Microsemi A1415A Accelerator series fpgas â act 3 family Datasheet

Revision 3
Accelerator Series FPGAs – ACT 3 Family
Features
• Up to 10,000 Gate Array Equivalent Gates (up to 25,000
equivalent PLD Gates)
• Highly Predictable Performance with 100% Automatic Placeand-Route
• As Low as 9.0 ns Clock-to-Output Times (–1 Speed Grade)
• Up to 186 MHz On-Chip Performance (–1 Speed Grade)
• Up to 228 User-Programmable I/O Pins
• Four Fast, Low-Skew Clock Networks
•
•
•
•
•
•
•
•
•
•
More than 500 Macro Functions
Replaces up to Twenty 32 Macro-Cell CPLDs
Replaces up to One Hundred 20-Pin PAL® Packages
Up to 1,153 Dedicated Flip-Flops
VQFP, TQFP, BGA, and PQFP Packages
Nonvolatile, User Programmable
Fully Tested Prior to Shipment
5.0 V and 3.3 V Versions
Optimized for Logic Synthesis Methodologies
Low Power CMOS Technology
Table 1 • ACT 3 Family Product Information
Device
A1415
A1425
A1440
A1460
A14100
Gate Array Equivalent Gates
1,500
2,500
4,000
6,000
10,000
PLD Equivalent Gates
3,750
6,250
10,000
15,000
25,000
Capacity
TTL Equivalent Package (40 gates)
40
60
100
150
250
20-Pin PAL Equivalent Packages (100 gates)
15
25
40
60
100
Logic Modules
S-Module
C-Module
200
310
564
848
1,377
104
160
288
432
697
96
150
276
416
680
Dedicated Flip-Flops1
264
360
568
768
1,153
User I/Os (maximum)
80
100
140
168
228
Maximum Performance2 (worst-case commercial, –1 speed grade)
Chip-to-Chip3 (MHz)
80
80
80
78
76
Accumulators (16-bit, MHz)
47
47
47
47
47
Loadable Counter (16-bit, MHz)
82
82
82
82
78
Prescaled Loadable Counters (16-bit, MHz)
186
186
186
150
150
Datapath, Shift Registers (MHz)
186
186
186
150
150
Clock-to-Output (pad-to-pad, ns)
9.0
9.0
9.5
10.0
10.5
PG1005
PL84
PQ100
–
VQ100
PG1335
PL84
PQ100, PQ160
–
VQ100
–
–
CQ132
PG1755
PL84
PQ160
–
VQ100
TQ176
–
–
PG207
–
PQ160, PQ208
–
–
TQ176
BG2255
CQ196
PG257
–
–
RQ208
–
–
BG313
CQ256
Packages4 (by pin count)
CPGA
PLCC
PQFP
RQFP
VQFP
TQFP
BGA
CQFP
–
–
–
Notes:
1. One flip-flop per S0Module, two flip-flops per I/O Module.
2. Based on A1415A-1, A1425A-1, A1440A-1, A1460A-1, and A14100A-1.
3. Clock-to-Output (pad-to-pad) + assumed trace delay + setup time. Refer to the "System Performance Model" on page 1-1 and
Table 1-1 on page 1-2.
4. See the "Product Plan" table on page III for package availability.
5. Discontinued device and package combination.
6. –2 and –3 speed grades have been discontinued. For more information about discontinued devices, refer to the Product
Discontinuation Notices (PDNs) listed below, available on the Microsemi SoC Products Group website:
PDN March 2001, PDN 0104, PDN 0203, PDN 0604, PDN 1004
January 2012
© 2012 Microsemi Corporation
I
Accelerator Series FPGAs – ACT 3 Family
Ordering Information
A14100
A
_
1
RQ
G
208
C
Application (Temperature Range)
C = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Package Type
PG = Ceramic Pin Grid Array
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flatpack
RQ = Plastic Power Quad Flatpack
VQ = Very Thin (1.0 mm) Quad Flatpack
TQ = Thin (1.4 mm) Quad Flatpack
CQ = Ceramic Quad Flatpack
BG = Plastic Ball Grid Array
Speed Grade
Std = Standard Speed
–1 = Approximately 15% faster than Standard
–2 = Approximately 25% faster than Standard
–3 = Approximately 35% faster than Standard
Die Revision
A = 1.0 mm CMOS Process
Part Number
A1415A = 1,500 Gates
A14V15A = 1,500 Gates (3.3 V)
A1425A = 2,500 Gates
A14V25A = 2,500 Gates (3.3 V)
A1440A = 4,000 Gates
A14V40A = 4,000 Gates (3.3 V)
A1460A = 6,000 Gates
A14V60A = 6,000 Gates (3.3 V)
A14100A = 10,000 Gates
A14V100A = 10,000 Gates (3.3 V)
Notes:
1. The –2 and –3 speed grades have been discontinued.
2. The Ceramic Pin Grid Array packages PG100, PG133, and PG175 have been discontinued in all device densities, speed
grades, and temperature grades.
3. The Plastic Ball Grid Array package BG225 has been discontinued in all device densities (specifically for A1460A), all speed
grades, and all temperature grades.
4. Military Grade devices are no longer available for the A1440A device.
5. For more information about discontinued devices, refer to the Product Discontinuation Notices (PDNs) listed below, available on
the Microsemi SoC Products Group website:
PDN March 2001
PDN 0104
PDN 0203
PDN 0604
PDN 1004
II
R ev i si o n 3
Accelerator Series FPGAs – ACT 3 Family
Product Plan
Speed Grade1
Device/Package
Application1
Std.
–1
–2
–3
C
I
M
B
84-Pin Plastic Leaded Chip Carrier (PLCC)
✓
✓
D
D
✓
✓
✓
–
100-Pin Plastic Quad Flatpack (PQFP)
✓
✓
D
D
✓
✓
✓
–
100-Pin Very Thin Quad Flatpack (VQFP)
✓
✓
D
D
✓
✓
✓
–
100-Pin Ceramic Pin Grid Array (CPGA)
D
D
D
D
D
–
–
–
84-Pin Plastic Leaded Chip Carrier (PLCC)
✓
–
–
–
✓
–
–
–
100-Pin Very Thin Quad Flatpack (VQFP)
✓
–
–
–
✓
–
–
–
84-Pin Plastic Leaded Chip Carrier (PLCC)
✓
✓
D
D
✓
✓
100-Pin Plastic Quad Flatpack (PQFP)
✓
✓
D
D
✓
✓
–
–
100-Pin Very Thin Quad Flatpack (VQFP)
✓
✓
D
D
✓
✓
–
–
132-Pin Ceramic Quad Flatpack (CQFP)
✓
✓
–
–
✓
–
✓
✓
133-Pin Ceramic Pin Grid Array (CPGA)
D
D
D
D
D
–
D
D
160-Pin Plastic Quad Flatpack (PQFP)
✓
✓
D
D
✓
✓
–
–
84-Pin Plastic Leaded Chip Carrier (PLCC)
✓
–
–
–
✓
–
–
–
100-Pin Very Thin Quad Flatpack (VQFP)
✓
–
–
–
✓
–
–
–
160-Pin Plastic Quad Flatpack (PQFP)
✓
–
–
–
✓
–
–
–
84-Pin Plastic Leaded Chip Carrier (PLCC)
✓
✓
D
D
✓
✓
–
–
100-Pin Very Thin Quad Flatpack (VQFP)
✓
✓
D
D
✓
✓
–
–
160-Pin Plastic Quad Flatpack (PQFP)
✓
✓
D
D
✓
✓
–
–
175-Pin Ceramic Pin Grid Array (CPGA)
D
D
D
D
D
–
–
–
176-Pin Thin Quad Flatpack (TQFP)
✓
✓
D
D
✓
✓
–
–
Notes:
1. Applications:
C = Commercial
I = Industrial
M = Military
2. Commercial only
Availability:
✓ = Available
P = Planned
– = Not planned
D = Discontinued
A1415A Device
A14V15A Device
A1425A Device
A14V25A Device
A1440A Device
R e visi on 3
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
–3 = Approx. 35% faster than Std.
(–2 and –3 speed grades have
been discontinued.)
III
Accelerator Series FPGAs – ACT 3 Family
Speed Grade1
Device/Package
Application1
Std.
–1
–2
–3
C
I
M
B
84-Pin Plastic Leaded Chip Carrier (PLCC)
✓
–
–
–
✓
–
–
–
100-Pin Very Thin Quad Flatpack (VQFP)
✓
–
–
–
✓
–
–
–
160-Pin Plastic Quad Flatpack (PQFP)
✓
–
–
–
✓
–
–
–
176-Pin Thin Quad Flatpack (TQFP)
✓
–
–
–
✓
–
–
–
160-Pin Plastic Quad Flatpack (PQFP)
✓
✓
D
D
✓
✓
–
–
176-Pin Thin Quad Flatpack (TQFP)
✓
✓
D
D
✓
✓
–
–
196-Pin Ceramic Quad Flatpack (CQFP)
✓
✓
–
–
✓
–
✓
✓
207-Pin Ceramic Pin Grid Array (CPGA)
✓
✓
D
D
✓
–
✓
✓
208-Pin Plastic Quad Flatpack (PQFP)
✓
✓
D
D
✓
✓
–
–
225-Pin Plastic Ball Grid Array (BGA)
D
D
D
D
D
–
–
–
160-Pin Plastic Quad Flatpack (PQFP)
✓
–
–
–
✓
–
–
–
176-Pin Thin Quad Flatpack (TQFP)
✓
–
–
–
✓
–
–
–
208-Pin Plastic Quad Flatpack (PQFP)
✓
–
–
–
✓
–
–
–
208-Pin Power Quad Flatpack (RQFP)
✓
✓
D
D
✓
✓
–
–
257-Pin Ceramic Pin Grid Array (CPGA)
✓
✓
D
D
✓
–
✓
✓
313-Pin Plastic Ball Grid Array (BGA)
✓
✓
D
D
✓
–
–
–
256-Pin Ceramic Quad Flatpack (CQFP)
✓
✓
–
–
✓
–
✓
✓
208-Pin Power Quad Flatpack (RQFP)
✓
–
–
–
✓
–
–
–
313-Pin Plastic Ball Grid Array (BGA)
✓
–
–
–
✓
–
–
–
Notes:
1. Applications:
C = Commercial
I = Industrial
M = Military
2. Commercial only
Availability:
✓ = Available
P = Planned
– = Not planned
D = Discontinued
A14V40A Device
A1460A Device
A14V60A Device
A14100A Device
A14V100A Device
IV
R ev i si o n 3
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
–3 = Approx. 35% faster than Std.
(–2 and –3 speed grades have
been discontinued.)
Accelerator Series FPGAs – ACT 3 Family
Plastic Device Resources
User I/Os
Device
Series
Logic
Modules
Gates
PL84
PQ100
PQ160
PQ/RQ208
VQ100
TQ176
BG225*
BG313
A1415
200
1500
70
80
–
–
80
–
–
–
A1425
310
2500
70
80
100
–
83
–
–
–
A1440
564
4000
70
–
131
–
83
140
–
–
A1460
848
6000
–
–
131
167
–
151
168
–
A14100
1377
10000
–
–
–
175
–
–
–
228
Note: *Discontinued
Hermetic Device Resources
User I/Os
Device
Series
Logic
Modules
Gates
PG100*
PG133*
PG175*
PG207
PG257
CQ132
CQ196
CQ256
A1415
200
1500
80
–
–
–
–
–
–
–
A1425
310
2500
–
100
–
–
–
100
–
–
A1440
564
4000
–
–
140
–
–
–
–
–
A1460
848
6000
–
–
–
168
–
–
168
–
A14100
1377
10000
–
–
–
–
228
–
–
228
Note: *Discontinued
Contact your local Microsemi SoC Products Group (formerly Actel) representative for device availability:
http://www.microsemi.com/soc/contact/default.aspx.
R e visi on 3
V
Table of Contents
ACT 3 Family Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Detailed Specifications
Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Logic Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Clock Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Routing Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
5 V Operating Conditions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
3.3 V Operating Conditions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
ACT 3 Timing Model
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-42
Package Pin Assignments
PL84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
PQ100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
PQ160 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
PQ208, RQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
VQ100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
CQ132 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
CQ196 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
CQ256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
BG225 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-20
BG313 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
PG100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24
PG133 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26
PG175 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-28
PG207 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30
PG257 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
VI
Revision 3
1 – ACT 3 Family Overview
General Description
Microsemi’s ACT 3 Accelerator Series of FPGAs offers the industry’s fastest high-capacity
programmable logic device. ACT 3 FPGAs offer a high performance, PCI compliant programmable
solution capable of 186 MHz on-chip performance and 9.0 nanosecond clock-to-output (–1 speed grade),
with capacities spanning from 1,500 to 10,000 gate array equivalent gates.
The ACT 3 family builds on the proven two-module architecture consisting of combinatorial and
sequential logic modules used in Microsemi’s 3200DX and 1200XL families. In addition, the ACT 3 I/O
modules contain registers which deliver 9.0 nanosecond clock-to-out times (–1 speed grade). The
devices contain four clock distribution networks, including dedicated array and I/O clocks, supporting
very fast synchronous and asynchronous designs. In addition, routed clocks can be used to drive high
fanout signals such as flip-flop resets and output.
The ACT 3 family is supported by Microsemi’s Designer Series Development System which offers
automatic placement and routing (with automatic or fixed pin assignments), static timing analysis, user
programming, and debug and diagnostic probe capabilities.
