MOLEX 73659-0004

This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
0736590004
Active
hdm
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,
Power Receptacle, 12 Circuits, Gold (Au) 0.76µm (30µ")
Documents:
3D Model
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
General
Product Family
Series
Application
Comments
Component Type
Overview
Product Name
Style
Backplane Connectors
73659
Backplane
Midplane Power Module
Power Header
hdm
HDM®
N/A
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
12
12
Black
250
No
No
None
Beryllium Copper
Gold
Tin
High Temperature Thermoplastic
1
Open Pin Field
3
Vertical
0.138 In
3.50 mm
No
Yes
0.098 In
2.50 mm
Tube
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
150
3.75
No
No
Yes
-55°C to +105°C
Through Hole
EU RoHS
China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Not Reviewed
Need more information on product
environmental compliance?
Email [email protected]
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
73659Series
Mates With
73651 HDM® Board-to-Board
Daughterboard Power Module
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
Voltage - Maximum
15A
1.0 Gbps
38
Yes
500V AC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
40
Reflow Capable (SMT only)
3
260
Material Info
Reference - Drawing Numbers
Packaging Specification
PK-70873-0819
Sales Drawing
SDA-73659-000*
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION