HSMx-C130 Surface Mount ChipLEDs Data Sheet Description Features The HSMx-C130 ChipLeds are designed specially for the membrane switch application. The request is to have as low as possible while retaining the footprint at the optimal size of a 0603 (1.6 x 0.8 mm) device. Apart from the membrane switch application, the HSMx-C130 is also suitable for use in applications where low height is required. x High brightness AlInGaP material These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. x Compatible with IR soldering Four different colors are available: amber, red, green, and orange. All parts are intensity binned and color binned (except for red color). They come in 8 mm conductive tape on a 7 inch diameter reel with 4000 units per reel which make them compatible for automatic placement. x Small size with extremely low profile x 0603 industry standard footprint with 0.35mm height x Diffused optics x Operating range of -40qC to 85qC x Available in 4 colors x Available in 8 mm conductive tape on 7” diameter reel x Reel sealed in zip locked moisture barrier bags Applications x Membrane switch indicator x LCD backlighting x Push button backlighting x Front panel indicator x Symbol backlighting x Keypad backlighting CAUTION: HSMx-C130 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK LED DIE 0.8 (0.031) (0.80) 1.6 (0.063 ) POLARITY 1.15 (0.045) 0.23 (0.009) DIFFUSED EPOXY 0.35 (0.014) PCB BOARD 0.12 (0.005) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS +/-0.1 mm (+/-0.004 IN.) UNLESS OTHERWISE SPECIFIED. Device Selection Guide 2 Part Number Color Die Technology Parts per Reel Package Description HSMA-C130 Amber AlInGaP 4000 Untinted, Diffused HSMC-C130 Red AlInGaP 4000 Untinted, Diffused HSME-C130 Yellow Green AlInGaP 4000 Untinted, Diffused HSML-C130 Orange AlInGaP 4000 Untinted, Diffused Absolute Maximum Ratings at TA = 25qC Parameter AlInGaP Units DC Forward Current [1] 20 mA Power Dissipation 48 mW Reverse Voltage (IR = 100PA) 5 V 95 °C LED Junction Temperature Operating Temperature Range -40 to +85qC Storage Temperature Range -40 to +85 qC Soldering Temperature See reflow soldering profile (Figure 5 & 6) Notes: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) @ IF = 20mA Reverse Breakdown VR (Volts) @ IR = 100PA Thermal Resistance RTJP (qC/W) Typical Part Number Typ. Max. Min. HSMA-C130 2.05 2.40 5 500 HSMC-C130 1.94 2.40 5 500 HSME-C130 1.94 2.40 5 500 HSML-C130 1.94 2.40 5 500 Optical Characteristics at TA = 25°C Luminous Intensity IV [1] (mcd) @ 20mA Part Number Min. Typ. Peak Wavelength Opeak (nm) Typical Color, Dominant Wavelength Od [2] (nm) Typical Viewing Angle 2 T1/2 [3] (Degrees) Typical HSMA-C130 28.5 87.0 591 589 110 HSMC-C130 28.5 131.0 635 626 110 HSME-C130 18.0 54.0 575 573 110 HSML-C130 28.5 139.0 612 606 110 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, Od are derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. O1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. 3 Light Intensity (IV) Bin Limits AlInGaP Red Color Bin Limits Intensity (mcd) Bin ID Minimum Dominant Wavelength (nm) Maximum Bin ID Minimum Maximum - 620.0 635.0 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 Tolerance : ±15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. Forward Voltage Limits Forward Voltage (V) Tolerance : ± 1nm AlInGaP Yellow Green Color Bin Limits Dominant Wavelength (nm) Bin ID Minimum Maximum A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance : ± 1nm Bin ID Minimum Maximum 1 1.60 1.80 2 1.80 2.00 3 2.00 2.20 Bin ID Minimum Maximum 4 2.20 2.40 A 597.0 600.0 Tolerance : ± 0.1V B 600.0 603.0 C 603.0 606.0 AlInGaP Amber Color Bin Limits D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 Dominant Wavelength (nm) Bin ID Minimum Maximum A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Tolerance : ±1nm 4 AlInGaP Orange Color Bin Limits Dominant Wavelength (nm) Tolerance : ± 1nm Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. 1.2 100 FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1 0.8 0.6 0.4 10 1 0.2 0.1 1.5 0 0 5 10 15 DC FORWARD CURRENT - mA 20 25 Yellow Green 0.9 Orange Amber Recommended Derating Curve (20mA) MAXIMUM FORWARD CURRENT - mA RELATIVE INTENSITY 0.6 0.5 0.4 0.3 0.2 0.1 560 580 600 620 640 660 680 WAVELENGTH - nm NORMALIZED INTENSITY Figure 3. Relative Intensity vs. Peak Wavelength 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation Pattern 5 2.3 25 Red 0.7 540 2.1 Figure 2. Forward Current vs. Forward Voltage 0.8 0.0 520 1.9 FORWARD VOLTAGE - V Figure 1. Luminous Intensity vs. Forward Current 1.0 1.7 20 15 10 5 0 0 20 40 60 AMBIENT TEMPERATURE - °C 80 Figure 4. Maximum DC Forward Current vs. Ambient Temperature 60 90 100 10 SEC. MAX. TEMPERATURE TEMPERATURE (°C) 10 SEC. MAX. 230 °C MAX. 4 °C/SEC. MAX. 140-160 °C –3 °C/SEC. MAX. 4 °C/SEC. MAX. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 60 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 7. Recommended Pb Free Reflow Soldering Profile Figure 6. Recommended Leaded Reflow Soldering Profile 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 8. Recommended Soldering Land Pattern Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling Orientation 6 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Figure 10. Reel Dimensions 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) TABLE 1 PART NUMBER HSMx-C130 DIM. A ± 0.10 (± 0.004) 1.75 (0.069) DIMENSIONS IN MILLIMETERS (INCHES) Figure 11. Tape Dimensions 7 COVER TAPE DIM. B ± 0.10 (± 0.004) 0.90 (0.035) DIM. C ± 0.10 (± 0.004) 0.60 (0.024) END START THERE SHALL BE A MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 150 mm-360 mm (5.9 - 14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 12. Tape leader and trailer dimensions Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 168 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-0484EN - November 23, 2010