Accumulators (16-Bit)
47 MHz
Loadable Counters (16-Bit)
Figure 1-1 •
82 MHz
Prescaled Loadable Counters (16-Bit)
186 MHz
Shift Registers
186 MHz
Predictable Performance (worst-case commercial, –1 speed grade)
System Performance Model
Chip #1 I/O Module
Chip #2 I/O Module
35 pF
I/O CLK
I/O CLK
tCKHS
tTRACE
Revision 3
tINSU
1 -1
ACT 3 Family Overview
Table 1-1 • Chip-to-Chip Performance (worst-case commercial)
Device and Speed
Grade
tCKHS (ns)
tTRACE (ns)
tINSU (ns)
Total (ns)
MHz
A1425A -3
7.5
1.0
1.8
10.3
97
A1460A -3
9.0
1.0
1.3
11.3
88
A1425A -2
7.5
1.0
2.0
10.5
95
A1460A -2
9.0
1.0
1.5
11.5
87
A1425A -1
9.0
1.0
2.3
12.3
81
A1460A -1
10.0
1.0
1.8
12.8
78
A1425A STD
10.0
1.0
2.7
13.7
73
A1460A STD
11.5
1.0
2.0
14.5
69
Note: The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN
0604, and PDN 1004 at http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
1-2
R e vi s i o n 3
2 – Detailed Specifications
This section of the datasheet is meant to familiarize the user with the architecture of the ACT 3 family of
FPGA devices. A generic description of the family will be presented first, followed by a detailed
description of the logic blocks, the routing structure, the antifuses, and the special function circuits. The
on-chip circuitry required to program the devices is not covered.
Topology
The ACT 3 family architecture is composed of six key elements: Logic modules, I/O modules, I/O Pad
Drivers, Routing Tracks, Clock Networks, and Programming and Test Circuits. The basic structure is
similar for all devices in the family, differing only in the number of rows, columns, and I/Os. The array
itself consists of alternating rows of modules and channels. The logic modules and channels are in the
center of the array; the I/O modules are located along the array periphery. A simplified floor plan is
depicted in Figure 2-1.
An Array with n rows and m columns
0
Rows
1
2
3
4
5
c–1
c
c+1
m m+1 m+2 m+3
Columns
Channels
n+2
IO
n+1
IO IO
CLKM
IO
IO IO
IO
IO
IO
Top I/Os
n+1
n
IO
IO BIN S
S
C
C
S
S
C
C
S
C
S
IO
IO
IO
IO BIN S
S
C
C
S
S
C
C
S
C
S
IO
IO
IO
IO BIN S
S
C
C
S
S
C
C
S
C
S
IO
IO
IO
IO BIN S
S
C
C
S
S
C
C
S
C
S
IO
IO
IO
IO IO
IO
IO IO
IO
IO IO
IO
Right I/Os
Bottom I/Os
n
n–1
•
•
•
2
n–1
•
•
•
2
1
1
Left I/Os
0
BIO IO
0
Figure 2-1 •
Generalized Floor Plan of ACT 3 Device
Revision 3
2 -1
Detailed Specifications
Logic Modules
ACT 3 logic modules are enhanced versions of the 1200XL family logic modules. As in the 1200XL
family, there are two types of modules: C-modules and S-modules (Figure 2-2 and Figure 2-3). The Cmodule is functionally equivalent to the 1200XL C-module and implements high fanin combinatorial
macros, such as 5-input AND, 5-input OR, and so on. It is available for use as the CM8 hard macro. The
S-module is designed to implement high-speed sequential functions within a single module.
D00
D01
OUT
Y
D10
D11
Figure 2-2 •
S1
S0
A1 B1
A0 B0
C-Module Diagram
D00
D01
D10
Y
D
Q
OUT
D11
S1
S0
A1 B1
A0 B0
CLK
Figure 2-3 •
CLR
S-Module Diagram
S-modules consist of a full C-module driving a flip-flop, which allows an additional level of logic to be
implemented without additional propagation delay. It is available for use as the DFM8A/B and DLM8A/B
hard macros. C-modules and S-modules are arranged in pairs called module-pairs. Module-pairs are
arranged in alternating patterns and make up the bulk of the array. This arrangement allows the
placement software to support two-module macros of four types (CC, CS, SC, and SS). The C-module
implements the following function:
Y = !S1 * !S0 * D00 + !S1 * S0 * D01 + S1 * !S0 * D10 + S1 * S0 * D11
EQ 1
where: S0 = A0 * B0 and S1 = A1 + B1
2-2
R e vi s i o n 3
Accelerator Series FPGAs – ACT 3 Family
The S-module contains a full implementation of the C-module plus a clearable sequential element that
can either implement a latch or flip-flop function. The S-module can therefore implement any function
implemented by the C-module. This allows complex combinatorial-sequential functions to be
implemented with no delay penalty. The Designer Series Development System will automatically
combine any C-module macro driving an S-module macro into the S-module, thereby freeing up a logic
module and eliminating a module delay.
The clear input CLR is accessible from the routing channel. In addition, the clock input may be connected
to one of three clock networks: CLKA, CLKB, or HCLK. The C-module and S-module functional
descriptions are shown in Figure 2-2 and Figure 2-3 on page 2-2. The clock selection is determined by a
multiplexer select at the clock input to the S-module.
I/Os
I/O Modules
I/O modules provide an interface between the array and the I/O Pad Drivers. I/O modules are located in
the array and access the routing channels in a similar fashion to logic modules. The I/O module
schematic is shown in Figure 4. The signals DataIn and DataOut connect to the I/O pad driver.
D
0
MUX
1
Q
DATAOUT
CLR/PRE
ODE
Y
D
0
MUX
1
0
S0
S1
1
MUX 2
3
Q
D
1
MUX
0
DATAIN
CLR/PRE
IOPCL
IOCLK
Figure 2-4 •
Functional Diagram for I/O Module
Each I/O module contains two D-type flip-flops. Each flip-flop is connected to the dedicated I/O clock
(IOCLK). Each flip-flop can be bypassed by nonsequential I/Os. In addition, each flip-flop contains a data
enable input that can be accessed from the routing channels (ODE and IDE). The asynchronous
preset/clear input is driven by the dedicated preset/clear network (IOPCL). Either preset or clear can be
selected individually on an I/O module by I/O module basis.
Revision 3
2 -3
Detailed Specifications
The I/O module output Y is used to bring Pad signals into the array or to feed the output register back into
the array. This allows the output register to be used in high-speed state machine applications. Side I/O
modules have a dedicated output segment for Y extending into the routing channels above and below
(similar to logic modules). Top/Bottom I/O modules have no dedicated output segment. Signals coming
into the chip from the top or bottom are routed using F-fuses and LVTs (F-fuses and LVTs are explained
in detail in the routing section).
I/O Pad Drivers
All pad drivers are capable of being tristate. Each buffer connects to an associated I/O module with four
signals: OE (Output Enable), IE (Input Enable), DataOut, and DataIn. Certain special signals used only
during programming and test also connect to the pad drivers: OUTEN (global output enable), INEN
(global input enable), and SLEW (individual slew selection). See Figure 2-5.
OE
SLEW
DATAOUT
PAD
DATAIN
IEN
INEN
OUTEN
Figure 2-5 •
Function Diagram for I/O Pad Driver
Special I/Os
The special I/Os are of two types: temporary and permanent. Temporary special I/Os are used during
programming and testing. They function as normal I/Os when the MODE pin is inactive. Permanent
special I/Os are user programmed as either normal I/Os or special I/Os. Their function does not change
once the device has been programmed. The permanent special I/Os consist of the array clock input
buffers (CLKA and CLKB), the hard-wired array clock input buffer (HCLK), the hard-wired I/O clock input
buffer (IOCLK), and the hard-wired I/O register preset/clear input buffer (IOPCL). Their function is
determined by the I/O macros selected.
Clock Networks
The ACT 3 architecture contains four clock networks: two high-performance dedicated clock networks
and two general purpose routed networks. The high-performance networks function up to 200 MHz,
while the general purpose routed networks function up to 150 MHz.
2-4
R e vi s i o n 3
Accelerator Series FPGAs – ACT 3 Family
Dedicated Clocks
Dedicated clock networks support high performance by providing sub-nanosecond skew and guaranteed
performance. Dedicated clock networks contain no programming elements in the path from the I/O Pad
Driver to the input of S-modules or I/O modules. There are two dedicated clock networks: one for the
array registers (HCLK), and one for the I/O registers (IOCLK). The clock networks are accessed by
special I/Os.
CLKB
CLKINB
CLKA
CLKINA
FROM
PADS
CLKMOD
S0
S1
INTERNAL
SIGNAL
CLKO(17)
CLOCK
DRIVERS
CLKO(16)
CLKO(15)
CLKO(2)
CLKO(1)
CLOCK TRACKS
Figure 2-6 •
Clock Networks
The routed clock networks are referred to as CLK0 and CLK1. Each network is connected to a clock
module (CLKMOD) that selects the source of the clock signal and may be driven as follows (Figure 2-6):
•
Externally from the CLKA pad
•
Externally from the CLKB pad
•
Internally from the CLKINA input
•
Internally from the CLKINB input
The clock modules are located in the top row of I/O modules. Clock drivers and a dedicated horizontal
clock track are located in each horizontal routing channel. The function of the clock module is determined
by the selection of clock macros from the macro library. The macro CLKBUF is used to connect one of
the two external clock pins to a clock network, and the macro CLKINT is used to connect an internally
generated clock signal to a clock network. Since both clock networks are identical, the user does not care
whether CLK0 or CLK1 is being used. Routed clocks can also be used to drive high fanout nets like
resets, output enables, or data enables. This saves logic modules and results in performance increases
in some cases.
Routing Structure
The ACT 3 architecture uses vertical and horizontal routing tracks to connect the various logic and I/O
modules. These routing tracks are metal interconnects that may either be of continuous length or broken
into segments. Segments can be joined together at the ends using antifuses to increase their lengths up
to the full length of the track.
Revision 3
2 -5
Detailed Specifications
Horizontal Routing
Horizontal channels are located between the rows of modules and are composed of several routing
tracks. The horizontal routing tracks within the channel are divided into one or more segments. The
minimum horizontal segment length is the width of a module-pair, and the maximum horizontal segment
length is the full length of the channel. Any segment that spans more than one-third the row length is
considered a long horizontal segment. A typical channel is shown in Figure 2-7. Undedicated horizontal
routing tracks are used to route signal nets. Dedicated routing tracks are used for the global clock
networks and for power and ground tie-off tracks.
Module Row
HCLK
CLK0
NVCC
SIGNAL
Track
Segment
SIGNAL
(LHT)
|
|
|
|
|
|
|
HF
SIGNAL
NVSS
CLK1
Module Row
Figure 2-7 •
Horizontal Routing Tracks and Segments
Vertical Routing
Other tracks run vertically through the modules. Vertical tracks are of three types: input, output, and long.
Vertical tracks are also divided into one or more segments. Each segment in an input track is dedicated
to the input of a particular module. Each segment in an output track is dedicated to the output of a
particular module. Long segments are uncommitted and can be assigned during routing. Each output
segment spans four channels (two above and two below), except near the top and bottom of the array
where edge effects occur. LVTs contain either one or two segments. An example of vertical routing tracks
and segments is shown in Figure 2-8.
LVTs
Module Row
C-Module
S-Module
VF
Channel
XF
Vertical Input
Segment
FF
S-Module
Figure 2-8 •
2-6
Vertical Routing Tracks and Segments
R e vi s i o n 3
C-Module
Accelerator Series FPGAs – ACT 3 Family
Antifuse Connections
An antifuse is a “normally open” structure as opposed to the normally closed fuse structure used in
PROMs or PALs. The use of antifuses to implement a programmable logic device results in highly
testable structures as well as an efficient programming architecture. The structure is highly testable
because there are no preexisting connections; temporary connections can be made using pass
transistors. These temporary connections can isolate individual antifuses to be programmed as well as
isolate individual circuit structures to be tested. This can be done both before and after programming. For
example, all metal tracks can be tested for continuity and shorts between adjacent tracks, and the
functionality of all logic modules can be verified.
Four types of antifuse connections are used in the routing structure of the ACT 3 array. (The physical
structure of the antifuse is identical in each case; only the usage differs.)
Table 2-1 shows four types of antifuses.
Table 2-1 • Antifuse Types
Type
Description
XF
Horizontal-to-vertical connection
HF
Horizontal-to-horizontal connection
VF
Vertical-to-vertical connection
FF
"Fast" vertical connection
Examples of all four types of connections are shown in Figure 2-7 on page 2-6 and Figure 2-8 on
page 2-6.
Module Interface
Connections to Logic and I/O modules are made through vertical segments that connect to the module
inputs and outputs. These vertical segments lie on vertical tracks that span the entire height of the array.
Module Input Connections
The tracks dedicated to module inputs are segmented by pass transistors in each module row. During
normal user operation, the pass transistors are inactive, which isolates the inputs of a module from the
inputs of the module directly above or below it. During certain test modes, the pass transistors are active
to verify the continuity of the metal tracks. Vertical input segments span only the channel above or the
channel below. The logic modules are arranged such that half of the inputs are connected to the channel
above and half of the inputs to segments in the channel below, as shown in Figure 2-9.
Y+2
Y+2
Y+1
B1 B0
D01 D00
A1 D10 D11
A0
Y+1
Y-1
D10
B1 D01
A0 D11 A1
Y-1
Y-2
Y-2
LVTs
S-Modules
Figure 2-9 •
B0
Y
Y
C-Modules
Logic Module Routing Interface
Revision 3
2 -7
Detailed Specifications
Module Output Connections
Module outputs have dedicated output segments. Output segments extend vertically two channels above
and two channels below, except at the top or bottom of the array. Output segments twist, as shown in
Figure 10, so that only four vertical tracks are required.
