® INA101 High Accuracy INSTRUMENTATION AMPLIFIER FEATURES ● ● ● ● ● ● ● APPLICATIONS LOW DRIFT: 0.25µV/°C max LOW OFFSET VOLTAGE: 25µV max LOW NONLINEARITY: 0.002% LOW NOISE: 13nV/√Hz HIGH CMR: 106dB AT 60Hz HIGH INPUT IMPEDANCE: 1010Ω 14-PIN PLASTIC, CERAMIC DIP, SOL-16, AND TO-100 PACKAGES ● ● ● ● ● ● STRAIN GAGES THERMOCOUPLES RTDs REMOTE TRANSDUCERS LOW-LEVEL SIGNALS MEDICAL INSTRUMENTATION DESCRIPTION The INA101 is a high accuracy instrumentation amplifier designed for low-level signal amplification and general purpose data acquisition. Three precision op amps and laser-trimmed metal film resistors are integrated on a single monolithic integrated circuit. The INA101 is packaged in TO-100 metal, 14-pin plastic and ceramic DIP, and SOL-16 surface-mount packages. Commercial, industrial and military temperature range models are available. Offset Adj. 2 Offset Adj. TO-100 PACKAGE 3 6 INA101 –Input –Input 10 1kΩ 10kΩ Gain Sense 1 20kΩ Output A3 RG 4 8 Gain Set 1 RG Gain Set 2 20kΩ DIP PACKAGE 8 INA101 A1 1kΩ 10kΩ A1 Output 3 A1 1 7 10kΩ 4 10kΩ 20kΩ 5 Output A3 10 11 1 20kΩ Gain Sense 2 Common 1kΩ A2 5 10kΩ 10kΩ 7 Common 1kΩ +Input A2 12 10kΩ 10kΩ 14 +Input 9 2 6 +VCC –VCC 13 +VCC –VCC 9 A2 Output International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 ©1981 Burr-Brown Corporation SBOS133 PDS-454K Printed in U.S.A. July, 1998 SPECIFICATIONS ELECTRICAL At +25°C with ±15VDC power supply and in circuit of Figure 1, unless otherwise noted. INA101AM, AG PARAMETER MIN GAIN Range of Gain Gain Equation Error from Equation, DC(1) MAX MIN 1000 * G = 1 + (40k/RG) ±(0.04 + 0.00016G –0.02/G) ±(0.1 + 0.0003G –0.05/G) 2 20 22 22 ±(0.002 + 10–5 G) 5 100 110 110 ±(0.005 + 2 x 10–5 G) 1 Gain Temp. Coefficient(3) G=1 G = 10 G = 100 G = 1000 Nonlinearity, DC(2) RATED OUTPUT Voltage Current Output Impedance Capacitive Load ±10 ±5 INPUT OFFSET VOLTAGE Initial Offset at +25°C INA101SM, SG TYP ±12.5 ±10 0.2 1000 ±(25 + 200/G) * * ±(50 + 400/G) ±(1 + 20/G) ±(1 + 20/G) vs Supply vs Time INPUT BIAS CURRENT Initial Bias Current (each input) vs Temperature vs Supply Initial Offset Current vs Temperature ±15 ±0.2 ±0.1 ±15 ±0.5 INPUT IMPEDANCE Differential Common-mode MIN * * * * * * * * * * * ±(0.001 +10–5 G) * * * * ±(0.002 +10–5 G) * 10 11 11 ±(0.001 +10–5 G) * * * * ±(0.002 +10–5 G) * * * * * * ±(25 +200/G) ±(0.75 + 10/G) ±30 ±(10+ 100/G) * * ±(25 + 200/G) ±(0.25 + 10/G) ±5 * * ±5 * * * * * MAX UNITS * * ±(0.1 + 0.00015G) –0.05/G ±(0.3 + 0.0002G) –0.10/G V/V V/V % * * * * * * * * * * * * * * ±(125 + 450/G) ±(2 + 20/G) * * ±10 * * ±10 * ±30 * * * * TYP V mA Ω pF ±(250 + 900/G) * * * * * ±20 * * µV µV/°C µV/V µV/mo * * ±20 ppm/°C ppm/°C ppm/°C ppm/°C % of p-p FS * * nA nA/°C nA/V nA nA/°C * * Ω || pF Ω || pF * * * * * * V 80 96 106 90 106 110 * * * * * * * * * * * * 65 90 100 85 95 105 dB dB dB ±5 TEMPERATURE RANGE(5) Specification Operation Storage MAX ±12 0.2 POWER SUPPLY Rated Voltage Voltage Range Current, Quiescent(2) * * * INA101HP, KU TYP ±10 INPUT NOISE Input Voltage Noise fB = 0.01Hz to 10Hz Density, G = 1000 fO = 10Hz fO = 100Hz fO = 1kHz Input Current Noise fB = 0.01Hz to 10Hz Density fO = 10Hz fO = 100Hz fO = 1kHz DYNAMIC RESPONSE Small Signal, ±3dB Flatness G=1 G = 10 G = 100 G = 1000 Small Signal, ±1% Flatness G=1 G = 10 G = 