Fairchild FCPF190N60 F152-ND Fcp190n60 / fcpf190n60 n-channel superfet ii mosfet 600 v, 20.2 a, 199 mî© Datasheet

FCP190N60 / FCPF190N60
N-Channel SuperFET® II MOSFET
600 V, 20.2 A, 199 mΩ
Features
Description
• 650 V @ TJ = 150°C
SuperFET® II MOSFET is Fairchild Semiconductor’s brand-new
high voltage super-junction (SJ) MOSFET family that is utilizing
charge balance technology for outstanding low on-resistance
and lower gate charge performance. This technology is tailored
to minimize conduction loss, provide superior switching performance, dv/dt rate and higher avalanche energy. Consequently,
SuperFET II MOSFET is very suitable for the switching power
applications such as PFC, server/telecom power, FPD TV
power, ATX power and industrial power applications.
• Typ. RDS(on) = 170 mΩ
• Ultra Low Gate Charge (Typ. Qg = 57 nC)
• Low Effective Output Capacitance (Typ. Coss(eff.) = 160 pF)
• 100% Avalanche Tested
• RoHS Compliant
Applications
• LCD / LED / PDP TV Lighting
• Solar Inverter
• AC-DC Power Supply
D
GD
S
G
G
D
S
TO-220
TO-220F
S
Absolute Maximum Ratings TC = 25oC unless otherwise noted.
Symbol
VDSS
Drain to Source Voltage
Parameter
VGSS
Gate to Source Voltage
ID
Drain Current
FCP190N60 FCPF190N60
600
- DC
±20
- AC
(f > 1 Hz)
- Continuous (TC = 25oC)
- Continuous (TC = 100oC)
(Note 1)
V
±30
20.2
20.2*
12.7
12.7*
IDM
Drain Current
Single Pulsed Avalanche Energy
IAR
Avalanche Current
(Note 1)
4.0
A
EAR
Repetitive Avalanche Energy
(Note 1)
2.1
mJ
(Note 2)
60.6*
A
400
MOSFET dv/dt
mJ
100
Peak Diode Recovery dv/dt
(Note 3)
(TC = 25oC)
PD
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
TL
60.6
A
EAS
dv/dt
- Pulsed
Unit
V
- Derate Above 25oC
V/ns
20
208
39
W
1.67
0.31
W/oC
-55 to +150
o
C
300
o
C
*Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
Parameter
FCP190N60
FCPF190N60
RθJC
Thermal Resistance, Junction to Case, Max.
0.6
3.2
RθJA
Thermal Resistance, Junction to Ambient, Max.
62.5
62.5
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
1
Unit
oC/W
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
December 2013
Part Number
FCP190N60
Top Mark
FCP190N60
Package
TO-220
Packing Method
Tube
Reel Size
N/A
Tape Width
N/A
Quantity
50 units
FCPF190N60
FCPF190N60
TO-220F
Tube
N/A
N/A
50 units
Electrical Characteristics TC = 25oC unless otherwise noted.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VGS = 0 V, ID = 10 mA, TJ = 25°C
600
-
-
VGS = 0 V, ID = 10 mA, TJ = 150°C
650
-
-
ID = 10 mA, Referenced to 25oC
-
0.67
-
V/oC
VGS = 0 V, ID = 20 A
-
700
-
V
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ΔBVDSS
/ ΔTJ
BVDS
Breakdown Voltage Temperature
Coefficient
Drain to Source Avalanche Breakdown
Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
VDS = 480 V, VGS = 0 V
V
-
-
1
VDS = 480 V, TC = 125oC
-
-
10
VGS = ±20 V, VDS = 0 V
-
-
±100
2.5
-
3.5
V
-
0.17
0.199
Ω
-
21
-
S
μA
nA
On Characteristics
VGS(th)
RDS(on)
Gate Threshold Voltage
VGS = VDS, ID = 250 μA
Static Drain to Source On Resistance
gFS
Forward Transconductance
VGS = 10 V, ID = 10 A
VDS = 20 V, ID = 10 A
Dynamic Characteristics
-
2220
2950
pF
-
1630
2165
pF
-
85
128
pF
-
42
-
pF
VDS = 0 V to 480 V, VGS = 0 V
-
160
-
pF
VDS = 380 V, ID = 10 A,
VGS = 10 V
-
57
74
nC
-
9
-
nC
-
21
-
nC
-
1
-
Ω
-
20
50
ns
-
10
30
ns
-
64
138
ns
-
5
20
ns
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss
Output Capacitance
VDS = 380 V, VGS = 0 V, f = 1 MHz
Coss(eff.)
Effective Output Capacitance
Qg(tot)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
ESR
Equivalent Series Resistance
VDS = 25 V, VGS = 0 V
f = 1 MHz
(Note 4)
f = 1 MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
VDD = 380 V, ID = 10 A,
VGS = 10 V, RG = 4.7 Ω
(Note 4)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
20.2
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
60.6
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0 V, ISD = 10 A
-
-
1.2
V
trr
Reverse Recovery Time
-
280
-
ns
Qrr
Reverse Recovery Charge
VGS = 0 V, ISD = 10 A,
dIF/dt = 100 A/μs
-
3.8
-
μC
Notes:
