AIC AIC1730-18 150ma, low noise, low dropout linear regulator Datasheet

AIC1730
150mA, Low Noise, Low Dropout Linear Regulator
„ FEATURES
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„ DESCRIPTION
Very Low Quiescent Current, 55μA
Very Low Dropout Voltage, 90mV @ 50mA.
Short Circuit and Thermal Protection.
Available in ±2% Output Tolerance.
1.8V to 3.3V Output Voltage with 0.1V Increment.
Active Low Shutdown Control.
Low Noise.
Low Profile Package: SOT-23-5
The AIC1730 is a low noise, low dropout linear
regulator, and is housed in a small SOT-23-5
package. The device is in the “ON” state when
the SHDN pin is set to logic high level. A low
dropout voltage of 90mV at 50mA load current is
performed. It offers high precision output voltage
of ±2%. The quality of low quiescent current and
„ APPLICATIONS
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low dropout voltage makes this device ideal for
battery power applications. The internal reverse
Cellular Telephones.
Pagers.
Personal Communication Equipment.
Cordless Telephones.
Portable Instrumentation.
Portable Consumer Equipment.
Radio Control Systems.
Low Voltage Systems.
Battery Powered Systems.
bias protection eliminates the requirement for a
reverse voltage protection diode. The high ripple
rejection and low noise provide enhanced
performance for critical applications. The noise
bypass pin can be connected an external
capacitor to reduce the output noise level.
„ TYPICAL APPLICATION CIRCUIT
VIN
VIN
CIN
VOUT
+
+
1μF
GND
VOUT
COUT
1μF
BP
SHDN
CBP
V SHDN
AIC1730
0.1μF
Low Noise Low Dropout Linear Regulator
Analog Integrations Corporation
Si-Soft Research Center
DS-1730G-01
20100118
3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
1
AIC1730
„ ORDERING INFORMATION
AIC1730-XXXXXX
PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
BG: BAG
PACKAGE TYPE
V: SOT-23-5
C: COMMERCIAL
P: LEAD FREE COMMERCIAL
G:GREEN PACKAGE
SOT-23-5
TOP VIEW
1: VIN
2: GND
3: SH DN
4: BP
5: VOUT
4
5
1
2
3
OUTPU T VOLTAGE
18: 1.8V
:
285: 2.85V
:
33: 3.3V
The output voltage is available by 0.1V per step.
Example: AIC1730-18CVTR
Æ 1.8V version in SOT-23-5 Package & Taping & Reel Packing Type
AIC1730-18PVTR
Æ
1.8V version in SOT-23-5 Lead Free Package & Taping & Reel Packing Type
AIC1730-18GVTR
Æ
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1.8V version in SOT-23-5 Green Package & Taping & Reel Packing Type
SOT-23-5 Marking
Part No.
AIC1730-18
AIC1730-19
AIC1730-20
AIC1730-21
AIC1730-22
AIC1730-23
AIC1730-24
AIC1730-25
AIC1730-26
CV
EC18
EC19
EC20
EC21
EC22
EC23
EC24
EC25
EC26
PV
EC18P
EC19P
EC20P
EC21P
EC22P
EC23P
EC24P
EC25P
EC26P
GV
EC18G
EC19G
EC20G
EC21G
EC22G
EC23G
EC24G
EC25G
EC26G
Part No.
AIC1730-27
AIC1730-28
AIC1730-285
AIC1730-29
AIC1730-30
AIC1730-31
AIC1730-32
AIC1730-33
CV
EC27
EC28
EC2J
EC29
EC30
EC31
EC32
EC33
PV
EC27P
EC28P
EC2JP
EC29P
EC30P
EC31P
EC32P
EC33P
GV
EC27G
EC28G
EC2JG
EC29G
EC30G
EC31G
EC32G
EC33G
2
AIC1730
„ ABSOLUTE MAXIMUM RATINGS
Supply Voltage
12V
Shutdown Terminal Voltage
12V
Noise Bypass Terminal Voltage
5V
Operating Temperature Range
-40ºC~85ºC
Maximum Junction Temperature
125°C
Storage Temperature Range
.-65ºC~150ºC
Lead Temperature (Soldering, 10 sec)
260°C
Thermal Resistance Junction to Case
SOT-23-5
.130°C /W
Thermal Resistance Junction to Ambient
SOT-23-5
..220°C /W
(Assume no ambient airflow, no heatsink)
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
„
TEST CIRCUIT
Refer to TYPICAL APPLICATION CIRCUIT
3
AIC1730
„
ELECTRICAL CHARACTERISTICS
(CIN=1μF, COUT=10μF, TJ=25°C, unless otherwise specified) (Note1)
PARAMETER
TEST CONDITIONS
SYMBOL
Quiescent Current
IOUT = 0mA, VIN = 3.6~12V
IQ
Standby Current
VIN = 3.6~8V, output OFF
ISTBY
GND Pin Current
IOUT = 0.1~150mA
IGND
Continuous Output Current
VIN = VOUT + 1V
IOUT
Output Current Limit
VIN = VOUT + 1V, VOUT = 0V
Output Voltage Tolerance
VIN = VOUT + 1V, no load
Temperature Coefficient
Line Regulation
VIN = VOUT(TYP) + 1V to
VOUT(TYP) + 6V
Load Regulation
VIN = 5V,
IOUT = 0.1~150mA
MIN.
IOUT = 100 mA VOUT≥2.5V
IIL
150
VOUT
-2
IOUT=150 mA
VOUT <2.5V
Noise Bypass Terminal Voltage
Output Noise
CBP = 0.1μF, f = 1KHz
UNIT
55
80
μA
0.1
μA
80
μA
150
mA
220
mA
2
%
TC
50
150
ppm/ºC
ΔVLIR
2
7
mV
ΔVLOR
7
25
mV
90
160
mV
140
230
mV
200
350
mV
700
mV
VDROP1
IOUT = 150 mA
Dropout Voltage (2)
MAX.
55
IOUT = 50 mA
Dropout Voltage (1)
TYP.
VDROP2
VREF
1.23
Δn
0.46
V
μV
Hz
VIN = 5V
SHUTDOWN TERMINAL SPECIFICATIONS
Shutdown Pin Current
I SHDN
Shutdown Pin Voltage (ON)
Output ON
V SHDN
(ON)
Shutdown Pin Voltage (OFF)
Output OFF
V SHDN
(OFF)
Shutdown Exit Delay Time
CBP = 0.1μF, COUT = 1μF,
IOUT=30mA
0.1
1.6
μA
V
0.6
V
Δt
300
μS
TSD
155
ºC
THYST
20
ºC
THERMAL PROTECTION
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Guaranteed by design
Note 1: Specifications are production tested at TA=25°C. Specifications over the -40°C to 85°C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
4
AIC1730
„
TYPICAL PERFORMANCE CHARACTERISTICS
IOUT=1mA,CBP=0.1μF
IOUT=1mA,CBP=0.1μF
COUT=10μF
COUT=1μF
VOUT
VOUT
50mV/DIV
50mV/DIV
VOUT+3V
VOUT+3V
VOUT+1V
VOUT+1V
VIN
VIN
2V/DIV
2V/DIV
Time (100μS/DIV)
TIME (100μS/DIV)
Fig. 1 Line Transient Response
Fig. 2 Line Transient Response
IOUT=1mA,CBP=1μF
IOUT=1mA,CBP=1μF
COUT=1μF
COUT=10μF
VOUT
VOUT
50mV/DIV
50mV/DIV
VOUT+3V
VOUT+1V
VOUT+3V
VIN
VOUT+1V
VIN
2V/DIV
2V/DIV
Time (100μS/DIV)
Time (100μS/DIV)
Fig. 3 Line Transient Response
Fig. 4 Line Transient Response
IOUT=30mA,CBP=0.01μF
VOUT
IOUT=30mA,CBP=0.1μF
VOUT
COUT=3.3μF
2V/DIV
COUT=3.3μF
2V/DIV
Time (250μS/DIV)
Fig. 5
Shutdown Exit Delay
VSHDN
VSHDN
2V/DIV
2V/DIV
Time (250μS/DIV)
Fig. 6 Shutdown Exit Delay
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AIC1730
„
TYPICAL PERFORMANCE CHARACTERISTICS
IOUT=10mA,CBP=0.1μF
VOUT
COUT=1μF
2V/DIV
(Continued)
IOUT=10mA,CBP=0.1μF
VOUT
COUT=10μF
2V/DIV
VSHDN
VSHDN
2V/DIV
2V/DIV
Time (250μS/DIV)
TIME (250μS/DIV)
Fig. 7 Shutdown Exit Delay
Fig. 8 Shutdown Exit Delay
CBP=0.1μF
CBP=0.1μF
COUT=1μF
COUT=10μF
VOUT
VOUT
20mV/DIV
20mV/DIV
IOUT=60mA
IOUT=60mA
IOUT=0mA
IOUT=0mA
IOUT
IOUT
TIME (1mS/DIV)
Time (1mS/DIV)
Fig. 9
Fig. 10 Load Transient Response
Load Transient Response
CBP=0.1μF
CBP=0.1μF
COUT=1μF
COUT=10μF
VOUT
VOUT
20mV/DIV
20mV/DIV
IOUT=90mA
IOUT=90mA
IOUT=0mA
IOUT=0mA
IOUT
IOUT
Time (1mS/DIV)
Fig. 11
Load Transient Response
Time (1mS/DIV)
Fig. 12 Load Transient Response
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AIC1730
TYPICAL PERFORMANCE CHARACTERISTICS
250
(Continued)
500
AIC1730-20
450
VOUT=3.0V
200
400
vDROP (mV)
VDROP (mV)
350
150
100
300
250
200
