ESDA25P35-1U1M High power transient voltage suppressor Datasheet - production data Description The ESDA25P35-1U1M is a unidirectional single line TVS diode designed to protect the power line against EOS and ESD transients. n1 Pi The device is ideal for applications where high power TVS and board space saving are required. n2 Pi Figure 1: Pin configuration Low clamping voltage Typical peak pulse power: 1400 W (8/20 µs) Stand-off voltage 22 V Unidirectional diode Low leakage current: 0.2 µA at 25 °C Complies with IEC 61000-4-2 level 4 ±30 kV (air discharge) ±30 kV (contact discharge) Pin2 Features Pin1 1610 package Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: Smartphones, mobile phones, tablets, portable multimedia USB VBUS protection Power supply protection Battery protection July 2016 DocID029556 Rev 1 This is information on a product in full production. 1/10 www.st.com Characteristics 1 ESDA25P35-1U1M Characteristics Table 1: Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit VPP Peak pulse voltage IEC 61000-4-2: Contact discharge Air discharge >30 >30 kV PPP Peak pulse power 8/20μs 1400 W IPP Peak pulse current 8/20μs 35 A Tstg Storage junction temperature range -55 to +150 Maximum operating junction temperature -55 to +150 Tj °C Figure 2: Electrical characteristics (definitions) Table 2: Electrical characteristics (Tamb = 25 °C) Symbol VBR Test condition IR = 1 mA Min. Typ. 23.3 24.6 VRM VRM = 22 V Rd 8/20 µs VF 2/10 25.8 Unit V 22 IRM VCL Max. 200 Ω 0.45 IPP = 35 A; 8/20 µs 39 41 IPP = 10 A; 8/20 µs 29 31 IF = 10 mA 0.75 DocID029556 Rev 1 nA V V ESDA25P35-1U1M 1.2 Characteristics Characteristics (curves) Figure 3: Peak power dissipation versus initial temperature (typical value) 1500 Figure 4: Peak pulse power versus exponential pulse duration (Tj initial = 25°C) (typical value) PPP (W) PPP (W) Tj initial = 25 °C typical value 8/20µs typical value 1000 1250 1000 100 750 Tj(°C) 500 25 50 75 100 125 150 10 175 Figure 5: Clamping voltage versus peak pulse current (max. value) 100.00 100 1000 Figure 6: Leakage current versus junction temperature (typical value) IR(nA) IPP (A) 35 8/20 µs T j initial = 25 °C tp(µs) 10 VR = VRM = 22 V reverse typical value 30 25 10.00 20 15 1.00 10 5 0.10 20.00 VCL(V) 25.00 30.00 35.00 40.00 45.00 Figure 7: ESD response to IEC 61000-4-2 (+8kV contact discharge) Tj(°C) 0 25 50 75 100 125 150 Figure 8: ESD response to IEC 61000-4-2 (-8kV contact discharge) 5 V/div 10 V/div 20 ns/div 20 ns/div ESD level V pp V CL @ 30ns V CL @ 60ns V CL @ 100ns ESD level V pp V CL @ 30ns V CL @ 60ns V CL @ 100ns +8kV 45V 26V 27V 27V -8kV -16.2V -1.8V -1.2V -0.8V DocID029556 Rev 1 3/10 Package information 2 ESDA25P35-1U1M Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 QFN 1610 package information Figure 9: QFN 1610 package outline E D A Top view A1 Side view b e L Bottom view Table 3: QFN 1610 package mechanical data Dimensions Ref. A Millimeters Min. Typ. Max. Min. Typ. Max. 0.51 0.55 0.60 0.0201 0.0217 0.0236 0.02 0.05 0.0008 0.0020 0.80 0.85 0.0315 0.0335 A1 b 0.75 0.0295 D 1.60 0.0630 E 1.00 0.0394 e 1.05 0.0413 L 4/10 Inches 0.030 0.035 0.040 DocID029556 Rev 1 0.0118 0.0138 0.0157 Package information ESDA25P35-1U1M Figure 10: Footprint recommendations, dimensions in mm (inches) Figure 11: Alternative footprint Figure 12: Marking Pin2 P Pin1 Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DocID029556 Rev 1 5/10 Package information ESDA25P35-1U1M Figure 13: Tape and reel specification 2.0 ±0.05 Ø 1.50 +0.10 4.0 ±0.10 1.75 ±0.10 Bar indicates Pin1 1.14 ±0.03 0.67 ±0.05 2.0 ±0.10 All dimensions are typical values in mm User direction of unreeling 6/10 DocID029556 Rev 1 P P P P P P P 3.50 ±0.05 1.75 ±0.03 8.0 ±0.10 0.20 ±0.02 Recommendation on PCB assembly ESDA25P35-1U1M 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. 2. General recommendation on stencil opening design a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). General design rule a. Stencil thickness (T) = 75 ~ 125 μm 𝑊 b. Aspect ratio = ≥ 1.5 𝑇 c. 3. Aspect area = 𝐿×𝑊 2𝑇(𝐿+𝑊) ≥ 0.66 Reference design a. Stencil opening thickness: 100 μm b. Stencil opening for leads: Opening to footprint ratio is 90%. Figure 14: Stencil opening dimensions Figure 15: Recommended stencil window position 3.2 Figure 16: Alternative stencil window position Solder paste 1. 2. 3. 4. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. “No clean” solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-38 μm. DocID029556 Rev 1 7/10 Recommendation on PCB assembly 3.3 Placement 1. 2. 3. 4. 5. 6. 3.4 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 3.5 ESDA25P35-1U1M To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 17: ST ECOPACK® recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. 8/10 DocID029556 Rev 1 Ordering information ESDA25P35-1U1M 4 Ordering information Figure 18: Ordering information scheme ESDA 25 P35 - 1U1 M ESD Array Breakdown voltage 25 = 25 V typ. IPP 8/20 µs P35 = 35 A Direction 1U1 = Unidirectional Package M = QFN Table 4: Ordering information Order code Marking(1) Package Weight Base qty. Delivery mode ESDA25P35-1U1M P QFN 1610 2.4 mg 8000 Tape and reel Notes: (1)The 5 marking can be rotated by multiples of 90° to differentiate assembly location Revision history Table 5: Document revision history Date Revision 28-Jul-2016 1 DocID029556 Rev 1 Changes Initial release. 9/10 ESDA25P35-1U1M IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 10/10 DocID029556 Rev 1