1. Repetitive rating: pulse-width limited by maximum junction temperature.
2. IAS = 4 A, VDD = 50 V, RG = 25 Ω, starting TJ = 25°C.
3. ISD ≤ 10 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, starting TJ = 25°C.
4. Essentially independent of operating temperature typical characteristics.
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
2
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
100
VGS = 15.0V
10.0V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
10
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
ID, Drain Current[A]
ID, Drain Current[A]
50
1
o
150 C
10
o
25 C
o
-55 C
*Notes:
1. 250μs Pulse Test
o
0.3
0.1
2. TC = 25 C
1
VDS, Drain to Source Voltage[V]
1
10
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
3
4
5
6
7
VGS, Gate to Source Voltage[V]
100
IS, Reverse Drain Current [A]
0.4
0.3
VGS = 10V
0.2
VGS = 20V
o
150 C
o
25 C
10
*Notes:
1. VGS = 0V
o
0.1
*Note: TC = 25 C
0
10
20
30
ID, Drain Current [A]
40
1
0.2
50
Figure 5. Capacitance Characteristics
VGS, Gate to Source Voltage [V]
1000
Coss
100
1
0.5
0.1
1.4
10
Ciss
10
2. 250μs Pulse Test
0.4
0.6
0.8
1.0
1.2
VSD, Body Diode Forward Voltage [V]
Figure 6. Gate Charge Characteristics
10000
Capacitances [pF]
8
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
0.5
RDS(ON) [Ω],
Drain to Source On-Resistance
2
*Note:
1. VGS = 0V
2. f = 1MHz
Crss
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
1
10
100
VDS, Drain to Source Voltage [V]
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
6
4
2
0
600
3
VDS = 120V
VDS = 300V
VDS = 480V
8
*Note: ID = 10A
0
20
40
Qg, Total Gate Charge [nC]
60
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
RDS(on), [Normalized]
Drain to Source On-Resistance
BVDSS, [Normalized]
Drain to Source Breakdown Voltage
1.2
1.1
1.0
0.9
*Notes:
1. VGS = 0V
2. ID = 10mA
0.8
-100
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
2.0
1.5
1.0
*Notes:
1. VGS = 10V
2. ID = 10A
0.5
0.0
-100
200
Figure 9. Maximum Safe Operating Area
for FCP190N60
100
2.5
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
200
Figure 10. Maximum Safe Operating Area
for FCPF190N60
100
10μs
10μs
10
ID, Drain Current [A]
ID, Drain Current [A]
100μs
1ms
10ms
DC
1
Operation in This Area
is Limited by R DS(on)
0.1
100μs
10
1ms
10ms
1
DC
Operation in This Area
is Limited by R DS(on)
*Notes:
*Notes:
0.1
o
o
1. TC = 25 C
1. TC = 25 C
o
0.01
0.1
o
2. TJ = 150 C
3. Single Pulse
1
10
100
VDS, Drain to Source Voltage [V]
0.01
0.1
1000
25
10
20
8
15
10
5
0
25
1
10
100
VDS, Drain to Source Voltage [V]
1000
Figure 12. Eoss vs. Drain to Source Voltage
EOSS, [μJ]
ID, Drain Current [A]
Figure 11. Maximum Drain Current
vs. Case Temperature
2. TJ = 150 C
3. Single Pulse
6
4
2
50
75
100
125
o
TC, Case Temperature [ C]
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
0
150
4
0
100
200
300
400
500
VDS, Drain to Source Voltage [V]
600
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
Typical Performance Characteristics (Continued)
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
Typical Performance Characteristics (Continued)
Figure 13. Transient Thermal Response Curve for FCP190N60
θ JC
o
ZθJC
(t), Thermal
Response
Thermal
Response
[Z [ ]C/W]
1
0.5
0.2
0.1
PDM
0.1
t1
0.05
t2
*Notes:
0.02
o
1. ZθJC(t) = 0.6 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.01
Single pulse
0.01
-5
10
-4
10
-3
-2
10
10
Rectangular
Pulse
t1, Rectangular
PulseDuration
Duration [sec]
[sec]
-1
10
1
Figure 14. Transient Thermal Response Curve for FCPF190N60
ZθJC
(t), Thermal
Response
[o]C/W]
Thermal
Response
[ZθJC
5
0.5
1
0.2
0.1
PDM
0.05
0.1
t1
0.02
o
1. ZθJC(t) = 3.2 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
Single pulse
0.01
-5
10
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
t2
*Notes:
0.01
-4
10
-3
-2
-1
10
10
10
1
Pulse Duration [sec]
tRectangular
1, Rectangular Pulse Duration [sec]
5
10
100
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
IG = const.
Figure 15. Gate Charge Test Circuit & Waveform
VDS
RG
RL
VDS
VDD
VGS
VGS
DUT
V
10V
GS
90%
10%
td(on)
tr
t on
td(off)
tf
t off
Figure 16. Resistive Switching Test Circuit & Waveforms
VGS
Figure 17. Unclamped Inductive Switching Test Circuit & Waveforms
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
6
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VSD
VDD
Body Diode
Forward Voltage Drop
Figure 18. Peak Diode Recovery dv/dt Test Circuit & Waveforms
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
7
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
Mechanical Dimensions
Figure 19. TO-220, Molded, 3-Lead, Jedec Variation AB
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT220-003
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
8
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
Mechanical Dimensions
Figure 20. TO220, Molded, 3-Lead, Full Pack, EIAJ SC91, Straight Lead
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TF22S-003
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
9
www.fairchildsemi.com
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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Definition
Advance Information
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Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
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First Production
Datasheet contains preliminary data; supplementary data will be published at a later
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Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I66
©2012 Fairchild Semiconductor Corporation
FCP190N60 / FCPF190N60 Rev. C16
10
www.fairchildsemi.com
FCP190N60 / FCPF190N60 — N-Channel SuperFET® II MOSFET
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