P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES •Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. •Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. •Consult factory for Panelized Form or for mounting of consigned chips. GENERAL SPECIFICATIONS •BODY MATERIAL: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces •PADS: bare Cu protected with ENIG (Immersion Au over Electroless Ni) to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling •PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M •PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290 •OPERATING TEMPERATURE: 221°F [105°C] ORDERING INFORMATION MOUNTING CONSIDERATIONS CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. •SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. •Will plug into existing PGA footprint with matching Pad assignments Specify... P/N 97-AQ132D or P/N 97-AQ132D-P for Panelized form ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ROW-TO-ROW AND PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18022 Rev. AA