93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 16K Microwire Compatible Serial EEPROM Device Selection Table Part Number VCC Range ORG Pin PE Pin Word Size Temp Ranges Packages 93AA86A 1.8-5.5 No No 8-bit I OT 93AA86B 1.8-5-5 No No 16-bit I OT 93LC86A 2.5-5.5 No No 8-bit I, E OT 93LC86B 2.5-5.5 No No 16-bit I, E OT 93C86A 4.5-5.5 No No 8-bit I, E OT 93C86B 4.5-5.5 No No 16-bit I, E OT 93AA86C 1.8-5.5 Yes Yes 8 or 16-bit I P, SN, ST, MS 93LC86C 2.5-5.5 Yes Yes 8 or 16-bit I, E P, SN, ST, MS 93C86C 4.5-5.5 Yes Yes 8 or 16-bit I, E P, SN, ST, MS Features Description • • • • • The Microchip Technology Inc. 93XX86A/B/C devices are 16K bit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93XX86C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX86A devices are available, while the 93XX86B devices provide dedicated 16-bit communication, available on SOT-23 devices only. A Program Enable (PE) pin allows the user to write-protect the entire memory array. Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, and 8-lead TSSOP. Pb-free (Pure Matte Sn) finish is also available. • • • • • • • • • Low-power CMOS technology ORG pin to select word size for ‘86C’ version 2048 x 8-bit organization ‘A’ devices (no ORG) 1024 x 16-bit organization ‘B’ devices (no ORG) Program Enable pin to write-protect the entire array Self-timed ERASE/WRITE cycles (including auto-erase) Automatic ERAL before WRAL Power-on/off data protection circuitry Industry standard 3-wire serial I/O Device Status signal (READY/BUSY) Sequential READ function 1,000,000 E/W cycles Data retention > 200 years Temperature ranges supported: - Industrial (I) -40°C to +85°C - Automotive (E) -40°C to +125°C Pin Function Table Name Function CS Chip Select CLK Serial Data Clock DI Serial Data Input DO Serial Data Output VSS Ground PE Program Enable ORG Memory Configuration VCC Power Supply 2004 Microchip Technology Inc. Package Types (not to scale) PDIP/SOIC SOT-23 (P, SN) (OT) CS CLK 1 2 8 7 VCC PE DI 3 6 ORG DO 4 5 VSS DO 1 6 VCC VSS 2 5 CS DI 3 4 CLK TSSOP/MSOP (ST, MS) CS 1 8 VCC CLK 2 7 PE DI 3 6 ORG DO 4 5 VSS DS21797D-page 1 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................7.0V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ 4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol No. Parameter VCC = 1.8V to 5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Min Typ Max Units Conditions D1 VIH1 VIH2 High-level input voltage 2.0 0.7 VCC — — VCC +1 VCC +1 V V VCC ≥ 2.7V VCC < 2.7V D2 VIL1 VIL2 Low-level input voltage -0.3 -0.3 — — 0.8 0.2 VCC V V VCC ≥ 2.7V VCC < 2.7V D3 VOL1 VOL2 Low-level output voltage — — — — 0.4 0.2 V V IOL = 2.1 mA, VCC = 4.5V IOL = 100 µA, VCC = 2.5V D4 VOH1 VOH2 High-level output voltage 2.4 VCC - 0.2 — — — — V V IOH = -400 µA, VCC = 4.5V IOH = -100 µA, VCC = 2.5V D5 ILI Input leakage current — — ±1 µA VIN = VSS to VCC D6 ILO Output leakage current — — ±1 µA VOUT = VSS to VCC D7 CIN, COUT Pin capacitance (all inputs/ outputs) — — 7 pF VIN/VOUT = 0V (Note 1) TA = 25°C, FCLK = 1 MHz D8 ICC write Write current — — — 500 3 — mA µA FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 2.5V D9 ICC read Read current — — — — — 100 1 500 — mA µA µA FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 3.0V FCLK = 2 MHz, VCC = 2.5V D10 ICCS Standby current — — — — 1 5 µA µA I – Temp E – Temp CLK = Cs = 0V ORG = DI = VSS or VCC (Note 2) (Note 3) D11 VPOR VCC voltage detect 93AA86A/B/C, 93LC86A/B/C 93C86A/B/C — — 1.5V 3.8V — — V V (Note 1) Note 1: 2: 3: This parameter is periodically sampled and not 100% tested. ORG pin not available on ‘A’ or ‘B’ versions. READY/BUSY status must be cleared from DO, see Section 3.4 “Data Out (DO)”. DS21797D-page 2 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C TABLE 1-2: AC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol No. Parameter VCC = 1.8V to 5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Min Max Units Conditions A1 FCLK Clock frequency — 3 2 1 MHz MHz MHz 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V A2 TCKH Clock high time 200 250 450 — ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V A3 TCKL Clock low time 100 200 450 — ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V A4 TCSS Chip Select setup time 50 100 250 — ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V A5 TCSH Chip Select hold time 0 — ns 1.8V ≤ VCC < 5.5V A6 TCSL Chip Select low time 250 — ns 1.8V ≤ VCC < 5.5V A7 TDIS Data input setup time 50 100 250 — ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V A8 TDIH Data input hold time 50 100 250 — ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V A9 TPD Data output delay time — 100 250 400 ns ns ns 4.5V ≤ VCC < 5.5V, CL = 100 pF 2.5V ≤ VCC < 4.5V, CL = 100 pF 1.8V ≤ VCC < 2.5V, CL = 100 pF A10 TCZ Data output disable time — 100 200 ns ns 4.5V ≤ VCC < 5.5V, (Note 1) 1.8V ≤ VCC < 4.5V, (Note 1) A11 TSV Status valid time — 200 300 500 ns ns ns 4.5V ≤ VCC < 5.5V, CL = 100 pF 2.5V ≤ VCC < 4.5V, CL = 100 pF 1.8V ≤ VCC < 2.5V, CL = 100 pF A12 TWC Program cycle time — 5 ms ERASE/WRITE mode (AA and LC versions) A13 TWC — 2 ms ERASE/WRITE mode (93C versions) A14 TEC — 6 ms ERAL mode, 4.5V ≤ VCC ≤ 5.5V A15 TWL — 15 ms WRAL mode, 4.5V ≤ VCC ≤ 5.5V A16 — 1M — Note 1: 2: Endurance cycles 25°C, VCC = 5.0V, (Note 2) This parameter is periodically sampled and not 100% tested. This application is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which may be obtained from www.microchip.com. 2004 Microchip Technology Inc. DS21797D-page 3 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C FIGURE 1-1: CS SYNCHRONOUS DATA TIMING VIH TCSS VIL TCKH TCKL TCSH VIH CLK VIL TDIS TDIH VIH DI VIL DO (READ) VOH VOL TCZ TSV DO VOH (PROGRAM) VOL Note: TCZ TPD TPD STATUS VALID TSV is relative to CS. TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX86B OR 93XX86C WITH ORG = 1) SB Opcode Address Data In Data Out Req. CLK Cycles READ 1 10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 — D15 – D0 29 EWEN 1 00 X — HIGH-Z 13 ERASE 1 11 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 — (RDY/BSY) 13 ERAL 1 00 — (RDY/BSY) 13 WRITE 1 01 (RDY/BSY) 29 WRAL 1 00 0 1 X X X X X X X X D15 – D0 (RDY/BSY) 29 EWDS 1 00 0 0 X X X X X X X X — HIGH-Z 13 Instruction 1 1 1 0 X X X X X X X X X X X X X X X A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D15 – D0 TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX86A OR 93XX86C WITH ORG = 0) SB Opcode Address Data In Data Out Req. CLK Cycles READ 1 10 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 — D7 – D0 22 EWEN 1 00 X — HIGH-Z 14 ERASE 1 11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 — (RDY/BSY) 14 ERAL 1 00 — (RDY/BSY) 14 WRITE 1 01 (RDY/BSY) 22 WRAL 1 00 0 1 X X X X X X X X X D7 – D0 (RDY/BSY) 22 EWDS 1 00 0 0 X X X X X X X X X — HIGH-Z 14 Instruction DS21797D-page 4 1 1 1 0 X X X X X X X X X X X X X X X X X A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 – D0 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 2.0 FUNCTIONAL DESCRIPTION 2.2 Data In/Data Out (DI/DO) When the ORG* pin is connected to VCC, the (x16) organization is selected. When it is connected to ground, the (x8) organization is selected. Instructions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a HIGH-Z state except when reading data from the device, or when checking the READY/ BUSY status during a programming operation. The READY/BUSY status can be verified during an Erase/ Write operation by polling the DO pin; DO low indicates that programming is still in progress, while DO high indicates the device is ready. DO will enter the HIGH-Z state on the falling edge of CS. It is possible to connect the Data In and Data Out pins together. However, with this configuration it is possible for a “bus conflict” to occur during the “dummy zero” that precedes the read operation, if A0 is a logic high level. Under such a condition the voltage level seen at Data Out is undefined and will depend upon the relative impedances of Data Out and the signal source driving A0. The higher the current sourcing capability of the driver, the higher the voltage at the Data Out pin. In order to limit this current, a resistor should be connected between DI and DO. 2.1 All modes of operation are inhibited when VCC is below a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices or 3.8V for ‘93C’ devices. Start Condition The Start bit is detected by the device if CS and DI are both high with respect to the positive edge of CLK for the first time. Before a Start condition is detected, CS, CLK, and