ON NRVTSM245ET1G Surface mount trench schottky power rectifier Datasheet

NRVTSM245E
Surface Mount Trench
Schottky Power Rectifier
POWERMITE®
Power Surface Mount Package
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Features
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Low Profile − Maximum Height of 1.1 mm
Small Footprint − Footprint Area of 8.45 mm2
Supplied in 12 mm Tape and Reel
Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
Fine Lithography Trench−based Schottky Technology for Very Low
Forward Voltage and Low Leakage
Fast Switching with Exceptional Temperature Stability
Low Power Loss and Lower Operating Temperature
Higher Efficiency for Achieving Regulatory Compliance
High Surge Capability
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These are Pb−Free and Halide−Free Devices
SCHOTTKY TRENCH
RECTIFIER
2.0 AMPERES, 45 VOLTS
CATHODE
ANODE
POWERMITE
CASE 457
MARKING DIAGRAM
1
Typical Applications
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Switching Power Supplies including Adapters & Flat Panel Displays
High Frequency and DC−DC Converters
Freewheeling and OR−ing diodes
Reverse Battery Protection
Instrumentation
Mechanical Characteristics:
•
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Powermite is JEDEC Registered as D0−216AA
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 16.3 mg (Approximately)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
M
E24
G
M
E24G
2
= Date Code
= Device Code
= Pb−Free Package
(Marking Style 1)
ORDERING INFORMATION
Package
Shipping†
NRVTSM245ET1G
Powermite
(Pb−Free)
3000 / Tape &
Reel
NRVTSM245ET3G
Powermite
(Pb−Free)
12000 / Tape &
Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
March, 2015 − Rev. 0
1
Publication Order Number:
NRVTSM245E/D
NRVTSM245E
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
45
V
Average Rectified Forward Current
(TL = 168°C)
IO
2.0
A
Peak Repetitive Forward Current
(Square Wave, 20 kHz, TL = 167°C)
IFRM
4.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
50
A
Tstg, TJ
−65 to +175
°C
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Storage and Operating Junction Temperature Range (Note 1)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction−to−Lead (Note 2)
YJCL
6.3
°C/W
Thermal Resistance, Junction−to−Ambient (Note 2)
RqJA
82
°C/W
Thermal Resistance, Junction−to−Ambient (Note 3)
RqJA
200
°C/W
Symbol
Value
Unit
ELECTRICAL CHARACTERISTICS
Characteristic
VF
Maximum Instantaneous Forward Voltage (Note 4)
(IF = 2 A, TJ = 25°C)
V
0.65
0.58
(IF = 2 A, TJ = 125°C)
Maximum Instantaneous Reverse Current (Note 4)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 125°C)
IR
75
3
mA
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Mounted with 700 mm2 copper pad size (Approximately 1 in2) 1 oz FR4 Board.
3. Mounted with pad size approximately 20 mm2 copper, 1 oz FR4 Board.
4. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2.0%.
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2
NRVTSM245E
TYPICAL CHARACTERISTICS
100
iF, INSTANTANEOUS FORWARD
CURRENT (A)
iF, INSTANTANEOUS FORWARD
CURRENT (A)
100
TA = 175°C
10
TA = 150°C
TA = 125°C
TA = 90°C
1
TA = 25°C
TA = −55°C
0.1
TA = 125°C
TA = 90°C
1
TA = 25°C
0.5
0.7
0.9
1.1
TA = −55°C
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.8
1.6
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E−02
1.E−01
TA = 175°C
TA = 150°C
1.E−03
TA = 175°C
TA = 150°C
1.E−02
TA = 125°C
1.E−04
IR, INSTANTANEOUS REVERSE CURRENT (A)
IR, INSTANTANEOUS REVERSE CURRENT (A)
0.3
TA = 175°C
10
0.1
0.1
TA = 90°C
TA = 125°C
1.E−03
1.E−05
TA = 25°C
TA = 90°C
1.E−04
1.E−06
1.E−07
TA = 25°C
1.E−05
5
15
25
35
45
5
15
25
35
45
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
4
1000
TJ = 25°C
IF(AV), AVERAGE FORWARD
CURRENT (A)
C, JUNCTION CAPACITANCE (pF)
TA = 150°C
100
DC
3
Square Wave
2
1
RqJL = 6.3°C/W
0
10
0.1
1
10
10
30
50
70
90
110
130
VR, REVERSE VOLTAGE (V)
TC, LEAD TEMPERATURE (°C)
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating
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3
150
170
NRVTSM245E
TYPICAL CHARACTERISTICS
4
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
IPK/IAV = 10
3
IPK/IAV = 20
IPK/IAV = 5
2
DC
1
Square Wave
0
0
0.5
1.0
1.5
2.0
2.5
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 7. Forward Power Dissipation
R(t), TYPICAL TRANSIENT
THERMAL RESISTANCE (°C/W)
100
50%
20%
10 10%
5%
2%
1
1%
0.1
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
t, PULSE TIME (sec)
Figure 8. Thermal Response, Junction−to−Ambient
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4
10
100
1000
NRVTSM245E
PACKAGE DIMENSIONS
POWERMITE
CASE 457−04
ISSUE F
F
0.08 (0.003)
C
−A−
J
M
T B
S
C
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 (0.006) PER SIDE.
DIM
A
B
C
D
F
H
J
K
L
R
S
PIN 1
−B−
K
PIN 2
R
L
J
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
1.75
2.05 0.069
0.081
1.75
2.18 0.069
0.086
0.85
1.15 0.033
0.045
0.40
0.69 0.016
0.027
0.70
1.00 0.028
0.039
-0.05
+0.10 -0.002 +0.004
0.10
0.25 0.004
0.010
3.60
3.90 0.142
0.154
0.50
0.80 0.020
0.031
1.20
1.50 0.047
0.059
0.50 REF
0.019 REF
D
H
−T−
0.08 (0.003)
M
T B
S
C
S
SOLDERING FOOTPRINT*
0.635
0.025
2.67
0.105
0.762
0.030
2.54
0.100
1.27
0.050
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
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NRVTSM245E/D
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