO
SANYO
Display shift
ANYO
Display shift
26
NYO
Display shift
27
YO
Display shift
28
O
Display shift
29
32
Operation
Loads the DCRAM address 00H and the
Display shift
25
31
0
Display on/off control
F
24
30
Display
Set AC address
22
23
MSB
D96 to
LSI
LSI
LSI
LC75
Shifts the display (MDATA only) to the left
LC758
Shifts the display (MDATA only) to the left
LC7581
Shifts the display (MDATA only) to the left
LC75812
Shifts the display (MDATA only) to the left
LC75812
Display on/off control
0
0
F
F
0
0
1
0
digits
LSI
Set AC address
0
Shifts the display (MDATA only) to the left
Set to sleep mode, turns off the LCD for all
Display on/off control
F
MDATA
Shifts the display (MDATA only) to the left
LSI
LSI
Turns on the LCD for all digits (13 digits) in
LC7
LSI
LSI
LC
LC75812
Turns on the LCD for all digits (13 digits) in
MDATA
SANYO
LSI
LC
Loads the DCRAM address 00H and the
ADRAM address 0H into AC
*35) The sample correspondence between the instructions and the display assumes the use of 13 digits1 row 57 dot
matrix LCD. Neither CGRAM nor ADRAM are used.
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46
LC75812PT
*36) Given below are the data formats of the "DCRAM data write" instructions (No. 3 to No. 21) for the sample
correspondence between the instructions and the display executed in the super increment mode. In the super
increment mode processing example shown below, 19 characters of DCRAM data is divided and written into
DCRAM in two operations.
Instruction (HEX)
No.
3 to 15
LSB
MSB
D0 to
D4 to
D8 to
D12 to
D16 to
D20 to
D24 to
D28 to
D32 to
D36 to
D40 to
D44 to
D3
D7
D11
D15
D19
D23
D27
D31
D35
D39
D43
D47
0
2
3
5
9
5
F
4
DCRAM data write (Super increment mode)
1
4
E
4
DCRAM data write (Super increment mode)
16 to 21
Instruction (HEX)
No.
3 to 15
LSB
MSB
D48 to
D52 to
D56 to
D60 to
D51
D55
D59
D63
D64 to
D68 to
D72 to
D76 to
D80 to
D84 to
D88 to
D92 to
D67
D71
D75
D79
D83
D87
D91
D95
0
2
C
4
1
3
2
3
DCRAM data write (Super increment mode)
0
2
C
4
7
3
3
5
9
4
DCRAM data write (Super increment mode)
16 to 21
5
3
8
3
Instruction (HEX)
No.
LSB
MSB
D96 to
D100 to
D99
D103
D104 to
D108 to
D112 to
D116 to
D107
D111
D115
D119
DCRAM data write
Display data “ ” “S” “A” “N” “Y” “O” “ ” “L” “S” “I” “ ” “L” “C”
(Super increment mode)
3 to 15
3
4
0
0
are written sequentially to DCRAM addresses 00H to
2
A
DCRAM data write
0
2
D
0
0CH.
Display data “7” “5” “8” “1” “2” “ ” are written sequentially
(Super increment mode)
16 to 21
Operation
2
A
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47
to DCRAM addresses 0DH to 12H.
LC75812PT
Notes on the controller key data read techniques
1. Timer based key data acquisition
Flowchart
CE=”L”
NO
DO=”L”
YES
Key data read
processing
Timing chart
Key on
Key on
Key input
Key scan
t5
t6
t5
t5
CE
DI
t8
Key
address
t7
t8
Key data read
t8
t7
t7
DO
Key data read request
t9
Controller
determination
(Key on)
t9
Controller
determination
(Key on)
t9
Controller
determination
(Key off)
t9
Controller
determination
(Key on)
Controller
Determination
(Key off)
t5: Key scan execution time when the key data agreed for two key scans. (4800T(s))
t6: Key scan execution time when the key data did not agree for two key scans and the key scan was
executed again. (9600T(s))
1
1
t7: Key address (43H) transfer time
T=
T=
fCK
fosc
t8: Key data read time
Explanation
In this technique, the controller uses a timer to determine key on/off states and read the key data. The controller
must check the DO state when CE is low every t9 period without fail. If DO is low, the controller recognizes that a
key has been pressed and executes the key data read operation.
The period t9 in this technique must satisfy the following condition.
t9>t6+t7+t8
When key data read operation is executed with DO set high (no key data read request present), the key data (KD1
to KD35) and sleep acknowledge data (SA) are invalid.
