SPSEMI ASC33A Glass passivated chip Datasheet

AUTO
AUTOTVS/ASC
TVS/PK
) Series
ASC Series
Features
> Glass passivated chip
> 10KW peak pulse power capability with a
10/1000 ȝs waveform, repetitive rate (duty
cycle):0.01 %
> Meet AEC-Q101 requirement
> Low leakage
> Uni-directional polarity
> Excellent clamping capability
> Very fast response time
> RoHS compliant
Mechanical Data
> Plastic package DO-218AB/SOD-BLOCK
> Epoxy: UL 94V-0 rate flame retardant
> Polarity: Heatsink is anode
IEC Compatibility
> ISO 16750-2 Test A 24v System (202V 4Ω 350ms 10c)
Electrical Characteristics
Maximum
Working
Breakdown Voltage VBR @I T
Reverse
Part Number Peak Reverse
Leakage IR
Voltage VRWM
(Uni)
Min(V) Max(V)
IT(mA)
(V)
@VRWM(uA)
Maximum
Maximu
IR@VRWM Reverse Surge
TJ=175
Current I PP
(1)
(uA)
(A)
Maximum
Clamping
Voltage
VC@I PP (V)
ASC30A
30
33.3
36.8
5
10
150
206.6
48.4
ASC33A
33
36.7
40.6
5
10
150
187.6
53.3
ASC36A
36
40.0
44.2
5
10
150
172.1
58.1
ASC40A
40
44.4
49.1
5
10
150
155.0
64.5
NOTE: Surge current waveform is defined at 10/1000uS waveform
REV.2016.01.04
01 | www.spsemi.cn
AUTO
AUTOTVS/ASC
TVS/PK
) Series
ASC Series
Max imum Ratings(TA=25ɗunless otherwise noted)
Symbol
PPP
Parameter
Peak power dissipation with a 10/1000 ȝs waveform (1)
Peak pulse current wih a 10/1000 ȝs waveform (1)
Power dissipation on infinite heatsink at TL= 25 °C
Value
10
UNIT
KW
I PP
See above Table
PD
8.0
I FSM
700
TJ , TSTG
–55 to +175
Peak forward surge current 8.3 ms single half sineOperating junction and storage temperature range
A
W
A
°C
Note:
(1)Non-repetitive current pulse per Fig.2 and derated above TA = 25 °C per Fig.1
AMBIENAVERAGE FORWARD CURRENT, (A)
100
0
25
100
175
0
75
100
50
25
0
unless otherwise noted)
Tr=10ȝs
100
Peak Pulse Current , (% )
Peak Pulse Derating in Percentage of Peak
Power or Current, (%)
Ratings and Characteristics Curves (TA =25ɗ
Peak Value
(Ipp)
Half Value = Ipp
2
50
10/1000 ȝsec. Waveform
td
0
0
25
50
75
100
125
150
175
200
0
1
Ambient Temperature ,TA (ɗ)
Fig. 1 - Pulse Derating Curve
0
4.0
2.0
0
25
50
75
100
125
150
175
Lead Temperature , TL (ɗ)
Fig. 3 - Steady State Power Derating Curve
REV.2016.01.04
4
8
6.0
0.0
3
0
##
76
50
33
23
13
10
1000
8
PPPM-Peak Pulse Power (kW)
Steady State Power Dissipation, (W)
25
2
Time , (ms)
0
0.2
0.5
1
1.5
2
3
4
Fig. 2 - Pulse Waveform
8.0
0
##
TJ = 25 ƱC
Pulse Width (td) is defined as the
point where the peak current decays
to 50 % of Ipp
200
100
10
1
0.1
0.000001
0.00001
0.0001
0.001
td-Pulse Width (Sec.)
Fig. 4 - Peak Pulse Power Rating Curve
02 | www.spsemi.cn
AUTO
AUTOTVS/ASC
TVS/PK
) Series
ASC Series
Fig. 5 Ri-Vs chart for ISO-16750-2 Test A : 24V System
PACKAGE OUTLINE DIMENSIONS (millimeters)
Recommended Mounting Pad Layout
3.3
3.0
3.5
11.0
9.5
REV.2016.01.04
15.8
03 | www.spsemi.cn
AUTO
AUTOTVS/ASC
TVS/PK
ASC Series
SURFACE MOUNT TAPE AND REEL PACKAGING
G
ZONE 1
N A
ZONE1
B
D
C
T
DIMENSIONS in millimeters (inches)
TAPE SIZE
24 mm (0.945)
A MAX.
B MIN.
C
330 ± 2.0 (13.0 ±
13.0 ± 0.20
0.079)
1.5 (0.059) (0.51 ±
178 ± 2.0 (7.0 ±
0.0008)
0.079)
D MIN.
N MIN.
G MAX.
T MAX.
20.2
(0.795)
50 (1.97)
26.4 (1.039)
30.4
(1.197)
Recommended Soldering Parameters
IR-Reflow Condition
Temp. min
150
ɗ
Temp. max
200
ɗ
Time(min to max) 60-180
Ramp up rate (150-200
ɗ)
<3
Liquidus Temp. >220
Reflow
Peak Temp. 255-260
Time(Liq. to Peak) 60-150
Ramp up rate (220-200
ɗ)
<3
Time within actual peak temp.10-30
sec
ɗ/sec
ɗ
sec
sec
ɗ/sec
tp
Temperature(T)
Pre Heat
TP
Ramp-up
tL
TL
Ts(max)
Ts(min)
ts
Perheat
sec
Temp from 25 °C to Peak
Ramp down Rate
<5
ɗ/sec
Time(25ɗ to Peak temp.)
<6
njo
Do not exceed
280
ɗ
REV.2016.01.04
Time(t)
04 | www.spsemi.cn
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