100 G = 1000 Full Power, G = 1 to 100 Slew Rate, G = 1 to 100 Settling Time (0.1%) G=1 G = 100 G = 1000 Settling Time (0.01%) G=1 G = 100 G = 1000 MIN * * 1010 || 3 1010 || 3 INPUT VOLTAGE RANGE Range, Linear Response CMR with 1kΩ Source Imbalance DC to 60Hz, G = 1 DC to 60Hz, G = 10 DC to 60Hz, G = 100 to 1000 MAX ±10+ 100/G) ±(2 + 20/G) vs Temperature INA101CM, CG TYP 0.8 * * * µV, p-p 18 15 13 * * * * * * * * * nV/√Hz nV/√Hz nV/√Hz 50 * * * pA, p-p 0.8 0.46 0.35 * * * * * * * * * pA/√Hz pA/√Hz pA/√Hz 300 140 25 2.5 * * * * * * * * * * * * kHz kHz kHz kHz 20 10 1 200 6.4 0.4 * * * * * * * * * * * * * * * * * * kHz kHz kHz Hz kHz V/µs * * * 30 40 350 40 55 470 * * * * * * * * * * * * * * * * * * µs µs µs 30 50 500 45 70 650 * * * * * * * * * * * * * * * * * * µs µs µs * * V V mA +70 +85 +85 °C °C °C ±15 ±6.7 –25 –55 –65 * ±20 ±8.5 * +85 +125 +150 –55 * * * * * * * +125 * * * * * * * * * * * * * 0 –25 –40 * * Specifications same as for INA101AM, AG. NOTES: (1) Typically the tolerance of RG will be the major source of gain error. (2) Nonlinearity is the maximum peak deviation from the best straight-line as a percentage of peak-to-peak full scale output. (3) Not including the TCR of RG. (4) Adjustable to zero at any one gain. (5) θJC output stage = 113°C/W, θJC quiescent circuitry = 19°C/W, θCA = 83°C/W. ® INA101 2 PIN CONFIGURATIONS Top View DIP G and P Package TO-100 M Package –In Gain Set 10 1 9 +VCC Offset Adjust 2 8 Output Offset Adjust 3 7 Common Gain Set 6 4 5 –VCC +In SOIC U Package Output 1 14 Common +VCC 2 13 –VCC –Input 3 12 +Input Gain Sense 1 4 11 Gain Sense 2 Gain Set 1 5 10 Gain Set 2 Output 1 16 Common Offset Adj. 6 9 A2 Output +VCC 2 15 –VCC Offset Adj. 7 8 A1 Output –Input 3 14 +Input Gain Sense 1 4 13 Gain Sense 2 Gain Set 1 5 12 Gain Set 2 Offset Adj. 6 11 A2 Output Offset Adj. 7 10 A1 Output NC 8 9 ORDERING INFORMATION NC ABSOLUTE MAXIMUM RATINGS PRODUCT PACKAGE TEMPERATURE RANGE INA101AM INA101CM INA101AG INA101CG INA101HP INA101KU INA101SG INA101SM 10-Pin Metal TO-100 10-Pin Metal TO-100 14-Pin Ceramic DIP 14-Pin Ceramic DIP 14-Pin Plastic DIP SOL-16 Surface-Mount 14-Pin Ceramic DIP 10-Pin Metal TO-100 –25°C to +85°C –25°C to +85°C –25°C to +85°C –25°C to +85°C 0°C to +70°C 0°C to +70°C –55°C to +125°C –55°C to +125°C Supply Voltage ................................................................................... ±20V Power Dissipation .......................................................................... 600mW Input Voltage Range .......................................................................... ±VCC Output Short Circuit (to ground) ............................................... Continuous Operating Temperature M, G Package ........................... –55°C to +125°C P, U Package ................................................................. –25°C to +85°C Storage Temperature M, G Package .............................. –65°C to +150°C P, U Package ................................................................. –40°C to +85°C Lead Temperature (soldering, 10s) M, G, P Package ................... +300°C Lead Temperature (wave soldering, 3s) U Package ...................... +260°C ELECTROSTATIC DISCHARGE SENSITIVITY PACKAGE INFORMATION PRODUCT PACKAGE PACKAGE DRAWING NUMBER(1) INA101AM