LVT Connections
Outputs may also connect to nondedicated segments called Long Vertical Tracks (LVTs). Each module
pair in the array shares four LVTs that span the length of the column. Any module in the column pair can
connect to one of the LVTs in the column using an FF connection. The FF connection uses antifuses
connected directly to the driver stage of the module output, bypassing the isolation transistor. FF
antifuses are programmed at a higher current level than HF, VF, or XF antifuses to produce a lower
resistance value.
Antifuse Connections
In general every intersection of a vertical segment and a horizontal segment contains an unprogrammed
antifuse (XF-type). One exception is in the case of the clock networks.
Clock Connections
To minimize loading on the clock networks, a subset of inputs has antifuses on the clock tracks. Only a
few of the C-module and S-module inputs can be connected to the clock networks. To further reduce
loading on the clock network, only a subset of the horizontal routing tracks can connect to the clock
inputs of the S-module.
Programming and Test Circuits
The array of logic and I/O modules is surrounded by test and programming circuits controlled by the
temporary special I/O pins MODE, SDI, and DCLK. The function of these pins is similar to all ACT family
devices. The ACT 3 family also includes support for two Actionprobe® circuits, allowing complete
observability of any logic or I/O module in the array using the temporary special I/O pins, PRA and PRB.
2-8
R e vi s i o n 3
Accelerator Series FPGAs – ACT 3 Family
5 V Operating Conditions
Table 2-2 • Absolute Maximum Ratings1, Free Air Temperature Range
Symbol
Parameter
VCC
DC supply voltage
VI
Input voltage
VO
Output voltage
Limits
Units
–0.5 to +7.0
V
–0.5 to VCC + 0.5
V
–0.5 to VCC + 0.5
V
±20
mA
–65 to +150
°C
current2
IIO
I/O source sink
TSTG
Storage temperature
Notes:
1. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Device should not be
operated outside the recommended operating conditions.
2. Device inputs are normally high impedance and draw extremely low current. However, when input voltage is greater
than VCC + 0.5 V for less than GND –0.5 V, the internal protection diodes will forward bias and can draw excessive
current.
Table 2-3 • Recommended Operating Conditions
Parameter
Temperature range*
5 V power supply tolerance
Commercial
Industrial
Military
Units
0 to +70
–40 to +85
–55 to +125
°C
±5
±10
±10
%VCC
Note: *Ambient temperature (TA) is used for commercial and industrial; case temperature (TC) is used for military.
Table 2-4 • Electrical Specifications
Commercial
Symbol
1,2
VOH
Parameter
High level output
VOL1,2 Low level output
Test Condition
Industrial
Military
Min.
Max.
Min.
Max.
Min.
Max.
Units
IOH = –4 mA (CMOS)
–
–
3.7
–
3.7
–
V
IOH = –6 mA (CMOS)
3.84
V
IOH = –10 mA (TTL)3
2.40
V
IOL = +6 mA (CMOS)
0.33
3
0.50
IOL = +12 mA (TTL)
0.4
0.4
V
VIH
High level input
TTL inputs
2.0 VCC + 0.3 2.0 VCC + 0.3 2.0 VCC + 0.3
V
VIL
Low level input
TTL inputs
–0.3
0.8
–0.3
0.8
–0.3
0.8
V
IIN
Input leakage
VI = VCC or GND
–10
+10
–10
+10
–10
+10
µA
IOZ
3-state output leakage VO = VCC or GND
–10
+10
–10
+10
–10
+10
µA
CIO
3,4
I/O capacitance
ICC(S) Standby VCC supply current (typical = 0.7 mA)
10
10
10
pF
2
10
20
mA
ICC(D) Dynamic VCC supply current. See the Power Dissipation section.
Notes:
1. Microsemi devices can drive and receive either CMOS or TTL signal levels. No assignment of I/Os as TTL or CMOS is
required.
2. Tested one output at a time, VCC = minimum.
3. Not tested; for information only.
4. VOUT = 0 V, f = 1 MHz
5. Typical standby current = 0.7 mA. All outputs unloaded. All inputs = VCC or GND.
Revision 3
2 -9
Detailed Specifications
3.3 V Operating Conditions
Table 2-5 • Absolute Maximum Ratings1, Free Air Temperature Range
Symbol
Parameter
VCC
DC supply voltage
VI
Input voltage
VO
Output voltage
Limits
Units
–0.5 to +7.0
V
–0.5 to VCC + 0.5
V
–0.5 to VCC + 0.5
V
±20
mA
–65 to +150
°C
current2
IIO
I/O source sink
TSTG
Storage temperature
Notes:
1. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Device should not be
operated outside the recommended operating conditions.
2. Device inputs are normally high impedance and draw extremely low current. However, when input voltage is greater
than VCC + 0.5 V for less than GND –0.5 V, the internal protection diodes will forward bias and can draw excessive
current.
Table 2-6 • Recommended Operating Conditions
Parameter
Commercial
Units
Temperature range*
0 to +70
°C
Power supply tolerance
3.0 to 3.6
V
Note: *Ambient temperature (TA) is used for commercial.
Table 2-7 • Electrical Specifications
Commercial
Parameter
1
VOH
VOL1
Min.
Max.
Units
IOH = –4 mA
2.15
–
V
IOH = –3.2 mA
2.4
0.4
V
–0.3
0.8
V
2.0
VCC + 0.3
V
–10
+10
µA
10
pF
0.75
mA
10
µA
IOL = 6 mA
VIL
VIH
Input transition time tR, tF2
VI = VCC or GND
CIO I/O Capacitance2,3
4
Standby current, ICC (typical = 0.3 mA)
5
–10
Leakage current
1.
2.
3.
4.
5.
Only one output tested at a time. VCC = minimum.
Not tested; for information only.
Includes worst-case 84-pin PLCC package capacitance. VOUT = 0 V, f - 1 MHz.
Typical standby current = 0.3 mA. All outputs unloaded. All inputs = VCC or GND.
VO, VIN = VCC or GND
2- 10
R e visio n 3
V
Accelerator Series FPGAs – ACT 3 Family
Package Thermal Characteristics
The device junction to case thermal characteristic is θjc, and the junction to ambient air characteristic is
θja. The thermal characteristics for θja are shown with two different air flow rates.
Maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power dissipation allowed for a CPGA 175-pin package at
commercial temperature and still air is as follows:
150°C – 70°C
Max.
junction temp. (°C) – Max. ambient temp. (°C)-------------------------------------------------------------------------------------------------------------------------------------= ------------------------------------ = 3.2 W
25°C/W
θ ja °C/W
EQ 2
Table 2-8 • Package Thermal Characteristics
Pin Count
θjc
θja
Still Air
θja
300 ft./min.
Units
100
20
35
17
°C/W
133
20
30
15
°C/W
175
20
25
14
°C/W
207
20
22
13
°C/W
257
20
15
8
°C/W
132
13
55
30
°C/W
196
13
36
24
°C/W
256
13
30
18
°C/W
100
13
51
40
°C/W
160
10
33
26
°C/W
208
10
33
26
°C/W
Very Thin Quad Flatpack
100
12
43
35
°C/W
Thin Quad Flatpack
176
11
32
25
°C/W
Power Quad Flatpack
208
0.4
17
13
°C/W
Plastic Leaded Chip Carrier
84
12
37
28
°C/W
Plastic Ball Grid Array
225
10
25
19
°C/W
313
10
23
17
°C/W
Package Type*
Ceramic Pin Grid Array
Ceramic Quad Flatpack
Plastic Quad Flatpack
Note: Maximum power dissipation in still air:
PQ160 = 2.4 W
PQ208 = 2.4 W
PQ100 = 1.6 W
VQ100 = 1.9 W
TQ176 = 2.5 W
PL84 = 2.2 W
RQ208 = 4.7 W
BG225 = 3.2 W
BG313 = 3.5 W
Revision 3
2- 11
Detailed Specifications
Power Dissipation
P = [ICC standby + Iactive] * VCC * IOL * VOL * N + IOH* (VCC – VOH) * M
EQ 3
where:
ICC standby is the current flowing when no inputs or outputs are changing
Iactive is the current flowing due to CMOS switching.
IOL and IOH are TTL sink/source current.
VOL and VOH are TTL level output voltages.
N is the number of outputs driving TTL loads to VOL.
M equals the number of outputs driving TTL loads to VOH.
An accurate determination of N and M is problematical because their values depend on the design and
on the system I/O. The power can be divided into two components: static and active.
Static Power Component
Microsemi FPGAs have small static power components that result in lower power dissipation than PALs
or PLDs. By integrating multiple PALs/PLDs into one FPGA, an even greater reduction in board-level
power dissipation can be achieved.
The power due to standby current is typically a small component of the overall power. Standby power is
calculated in Table 2-9 for commercial, worst case conditions.
Table 2-9 • Standby Power Calculation
ICC
2 mA
VCC
Power
5.25 V
10.5 mW
The static power dissipated by TTL loads depends on the number of outputs driving high or low and the
DC load current. Again, this value is typically small. For instance, a 32-bit bus sinking 4 mA at 0.33 V will
generate 42 mW with all outputs driving low, and 140 mW with all outputs driving high. The actual
dissipation will average somewhere between as I/Os switch states with time.
Active Power Component
Power dissipation in CMOS devices is usually dominated by the active (dynamic) power dissipation. This
component is frequency dependent, a function of the logic and the external I/O. Active power dissipation
results from charging internal chip capacitances of the interconnect, unprogrammed antifuses, module
inputs, and module outputs, plus external capacitance due to PC board traces and load device inputs.
An additional component of the active power dissipation is the totem-pole current in CMOS transistor
pairs. The net effect can be associated with an equivalent capacitance that can be combined with
frequency and voltage to represent active power dissipation.
Equivalent Capacitance
The power dissipated by a CMOS circuit can be expressed by EQ 4.
Power (µW) = CEQ * VCC2 * F
EQ 4
Where:
CEQ is the equivalent capacitance expressed in pF.
VCC is the power supply in volts.
F is the switching frequency in MHz.
2- 12
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
Equivalent capacitance is calculated by measuring ICC active at a specified frequency and voltage for
each circuit component of interest. Measurements have been made over a range of frequencies at a
fixed value of VCC. Equivalent capacitance is frequency independent so that the results may be used
over a wide range of operating conditions. Equivalent capacitance values are shown in Figure 2-10.
Table 2-10 • CEQ Values for Microsemi FPGAs
Item
CEQ Value
Modules (CEQM)
6.7
Input Buffers (CEQI)
7.2
Output Buffers (CEQO)
10.4
Routed Array Clock Buffer Loads (CEQCR)
1.6
Dedicated Clock Buffer Loads (CEQCD)
0.7
I/O Clock Buffer Loads (CEQCI)
0.9
To calculate the active power dissipated from the complete design, the switching frequency of each part
of the logic must be known. EQ 5 shows a piece-wise linear summation over all components.
Power =VCC2 * [(m * CEQM * fm)modules + (n * CEQI * fn) inputs
+ (p * (CEQO+ CL) * fp)outputs
+ 0.5 * (q1 * CEQCR * fq1)routed_Clk1 + (r1 * fq1)routed_Clk1
+ 0.5 * (q2 * CEQCR * fq2)routed_Clk2
+ (r2 * fq2)routed_Clk2 + 0.5 * (s1 * CEQCD * fs1)dedicated_Clk
+ (s2 * CEQCI * fs2)IO_Clk]
EQ 5
Where:
m = Number of logic modules switching at fm
n = Number of input buffers switching at fn
p = Number of output buffers switching at fp
q1 = Number of clock loads on the first routed array clock
q2 = Number of clock loads on the second routed array clock
r1 = Fixed capacitance due to first routed array clock
r2 = Fixed capacitance due to second routed array clock
s1 = Fixed number of clock loads on the dedicated array clock
s2 = Fixed number of clock loads on the dedicated I/O clock
CEQM = Equivalent capacitance of logic modules in pF
CEQI = Equivalent capacitance of input buffers in pF
CEQO = Equivalent capacitance of output buffers in pF
CEQCR = Equivalent capacitance of routed array clock in pF
CEQCD = Equivalent capacitance of dedicated array clock in pF
CEQCI = Equivalent capacitance of dedicated I/O clock in pF
CL = Output lead capacitance in pF
fm = Average logic module switching rate in MHz
fn = Average input buffer switching rate in MHz
fp = Average output buffer switching rate in MHz
fq1 = Average first routed array clock rate in MHz
fq2 = Average second routed array clock rate in MHz
fs1 = Average dedicated array clock rate in MHz
fs2 = Average dedicated I/O clock rate in MHz
Revision 3
2- 13
Detailed Specifications
Table 2-11 • Fixed Capacitance Values for Microsemi FPGAs
Device Type
r1, routed_Clk1
r2, routed_Clk2
A1415A
60
60
A14V15A
57
57
A1425A
75
75
A14V25A
72
72
A1440A
105
105
A14V40A
100
100
A1440B
105
105
A1460A
165
165
A14V60A
157
157
A1460B
165
165
A14100A
195
195
A14V100A
185
185
A14100B
195
195
s1, Clock Loads on Dedicated
Array Clock
s2, Clock Loads on Dedicated
I/O Clock
A1415A
104
80
A14V15A
104
80
A1425A
160
100
A14V25A
160
100
A1440A
288
140
A14V40A
288
140
A1440B
288
140
A1460A
432
168
A14V60A
432
168
A1460B
432
168
A14100A
697
228
A14V100A
697
228
A14100B
697
228
Table 2-12 • Fixed Clock Loads (s1/s2)
Device Type
2- 14
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
Determining Average Switching Frequency
To determine the switching frequency for a design, you must have a detailed understanding of the data
input values to the circuit. The following guidelines are meant to represent worst-case scenarios so that
they can be generally used to predict the upper limits of power dissipation. These guidelines are as
follows:
Table 2-13 • Guidelines for Predicting Power Dissipation
Data
Value
Logic Modules (m)
80% of modules
Inputs switching (n)
# inputs/4
Outputs switching (p)
# output/4
First routed array clock loads (q1)
40% of sequential modules
Second routed array clock loads (q2)
40% of sequential modules
Load capacitance (CL)
35 pF
Average logic module switching rate (fm)
F/10
Average input switching rate (fn)
F/5
Average output switching rate (fp)
F/10
Average first routed array clock rate (fq1)
F/2
Average second routed array clock rate (fq2)
F/2
Average dedicated array clock rate (fs1)
F
Average dedicated I/O clock rate (fs2)
F
Revision 3
2- 15
Detailed Specifications
ACT 3 Timing Model
Input Delays
I/O Module
tINY = 3.6 ns
Internal Delays
Combinatorial
Logic Module
Predicted
Routing
Delays
Output Delays
I/O Module
tIRD2 = 1.6 ns
tDHS = 6.4 ns
D
Q
tINH = 0.0 ns
tINSU = 2.3 ns
tICKY = 6.0 ns
tRD1 = 1.1 ns
tRD4 = 2.2 ns
tRD8 = 3.6 ns
tPD = 2.6 ns
I/O Module
tDHS = 6.4 ns
Sequential
Logic Module
Comb.
Logic
Included
D
D
Q
tRD1 = 1.1 ns
in tSUD
ARRAY
CLOCK
tHCKH = 3.9 ns
tSUD = 0.7 ns
tHD = 0.0 ns
tCO = 2.6 ns
FHMAX = 150 MHz
I/O CLOCK tCKHS = 9.0 ns
(pad-pad)
FIOMAX = 150 MHz
Note: Values shown for A1425A –1 speed grade device.
Figure 2-10 • Timing Model
2- 16
R e visio n 3
Q
tENZHS = 5.1 ns
tOUTH = 0.9 ns
tOUTSU = 0.9 ns
Accelerator Series FPGAs – ACT 3 Family
E
D
VCC
In
50%
Out
VOL
50%
VOH
PAD To AC test loads (shown below)
TRIBUFF
VCC
GND
En
1.5 V
1.5 V
50%
VCC
VCC
GND
50%
1.5 V
Out
10%
VOL
tDHS,
tENZHS,
tDHS
En
50%
Out
GND
50%
VOH
90%
1.5 V
tENZHS,
tENHSZ
GND
tENHSZ
Figure 2-11 • Output Buffers
Load 2
(Used to measure rising/falling edges)
Load 1
(Used to measure propagation delay)
VCC
GND
To the output under test
35 pF
To the output under test
R to VCCfor tPLZ / tPZL
R to GND for tPHZ / tPZH
R = 1 kΩ
35 pF
Figure 2-12 • AC Test Loads
PAD
Y
INBUF
3V
In
0V
1.5 V 1.5 V
VCC
Out
GND
50%
50%
tINY
tINY
Figure 2-13 • Input Buffer Delays
Revision 3
2- 17
Detailed Specifications
S
A
B
Y
VCC
S, A or B
50% 50%
VCC
Out
GND
50%
GND
50%
tPD
tPD
VCC
Out
GND
50%
tPD
50%
tPD
Figure 2-14 • Module Delays
Flip-Flops
D
CLK
Q
CLR
(Positive edge triggered)
tHD
D
tSUD
tA
tWCLKA
CLK
tWCLKA
tCO
Q
tCLR
CLR
tWASYN
Figure 2-15 • Sequential Module Timing Characteristics
2- 18
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
D
E
Y
PRE
IOCLK
CLR
(Positive edge triggered)
tINH
D
tIOP
tIOPWH
tINSU
IOCLK
tIDESU
tIOPWL
tIDEH
E
tICKY
Y
tICLRY
PRE, CLR
tIOASPW
Figure 2-16 • I/O Module: Sequential Input Timing Characteristics
D
E
Q
PRE
IOCLK
CLR
Y
(Positive edge triggered)
tOUTH
D
tOUTSU
tIOP
tIOPWH
IOCLK
tODESU
tIOPWL
tODEH
E
tOCKY
Y
tCKHS,
tCKLS
Q
tOCLRY
PRE, CLR
tIOASPW
Figure 2-17 • I/O Module: Sequential Output Timing Characteristics
Revision 3
2- 19
Detailed Specifications
Tightest Delay Distributions
Propagation delay between logic modules depends on the resistive and capacitive loading of the routing
tracks, the interconnect elements, and the module inputs being driven. Propagation delay increases as
the length of routing tracks, the number of interconnect elements, or the number of inputs increases.
From a design perspective, the propagation delay can be statistically correlated or modeled by the fanout
(number of loads) driven by a module. Higher fanout usually requires some paths to have longer lengths
of routing track. The ACT 3 family delivers the tightest fanout delay distribution of any FPGA. This tight
distribution is achieved in two ways: by decreasing the delay of the interconnect elements and by
decreasing the number of interconnect elements per path.
Microsemi’s patented PLICE antifuse offers a very low resistive/capacitive interconnect. The ACT 3
family’s antifuses, fabricated in 0.8 micron m lithography, offer nominal levels of 200Ω resistance and 6
femtofarad (fF) capacitance per antifuse. The ACT 3 fanout distribution is also tighter than alternative
devices due to the low number of antifuses required per interconnect path. The ACT 3 family’s
proprietary architecture limits the number of antifuses per path to only four, with 90% of interconnects
using only two antifuses.
The ACT 3 family’s tight fanout delay distribution offers an FPGA design environment in which fanout can
be traded for the increased performance of reduced logic level designs. This also simplifies performance
estimates when designing with ACT 3 devices.
Table 2-14 • Logic Module and Routing Delay by Fanout (ns); Worst-Case Commercial Conditions
Speed Grade
FO = 1
FO = 2
FO = 3
FO = 4
FO = 8
ACT 3 –3
2.9
3.2
3.4
3.7
4.8
ACT 3 –2
3.3
3.7
3.9
4.2
5.5
ACT 3 –1
3.7
4.2
4.4
4.8
6.2
ACT 3 STD
4.3
4.8
5.1
5.5
7.2
Notes:
1. Obtained by added tRD(x=FO) to tPD from the Logic Module Timing Characteristics Tables found in this
datasheet.
2. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and
PDN 1004 at http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
Timing Characteristics
Timing characteristics for ACT 3 devices fall into three categories: family dependent, device dependent,
and design dependent. The input and output buffer characteristics are common to all ACT 3 family
members. Internal routing delays are device dependent. Design dependency means actual delays are
not determined until after placement and routing of the user’s design is complete. Delay values may then
be determined by using the ALS Timer utility or performing simulation with post-layout delays.
Critical Nets and Typical Nets
Propagation delays are expressed only for typical nets, which are used for initial design performance
evaluation. Critical net delays can then be applied to the most time-critical paths. Critical nets are
determined by net property assignment prior to placement and routing. Up to 6% of the nets in a design
may be designated as critical, while 90% of the nets in a design are typical.
Long Tracks
Some nets in the design use long tracks. Long tracks are special routing resources that span multiple
rows, columns, or modules. Long tracks employ three and sometimes four antifuse connections. This
increases capacitance and resistance, result ng in longer net delays for macros connected to long tracks.
Typically up to 6% of nets in a fully utilized device require long tracks. Long tracks contribute
approximately 4 ns to 14 ns delay. This additional delay is represented statistically in higher fanout
(FO = 8) routing delays in the datasheet specifications section.
2- 20
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
Timing Derating
ACT 3 devices are manufactured in a CMOS process. Therefore, device performance varies according
to temperature, voltage, and process variations. Minimum timing parameters reflect maximum operating
voltage, minimum operating temperature, and best-case processing. Maximum timing parameters reflect
minimum operating voltage, maximum operating temperature, and worst-case processing.
Table 2-15 • Timing Derating Factor (Temperature and Voltage)
(Commercial Minimum/Maximum Specification) x
Industrial
Military
Min.
Max.
Min.
0.66
1.07
0.63
Max.
1.17
Table 2-16 • Timing Derating Factor for Designs at Typical Temperature (TJ = 25°C)
and Voltage (5.0 V)
(Commercial Maximum Specification) x
0.85
Table 2-17 • Temperature and Voltage Derating Factors
(normalized to Worst-Case Commercial, TJ = 4.75 V, 70°C)
–55
–40
0
25
70
85
125
4.50
0.72
0.76
0.85
0.90
1.04
1.07
1.117
4.75
0.70
0.73
0.82
0.87
1.00
1.03
1.12
5.00
0.68
0.71
0.79
0.84
0.97
1.00
1.09
5.25
0.66
0.69
0.77
0.82
0.94
0.97
1.06
5.50
0.63
0.66
0.74
0.79
0.90
0.93
1.01
1.20
Derating Factor
1.10
1.00
0.90
0.80
0.70
0.60
4.50
4.75
5.00
5.25
5.50
Voltage (V)
Note: This derating factor applies to all routing and propagation delays.
Figure 2-18 • Junction Temperature and Voltage Derating Curves
(normalized to Worst-Case Commercial, TJ = 4.75 V, 70°C)
Revision 3
2- 21
Detailed Specifications
A1415A, A14V15A Timing Characteristics
Table 2-18 • A1415A, A14V15A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C1
Logic Module Propagation Delays2
–3 Speed3
–2 Speed3
Parameter/Description
Min.
Max.
Min. Max. Min.
Max.
–1 Speed
Std. Speed 3.3 V Speed1 Units
Min.
Max. Min.
Max.
tPD
Internal Array Module
2.0
2.3
2.6
3.0
3.9
ns
tCO
Sequential Clock to Q
2.0
2.3
2.6
3.0
3.9
ns
tCLR
Asynchronous Clear to Q
2.0
2.3
2.6
3.0
3.9
ns
4
Predicted Routing Delays
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
Logic Module Sequential Timing
tSUD
Flip-Flop Data Input Setup
0.5
0.6
0.7
0.8
0.8
ns
tHD
Flip-Flop Data Input Hold
0.0
0.0
0.0
0.0
0.0
ns
tSUD
Latch Data Input Setup
0.5
0.6
0.7
0.8
0.8
ns
tHD
Latch Data Input Hold
0.0
0.0
0.0
0.0
0.0
ns
tWASYN Asynchronous Pulse Width
1.9
2.4
3.2
3.8
4.8
ns
tWCLKA Flip-Flop Clock Pulse Width
1.9
2.4
3.2
3.8
4.8
ns
tA
Flip-Flop Clock Input Period
4.0
5.0
6.8
8.0
10.0
ns
fMAX
Flip-Flop Clock Frequency
250
200
150
125
100
MHz
Notes:
1. VCC = 3.0 V for 3.3 V specifications.
2. For dual-module macros, use tPD + tRD1 + tPDn + tCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD, whichever is appropriate.
3. The –2 and –3 speed grades have been discontinued. Please refer to the Product Discontinuation Notices (PDNs) listed
below:
PDN March 2001
PDN 0104
PDN 0203
PDN 0604
PDN 1004
4. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
2- 22
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A1415A, A14V15A Timing Characteristics (continued)
Table 2-19 • A1415A, A14V15A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module Input Propagation Delays
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed2 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tINY
Input Data Pad to Y
2.8
3.2
3.6
4.2
5.5
ns
tICKY
Input Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tOCKY
Output Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tICLRY
Input Asynchronous Clear to Y
4.7
5.3
6.0
7.0
9.2
ns
4.7
5.3
6.0
7.0
9.2
ns
tOCLRY Output Asynchronous Clear to Y
Predicted Input Routing Delays2
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
I/O Module Sequential Timing (wrt IOCLK pad)
tINH
Input F-F Data Hold
0.0
0.0
0.0
0.0
0.0
ns
tINSU
Input F-F Data Setup
2.0
2.3
2.5
3.0
3.0
ns
tIDEH
Input Data Enable Hold
0.0
0.0
0.0
0.0
0.0
ns
tIDESU Input Data Enable Setup
5.8
6.5
7.5
8.6
8.6
ns
tOUTH
0.7
0.8
0.9
1.0
1.0
ns
0.7
0.8
0.9
1.0
1.0
ns
0.3
0.4
0.4
0.5
0.5
ns
1.3
1.5
1.7
2.0
2.0
ns
Output F-F Data hold
tOUTSU Output F-F Data Setup
tODEH
Output Data Enable Hold
fODESU Output Data Enable Setup
Notes:
1. The –2 and –3 speed grades have been discontinued. Please refer to the Product Discontinuation Notices (PDNs) listed
below:
PDN March 2001
PDN 0104
PDN 0203
PDN 0604
PDN 1004
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
Revision 3
2- 23
Detailed Specifications
A1415A, A14V15A Timing Characteristics (continued)
Table 2-20 • A1415A, A14V15A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module – TTL Output Timing1
–3 Speed2 –2 Speed2 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tDHS
Data to Pad, High Slew
5.0
5.6
6.4
7.5
9.8
ns
tDLS
Data to Pad, Low Slew
8.0
9.0
10.2
12.0
15.6
ns
tENZHS Enable to Pad, Z to H/L, High Slew
4.0
4.5
5.1
6.0
7.8
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
6.5
7.5
8.5
10.0
13.0
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
6.5
7.5
8.5
10.0
13.0
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
7.5
7.5
9.0
10.0
13.0
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
11.3
11.3
13.5
15.0
19.5
ns
dTLHHS Delta Low to High, High Slew
0.02
0.02
0.03
0.03
0.04
ns/pF
dTLHLS Delta Low to High, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
dTHLHS Delta High to Low, High Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
dTHLLS Delta High to Low, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
1
I/O Module – CMOS Output Timing
tDHS
Data to Pad, High Slew
6.2
7.0
7.9
9.3
12.1
ns
tDLS
Data to Pad, Low Slew
11.7
13.1
14.9
17.5
22.8
ns
tENZHS Enable to Pad, Z to H/L, High Slew
5.2
5.9
6.6
7.8
10.1
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
8.9
10.0
11.3
13.3
17.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
6.7
7.5
8.5
10.0
13.0
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
6.7
7.5
9.0
10.0
13.0
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
8.9
8.9
10.7
11.8
15.3
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
13.0
13.0
15.6
17.3
22.5
ns
dTLHHS Delta Low to High, High Slew
0.04
0.04
0.05
0.06
0.08
ns/pF
dTLHLS Delta Low to High, Low Slew
0.07
0.08
0.09
0.11
0.14
ns/pF
dTHLHS Delta High to Low, High Slew
0.03
0.03
0.03
0.04
0.05
ns/pF
dTHLLS Delta High to Low, Low Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
Notes:
1. Delays based on 35 pF loading.
2. The –2 and –3 speed grades have been discontinued. Please refer to the Product Discontinuation Notices (PDNs) listed
below:
PDN March 2001
PDN 0104
PDN 0203
PDN 0604
PDN 1004
2- 24
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A1415A, A14V15A Timing Characteristics (continued)
Table 2-21 • A1415A, A14V15A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
Dedicated (hardwired) I/O Clock Network
–3 Speed –2 Speed –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tIOCKH
Input Low to High (pad to I/O module
input)
tIOPWH
Minimum Pulse Width High
1.9
2.4
3.3
3.8
4.8
ns
tIPOWL
Minimum Pulse Width Low
1.9
2.4
3.3
3.8
4.8
ns
tIOSAPW
Minimum Asynchronous Pulse Width
1.9
2.4
3.3
3.8
4.8
ns
tIOCKSW
Maximum Skew
tIOP
Minimum Period
fIOMAX
Maximum Frequency
2.0
2.3
0.4
4.0
2.6
0.4
5.0
3.0
0.4
6.8
3.5
0.4
8.0
0.4
10.0
ns
ns
ns
250
200
150
125
100
MHz
Dedicated (hardwired) Array Clock
tHCKH
Input Low to High (pad to S-module
input)
3.0
3.4
3.9
4.5
5.5
ns
tHCKL
Input High to Low (pad to S-module
input)
3.0
3.4
3.9
4.5
5.5
ns
tHPWH
Minimum Pulse Width High
1.9
2.4
3.3
3.8
4.8
ns
tHPWL
Minimum Pulse Width Low
1.9
2.4
3.3
3.8
4.8
ns
tHCKSW
Delta High to Low, Low Slew
tHP
Minimum Period
fHMAX
Maximum Frequency
0.3
4.0
0.3
5.0
0.3
6.8
0.3
8.0
0.3
10.0
ns
ns
250
200
150
125
100
MHz
Routed Array Clock Networks
tRCKH
Input Low to High (FO = 64)
3.7
4.1
4.7
5.5
9.0
ns
tRCKL
Input High to Low (FO = 64)
4.0
4.5
5.1
6.0
9.0
ns
tRPWH
Min. Pulse Width High (FO = 64)
3.3
3.8
4.2
4.9
6.5
ns
tRPWL
Min. Pulse Width Low (FO = 64)
3.3
3.8
4.2
4.9
6.5
ns
tRCKSW
Maximum Skew (FO = 128)
tRP
Minimum Period (FO = 64)
fRMAX
Maximum Frequency (FO = 64)
0.7
6.8
0.8
8.0
150
0.9
8.7
125
1.0
10.0
115
1.0
13.4
100
ns
ns
75
MHz
Clock-to-Clock Skews
tIOHCKSW I/O Clock to H-Clock Skew
0.0
1.7
0.0
1.8
0.0
2.0
0.0
2.2
0.0
3.0
ns
tIORCKSW I/O Clock to R-Clock Skew (FO = 64)
0.0
1.0
0.0
1.0
0.0
1.0
0.0
1.0
0.0
3.0
ns
tHRCKSW H-Clock to R-Clock Skew (FO = 64)
(FO = 50% maximum)
0.0
1.0
0.0
1.0
0.0
1.0
0.0
1.0
0.0
0.0
3.0
3.0
ns
Notes:
1. Delays based on 35 pF loading.
2. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
Revision 3
2- 25
Detailed Specifications
A1425A, A14V25A Timing Characteristics
Table 2-22 • A1425A, A14V25A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C1
Logic Module Propagation Delays2
–3 Speed3
–2 Speed3
Parameter/Description
Min.
Max.
Min. Max. Min.
Max.
–1 Speed
Std. Speed 3.3 V Speed1 Units
Min.
Max. Min.
Max.
tPD
Internal Array Module
2.0
2.3
2.6
3.0
3.9
ns
tCO
Sequential Clock to Q
2.0
2.3
2.6
3.0
3.9
ns
tCLR
Asynchronous Clear to Q
2.0
2.3
2.6
3.0
3.9
ns
4
Predicted Routing Delays
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
Logic Module Sequential Timing
tSUD
Flip-Flop Data Input Setup
0.5
0.6
0.7
0.8
0.8
ns
tHD
Flip-Flop Data Input Hold
0.0
0.0
0.0
0.0
0.0
ns
tSUD
Latch Data Input Setup
0.5
0.6
0.7
0.8
0.8
ns
tHD
Latch Data Input Hold
0.0
0.0
0.0
0.0
0.0
ns
tWASYN Asynchronous Pulse Width
1.9
2.4
3.2
3.8
4.8
ns
tWCLKA Flip-Flop Clock Pulse Width
1.9
2.4
3.2
3.8
4.8
ns
tA
Flip-Flop Clock Input Period
4.0
5.0
6.8
8.0
10.0
ns
fMAX
Flip-Flop Clock Frequency
250
200
150
125
100
MHz
Notes:
1. VCC = 3.0 V for 3.3 V specifications.
2. For dual-module macros, use tPD + tRD1 + tPDn + tCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD, whichever is appropriate.
3. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
4. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
2- 26
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A1425A, A14V25A Timing Characteristics (continued)
Table 2-23 • A1425A, A14V25A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module Input Propagation Delays
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tINY
Input Data Pad to Y
2.8
3.2
3.6
4.2
5.5
ns
tICKY
Input Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tOCKY
Output Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tICLRY
Input Asynchronous Clear to Y
4.7
5.3
6.0
7.0
9.2
ns
4.7
5.3
6.0
7.0
9.2
ns
tOCLRY Output Asynchronous Clear to Y
Predicted Input Routing Delays2
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
I/O Module Sequential Timing (wrt IOCLK pad)
tINH
Input F-F Data Hold
0.0
0.0
0.0
0.0
0.0
ns
tINSU
Input F-F Data Setup
1.8
2.0
2.3
2.7
3.0
ns
tIDEH
Input Data Enable Hold
0.0
0.0
0.0
0.0
0.0
ns
tIDESU Input Data Enable Setup
5.8
6.5
7.5
8.6
8.6
ns
tOUTH
0.7
0.8
0.9
1.0
1.0
ns
0.7
0.8
0.9
1.0
1.0
ns
0.3
0.4
0.4
0.5
0.5
ns
1.3
1.5
1.7
2.0
2.0
ns
Output F-F Data hold
tOUTSU Output F-F Data Setup
tODEH
Output Data Enable Hold
fODESU Output Data Enable Setup
Notes: *
1. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
Revision 3
2- 27
Detailed Specifications
A1425A, A14V25A Timing Characteristics (continued)
Table 2-24 • A1425A, A14V25A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module – TTL Output Timing1
–3 Speed2 –2 Speed2 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tDHS
Data to Pad, High Slew
5.0
5.6
6.4
7.5
9.8
ns
tDLS
Data to Pad, Low Slew
8.0
9.0
10.2
12.0
15.6
ns
tENZHS Enable to Pad, Z to H/L, High Slew
4.0
4.5
5.1
6.0
7.8
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
6.5
7.5
8.5
10.0
13.0
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
6.5
7.5
8.5
10.0
13.0
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
7.5
7.5
9.0
10.0
13.0
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
11.3
11.3
13.5
15.0
19.5
ns
dTLHHS Delta Low to High, High Slew
0.02
0.02
0.03
0.03
0.04
ns/pF
dTLHLS Delta Low to High, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
dTHLHS Delta High to Low, High Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
dTHLLS Delta High to Low, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
1
I/O Module – CMOS Output Timing
tDHS
Data to Pad, High Slew
6.2
7.0
7.9
9.3
12.1
ns
tDLS
Data to Pad, Low Slew
11.7
13.1
14.9
17.5
22.8
ns
tENZHS Enable to Pad, Z to H/L, High Slew
5.2
5.9
6.6
7.8
10.1
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
8.9
10.0
11.3
13.3
17.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
6.7
7.5
8.5
10.0
13.0
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
6.7
7.5
9.0
10.0
13.0
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
8.9
8.9
10.7
11.8
15.3
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
13.0
13.0
15.6
17.3
22.5
ns
dTLHHS Delta Low to High, High Slew
0.04
0.04
0.05
0.06
0.08
ns/pF
dTLHLS Delta Low to High, Low Slew
0.07
0.08
0.09
0.11
0.14
ns/pF
dTHLHS Delta High to Low, High Slew
0.03
0.03
0.03
0.04
0.05
ns/pF
dTHLLS Delta High to Low, Low Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
Notes: *
1. Delays based on 35 pF loading.
2. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2- 28
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A1425A, A14V25A Timing Characteristics (continued)
Table 2-25 • A1425A, A14V25A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
Dedicated (hardwired) I/O Clock Network
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tIOCKH
Input Low to High (pad to I/O module
input)
tIOPWH
Minimum Pulse Width High
1.9
2.4
3.3
3.8
4.8
ns
tIPOWL
Minimum Pulse Width Low
1.9
2.4
3.3
3.8
4.8
ns
tIOSAPW
Minimum Asynchronous Pulse Width
1.9
2.4
3.3
3.8
4.8
ns
tIOCKSW
Maximum Skew
tIOP
Minimum Period
fIOMAX
Maximum Frequency
2.0
2.3
0.4
4.0
2.6
0.4
5.0
3.0
0.4
6.8
3.5
0.4
8.0
0.4
10.0
ns
ns
ns
250
200
150
125
100
MHz
Dedicated (hardwired) Array Clock
tHCKH
Input Low to High (pad to S-module
input)
3.0
3.4
3.9
4.5
5.5
ns
tHCKL
Input High to Low (pad to S-module
input)
3.0
3.4
3.9
4.5
5.5
ns
tHPWH
Minimum Pulse Width High
1.9
2.4
3.3
3.8
4.8
ns
tHPWL
Minimum Pulse Width Low
1.9
2.4
3.3
3.8
4.8
ns
tHCKSW
Delta High to Low, Low Slew
tHP
Minimum Period
fHMAX
Maximum Frequency
0.3
4.0
0.3
5.0
0.3
6.8
0.3
8.0
0.3
10.0
ns
ns
250
200
150
125
100
MHz
Routed Array Clock Networks
tRCKH
Input Low to High (FO = 64)
3.7
4.1
4.7
5.5
9.0
ns
tRCKL
Input High to Low (FO = 64)
4.0
4.5
5.1
6.0
9.0
ns
tRPWH
Min. Pulse Width High (FO = 64)
3.3
3.8
4.2
4.9
6.5
ns
tRPWL
Min. Pulse Width Low (FO = 64)
3.3
3.8
4.2
4.9
6.5
ns
tRCKSW
Maximum Skew (FO = 128)
tRP
Minimum Period (FO = 64)
fRMAX
Maximum Frequency (FO = 64)
0.7
6.8
0.8
8.0
150
0.9
8.7
125
1.0
10.0
115
1.0
13.4
100
ns
ns
75
MHz
Clock-to-Clock Skews
tIOHCKSW I/O Clock to H-Clock Skew
0.0
1.7
0.0
1.8
0.0
2.0
0.0
2.2
0.0
3.0
ns
tIORCKSW I/O Clock to R-Clock Skew (FO = 64)
(FO = 80)
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
3.0
3.0
ns
tHRCKSW H-Clock to R-Clock Skew (FO = 64)
(FO = 80)
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
ns
Notes:
1. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2. Delays based on 35 pF loading.
Revision 3
2- 29
Detailed Specifications
A1440A, A14V40A Timing Characteristics
Table 2-26 • A1440A, A14V40A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C1
Logic Module Propagation Delays2
–3 Speed 3
–2 Speed3
Parameter/Description
Min.
Max.
Min. Max. Min.
Max.
–1 Speed
Std. Speed 3.3 V Speed1 Units
Min.
Max. Min.