150
50
100
50
0
0
50
100
0
150
20
0
40
60
Fig. 14
Fig. 13 Dropout Voltage vs. Output Current
70
100
120
140
Dropout Voltage vs. Output Current
80
IOUT=50mA
70
60
IOUT=0mA
50
60
50
40
IQ (μA)
IGND (uA)
80
ILOAD (mA)
IOUT (mA)
30
IOUT=0mA
40
30
20
20
10
10
0
0
0
1
2
3
4
5
6
0
2
4
6
Fig. 15
8
10
12
14
16
VIN (V)
VIN (V)
Ground Current vs. Input Voltage (VOUT=3.0V)
Fig. 16
Quiescent Current (ON Mode) vs. Input Voltage
2.0
70
IOUT=90mA
68
66
1.5
64
Output ON
IOUT=60mA
62
60
VSHDN (V)
IGND (mA)
„
IOUT=30mA
58
56
1.0
0.5
54
Output
52
50
-40
0.0
-20
0
20
40
60
80
100
120
140
160
-40
0
TA (°C)
Fig. 17
Ground Current vs. Temperature
40
80
120
TA (°C)
Fig. 18
Shutdown Voltage vs. Temperature
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AIC1730
„
TYPICAL PERFORMANCE CHARACTERISTICS
400
(Continued)
70
65
IGND (μA)
IOUT (mA)
300
200
60
VOUT is connected to GND
100
0
0
2
4
6
55
8
0
50
Fig. 19
„
100
150
IOUT (mA)
VIN (V)
Short Circuit Current vs. Input Voltage
Fig. 20
Ground Current vs. Output Current
BLOCK DIAGRAM
VIN
Current
Limiting
BP
VREF
1.23V
SHDN
Power
Shutdown
+
Error
Amp.
VOUT
Thermal
Limiting
GND
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AIC1730
„
PIN DESCRIPTIONS
PIN 1 : VIN
Power supply input pin. Bypass
with a 1μF capacitor to GND
PIN 2 : GND - Ground pin.
PIN 3 : SHDN - Active-Low shutdown input pin.
PIN 4 : BP
- Noise bypass pin. An external
bypass capacitor connecting to
„
-
BP pin to reduce noises at the
output.
PIN 5 : VOUT - Output pin. Sources up to 150
mA.
DETAILED DESCRIPTION OF TECHNICAL TERMS
DROPOUT VOLTAGE (VDROP)
GROUND CURRENT (IGND)
The dropout voltage is defined as the difference
Ground current is the current flowing through the
between the input voltage and output voltage at
ground pin with output load.
which the output voltage drops 100mV. Below
this value, the output voltage will fall as the input
voltage reduces. It depends on the load current
and junction temperature.
LINE REGULATION
Line regulation is the ability of the regulator to
maintain a constant output voltage as the input
voltage changes. The line regulation is specified
as the input voltage changes from VIN = VOUT + 1V
STANDBY CURRENT (ISTBY)
Standby current is the current flowing into the
regulator when the output is shutdown by setting
V SHDN at 0V and VIN at 8 V.
CURRENT LIMIT (IIL)
Current limiting of AIC1730 monitors and controls
the maximum output current, in case of a shorted
output. It protects device from the damage
resulting from any unexpected current.
to VIN = 8V and IOUT = 1mA.
