AIC AIC6193 Single channel bare-bone usb switch Datasheet

AIC6193
Single Channel Bare-Bone USB Switch
 FEATURES
 DESCRIPTION
 170m High-Side MOSFET Switch.
The AIC6193 is an integrated 170m high-side

1A Continuous Load Current.
power switch, the preferred circuit protection

40A Quiescent Supply Current.
method for computer, consumer, multimedia

3.2V to 5.5V Input Voltage Range.
and portable applications. AIC6193 can protect

Under-Voltage Lockout.
sensitive electronics from damage caused by

Current-Limit / Short Circuit Protection.
both overcurrent and overtemperature events.

Thermal Shutdown Protection under Over Current
The protection includes current limiting with
Condition.
foldback, short circuit, soft start and thermal
Under Voltage Lockout Ensures that Switch is off
shutdown under overcurrent occurs.
at Start Up.
Guaranteed minimum output rise time limits

Soft Start prevents large Inrush Current.
inrush current during hot plug-in as well as

No Reverse Current when Power off.
minimizing EMI and prevents the voltage at

Available in SOT-23 Packages.

upstream port from dropping excessively.
 APPLICATIONS

USB Power Management

High-Side Power Protection Switch

Hot Plug-In Power Supplies

Battery-Charger Circuits

Portable Application.

