Material Content Data Sheet Sales Product Name BSZ018NE2LS MA# MA001336490 Package PG-TSDSON-8-26 Issued 19. February 2015 Weight* 36.78 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper phosphorus zinc iron copper 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7723-14-0 7440-66-6 7439-89-6 7440-50-8 0.671 1.82 0.002 0.01 0.010 0.03 267 0.197 0.53 5349 7.988 21.72 22.29 217175 222858 0.028 0.07 0.07 748 748 0.037 0.10 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.82 18243 18243 67 999 1.893 5.15 16.451 44.74 49.99 447237 499706 0.395 1.07 1.07 10746 10746 0.020 0.06 0.06 552 552 0.024 0.06 0.019 0.05 0.912 2.48 0.001 0.00 0.005 0.01 128 0.094 0.26 2555 3.816 10.37 0.001 0.00 0.005 0.01 138 0.101 0.28 2753 4.112 11.18 51470 649 519 2.59 24797 10.64 103741 2. 3. 11.47 111801 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 106456 34 Important Remarks: 1. 25965 32 114726 1000000