INA101CM INA101AG INA101CG INA101HP INA101KU INA101SG INA101SM 10-Pin Metal TO-100 10-Pin Metal TO-100 14-Pin Ceramic DIP 14-Pin Ceramic DIP 14-Pin Plastic DIP SOL-16 Surface-Mount 14-Pin Ceramic DIP 10-Pin Metal TO-100 007 007 169 169 010 211 169 007 This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® 3 INA101 TYPICAL PERFORMANCE CURVES At +25°C, VCC = ±15V unless otherwise noted. GAIN NONLINEARITY vs GAIN GAIN vs FREQUENCY Gain Nonlinearity (% p-p, FS) 0.01 G = 1000 60 0.003 Gain (dB) Max Typ G = 100 40 G = 10 20 0.001 1% Error G=1 0 0.0003 1 10 100 1000 100 1k 10k Gain (V/V) 1M WARM-UP DRIFT vs TIME CMR vs FREQUENCY 10 120 Change in Input Offset Voltage (µV) G = 100, 1000 G = 10 100 CMR (dB) 100k Frequency (Hz) G=1 80 Balanced Source 60 8 6 4 2 0 10 1 100 1k 0 10k 1 2 3 4 Frequency (Hz) Time (Minutes) QUIESCENT CURRENT vs SUPPLY STEP RESPONSE 5 G=1 +10 ±8 Output (V) Quiescent Current (mA) ±9 ±7 G = 1000 +5 0 –5 ±6 –10 ±5 0 ±5 ±10 ±15 0 ±20 Supply Voltage (V) 200 300 Time (µs) ® INA101 100 4 400 500 600 TYPICAL PERFORMANCE CURVES (CONT) At +25°C, VCC = ±15V unless otherwise noted. OUTPUT NOISE vs GAIN SETTLING TIME vs GAIN 1000 Settling Time (µs) RL = 2kΩ CL = 1000pF Output Noise Voltage (mV, rms) 30 0.01% 0.1% 100 1% 10 20 RS = 1MΩ 10 RS = 1000kΩ RS = 10kΩ RS = 0 0 1 10 100 0 1000 10 100 1000 Gain (V/V) Gain (V/V) INPUT NOISE VOLTAGE vs FREQUENCY (100 ≤ GAIN ≤ 1000) Input Noise Voltage (nV/√Hz) 1000 100 10 1 0 10 100 1000 Frequency (Hz) APPLICATION INFORMATION Figure 1 shows the basic connections required for operation of the INA101. (Pin numbers shown are for the TO-100 metal package.) Applications with noisy or high impedance power supplies may require decoupling capacitors close to the device pins as shown. The 40kΩ term in equation (1) comes from the sum of the two internal feedback resistors. These are on-chip metal film resistors which are laser trimmed to accurate absolute values. The accuracy and temperature coefficient of these resistors are included in the gain accuracy and drift specifications of the INA101. The output is referred to the output Common terminal which is normally grounded. This must be a low-impedance connection to assure good common-mode rejection. A resistance greater than 0.1Ω in series with the Common pin will cause common-mode rejection to fall below 106dB. The stability and temperature drift of the external gain setting resistor, RG, also affects gain. RG’s contribution to gain accuracy and drift can be directly inferred from the gain equation (1). Low resistor values required for high gain can make wiring resistance important. Sockets add to the wiring resistance which will contribute additional gain error (possibly an unstable gain error) in gains of approximately 100 or greater. The gain sense connections on the DIP and SOL-16 packages (see Figure 2) reduce the gain error produced by wiring or socket resistance. SETTING THE GAIN Gain of the INA101 is set by connecting a single external resistor, RG: G = 1 + 40kΩ RG (1) ® 5 INA101 OFFSET TRIMMING The INA101 is laser trimmed for low offset voltage and drift. Most applications require no external offset adjustment. Figure 2 shows connection of an optional potentiometer connected to the Offset Adjust pins for trimming the input