Shoulder HDF778AS4 Low-loss saw filter of cordless system. Datasheet

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF778A SMD-4
MARKING 印 字:
HDF4733
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2010-7-6
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
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E-mail:[email protected]
Page 1 of 8
SAW FILTER
HDF778A S4
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Page 2 of 8
SAW FILTER
HDF778A S4
1. Package Dimension
Unit:mm
2. Marking:HDF4733
HD: Brand
F : Filter
4 : SMD-4
733 : No.
3.Performance
3.1Application
Low-Loss SAW Filter of cordless system.
Center Frequency:778 MHz
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SAW FILTER
HDF778A S4
3.2Maximum Rating
Operation Temperature Range
-40℃ to +85℃
Storage Temperature Range
-40℃ to +85℃
DC. Permissive Voltage
0V
Maximum Input Power
11dBm
3.3 Electronic Characteristics
Center Frequency
Insertion Loss (In Fc +/- 4 MHz)
Amplitude Ripple (In Fc +/- 4 MHz)
Relative Attenuation
0.3 MHz ~ Fo-35 MHz
Fo+45 MHz ~ ….
Input/Output Impedance
3.4 Frequency Characteristics
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Unit
Minimum
Typical
Maximum
MHz
dB
dB
-
778
-
2.0
1.0
3.5
2.0
dB
40
40
50
50
50
-
Ohms
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Page 4 of 8
SAW FILTER
HDF778A S4
3.5 Test Circuit
4. ENVIRONMENTAL CHARACTERISTICS
4-1 Temperature cycling
Subject the device to a low temperature of -45℃ for 30 minutes. Following by a
high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30
Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the
measurement. It shall meet the specifications in 3.3.
4-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in 3.3.
4-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in 3.3.
4-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in 3.3.
4-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the
mm at 10 to 55 hz. The filter shall fulfill the specifications in 3.3.
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amplitude of 1.5
Page 5 of 8
SAW FILTER
HDF778A S4
5. REMARK
5.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
5.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
5.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
6. Packing
6.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
6.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
6.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
(2) Label
Device Name
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Page 6 of 8
SAW FILTER
HDF778A S4
User Product Name
Quantity
Lot No.
(3) Leader part and vacant position specifications.
7. TAPE SPECIFICATIONS
7.1 Tensile Strength of Carrier Tape: 4.4N/mm width
7.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
(3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
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Page 7 of 8
SAW FILTER
HDF778A S4
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.00
±0.30
5.50
±0.10
1.75
±0.10
4.00
±0.10
8.00
±0.10
2.00
±0.10
Ø1.50
Ø1.0
±0.25
0.25
±0.05
1.65
±0.10
4.04
±0.10
4.10
±0.10
[Figure 2]
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
±1.0
Ø100
±0.5
Ø13
±0.5
Ø21
±0.8
2
±0.5
13
±0.3
3
max.
1.0
max.
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Page 8 of 8
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