DI may change in any combination (except to that of a Start condition), without resulting in any device operation (READ, WRITE, ERASE, EWEN, EWDS, ERAL or WRAL). As soon as CS is high, the device is no longer in Standby mode. An instruction following a Start condition will only be executed if the required opcode, address and data bits for any particular instruction are clocked in. 2.3 Data Protection The EWEN and EWDS commands give additional protection against accidentally programming during normal operation. Note: For added protection, an EWDS command should be performed after every write operation. After power-up, the device is automatically in the EWDS mode. Therefore, an EWEN instruction must be performed before the initial ERASE or WRITE instruction can be executed. Block Diagram VCC VSS Memory Array Address Decoder Address Counter Data Register Output Buffer DO DI ORG* CS Mode Decode Logic PE* CLK Clock Register *ORG and PE inputs are not available on A/B devices. 2004 Microchip Technology Inc. DS21797D-page 5 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 2.4 ERASE The DO pin indicates the READY/BUSY status of the device if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical ‘0’ indicates that programming is still in progress. DO at logical ‘1’ indicates that the register at the specified address has been erased and the device is ready for another instruction. The ERASE instruction forces all data bits of the specified address to the logical ‘1’ state. The rising edge of CLK before the last address bit initiates the write cycle. Note: FIGURE 2-1: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. ERASE TIMING TCSL CS CHECK STATUS CLK 1 DI 1 1 AN AN-1 AN-2 ••• A0 TSV DO HIGH-Z BUSY TCZ READY HIGH-Z TWC DS21797D-page 6 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 2.5 ERASE ALL (ERAL) The DO pin indicates the READY/BUSY status of the device, if CS is brought high after a minimum of 250 ns low (TCSL). The Erase All (ERAL) instruction will erase the entire memory array to the logical ‘1’ state. The ERAL cycle is identical to the ERASE cycle, except for the different opcode. The ERAL cycle is completely self-timed. The rising edge of CLK before the last data bit initiates the write cycle. Clocking of the CLK pin is not necessary after the device has entered the ERAL cycle. FIGURE 2-2: Note: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. VCC must be ≥ 4.5V for proper operation of ERAL. ERAL TIMING TCSL CS CHECK STATUS CLK 1 DI 0 0 1 0 X ••• X TSV DO HIGH-Z BUSY TCZ READY HIGH-Z TEC 2004 Microchip Technology Inc. DS21797D-page 7 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 2.6 ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN) The 93XX86A/B/C powers up in the ERASE/WRITE Disable (EWDS) state. All programming modes must be preceded by an ERASE/WRITE Enable (EWEN) instruction. Once the EWEN instruction is executed, programming remains enabled until an EWDS instruction is executed or VCC is removed from the device. FIGURE 2-3: To protect against accidental data disturbance, the EWDS instruction can be used to disable all ERASE/ WRITE functions and should follow all programming operations. Execution of a READ instruction is independent of both the EWEN and EWDS instructions. EWDS TIMING TCSL CS CLK 1 DI FIGURE 2-4: 0 0 0 0 ••• X X EWEN TIMING TCSL CS CLK 1 DI 2.7 0 0 1 1 ••• X READ devices) output string. The output data bits will toggle on the rising edge of the CLK and are stable after the specified time delay (TPD). Sequential read is possible when CS is held high. The memory data will automatically cycle to the next register and output sequentially. The READ instruction outputs the serial data of the addressed memory location on the DO pin. A dummy zero bit precedes the 8-bit (If ORG pin is low or A-Version devices) or 16-bit (If ORG pin is high or B-version FIGURE 2-5: X READ TIMING CS CLK DI DO DS21797D-page 8 1 HIGH-Z 1 0 An ••• A0 0 Dx ••• D0 Dx ••• D0 Dx ••• D0 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 2.8 WRITE The DO pin indicates the READY/BUSY status of the device, if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical ‘0’ indicates that programming is still in progress. DO at logical ‘1’ indicates that the register at the specified