Material Content Data Sheet Sales Product Name BFP 640F H6327 MA# MA000895776 Package PG-TSFP-4-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal < 10% tin gold silicon silicon titanium chromium copper gold carbon black epoxy resin silicondioxide tin silver 7440-31-5 7440-57-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 1.87 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.001 0.03 269 0.002 0.10 1042 0.014 0.77 0.000 0.01 0.001 0.04 395 0.002 0.12 1185 0.734 39.32 39.49 393151 394810 0.007 0.36 0.36 3557 3557 0.010 0.52 0.208 11.14 0.750 40.15 51.81 401597 518190 0.049 2.62 2.62 26208 26208 0.090 4.82 4.82 48206 0.90 7718 2. 3. 5182 111411 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 9029 79 Important Remarks: 1. Sum [ppm] 48206 1000000