Material Content Data Sheet Sales Product Name BSS306N H6327 MA# MA000933192 Package PG-SOT23-3-5 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material non noble metal inorganic material non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% tin gold silicon chromium silicon titanium copper copper carbon black epoxy resin silicondioxide tin silver 7440-31-5 7440-57-5 7440-21-3 7440-47-3 7440-21-3 7440-32-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 9.42 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.004 0.05 468 0.017 0.18 1816 0.261 2.77 0.009 0.10 0.001 0.01 64 0.003 0.03 320 3.000 31.86 32.00 318553 319897 0.073 0.77 0.77 7722 7722 0.056 0.60 1.208 12.82 4.353 46.20 59.62 462137 596306 0.150 1.59 1.59 15887 15887 0.284 3.02 3.02 30197 3.00 27707 2. 3. 5963 128206 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 29991 960 Important Remarks: 1. Sum [ppm] 30197 1000000