address has been written with the data specified and the device is ready for another instruction. The WRITE instruction is followed by 8 bits (If ORG is low or A-version devices) or 16 bits (If ORG pin is high or B-version devices) of data which are written into the specified address. The self-timed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. FIGURE 2-6: Note: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. WRITE TIMING TCSL CS CLK DI 1 0 1 An ••• A0 Dx ••• D0 TSV DO HIGH-Z BUSY TCZ READY HIGH-Z Twc 2004 Microchip Technology Inc. DS21797D-page 9 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 2.9 WRITE ALL (WRAL) The DO pin indicates the READY/BUSY status of the device if CS is brought high after a minimum of 250 ns low (TCSL). The Write All (WRAL) instruction will write the entire memory array with the data specified in the command. The self-timed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. Clocking of the CLK pin is not necessary after the device has entered the WRAL cycle. The WRAL command does include an automatic ERAL cycle for the device. Therefore, the WRAL instruction does not require an ERAL instruction but the chip must be in the EWEN status. FIGURE 2-7: Note: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. VCC must be ≥ 4.5V for proper operation of WRAL. WRAL TIMING TCSL CS CLK DI 1 0 0 0 1 X ••• X Dx ••• D0 TSV DO HIGH-Z BUSY TCZ READY HIGH-Z TWL DS21797D-page 10 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 3.0 PIN DESCRIPTIONS TABLE 3-1: 3.1 PIN DESCRIPTIONS Name SOIC/PDIP/ MSOP/TSSOP SOT-23 CS 1 5 Chip Select CLK 2 4 Serial Clock DI 3 3 Data In DO 4 1 Data Out VSS 5 2 ORG 6 N/A Organization / 93XX86C PE 7 N/A Program Enable VCC 8 6 Chip Select (CS) A high level selects the device; a low level deselects the device and forces it into Standby mode. However, a programming cycle which is already in progress will be completed, regardless of the Chip Select (CS) input signal. If CS is brought low during a program cycle, the device will go into Standby mode as soon as the programming cycle is completed. CS must be low for 250 ns minimum (TCSL) between consecutive instructions. If CS is low, the internal control logic is held in a Reset status. 3.2 Function Serial Clock (CLK) The Serial Clock is used to synchronize the communication between a master device and the 93XX series device. Opcodes, address and data bits are clocked in on the positive edge of CLK. Data bits are also clocked out on the positive edge of CLK. CLK can be stopped anywhere in the transmission sequence (at high or low level) and can be continued anytime with respect to clock high time (TCKH) and clock low time (TCKL). This gives the controlling master freedom in preparing opcode, address and data. CLK is a “don't care” if CS is low (device deselected). If CS is high, but the Start condition has not been detected (DI = 0), any number of clock cycles can be received by the device without changing its status (i.e., waiting for a Start condition). CLK cycles are not required during the self-timed WRITE (i.e., auto ERASE/WRITE) cycle. After detection of a Start condition the specified number of clock cycles (respectively low-to-high transitions of CLK) must be provided. These clock cycles are required to clock in all required opcode, address and data bits before an instruction is executed. CLK and DI then become don't care inputs waiting for a new Start condition to be detected. 2004 Microchip Technology Inc. Ground Power Supply 3.3 Data In (DI) Data In (DI) is used to clock in a Start bit, opcode, address and data synchronously with the CLK input. 3.4 Data Out (DO) Data Out (DO) is used in the Read mode to output data synchronously with the CLK input (TPD after the positive edge of CLK). This pin also provides READY/BUSY status information during ERASE and WRITE cycles. READY/BUSY status information is available on the DO pin if CS is brought high after being low for minimum Chip Select low time (TCSL) and an erase or write operation has been initiated. The Status signal is not available on DO, if CS is held low during the entire ERASE or WRITE cycle. In this case, DO is in the HIGH-Z mode. If status is checked after the ERASE/WRITE cycle, the data line will be high to indicate the device is ready. Note: 3.5 Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. Organization (ORG) When the ORG pin is connected to VCC or Logic HI, the (x16) memory organization is selected. When the ORG pin is tied to VSS or Logic LO, the (x8) memory organization is selected. For proper operation, ORG must be tied to a valid logic level. 