Material Content Data Sheet Sales Product Name ESD218-B1-02ELS E6327 MA# MA001228148 Package PG-TSSLP-2-4 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material non noble metal noble metal organic material plastics inorganic material noble metal noble metal noble metal < 10% tin gold silicon nickel gold carbon black epoxy resin silicondioxide gold palladium gold 7440-31-5 7440-57-5 7440-21-3 7440-02-0 7440-57-5 1333-86-4 60676-86-0 7440-57-5 7440-05-3 7440-57-5 leadframe wire encapsulation leadfinish plating *deviation 12. December 2014 Weight [mg] 0.21 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.001 0.33 3316 0.003 1.29 12870 0.033 15.71 17.33 157062 173248 0.108 51.43 51.43 514274 514274 0.002 1.18 1.18 11823 11823 0.000 0.14 1413 0.009 4.10 0.051 24.05 28.29 240473 282908 0.004 1.75 1.75 17547 17547 0.000 0.01 0.000 0.01 41022 76 0.02 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com Sum [ppm] 124 200 1000000