offset voltage. (Pin numbers shown are for the DIP package.) Use this adjustment to null the offset voltage in high gain (G ≥ 100) with both inputs connected to ground. Do not use this adjustment to null offset produced by the source or other system offset since this will increase the offset voltage drift by 0.3µV/°C per 100µV of adjusted offset. voltage can be adjusted with the optional trim circuit connected to the Common pin as shown in Figure 2. The voltage applied to Common terminal is summed with the output. Low impedance must be maintained at this node to assure good common-mode rejection. The op amp connected as a buffer provides low impedance. THERMAL EFFECTS ON OFFSET VOLTAGE To achieve lowest offset voltage and drift, prevent air currents from circulating near the INA101. Rapid changes in temperature will produce a thermocouple effect on the package leads that will degrade offset voltage and drift. A shield or cover that prevents air currents from flowing near the INA101 will assure best performance. Offset of the output amplifier usually dominates when the INA101 is used in unity gain (G = 1). The output offset No Connection 2 TO-100 PACKAGE 3 INA101 10 E2 A1 10kΩ 1 10kΩ 20kΩ G=1+ 40kΩ RG 4 E1 8 A3 RG Output VO = G (E1 – E2) 20kΩ A2 5 10kΩ 9 Tantalum 6 10kΩ 7 Tantalum + + 1µF 1µF +15V –15V FIGURE 1. Basic Connections. +15V 100kΩ Input Offset Adjustment Do not use to null source or system offset (see text). E2 A1 Output 6 DIP PACKAGE 7 3 INA101 A1 10kΩ 4 5 RG G=1+ 10kΩ 20kΩ A3 10 11 40kΩ RG 1 VO = G (E1 – E2) +VCOM 20kΩ Common E1 A2 12 10kΩ 2 10kΩ Approximately ±15mV Range +15V 13 +15V –15V VCOM 14 1MΩ Pinout shown is for DIP packages. A2 Output OPA177 100kΩ 1kΩ –15V FIGURE 2. Optional Trimming of Input and Output Offset Voltage. ® INA101 6 Output Offset Adjustment PACKAGE OPTION ADDENDUM www.ti.com 25-May-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty INA101AG NRND CDIP SB JD 14 1 Green (RoHS & no Sb/Br) AU N / A for Pkg Type INA101AM NRND TO-100 LME 10 20 Green (RoHS & no Sb/Br) AU N / A for Pkg Type INA101AM2 OBSOLETE TO-100 LME 10 TBD Call TI INA101CM NRND TO-100 LME 10 Green (RoHS & no Sb/Br) AU INA101CM1 OBSOLETE TO-100 LME 10 TBD Call TI INA101HP ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type INA101HPG4 ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type INA101KU ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR INA101KU/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR INA101KU/1KE4 ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR INA101KUE4 ACTIVE SOIC DW 16 Level-3-260C-168 HR INA101SG1 OBSOLETE TO-100 LME 10 INA101SM NRND TO-100 LME 10 100 Lead/Ball Finish 40 Green (RoHS & no Sb/Br) CU NIPDAU TBD Call TI 20 Green (RoHS & no Sb/Br) AU MSL Peak Temp (3) Call TI N / A for Pkg Type Call TI Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 25-May-2009 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device INA101KU/1K Package Package Pins Type Drawing SOIC DW 16 SPQ Reel Reel Diameter Width (mm) W1 (mm) 1000 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.85 10.8 2.7 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) INA101KU/1K SOIC DW 16 1000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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