LOAD REGULATION
Load regulation is the ability of the regulator to
maintain a constant output voltage as the load
current changes. A pulsed measurement with an
input voltage set to VIN = VOUT + VDROP can
minimize temperature effects. The load regulation
is specified by the output current ranging from
0.1mA to 150mA.
THERMAL PROTECTION
Thermal
sensor
protects
device
when
the
junction temperature exceeds TJ= +155ºC. It
signals shutdown logic, turning off pass transistor
and allowing IC to cool down. After the IC’s
junction temperature cools by 20ºC, the thermal
sensor will turn the pass transistor back on.
Thermal protection is designed to protect the
device in the event of fault conditions. For a
QUIESCENT CURRENT (IQ)
continuous operation, do not exceed the absolute
Quiescent current is the current flowing through
maximum junction-temperature rating of TJ=
ground pin with no output load.
150ºC, or damage may occur to the device.
9
AIC1730
„
APPLICATION INFORMATION
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output
capacitors to maintain stability. Input capacitor
at 1μF with 1uF aluminum electrolytic output
capacitor is recommended. And it should be
selected within the Equivalent Series Resistance
(ESR) range as shown in the figure 21, 22, 23,
and 24. ESR of ceramic capacitor is lower and
its electrical characteristics (capacitance and
ESR) vary widely over temperature. In general,
tantalum
or
electric
output
capacitor
is
and circuit board, the temperature difference
between the die junction and ambient air, and
the rate of airflow. The rate of temperature rise is
greatly affected by the mounting pad
configuration on the PCB, the board material,
and the ambient temperature. When the IC
mounting with good thermal conductivity is used,
the junction temperature will be low even when
large power dissipation applies.
The power dissipation across the device is
P = IOUT (VIN-VOUT).
The maximum power dissipation is:
PMAX =
(TJ − TA)
(RθJB + RθBA)
suggested for heavy load.
Normally, the output capacitor should be 1μF
(aluminum electrolytic) at least and rates for
operating temperature range. Note that it’s
important
to
check
selected
manufactures
electrical characteristics (capacitance and ESR)
over temperature.
NOISE BYPASS CAPACITOR
0.1μF bypass capacitor at BP pin reduces output
voltage noise. And the BP pin has to connect a
capacitor to GND.
Where TJ-TA is the temperature difference
between the die junction and the surrounding air,
RθJB is the thermal resistance of the package,
and RθBA is the thermal resistance through the
PCB, copper traces, and other materials to the
surrounding air.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
GND pin performs a dual function of providing
an
electrical
connection
to
ground
and
channeling heat away. Therefore, connecting the
POWER DISSIPATION
GND pin to ground with a large pad or ground
The maximum power dissipation of AIC1742
depends on the thermal resistance of its case
plane would increase the power dissipation and
reduce the device temperature.
10
AIC1730
100
100
COUT=1μF
COUT=2.2μF
10
1
ESR (Ω)
ESR(Ω)
10
STABLE REGION
1
Stable Region
0.1
0.1
0.01
50
100
IOUT (mA)
Fig. 21
150
0.01
50
Max Power Dissipation, COUT=1μF
Fig. 22
100
IOUT (mA)
100
150
Max Power Dissipation, COUT=2.2μF
100
COUT=10μF
COUT=3.3μF
10
ESR(Ω)
ESR(Ω)
10
1
1
Stable Region
Stable Region
0.1
0.1
0.01
100
50
150
0.01
Fig. 23
Max Power Dissipation, COUT=3.3μF
100
50
150
IOUT (mA)
IOUT (mA)
Fig. 24
Max Power Dissipation, COUT=10μF
11
AIC1730
PHYSICAL DIMENSIONS
z
SOT-23-5
(unit: mm)
D
A
A
E
E1
S
Y
M
B
O
L
e
e1
SEE VIEW B
c
A
A2
MAX.
0.95
1.45
A1
0.05
0.15
A2
0.90
1.30
b
0.30
0.50
c
0.08
0.22
D
2.80
3.00
E
2.60
3.00
E1
1.50
1.70
e
0.95 BSC
e1
1.90 BSC
0.30
L1
WITH PLATING
q
0.60
0.60 REF
0°
8°
SECTION A-A
0.25
A1
BASE METAL
MIN.
A
L
b
SOT-23-5
MILLIMETERS
GAUGE PLANE
SEATING PLANE
L
L1
θ
„
VIEW B
Note : 1. Refer to JEDEC MO-178AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 10 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any
circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties
that may result from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose
failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected
to result in a significant injury to the user.
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