Max.
tPD
Internal Array Module
2.0
2.3
2.6
3.0
3.9
ns
tCO
Sequential Clock to Q
2.0
2.3
2.6
3.0
3.9
ns
tCLR
Asynchronous Clear to Q
2.0
2.3
2.6
3.0
3.9
ns
4
Predicted Routing Delays
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
Logic Module Sequential Timing
tSUD
Flip-Flop Data Input Setup
0.5
0.6
0.7
0.8
0.8
ns
tHD
Flip-Flop Data Input Hold
0.0
0.0
0.0
0.0
0.0
ns
tSUD
Latch Data Input Setup
0.5
0.6
0.7
0.8
0.8
ns
tHD
Latch Data Input Hold
0.0
0.0
0.0
0.0
0.0
ns
tWASYN Asynchronous Pulse Width
1.9
2.4
3.2
3.8
4.8
ns
tWCLKA Flip-Flop Clock Pulse Width
1.9
2.4
3.2
3.8
4.8
ns
tA
Flip-Flop Clock Input Period
4.0
5.0
6.8
8.0
10.0
ns
fMAX
Flip-Flop Clock Frequency
250
200
150
125
100
MHz
Notes:
1. VCC = 3.0 V for 3.3 V specifications.
2. For dual-module macros, use tPD + tRD1 + tPDn + tCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD, whichever is appropriate.
3. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
4. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
2- 30
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A1440A, A14V40A Timing Characteristics (continued)
Table 2-27 • A1440A, A14V40A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module Input Propagation Delays
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tINY
Input Data Pad to Y
2.8
3.2
3.6
4.2
5.5
ns
tICKY
Input Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tOCKY
Output Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tICLRY
Input Asynchronous Clear to Y
4.7
5.3
6.0
7.0
9.2
ns
4.7
5.3
6.0
7.0
9.2
ns
tOCLRY Output Asynchronous Clear to Y
Predicted Input Routing Delays2
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
I/O Module Sequential Timing (wrt IOCLK pad)
tINH
Input F-F Data Hold
0.0
0.0
0.0
0.0
0.0
ns
tINSU
Input F-F Data Setup
1.8
1.7
2.0
2.3
2.3
ns
tIDEH
Input Data Enable Hold
0.0
0.0
0.0
0.0
0.0
ns
tIDESU Input Data Enable Setup
5.8
6.5
7.5
8.6
8.6
ns
tOUTH
0.7
0.8
0.9
1.0
1.0
ns
0.7
0.8
0.9
1.0
1.0
ns
0.3
0.4
0.4
0.5
0.5
ns
1.3
1.5
1.7
2.0
2.0
ns
Output F-F Data hold
tOUTSU Output F-F Data Setup
tODEH
Output Data Enable Hold
fODESU Output Data Enable Setup
Notes:
1. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
Revision 3
2- 31
Detailed Specifications
A1440A, A14V40A Timing Characteristics (continued)
Table 2-28 • A1440A, A14V40A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module – TTL Output Timing1
–3 Speed2 –2 Speed2 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tDHS
Data to Pad, High Slew
5.0
5.6
6.4
7.5
9.8
ns
tDLS
Data to Pad, Low Slew
8.0
9.0
10.2
12.0
15.6
ns
tENZHS Enable to Pad, Z to H/L, High Slew
4.0
4.5
5.1
6.0
7.8
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
7.4
8.3
9.4
11.0
14.3
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
8.5
8.5
9.5
11.0
14.3
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
11.3
11.3
13.5
15.0
19.5
ns
dTLHHS Delta Low to High, High Slew
0.02
0.02
0.03
0.03
0.04
ns/pF
dTLHLS Delta Low to High, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
dTHLHS Delta High to Low, High Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
dTHLLS Delta High to Low, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
1
I/O Module – CMOS Output Timing
tDHS
Data to Pad, High Slew
6.2
7.0
7.9
9.3
12.1
ns
tDLS
Data to Pad, Low Slew
11.7
13.1
14.9
17.5
22.8
ns
tENZHS Enable to Pad, Z to H/L, High Slew
5.2
5.9
6.6
7.8
10.1
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
8.9
10.0
11.3
13.3
17.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
7.4
8.3
9.4
11.0
14.3
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
9.0
9.0
10.1
11.8
14.3
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
13.0
13.0
15.6
17.3
22.5
ns
dTLHHS Delta Low to High, High Slew
0.04
0.04
0.05
0.06
0.08
ns/pF
dTLHLS Delta Low to High, Low Slew
0.07
0.08
0.09
0.11
0.14
ns/pF
dTHLHS Delta High to Low, High Slew
0.03
0.03
0.03
0.04
0.05
ns/pF
dTHLLS Delta High to Low, Low Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
Notes:
1. Delays based on 35 pF loading.
2. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2- 32
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A1440A, A14V40A Timing Characteristics (continued)
Table 2-29 • A1440A, A14V40A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
Dedicated (hardwired) I/O Clock Network
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tIOCKH
Input Low to High (pad to I/O module
input)
tIOPWH
Minimum Pulse Width High
1.9
2.4
3.3
3.8
4.8
ns
tIPOWL
Minimum Pulse Width Low
1.9
2.4
3.3
3.8
4.8
ns
tIOSAPW
Minimum Asynchronous Pulse Width
1.9
2.4
3.3
3.8
4.8
ns
tIOCKSW
Maximum Skew
tIOP
Minimum Period
fIOMAX
Maximum Frequency
2.0
2.3
0.4
4.0
2.6
0.4
5.0
3.0
0.4
6.8
3.5
0.4
8.0
0.4
10.0
ns
ns
ns
250
200
150
125
100
MHz
Dedicated (hardwired) Array Clock
tHCKH
Input Low to High (pad to S-module
input)
3.0
3.4
3.9
4.5
5.5
ns
tHCKL
Input High to Low (pad to S-module
input)
3.0
3.4
3.9
4.5
5.5
ns
tHPWH
Minimum Pulse Width High
1.9
2.4
3.3
3.8
4.8
ns
tHPWL
Minimum Pulse Width Low
1.9
2.4
3.3
3.8
4.8
ns
tHCKSW
Delta High to Low, Low Slew
tHP
Minimum Period
fHMAX
Maximum Frequency
0.3
4.0
0.3
5.0
0.3
6.8
0.3
8.0
0.3
10.0
ns
ns
250
200
150
125
100
MHz
Routed Array Clock Networks
tRCKH
Input Low to High (FO = 64)
3.7
4.1
4.7
5.5
9.0
ns
tRCKL
Input High to Low (FO = 64)
4.0
4.5
5.1
6.0
9.0
ns
tRPWH
Min. Pulse Width High (FO = 64)
3.3
3.8
4.2
4.9
6.5
ns
tRPWL
Min. Pulse Width Low (FO = 64)
3.3
3.8
4.2
4.9
6.5
ns
tRCKSW
Maximum Skew (FO = 128)
tRP
Minimum Period (FO = 64)
fRMAX
Maximum Frequency (FO = 64)
0.7
6.8
0.8
8.0
150
0.9
8.7
125
1.0
10.0
115
1.0
13.4
100
ns
ns
75
MHz
Clock-to-Clock Skews
tIOHCKSW I/O Clock to H-Clock Skew
0.0
1.7
0.0
1.8
0.0
2.0
0.0
2.2
0.0
3.0
ns
tIORCKSW I/O Clock to R-Clock Skew (FO = 64)
(FO = 144)
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
3.0
3.0
ns
tHRCKSW H-Clock to R-Clock Skew (FO = 64)
(FO = 144)
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
ns
Notes:
1. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2. Delays based on 35 pF loading.
Revision 3
2- 33
Detailed Specifications
A1460A, A14V60A Timing Characteristics
Table 2-30 • A1460A, A14V60A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C1
Logic Module Propagation Delays2
–3 Speed3
–2 Speed 3
Parameter/Description
Min.
Max.
Min. Max. Min.
Max.
–1 Speed
Std. Speed 3.3 V Speed1 Units
Min.
Max. Min.
Max.
tPD
Internal Array Module
2.0
2.3
2.6
3.0
3.9
ns
tCO
Sequential Clock to Q
2.0
2.3
2.6
3.0
3.9
ns
tCLR
Asynchronous Clear to Q
2.0
2.3
2.6
3.0
3.9
ns
4
Predicted Routing Delays
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
Logic Module Sequential Timing
tSUD
Flip-Flop Data Input Setup
0.5
0.6
0.7
0.8
0.8
ns
tHD
Flip-Flop Data Input Hold
0.0
0.0
0.0
0.0
0.0
ns
tSUD
Latch Data Input Setup
0.5
0.6
0.7
0.8
0.8
ns
tHD
Latch Data Input Hold
0.0
0.0
0.0
0.0
0.0
ns
tWASYN Asynchronous Pulse Width
2.4
3.2
3.8
4.8
6.5
ns
tWCLKA Flip-Flop Clock Pulse Width
2.4
3.2
3.8
4.8
6.5
ns
tA
Flip-Flop Clock Input Period
5.0
6.8
8.0
10.0
13.4
ns
fMAX
Flip-Flop Clock Frequency
200
150
125
100
75
MHz
Notes:
1. VCC = 3.0 V for 3.3 V specifications.
2. For dual-module macros, use tPD + tRD1 + tPDn + tCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD, whichever is appropriate.
3. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
4. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
2- 34
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A1460A, A14V60A Timing Characteristics (continued)
Table 2-31 • A1460A, A14V60A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module Input Propagation Delays
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tINY
Input Data Pad to Y
2.8
3.2
3.6
4.2
5.5
ns
tICKY
Input Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tOCKY
Output Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tICLRY
Input Asynchronous Clear to Y
4.7
5.3
6.0
7.0
9.2
ns
4.7
5.3
6.0
7.0
9.2
ns
tOCLRY Output Asynchronous Clear to Y
Predicted Input Routing Delays2
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
I/O Module Sequential Timing (wrt IOCLK pad)
tINH
Input F-F Data Hold
0.0
0.0
0.0
0.0
0.0
ns
tINSU
Input F-F Data Setup
1.3
1.5
1.8
2.0
2.0
ns
tIDEH
Input Data Enable Hold
0.0
0.0
0.0
0.0
0.0
ns
tIDESU Input Data Enable Setup
5.8
6.5
7.5
8.6
8.6
ns
tOUTH
0.7
0.8
0.9
1.0
1.0
ns
0.7
0.8
0.9
1.0
1.0
ns
0.3
0.4
0.4
0.5
0.5
ns
1.3
1.5
1.7
2.0
2.0
ns
Output F-F Data hold
tOUTSU Output F-F Data Setup
tODEH
Output Data Enable Hold
fODESU Output Data Enable Setup
Notes:
5. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
6. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
Revision 3
2- 35
Detailed Specifications
A1460A, A14V60A Timing Characteristics (continued)
Table 2-32 • A1460A, A14V60A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module – TTL Output Timing1
–3 Speed2 –2 Speed2 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tDHS
Data to Pad, High Slew
5.0
5.6
6.4
7.5
9.8
ns
tDLS
Data to Pad, Low Slew
8.0
9.0
10.2
12.0
15.6
ns
tENZHS Enable to Pad, Z to H/L, High Slew
4.0
4.5
5.1
6.0
7.8
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
7.8
8.7
9.9
11.6
15.1
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
9.0
9.0
10.0
11.5
15.0
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
12.8
12.8
15.3
17.0
22.1
ns
dTLHHS Delta Low to High, High Slew
0.02
0.02
0.03
0.03
0.04
ns/pF
dTLHLS Delta Low to High, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
dTHLHS Delta High to Low, High Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
dTHLLS Delta High to Low, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
1
I/O Module – CMOS Output Timing
tDHS
Data to Pad, High Slew
6.2
7.0
7.9
9.3
12.1
ns
tDLS
Data to Pad, Low Slew
11.7
13.1
14.9
17.5
22.8
ns
tENZHS Enable to Pad, Z to H/L, High Slew
5.2
5.9
6.6
7.8
10.1
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
8.9
10.0
11.3
13.3
17.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
7.4
8.3
9.4
11.0
14.3
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
10.4
10.4
12.1
13.8
17.9
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
14.5
14.5
17.4
19.3
25.1
ns
dTLHHS Delta Low to High, High Slew
0.04
0.04
0.05
0.06
0.08
ns/pF
dTLHLS Delta Low to High, Low Slew
0.07
0.08
0.09
0.11
0.14
ns/pF
dTHLHS Delta High to Low, High Slew
0.03
0.03
0.03
0.04
0.05
ns/pF
dTHLLS Delta High to Low, Low Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
Notes:
1. Delays based on 35 pF loading.
2. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2- 36
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A1460A, A14V60A Timing Characteristics (continued)
Table 2-33 • A1460A, A14V60A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
Dedicated (hardwired) I/O Clock Network
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tIOCKH
Input Low to High (pad to I/O module
input)
tIOPWH
Minimum Pulse Width High
2.4
3.2
3.8
4.8
6.5
ns
tIPOWL
Minimum Pulse Width Low
2.4
3.2
3.8
4.8
6.5
ns
tIOSAPW
Minimum Asynchronous Pulse Width
2.4
3.2
3.8
4.8
6.5
ns
tIOCKSW
Maximum Skew
tIOP
Minimum Period
fIOMAX
Maximum Frequency
2.3
2.6
0.6
5.0
3.0
0.6
6.8
3.5
0.6
8.0
4.5
0.6
10.0
0.6
13.4
ns
ns
ns
200
150
125
100
75
MHz
Dedicated (hardwired) Array Clock
tHCKH
Input Low to High (pad to S-module
input)
3.7
4.1
4.7
5.5
7.0
ns
tHCKL
Input High to Low (pad to S-module
input)
3.7
4.1
4.7
5.5
7.0
ns
tHPWH
Minimum Pulse Width High
2.4
3.2
3.8
4.8
6.5
ns
tHPWL
Minimum Pulse Width Low
2.4
3.2
3.8
4.8
6.5
ns
tHCKSW
Delta High to Low, Low Slew
tHP
Minimum Period
fHMAX
Maximum Frequency
0.6
5.0
0.6
6.8
0.6
8.0
0.6
10.0
0.6
13.4
ns
ns
200
150
125
100
75
MHz
Routed Array Clock Networks
tRCKH
Input Low to High (FO = 64)
6.0
6.8
7.7
9.0
11.8
ns
tRCKL
Input High to Low (FO = 64)
6.0
6.8
7.7
9.0
11.8
ns
tRPWH
Min. Pulse Width High (FO = 64)
4.1
4.5
5.4
6.1
8.2
ns
tRPWL
Min. Pulse Width Low (FO = 64)
4.1
4.5
5.4
6.1
8.2
ns
tRCKSW
Maximum Skew (FO = 128)
tRP
Minimum Period (FO = 64)
fRMAX
Maximum Frequency (FO = 64)
1.2
8.3
1.4
9.3
120
1.6
11.1
105
1.8
12.5
90
1.8
16.7
80
ns
ns
60
MHz
Clock-to-Clock Skews
tIOHCKSW I/O Clock to H-Clock Skew
0.0
2.6
0.0
2.7
0.0
2.9
0.0
3.0
0.0
3.0
ns
tIORCKSW I/O Clock to R-Clock Skew (FO = 64)
(FO = 216)
0.0
0.0
1.7
5.0
0.0
0.0
1.7
5.0
0.0
0.0
1.7
5.0
0.0
0.0
1.7
5.0
0.0
0.0
5.0
5.0
ns
tHRCKSW H-Clock to R-Clock Skew (FO = 64)
(FO = 216)
0.0
0.0
1.3
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
ns
Notes:
1. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2. Delays based on 35 pF loading.