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LC75812PT
2. Interrupt based key data acquisition
Flowchart
CE=”L”
NO
DO=”L”
YES
Key data read
processing
Wait for at least t10
CE=”L”
NO
DO=”H”
YES
Key OFF
Timing chart
Key on
Key on
Key input
Key scan
t5
t5
CE
DI
t8
t8
Key
address
t7
t5
t6
Key data read
t8
t7
t8
t7
t7
DO
Key data read request
t10
Controller
determination
(Key on)
Controller
determination
(Key off)
t10
Controller
determination
(Key on)
Controller
determination
(Key on)
t10
Controller
determination
(Key on)
t10
Controller
determination
(Key off)
t5: Key scan execution time when the key data agreed for two key scans. (4800T(s))
t6: Key scan execution time when the key data did not agree for two key scans and the key scan was
executed again. (9600T(s))
1
1
t7: Key address (43H) transfer time
T=
T=
fCK
fosc
t8: Key data read time
Explanation
In this technique, the controller uses interrupts to determine key on/off states and read the key data. The controller
must check the DO state when CE is low. If DO is low, the controller recognizes that a key has been pressed and
executes the key data read operation. After that the next key on/off determination is performed after the time t10
has elapsed by checking the DO state when CE is low and reading the key data. The period t10 in this technique
must satisfy the following condition.
t10 > t6
When key data read operation is executed with DO set high (no key data read request present), the key data (KD1
to KD35) and sleep acknowledge data (SA) are invalid.
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LC75812PT
About Data Communication Method with The Controller
1. About data communication method of 4 line type CCB format
The 4 line type CCB format is the data communication method of before. The LC75812PT must connect to the
controller as followings.
*38
(INT)
Controller
*37
Rup
DI
DO
DO
DI
CL
CL
CE
CE
LC75812PT
Note: *37. Connect the pull-up resistor Rup. Select a resistance
(between 1 to 10k) appropriate for the capacitance of the
external wiring so that signal waveforms are not degraded.
*38. The (INT) pin is an input port for the key data read request
signal (a low level on DO) detection.
2. About data communication method of 3 line type CCB format
The 3 line type CCB format is the data communication method that made a common use of the data input DI in the
data output DO. The LC75812PT must connect to the controller as followings.
*38
(INT)
*37
Rup
DIO
DO
Controller
DI
CL
CL
CE
CE
LC75812PT
Note: *37. Connect the pull-up resistor Rup. Select a resistance
(between 1 to 10k) appropriate for the capacitance of the
external wiring so that signal waveforms are not degraded.
*38. The (INT) pin is an input port for the key data read request
signal (a low level on DO) detection.
In this case, Applications must transfer the data communication start command before the serial data input (CCB
address “42H”, display data and control data transfer) or serial data output (CCB address “43H” transfer, key data read)
to avoid the collision of the data input signal DI and the data output signal DO.
Then applications must transfer the data communication stop command when the controller wants to detect the key data
read request signal (a low level on DO) during a movement stop of the serial data input and the serial data output.
1 Data communication start command
(1) When CL is stoped at the low level
(2) When CL is stoped at the high level
CE
CE
CL
CL
DI/DO
0 0 0 0 0 0 0 0
0
CCB address “00H”
DI/DO
0 1 1 0 1 1 1
Command data
CE
CL
CL
CCB address “00H”
1
0 0 1 1 0 1 1 1
Command data
(2) When CL is stoped at the high level
CE
0 0 0 0 0 0 0 0
0
CCB address “00H”
2 Data communication stop command
(1) When CL is stoped at the low level
DI/DO
0 0 0 0 0 0 0
DI/DO
1 0 0 0 1 1 1
0 0 0 0 0 0 0
CCB address “00H”
Command data
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50
0
1 1 0 0 0 1 1 1
Command data
LC75812PT
Data Communication Flowchart of 4 Line Type or 3 Line Type CCB Format
1. Flowchart of the initial setting when power is turned on.
Power on
(Applications must observe that the power
supply VDD rise time is at least 1ms.)
Power supply stability
(Applications must wait till the level of
the power supply is stable)
Serial data input
(Execute instructions)
Note: The flowchart for power-on time initialization is the same for the
4- and 3-wire CCB formats. See "Power Supply Sequence" and
"System Reset."
System reset clear
(Display on, Key scanning is enabled,
General-purpose output port state
setting are enabled)
2. Flowchart of the serial data input
Data communication start
command transfer
*39
Serial data input
(Execute instructions)
NO
The controller
wants to detect the key
data read request signal
(a low level on DO).
Note: *39. In the case of the 4 line type CCB format,
the transfers of data communication start
command and data communication stop
command are unnecessary, and, in the case
of the 3 line type CCB format, these transfers
are necessary.
YES
Data communication stop
command transfer
*39
3. Flowchart of the serial data output
NO
The controller
acknowledges the key data read
request (When the CE is low,
the DO is low)
Note: *40. In the case of the 4 line type CCB format,
the transfer of data communication start
command is unnecessary, and, in the case
of the 3 line type CCB format, the transfer
is necessary.
*41. Because the serial data output has the role
of the data communication stop command,
it is not necessary to transfer the data
communication stop command some other
time.