93XX86A devices are always x8 organization and 93XX86B devices are always x16 organization. DS21797D-page 11 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 3.6 Program Enable (PE) This pin allows the user to enable or disable the ability to write data to the memory array. If the PE pin is tied to VCC, the device can be programmed. If the PE pin is tied to VSS, programming will be inhibited. PE is not available on 93XX86A or 93XX86B. On those devices, programming is always enabled. This pin cannot be floated, it must be tied to VCC or VSS. DS21797D-page 12 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead MSOP (150 mil) Example: 3L86I 2281L7 XXXXXXT YWWNNN MSOP 1st Line Marking Codes Device std mark Pb-free mark 93AA86C 93LC86C 93C86C 3A86CT 3L86CT 3C86CT GA86CT GL86CT GC86CT T = blank for commercial, “I” for Industrial, “E” for Extended. Example: 6-Lead SOT-23 5EL7 XXNN 8-Lead PDIP Example: XXXXXXXX XXXXXNNN YYWW 93LC86 I/P 1L7 0228 8-Lead SOIC Example: XXXXXXXX XXXXYYWW NNN 93LC86 I/SN 0228 1L7 SOT23 Marking Codes Device 93AA86A 93AA86B 93LC86A 93LC86B 93C86A 93C86B I-temp 5BNN 5LNN 5ENN 5PNN 5HNN 5TNN E-temp – – 5FNN 5RNN 5JNN 5UNN Pb-free topside mark is same; Pb-free noted only on carton label. TSSOP 1st Line Marking Codes Example: 8-Lead TSSOP L86 I228 1L7 XXXX TYWW NNN Device std mark Pb-free mark 93AA86C A86C GAEC 93LC86C 93C86C L86C C86C GLEC GCEC Temperature grade is marked on line 2. Legend: XX...X T Blank I E YY WW NNN Note: Part number Temperature Commercial Industrial Extended Year code (last 2 digits of calendar year) except TSSOP and MSOP which use only the last 1 digit Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Custom marking available. 2004 Microchip Technology Inc. DS21797D-page 13 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 α A2 A c φ A1 (F) L β Units Dimension Limits n p MIN INCHES NOM MAX MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MIN 8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .031 Foot Length Footprint (Reference) F .037 REF φ 0° 8° Foot Angle c .003 .006 .009 Lead Thickness B .009 .012 .016 Lead Width α 5° 15° Mold Draft Angle Top β 5° 15° Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. MAX 1.10 0.95 0.15 0.80 8° 0.23 0.40 15° 15° JEDEC Equivalent: MO-187 Drawing No. C04-111 DS21797D-page 14 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 6-Lead Plastic Small Outline Transistor (OT) (SOT-23) E E1 B p1 n D 1 α c A A2 φ L β Units Dimension Limits n p MIN A1 INCHES* NOM MAX MILLIMETERS NOM 6 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MIN Number of Pins 6 Pitch .038 p1 Outside lead pitch (basic) .075 Overall Height A .035 .046 .057 Molded Package Thickness .035 .043 .051 A2 Standoff .000 .003 .006 A1 Overall Width E .102 .110 .118 Molded Package Width .059 .064 .069 E1 Overall Length D .110 .116 .122 Foot Length L .014 .018 .022 φ Foot Angle 0 5 10 c Lead Thickness .004 .006 .008 Lead Width B .014 .017 .020 α Mold Draft Angle Top 0 5 10 β Mold Draft Angle Bottom 0 5 10 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 JEITA (formerly EIAJ) equivalent: SC-74A Drawing No. C04-120 2004 Microchip Technology Inc. DS21797D-page 15 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c § B1 B eB α β MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21797D-page 16 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 α h 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 2004 Microchip Technology Inc. DS21797D-page 17 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β A1 A2 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN INCHES NOM MAX 8 .026 .033 .002 .246 .169 .114 .020 0 .004 .007 0 0 .035 .004 .251 .173 .118 .024 4 .006 .010 5 5 .043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 8 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 MIN Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 DS21797D-page 18 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C APPENDIX A: REVISION HISTORY Revision C Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision D Corrections to Device Selection Table, Table 1-1, Table 1-2, Section 2.4, Section 2.5, Section 2.8 and Section 2.9. Added note to Figure 2-7. 