Revision 3
2- 37
Detailed Specifications
A14100A, A14V100A Timing Characteristics
Table 2-34 • A14100A, A14V100A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C1
Logic Module Propagation Delays2
–3 Speed3
–2 Speed 3
Parameter/Description
Min.
Max.
Min. Max. Min.
Max.
–1 Speed
Std. Speed 3.3 V Speed1 Units
Min.
Max. Min.
Max.
tPD
Internal Array Module
2.0
2.3
2.6
3.0
3.9
ns
tCO
Sequential Clock to Q
2.0
2.3
2.6
3.0
3.9
ns
tCLR
Asynchronous Clear to Q
2.0
2.3
2.6
3.0
3.9
ns
4
Predicted Routing Delays
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
Logic Module Sequential Timing
tSUD
Flip-Flop Data Input Setup
0.5
0.6
0.8
0.8
0.8
ns
tHD
Flip-Flop Data Input Hold
0.0
0.0
0.5
0.5
0.5
ns
tSUD
Latch Data Input Setup
0.5
0.6
0.8
0.8
0.8
ns
tHD
Latch Data Input Hold
0.0
0.0
0.5
0.5
0.5
ns
tWASYN Asynchronous Pulse Width
2.4
3.2
3.8
4.8
6.5
ns
tWCLKA Flip-Flop Clock Pulse Width
2.4
3.2
3.8
4.8
6.5
ns
tA
Flip-Flop Clock Input Period
5.0
6.8
8.0
10.0
13.4
ns
fMAX
Flip-Flop Clock Frequency
200
150
125
100
75
MHz
Notes:
1. VCC = 3.0 V for 3.3 V specifications.
2. For dual-module macros, use tPD + tRD1 + tPDn + tCO + tRD1 + tPDn or tPD1 + tRD1 + tSUD, whichever is appropriate.
3. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
4. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
2- 38
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A14100A, A14V100A Timing Characteristics (continued)
Table 2-35 • A14100A, A14V100A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module Input Propagation Delays
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tINY
Input Data Pad to Y
2.8
3.2
3.6
4.2
5.5
ns
tICKY
Input Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tOCKY
Output Reg IOCLK Pad to Y
4.7
5.3
6.0
7.0
9.2
ns
tICLRY
Input Asynchronous Clear to Y
4.7
5.3
6.0
7.0
9.2
ns
4.7
5.3
6.0
7.0
9.2
ns
tOCLRY Output Asynchronous Clear to Y
Predicted Input Routing Delays2
tRD1
FO = 1 Routing Delay
0.9
1.0
1.1
1.3
1.7
ns
tRD2
FO = 2 Routing Delay
1.2
1.4
1.6
1.8
2.4
ns
tRD3
FO = 3 Routing Delay
1.4
1.6
1.8
2.1
2.8
ns
tRD4
FO = 4 Routing Delay
1.7
1.9
2.2
2.5
3.3
ns
tRD8
FO = 8 Routing Delay
2.8
3.2
3.6
4.2
5.5
ns
I/O Module Sequential Timing (wrt IOCLK pad)
tINH
Input F-F Data Hold
0.0
0.0
0.0
0.0
0.0
ns
tINSU
Input F-F Data Setup
1.2
1.4
1.5
1.8
1.8
ns
tIDEH
Input Data Enable Hold
0.0
0.0
0.0
0.0
0.0
ns
tIDESU Input Data Enable Setup
5.8
6.5
7.5
8.6
8.6
ns
tOUTH
0.7
0.8
1.0
1.0
1.0
ns
0.7
0.8
1.0
1.0
1.0
ns
0.3
0.4
0.5
0.5
0.5
ns
1.3
1.5
2.0
2.0
2.0
ns
Output F-F Data hold
tOUTSU Output F-F Data Setup
tODEH
Output Data Enable Hold
fODESU Output Data Enable Setup
Notes: *
1. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual worst-case
performance. Post-route timing is based on actual routing delay measurements performed on the device prior to
shipment.
Revision 3
2- 39
Detailed Specifications
A14100A, A14V100A Timing Characteristics (continued)
Table 2-36 • A14100A, A14V100A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
I/O Module – TTL Output Timing1
–3 Speed2 –2 Speed2 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tDHS
Data to Pad, High Slew
5.0
5.6
6.4
7.5
9.8
ns
tDLS
Data to Pad, Low Slew
8.0
9.0
10.2
12.0
15.6
ns
tENZHS Enable to Pad, Z to H/L, High Slew
4.0
4.5
5.1
6.0
7.8
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
8.0
9.0
10.2
12.0
15.6
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
9.5
9.5
10.5
12.0
15.6
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
12.8
12.8
15.3
17.0
22.1
ns
dTLHHS Delta Low to High, High Slew
0.02
0.02
0.03
0.03
0.04
ns/pF
dTLHLS Delta Low to High, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
dTHLHS Delta High to Low, High Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
dTHLLS Delta High to Low, Low Slew
0.05
0.05
0.06
0.07
0.09
ns/pF
1
I/O Module – CMOS Output Timing
tDHS
Data to Pad, High Slew
6.2
7.0
7.9
9.3
12.1
ns
tDLS
Data to Pad, Low Slew
11.7
13.1
14.9
17.5
22.8
ns
tENZHS Enable to Pad, Z to H/L, High Slew
5.2
5.9
6.6
7.8
10.1
ns
tENZLS Enable to Pad, Z to H/L, Low Slew
8.9
10.0
11.3
13.3
17.3
ns
tENHSZ Enable to Pad, H/L to Z, High Slew
8.0
9.0
10.0
12.0
15.6
ns
tENLSZ Enable to Pad, H/L to Z, Low Slew
7.4
8.3
9.4
11.0
14.3
ns
tCKHS
IOCLK Pad to Pad H/L, High Slew
10.4
10.4
12.4
13.8
17.9
ns
tCKLS
IOCLK Pad to Pad H/L, Low Slew
14.5
14.5
17.4
19.3
25.1
ns
dTLHHS Delta Low to High, High Slew
0.04
0.04
0.05
0.06
0.08
ns/pF
dTLHLS Delta Low to High, Low Slew
0.07
0.08
0.09
0.11
0.14
ns/pF
dTHLHS Delta High to Low, High Slew
0.03
0.03
0.03
0.04
0.05
ns/pF
dTHLLS Delta High to Low, Low Slew
0.04
0.04
0.04
0.05
0.07
ns/pF
Notes: *
1. Delays based on 35 pF loading.
2. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2- 40
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
A14100A, A14V100A Timing Characteristics (continued)
Table 2-37 • A14100A, A14V100A Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C
Dedicated (hardwired) I/O Clock Network
–3 Speed1 –2 Speed1 –1 Speed Std. Speed 3.3 V Speed1 Units
Parameter/Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max.
tIOCKH
Input Low to High (pad to I/O module
input)
tIOPWH
Minimum Pulse Width High
2.4
3.3
3.8
4.8
6.5
ns
tIPOWL
Minimum Pulse Width Low
2.4
3.3
3.8
4.8
6.5
ns
tIOSAPW
Minimum Asynchronous Pulse Width
2.4
3.3
3.8
4.8
6.5
ns
tIOCKSW
Maximum Skew
tIOP
Minimum Period
fIOMAX
Maximum Frequency
2.3
2.6
0.6
5.0
3.0
0.6
6.8
3.5
0.7
8.0
4.5
0.8
10.0
0.6
13.4
ns
ns
ns
200
150
125
100
75
MHz
Dedicated (hardwired) Array Clock
tHCKH
Input Low to High (pad to S-module
input)
3.7
4.1
4.7
5.5
7.0
ns
tHCKL
Input High to Low (pad to S-module
input)
3.7
4.1
4.7
5.5
7.0
ns
tHPWH
Minimum Pulse Width High
2.4
3.3
3.8
4.8
6.5
ns
tHPWL
Minimum Pulse Width Low
2.4
3.3
3.8
4.8
6.5
ns
tHCKSW
Delta High to Low, Low Slew
tHP
Minimum Period
fHMAX
Maximum Frequency
0.6
5.0
0.6
6.8
0.7
8.0
0.8
10.0
0.6
13.4
ns
ns
200
150
125
100
75
MHz
Routed Array Clock Networks
tRCKH
Input Low to High (FO = 64)
6.0
6.8
7.7
9.0
11.8
ns
tRCKL
Input High to Low (FO = 64)
6.0
6.8
7.7
9.0
11.8
ns
tRPWH
Min. Pulse Width High (FO = 64)
4.1
4.5
5.4
6.1
8.2
ns
tRPWL
Min. Pulse Width Low (FO = 64)
4.1
4.5
5.4
6.1
8.2
ns
tRCKSW
Maximum Skew (FO = 128)
tRP
Minimum Period (FO = 64)
fRMAX
Maximum Frequency (FO = 64)
1.2
8.3
1.4
9.3
120
1.6
11.1
105
1.8
12.5
90
1.8
16.7
80
ns
ns
60
MHz
Clock-to-Clock Skews
tIOHCKSW I/O Clock to H-Clock Skew
0.0
2.6
0.0
2.7
0.0
2.9
0.0
3.0
0.0
3.0
ns
tIORCKSW I/O Clock to R-Clock Skew (FO = 64)
(FO = 350)
0.0
0.0
1.7
5.0
0.0
0.0
1.7
5.0
0.0
0.0
1.7
5.0
0.0
0.0
1.7
5.0
0.0
0.0
5.0
5.0
ns
tHRCKSW H-Clock to R-Clock Skew (FO = 64)
(FO = 350)
0.0
0.0
1.3
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
0.0
0.0
1.0
3.0
ns
Notes: *
1. The –2 and –3 speed grades have been discontinued. Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004 at
http://www.microsemi.com/soc/support/notifications/default.aspx#pdn.
2. Delays based on 35 pF loading.
Revision 3
2- 41
Detailed Specifications
Pin Descriptions
CLKA
Clock A (Input)
Clock input for clock distribution networks. The Clock input is buffered prior to clocking the logic modules.
This pin can also be used as an I/O.
CLKB
Clock B (Input)
Clock input for clock distribution networks. The Clock input is buffered prior to clocking the logic modules.
This pin can also be used as an I/O.
GND
Ground
LOW supply voltage.
HCLK
Dedicated (Hard-wired)
Array Clock (Input)
Clock input for sequential modules. This input is directly wired to each S-Module and offers clock speeds
independent of the number of S-Modules being driven. This pin can also be used as an I/O.
I/O
Input/Output (Input, Output)
The I/O pin functions as an input, output, three-state, or bidirectional buffer. Input and output levels are
compatible with standard TTL and CMOS specifications. Unused I/O pins are tristated by the Designer
Series software.
IOCLK
Dedicated (Hard-wired)
I/O Clock (Input)
Clock input for I/O modules. This input is directly wired to each I/O module and offers clock speeds
independent of the number of I/O modules being driven. This pin can also be used as an I/O.
IOPCL
Dedicated (Hard-wired)
I/O Preset/Clear (Input)
Input for I/O preset or clear. This global input is directly wired to the preset and clear inputs of all I/O
registers. This pin functions as an I/O when no I/O preset or clear macros are used.
MODE
Mode (Input)
The MODE pin controls the use of diagnostic pins (DCLK, PRA, PRB, SDI). When the MODE pin is
HIGH, the special functions are active. When the MODE pin is LOW, the pins function as I/Os. To provide
Actionprobe capability, the MODE pin should be terminated to GND through a 10K resistor so that the
MODE pin can be pulled high when required.
NC
No Connection
This pin is not connected to circuitry within the device.
