Diodes DMP6350S-13 60v p-channel enhancement mode mosfet Datasheet

DMP6350S
60V P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
BVDSS
Features and Benefits
ID Max
TA = +25°C
RDS(ON) Max
350mΩ @ VGS = -10V
-1.5A
550mΩ @ VGS = -4.5V
-1.2A
-60V

Low On-Resistance

Low Input Capacitance

Fast Switching Speed

Low Input/Output Leakage



Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description and Applications
Mechanical Data
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it

Case: SOT23

Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminals: Finish  Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
ideal for high-efficiency power management applications.

Battery Charging

Power Management Functions

Terminals Connections: See Diagram Below

DC-DC Converters

Weight: 0.009 grams (Approximate)

Portable Power Adaptors
D
D
G
S
G
S
Top View
Internal Schematic
Top View
Ordering Information (Note 4)
Notes:
Part Number
Case
Packaging
DMP6350S-7
SOT23
3,000/Tape & Reel
DMP6350S-13
SOT23
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
Code
Month
Code
2015
C
Jan
1
2016
D
Feb
2
DMP6350S
Document number: DS38474 Rev. 3 - 2
P35 = Product Type Marking Code
YM = Date Code Marking
Y or Y= Year (ex: D = 2016)
M = Month (ex: 9 = September)
YM
P35
Mar
3
2017
E
Apr
4
2018
F
May
5
Jun
6
1 of 7
www.diodes.com
2019
G
Jul
7
2020
H
Aug
8
Sep
9
2021
I
Oct
O
2022
J
Nov
N
Dec
D
May 2016
© Diodes Incorporated
DMP6350S
Maximum Ratings (@TA = +25°C unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Steady
State
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Continuous Drain Current (Note 6), VGS = -10V
Unit
V
V
IDM
Value
-60
±20
-1.5
-1.2
-6
Symbol
PD
RθJA
PD
RθJA
RθJC
TJ, TSTG
Value
0.72
176
1.17
108
34
-55 to +150
Unit
W
°C/W
W
°C/W
°C/W
°C
TA = +25°C
TA = +70°C
ID
A
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5)
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 6)
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Electrical Characteristics
(@TA = +25°C unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -4.5V)
Total Gate Charge (VGS = -10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-60
-
-
-1.0
±100
V
μA
nA
VGS = 0V, ID = -250μA
VDS = -60V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
-1.0
-
-3.0
350
550
V
RDS(ON)
-1.8
257
343
VSD
-
-0.8
-1.2
V
VDS = VGS, ID = -250μA
VGS = -10V, ID = -0.9A
VGS = -4.5V, ID = -0.8A
VGS = 0V, IS = -1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
-
206
15
11
17
2.0
4.1
0.5
0.8
3.6
3.8
12.3
7.3
8.2
2.7
-
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
ns
nC
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
mΩ
Test Condition
VDS = -30V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = -30V, ID = -0.9A
VDD = -30V, VGS = -10V,
ID = -1.0A, Rg = 6Ω
IS = -1.0A, di/dt = -100A/μs
IS = -1.0A, di/dt = -100A/μs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMP6350S
Document number: DS38474 Rev. 3 - 2
2 of 7
www.diodes.com
May 2016
© Diodes Incorporated
DMP6350S
4.0
4
VDS = -5V
3.5
VGS = -4.5V
3.0
VGS = -4.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = -10.0V
VGS = -3.5V
2.0
VGS = -3.0V
1.0
3
2.5
2
1.5
1
VGS = -2.5V
TA = 85oC
TA = 125oC
TA = 25oC
TA = 150oC
0.5
TA = -55oC
0.0
0
0
1
2
3
4
5
1
0.5
0.45
VGS = -4.5V
0.4
0.35
0.3
VGS = -10V
0.25
0.2
0
1
2
3
4
5
3
4
1
0.8
0.6
ID = -900mA
0.4
0.2
0
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
4
8
12
16
20
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
0.6
2
VGS = -10V
150℃
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
2
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
0.5
125℃
0.4
85℃
0.3
25℃
0.2
-55℃
0.1
0
1
2
3
4
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Temperature
DMP6350S
Document number: DS38474 Rev. 3 - 2
3 of 7
www.diodes.com
1.8
VGS = -10V, ID = -900mA
1.6
1.4
1.2
VGS = -4.5V, ID = -800mA
1
0.8
0.6
-50
-25
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
May 2016
© Diodes Incorporated
0.7
2.2
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMP6350S
0.6
0.5
VGS = -4.5V, ID = -800mA
0.4
0.3
0.2
VGS = -10V, ID = -900mA
0.1
0
-50
-25
0
25
50
75
100
125
2
ID = -1mA
1.8
ID = -250μA
1.6
1.4
1.2
1
150
-50
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
4
1000
f=1MHz
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
IS, SOURCE CURRENT (A)
-25
3
2
TJ = 85oC
TJ =
125oC
TJ = 25oC
1
TJ = 150oC
Ciss
100
Coss
10
Crss
TJ = -55oC
1
0
0
0.3
0.6
0.9
1.2
0
1.5
5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
10
15
20
25
30
35
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
10
10
RDS(ON) Limited
ID, DRAIN CURRENT (A)
VGS (V)
8
6
4
VDS = -30V, ID = -0.9A
PW =100µs
1
PW =1ms
PW =100ms
PW =1s
0.01
2
0
0.001
0
1
2
3
4
5
Document number: DS38474 Rev. 3 - 2
TJ(Max) = 150℃
TC = 25℃
Single Pulse
DUT on 1*MRP Board
VGS= -10V
0.1
1
PW =10s
DC
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
Qg (nC)
Figure 11. Gate Charge
DMP6350S
PW =10ms
0.1
4 of 7
www.diodes.com
May 2016
© Diodes Incorporated
DMP6350S
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.7
D=0.5
D=0.3
D=0.9
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
RθJA(t) = r(t) * RθJA
RθJA = 173℃/W
Duty Cycle, D = t1 / t2
D=0.005
D=Single Pulse
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMP6350S
Document number: DS38474 Rev. 3 - 2
5 of 7
www.diodes.com
May 2016
© Diodes Incorporated
DMP6350S
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23
All 7°
H
K1
GAUGE PLANE
0.25
J
K
a
M
A
L
C
L1
B
D
F
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085 0.150 0.110
a
0°
8°
-All Dimensions in mm
G
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23
Y
Dimensions Value (in mm)
C
Y1
X
C
2.0
X
0.8
X1
1.35
Y
0.9
Y1
2.9
X1
DMP6350S
Document number: DS38474 Rev. 3 - 2
6 of 7
www.diodes.com
May 2016
© Diodes Incorporated
DMP6350S
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
DMP6350S
Document number: DS38474 Rev. 3 - 2
7 of 7
www.diodes.com
May 2016
© Diodes Incorporated
Similar pages