YES
Data communication start
command transfer
*40
Serial data output
(Key data and sleep
acknowledge data read)
*41
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51
LC75812PT
Timing Chart of 4 Line Type and 3 Line Type CCB Format
1. Timing chart of 4 line type CCB format
Example 1
Key on
Key off
Key input
Key scan
Key scan execution
*42
CE
CCB address
(42H)
Key scan execution
*42
CCB address CCB address
(42H)
(42H)
CCB address
(43H)
DI
DO
Serial data input
(Execute instructions)
Serial data output
(Key data read)
Key data read
request
Key data read
request
Example 2
Key input
Key off
Key off
Key on
Key on
Key scan
Key scan execution
*42
Key scan execution *42
CE
CCB address
(42H)
CCB address CCB address
(42H)
(42H)
CCB address
(43H)
CCB address
(43H)
DI
DO
Serial data input
(Execute instructions)
Serial data output
(Key data read)
Key data read
request
Serial data output
(Key data read)
Key data read
request
Example 3
Key on
Key input
Key off
Key off
Key scan
CE
Key scan execution
*42
Key scan execution
*42
CCB address
(42H)
CCB address CCB address
(42H)
(42H)
CCB address
(43H)
CCB address
(43H)
DI
DO
Key data read
request
Serial data input
(Execute instructions)
Serial data output
(Key data read)
Key data read
request
Note: *42. When the key data agrees for two key scans, the key scan execution time is 4800T[s].
And, when the key data does not agree for two key scans and the key scan is executed
again, the key scan execution time is 9600T[s].
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52
T=
1
fosc
Serial data output
(Key data read)
1
T= f
CK
LC75812PT
2. Timing chart of 3 line type CCB format
Example 1
Key on
Key off
Key input
Key scan
Key scan execution
*42
CE
CCB address
(42H)
CCB address
(42H)
CCB address
(42H)
Key scan execution
*42
CCB address
(43H)
DI/DO
Data communication
start command
Serial data input
(Execute instructions)
Data communication
stop command
Data
communication
start command
Key data read
request
Serial data
output
(Key data
read)
Key data read
request
Example 2
Key on
Key on
Key off
Key input
Key off
Key scan
Key scan execution *42
Key scan execution
*42
CE
CCB address
(42H)
CCB address
(42H)
CCB address
(42H)
CCB address
(43H)
CCB address
(43H)
DI/DO
Data communication
start command
Serial data input
(Execute instructions)
Data
communication
stop command
Data
communication
start command
Key data read
request
Serial data
Data
output
communication
(Key data
start command
read)
Key data read
request
Serial data
output
(Key data
read)
Example 3
Key on
Key input
Key off
Key off
Key scan
CE
Key scan execution
*42
Key scan execution
*42
CCB address
(42H)
CCB address CCB address CCB address
(42H)
(42H)
(43H)
CCB address
(43H)
DI/DO
Data
communication
start command
Serial data input
(Execute instructions)
Key data read
request
Serial data
output
(Key data
read)
Data
communication
start command
Key data read
request
Note: *42. When the key data agrees for two key scans, the key scan execution time is 4800T[s].
And, when the key data does not agree for two key scans and the key scan is executed
again, the key scan execution time is 9600T[s].
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53
T=
1
fosc
Serial data
output
(Key data
read)
1
T= f
CK
Upper
4BIT
(4)
(5)
(6)
0011
0100
0101
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
0111
1000
1001
1010
1011
1100
1101
1110
1111
(7)
(3)
0010
0110
(2)
MSB
0000
CG
RAM(1)
0001
0000
LSB
Lower
4BIT
0001
(
E
5
%
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54
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.
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$
6
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3
#
&
B
2
@
0100
A
0
0011
1
!
0010
LC75812PT-8565 Character Font (Standard)
[
_
Z
]
Y
X
W
V
U
T
S
R
Q
P
0101
Î
Ï
Í
Ì
ij
i
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IJ
g
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£
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e
å
a
Å
ã
s
Ü
Ù
S
Û
Ú
õ
Ö
Ò
Õ
G
o
Ë
È
Ô
Ê
É
Ó
Ä
Â
1111
À
Á
1110
ç
1101
Ç
1100
Ã
ü
ù
1011
ñ
û
ú
1010
Ñ
ö
ô
ï
ò
ó
ì
î
ë
è
í
ê
ä
à
é
â
1001
á
1000
m
l
k
z
y
i
j
x
w
v
u
t
s
r
q
p
0111
h
g
f
e
d
c
b
a
0110
LC75812PT
LC75812PT
ORDERING INFORMATION
Device
Package
Shipping (Qty / Packing)
LC75812PT-8565-H
TQFP100 14x14 / TQFP100
(Pb-Free / Halogen Free)
90 / Tray JEDEC
LC75812PTH-8565-H
TQFP100 14x14 / TQFP100
(Pb-Free / Halogen Free)
450 / Tray JEDEC
LC75812PTS-8565-H
TQFP100 14x14 / TQFP100
(Pb-Free / Halogen Free)
450 / Tray JEDEC
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