2004 Microchip Technology Inc. DS21797D-page 19 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C NOTES: DS21797D-page 20 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape® or Microsoft® Internet Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 042003 The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: • Latest Microchip Press Releases • Technical Support Section with Frequently Asked Questions • Design Tips • Device Errata • Job Postings • Microchip Consultant Program Member Listing • Links to other useful web sites related to Microchip Products • Conferences for products, Development Systems, technical information and more • Listing of seminars and events 2004 Microchip Technology Inc. DS21797D-page 21 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C Literature Number: DS21797D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21797D-page 22 2004 Microchip Technology Inc. 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. X PART NO. Device Tape & Reel Temperature Range Device /XX X Package X Lead Finish 93AA86A: 16K 1.8V Microwire Serial EEPROM (x8) 93AA86B: 16K 1.8V Microwire Serial EEPROM (x16) 93AA86C: 16K 1.8V Microwire Serial EEPROM w/ORG 93LC86A: 16K 2.5V Microwire Serial EEPROM (x8) 93LC86B: 16K 2.5V Microwire Serial EEPROM (x16) 93LC86C: 16K 2.5V Microwire Serial EEPROM w/ORG Examples: a) b) c) 93AA86CT-I/MS: 16K, 2048x8 or 1024x16 Serial EEPROM, MSOP package, tape and reel, 1.8V a) 93LC86C-I/MS: 16K, 2048x8, 1024x16 Serial EEPROM, MSOP package, 2.5V 93LC86BT-I/OT: 16K, 1024x16 Serial EEPROM, SOT-23 package, tape and reel, 2.5V 93LC86CT-I/SNG: 16K, 2048x8 or 1024x16 Serial EEPROM, SOIC package, Industrial temperature, tape and reel, Pb-free finish, 2.5V b) 93C86A: 93C86B: 93C86C: 16K 5.0V Microwire Serial EEPROM (x8) 16K 5.0V Microwire Serial EEPROM (x16) 16K 5.0V Microwire Serial EEPROM w/ORG Tape & Reel: Blank = T = Standard packaging Tape & Reel Temperature Range I E = = -40°C to +85°C -40°C to +125°C Package MS OT P SN ST = = = = = Plastic MSOP (Micro Small outline, 8-lead) SOT-23, 6-lead (Tape & Reel only) Plastic DIP (300 mil body), 8-lead Plastic SOIC (150 mil body), 8-lead TSSOP, 8-lead Lead Finish: Blank = G = 93AA86C-I/MS: 16K, 2048x8 or 1024x16 Serial EEPROM, MSOP package, 1.8V 93AA86AT-I/OT: 16K, 2048x8 Serial EEPROM, SOT-23 package, tape and reel, 1.8V c) a) b) 93C86C-I/MS: 16K, 2048x8 or 1024x16 Serial EEPROM, MSOP package, 5.0V 93C86AT-I/OT: 16K, 2048x8 Serial EEPROM, SOT-23 package, tape and reel, 5.0V Standard 63% / 37% SnPb Pb-free (Matte Tin - Pure Sn) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2004 Microchip Technology Inc. DS21797D-page 23 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C NOTES: DS21797D-page 24 2004 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2004 Microchip Technology Inc. DS21797D-page 25 WORLDWIDE SALES AND SERVICE AMERICAS China - Beijing Korea Corporate Office Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Chengdu 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 Boston China - Fuzhou 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 Atlanta Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 San Jose 1300 Terra Bella Avenue Mountain View, CA 94043 Tel: 650-215-1444 Fax: 650-961-0286 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Hong Kong SAR Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Singapore Taiwan Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE China - Shanghai Austria Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark China - Shenzhen Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393 China - Shunde Room 401, Hongjian Building, No. 2 Fengxiangnan Road, Ronggui Town, Shunde District, Foshan City, Guangdong 528303, China Tel: 86-757-28395507 Fax: 86-757-28395571 China - Qingdao Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Japan Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 France Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 01/26/04 DS21797D-page 26 2004 Microchip Technology Inc.