Digital televisions

Computer

Multimedia

Mobile Phones
Analog Integrations Corporation
Si-Soft Research Center
DS-6193G-01
20110310
3A1, No.1, Li-Hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
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AIC6193
 TYPICAL APPLICATION CIRCUIT
VIN
1
VIN
VOUT
GND
CIN
1uF AIC6193
3
2
VOUT
+
COUT
100uF
 ORDERING INFORMATION
AIC6193X XX XX
Package Type Configuration
PACKING TYPE
TR: TAPE & REEL
BG: BAG
U3
(SOT-23)
TOP VIEW
1: VIN
2: VOUT
3: GND
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PACKAGE TYPE
U3: SOT-23
G: Green Package
1
2
Example: AIC6193GU3TR
 In SOT-23 Green package and
TAPE & REEL packing.
2
AIC6193
 ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VIN)
6.0V
-40C~85C
Operating Temperature Range
125C
Junction Temperature
-65C ~ 150C
Storage Temperature Range
260C
Lead Temperature (Soldering, 10sec)
Thermal Resistance, θJC (Junction to Case)
Thermal Resistance, θJA (Junction to Ambient)
t
SOT-23
SOT-23
115C/W
250C/W
(Assume no Ambient Airflow, no Heatsink)
Absolute Maximum Ratings are those values beyond which the life of a device may be
impaired.
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AIC6193
 ELECTRICAL CHARACTERISTICS
(VIN= 5V, CIN=1μF, COUT = 100μF(Note 2), TA=25C, unless otherwise specified.) (Note 1)
PARAMETERS
CONDITIONS
Input Voltage
MIN.
TYP.
3.2
Supply Current
MAX.
UNIT
5.5
V
A
40
Current Limit Threshold
1.05
Output MOSFET Resistance
1.45
m
S
RL = 10 each Output
300
Output Turn-Off Fall Time
RL = 10 each Output
0.7
2
Over Temperature Shutdown
TJ Increasing
145
Threshold
TJ Decreasing
125
Under Voltage Lockout
Under Voltage Lockout Hysteresis
A
170
Output Turn-On Rise Time
Soft Start Time
1.80
20
S
mS
C
2.5
V
200
mV
Note1:Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
Note2: Electrolytic Capacitor is recommended for COUT capacitor.
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AIC6193
 TYPICAL PERFORMANCE CHARACTERISTICS
90.0
80.0
200.00
Switches ON
70.0
Supply Current (μA)
Output MOSFET Resistance (mΩ)
250.00
150.00
100.00
60.0
50.0
40.0
30.0
20.0
50.00
IL=100mA
10.0
TA=25°C
0.00
TA=25°C
0.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
3.0
3.5
4.0
Supply Voltage (V)
Fig. 1 Output MOSFET Resistance vs. Supply Voltage
5.0
5.5
6.0
Fig. 2 Supply Current vs. Supply Voltage
2.70
1.40
2.60
UVLO Threshold Voltage (V)
1.60
1.20
Current Limit (A)
4.5
Supply Voltage (V)
1.00
0.80
0.60
0.40
0.20
Rising
2.50
2.40
2.30
Falling
2.20
2.10
2.00
1.90
VIN=5V
1.80
0.00
-40
-20
0
20
40
60
80
-40
100
-20
0
20
Fig. 3
40
60
80
100
Temperature (℃)
Temperature (℃)
Fig. 4 UVLO Threshold Voltage vs. Temperature
Current Limit vs. Temperature
60.00
Output MOSFET Resistance (mΩ)
200.00
Supply Current (μA)
50.00
40.00
30.00
20.00
10.00
150.00
100.00
50.00
VIN=5V
VIN=5V
0.00
0.00
-40
-20
0
20
40
60
80
100
Temperature (℃)
Fig. 5 Supply Current(A) vs. Temperature
-40
-20
0
20
40
60
80
100
Temperature (℃)
Fig. 6 Output MOSFET Resistance vs. Temperature
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AIC6193
 BLOCK DIAGRAM
 PIN DESCRIPTIONS
PIN1 VIN:
Power supply input.
PIN2 VOUT: MOSFET switch output.
PIN3 GND:
Chip power ground.
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AIC6193
 APPLICATION INFORMATION
 Current Limit
are recommended in series with all power and
Current limiting is invoked when the load exceeds
ground connector pins. Ferrite beads reduce EMI
the set over-current threshold. It protects the
and limit the inrush current during hot-attachment
output MOSFET switches from damage resulting
by filtering high-frequency signals.
from undesirable short circuit conditions or excess
 Printed Circuit Layout
inrush current, which is often encountered during
The power circuitry of USB printed circuit boards
hot plug-in.
requires a customized layout to maximize thermal
 Thermal Shutdown
dissipation and to minimize voltage drop and EMI
When junction temperature of AIC6193 exceeds
145C for any reasons, the thermal shutdown
function turns MOSFET switch off. A hysteresis of
20C prevents the MOSFETs from turning back on
until the chip temperature drops below 125C.
thermal shutdown circuit functions only when the
switch is enabled.
 Under-voltage Lockout
UVLO prevents the MOSFET switch from turning
on until input voltage exceeds 2.5V typically. After
the switch turns on, if input voltage drops below
2.3V typically, UVLO shuts off the output MOSFET.
 Supply Filtering
A 0.1F to 1F bypass capacitor from IN to GND,
located near the device, is strongly recommended
to control supply transients. Without a bypass
capacitor, an output short may cause sufficient
ringing on the input (from supply lead inductance)
to
damage
internal
control
circuitry.
Input
transients must not exceed the maximum VIN
voltage for a short duration.
 Transient Requirements
USB supports dynamic attachment (hot plug-in) of
peripherals. A current surge is caused by the input
capacitance of downstream device. Ferrite beads
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AIC6193
 PHYSICAL DIMENSIONS (unit: mm)
 SOT-23 PACKAGE OUTLINE DRAWING
D
A
A
E
E1
e
e1
SEE VIEW B
WITH PLATING
c
A
A2
b
BASE METAL
A1
SECTION A-A
0.25
S
Y
M
B
O
L
GAUGE PLANE
SEATING PLANE
L1
VIEW B
θ
L
Note: 1. Refer to JEDEC MO-178.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 10 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
SOT-23
MILLIMETERS
MIN.
MAX.
A
0.95
1.45
A1
0.00
0.15
A2
0.90
1.30
b
0.30
0.50
c
0.08
0.22
D
2.80
3.00
E
2.60
3.00
E1
1.50
1.70
e
0.95 BSC
e1
1.90 BSC
L
θ
0.60
0.30
0.60 REF
L1
0°
8°
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry
other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result
from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user.
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