PRA
Probe A (Output)
The Probe A pin is used to output data from any user-defined design node within the device. This
independent diagnostic pin can be used in conjunction with the Probe B pin to allow real-time diagnostic
output of any signal path within the device. The Probe A pin can be used as a user-defined I/O when
debugging has been completed. The pin’s probe capabilities can be permanently disabled to protect
programmed design confidentiality. PRA is accessible when the MODE pin is HIGH. This pin functions as
an I/O when the MODE pin is LOW.
PRB
Probe B (Output)
The Probe B pin is used to output data from any user-defined design node within the device. This
independent diagnostic pin can be used in conjunction with the Probe A pin to allow real-time diagnostic
output of any signal path within the device. The Probe B pin can be used as a user-defined I/O when
debugging has been completed. The pin’s probe capabilities can be permanently disabled to protect
programmed design confidentiality. PRB is accessible when the MODE pin is HIGH. This pin functions as
an I/O when the MODE pin is LOW.
SDI
Serial Data Input (Input)
Serial data input for diagnostic probe and device programming. SDI is active when the MODE pin is
HIGH. This pin functions as an I/O when the MODE pin is LOW.
2- 42
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
SDO
Serial Data Output (Output)
Serial data output for diagnostic probe. SDO is active when the MODE pin is High. This pin functions as
an I/O when the MODE pin is Low.
DCLK
Diagnostic Clock (Input)
Clock input for diagnostic probe and device programming. DCLK is active when the MODE pin is HIGH.
This pin functions as an I/O when the MODE pin is LOW.
VCC
5 V Supply Voltage
HIGH supply voltage.
Revision 3
2- 43
3 – Package Pin Assignments
PL84
11
10
9
8
7
6
5
4
3
2
1
84 83
82
81
80
79 78
77 76
75
12
74
13
73
14
72
15
71
16
70
17
69
18
68
19
67
20
66
21
65
84-Pin
PLCC
22
64
23
63
24
62
25
61
26
60
27
59
28
58
29
57
30
56
31
55
32
54
33
34 35
36
37
38 39
40
41 42
43 44 45
46
47
48
49 50
51 52
53
Note: This is the top view of the package.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Revision 3
3 -1
Package Pin Assignments
PL84
Pin Number
A1415, A14V15 Function
A1425, A14V25 Function
A1440, A14V40 Function
1
VCC
VCC
VCC
2
GND
GND
GND
3
VCC
VCC
VCC
4
PRA, I/O
PRA, I/O
PRA, I/O
11
DCLK, I/O
DCLK, I/O
DCLK, I/O
12
SDI, I/O
SDI, I/O
SDI, I/O
16
MODE
MODE
MODE
27
GND
GND
GND
28
VCC
VCC
VCC
40
PRB, I/O
PRB, I/O
PRB, I/O
41
VCC
VCC
VCC
42
GND
GND
GND
43
VCC
VCC
VCC
45
HCLK, I/O
HCLK, I/O
HCLK, I/O
52
SDO
SDO
SDO
53
IOPCL, I/O
IOPCL, I/O
IOPCL, I/O
59
VCC
VCC
VCC
60
VCC
VCC
VCC
61
GND
GND
GND
68
VCC
VCC
VCC
69
GND
GND
GND
74
IOCLK, I/O
IOCLK, I/O
IOCLK, I/O
83
CLKA, I/O
CLKA, I/O
CLKA, I/O
84
CLKB, I/O
CLKB, I/O
CLKB, I/O
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
3-2
R e vi s i o n 3
Accelerator Series FPGAs – ACT 3 Family
PQ100
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
81
50
82
49
83
48
84
47
85
46
86
45
87
44
88
43
89
42
100-Pin
90
41
PQFP
91
40
92
39
93
38
94
37
95
36
96
35
97
34
98
33
99
32
100
31
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
Note: This is the top view of the package.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx
Revision 3
3 -3
Package Pin Assignments
PQ100
Pin Number
A1415 Function
A1425 Function
2
IOCLK, I/O
IOCLK, I/O
14
CLKA, I/O
CLKA, I/O
15
CLKB, I/O
CLKB, I/O
16
VCC
VCC
17
GND
GND
18
VCC
VCC
19
GND
GND
20
PRA, I/O
PRA, I/O
27
DCLK, I/O
DCLK, I/O
28
GND
GND
29
SDI, I/O
SDI, I/O
34
MODE
MODE
35
VCC
VCC
36
GND
GND
47
GND
GND
48
VCC
VCC
61
PRB, I/O
PRB, I/O
62
GND
GND
63
VCC
VCC
64
GND
GND
65
VCC
VCC
67
HCLK, I/O
HCLK, I/O
77
SDO
SDO
78
IOPCL, I/O
IOPCL, I/O
79
GND
GND
85
VCC
VCC
86
VCC
VCC
87
GND
GND
96
VCC
VCC
97
GND
GND
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
3-4
R e vi s i o n 3
Accelerator Series FPGAs – ACT 3 Family
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
PQ160
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
160-Pin
PQFP
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
Note: This is the top view of the package
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx
Revision 3
3 -5
Package Pin Assignments
PQ160
3-6
Pin Number
A1425, A14V25 Function
A1440, A14V40 Function
A1460, A14V60 Function
1
GND
GND
GND
2
SDI, I/O
SDI, I/O
SDI, I/O
5
NC
I/O
I/O
9
MODE
MODE
MODE
10
VCC
VCC
VCC
14
NC
I/O
I/O
15
GND
GND
GND
18
VCC
VCC
VCC
19
GND
GND
GND
20
NC
I/O
I/O
24
NC
I/O
I/O
27
NC
I/O
I/O
28
VCC
VCC
VCC
29
VCC
VCC
VCC
40
GND
GND
GND
41
NC
I/O
I/O
43
NC
I/O
I/O
45
NC
I/O
I/O
46
VCC
VCC
VCC
47
NC
I/O
I/O
49
NC
I/O
I/O
51
NC
I/O
I/O
53
NC
I/O
I/O
58
PRB, I/O
PRB, I/O
PRB, I/O
59
GND
GND
GND
60
VCC
VCC
VCC
62
HCLK, I/O
HCLK, I/O
HCLK, I/O
63
GND
GND
GND
74
NC
I/O
I/O
75
VCC
VCC
VCC
76
NC
I/O
I/O
77
NC
I/O
I/O
78
NC
I/O
I/O
79
SDO
SDO
SDO
80
IOPCL, I/O
IOPCL, I/O
IOPCL, I/O
81
GND
GND
GND
90
VCC
VCC
VCC
91
VCC
VCC
VCC
R e vi s i o n 3
Accelerator Series FPGAs – ACT 3 Family
PQ160
Pin Number
A1425, A14V25 Function
A1440, A14V40 Function
A1460, A14V60 Function
92
NC
I/O
I/O
93
NC
I/O
I/O
98
GND
GND
GND
99
VCC
VCC
VCC
100
NC
I/O
I/O
103
GND
GND
GND
107
NC
I/O
I/O
109
NC
I/O
I/O
110
VCC
VCC
VCC
111
GND
GND
GND
112
VCC
VCC
VCC
113
NC
I/O
I/O
119
NC
I/O
I/O
120
IOCLK, I/O
IOCLK, I/O
IOCLK, I/O
121
GND
GND
GND
124
NC
I/O
I/O
127
NC
I/O
I/O
136
CLKA, I/O
CLKA, I/O
CLKA, I/O
137
CLKB, I/O
CLKB, I/O
CLKB, I/O
138
VCC
VCC
VCC
139
GND
GND
GND
140
VCC
VCC
VCC
141
GND
GND
GND
142
PRA, I/O
PRA, I/O
PRA, I/O
143
NC
I/O
I/O
145
NC
I/O
I/O
147
NC
I/O
I/O
149
NC
I/O
I/O
151
NC
I/O
I/O
153
NC
I/O
I/O
154
VCC
VCC
VCC
160
DCLK, I/O
DCLK, I/O
DCLK, I/O
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3 -7
Package Pin Assignments
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
PQ208, RQ208
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
208-Pin
PQFP, RQFP
Note: This is the top view of the package
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx
3-8
R e vi s i o n 3
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
Accelerator Series FPGAs – ACT 3 Family
PQ208, RQ208
PQ208, RQ208
Pin Number
A1460, A14V60
Function
A14100, A14V100
Function
Pin Number
A1460, A14V60
Function
A14100, A14V100
Function
1
GND
GND
115
VCC
VCC
2
SDI, I/O
SDI, I/O
116
NC
I/O
11
MODE
MODE
129
GND
GND
12
VCC
VCC
130
VCC
VCC
25
VCC
VCC
131
GND
GND
26
GND
GND
132
VCC
VCC
27
VCC
VCC
145
VCC
VCC
28
GND
GND
146
GND
GND
40
VCC
VCC
147
NC
I/O
41
VCC
VCC
148
VCC
VCC
52
GND
GND
156
IOCLK, I/O
IOCLK, I/O
53
NC
I/O
157
GND
GND
60
VCC
VCC
158
NC
I/O
65
NC
I/O
164
VCC
VCC
76
PRB, I/O
PRB, I/O
180
CLKA, I/O
CLKA, I/O
77
GND
GND
181
CLKB, I/O
CLKB, I/O
78
VCC
VCC
182
VCC
VCC
79
GND
GND
183
GND
GND
80
VCC
VCC
184
VCC
VCC
82
HCLK, I/O
HCLK, I/O
185
GND
GND
98
VCC
VCC
186
PRA, I/O
PRA, I/O
102
NC
I/O
195
NC
I/O
103
SDO
SDO
201
VCC
VCC
104
IOPCL, I/O
IOPCL, I/O
205
NC
I/O
105
GND
GND
208
DCLK, I/O
DCLK, I/O
114
VCC
VCC
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3 -9
Package Pin Assignments
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
TQ176
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
176-Pin
TQFP
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
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3- 10
R e visio n 3
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
Accelerator Series FPGAs – ACT 3 Family
TQ176
TQ176
Pin Number
A1440, A14V40
Function
A1460, A14V60
Function
Pin Number
A1440, A14V40
Function
A1460, A14V60
Function
1
GND
GND
89
GND
GND
2
SDI, I/O
SDI, I/O
98
VCC
VCC
10
MODE
MODE
99
VCC
VCC
11
VCC
VCC
108
GND
GND
20
NC
I/O
109
VCC
VCC
21
GND
GND
110
GND
GND
22
VCC
VCC
119
NC
I/O
23
GND
GND
121
NC
I/O
32
VCC
VCC
122
VCC
VCC
33
VCC
VCC
123
GND
GND
44
GND
GND
124
VCC
VCC
49
NC
I/O
132
IOCLK, I/O
IOCLK, I/O
51
NC
I/O
133
GND
GND
63
NC
I/O
138
NC
I/O
64
PRB, I/O
PRB, I/O
152
CLKA, I/O
CLKA, I/O
65
GND
GND
153
CLKB, I/O
CLKB, I/O
66
VCC
VCC
154
VCC
VCC
67
VCC
VCC
155
GND
GND
69
HCLK, I/O
HCLK, I/O
156
VCC
VCC
82
NC
I/O
157
PRA, I/O
PRA, I/O
83
NC
I/O
158
NC
I/O
87
SDO
SDO
170
NC
I/O
88
IOPCL, I/O
IOPCL, I/O
176
DCLK, I/O
DCLK, I/O
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3- 11
Package Pin Assignments
76
77
78
80
79
81
82
84
83
86
85
87
88
89
91
90
93
92
94
95
96
97
98
99
100
VQ100
1
75
2
74
3
73
4
72
5
71
6
70
7
69
8
68
9
67
10
66
11
65
100-Pin
VQFP
12
13
64
63
Note: This is the top view.
Note
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3- 12
R e visio n 3
50
49
48
47
46
45
44
43
42
41
40
39
38
51
37
52
25
36
53
24
35
54
23
34
55
22
33
56
21
32
57
20
31
58
19
30
59
18
29
60
17
28
61
16
27
62
15
26
14
Accelerator Series FPGAs – ACT 3 Family
VQ100
Pin Number
A1415, A14V15 Function
A1425, A14V25 Function
A1440, A14V40 Function
1
GND
GND
GND
2
SDI, I/O
SDI, I/O
SDI, I/O
7
MODE
MODE
MODE
8
VCC
VCC
VCC
9
GND
GND
GND
20
VCC
VCC
VCC
21
NC
I/O
I/O
34
PRB, I/O
PRB, I/O
PRB, I/O
35
VCC
VCC
VCC
36
GND
GND
GND
37
VCC
VCC
VCC
39
HCLK, I/O
HCLK, I/O
HCLK, I/O
49
SDO
SDO
SDO
50
IOPCL, I/O
IOPCL, I/O
IOPCL, I/O
51
GND
GND
GND
57
VCC
VCC
VCC
58
VCC
VCC
VCC
67
VCC
VCC
VCC
68
GND
GND
GND
69
GND
GND
GND
74
NC
I/O
I/O
75
IOCLK, I/O
IOCLK, I/O
IOCLK, I/O
87
CLKA, I/O
CLKA, I/O
CLKA, I/O
88
CLKB, I/O
CLKB, I/O
CLKB, I/O
89
VCC
VCC
VCC
90
VCC
VCC
VCC
91
GND
GND
GND
92
PRA, I/O
PRA, I/O
PRA, I/O
93
NC
I/O
I/O
100
DCLK, I/O
DCLK, I/O
DCLK, I/O
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3- 13
Package Pin Assignments
CQ132
132 131 130 129 128 127 126 125 124
107 106 105 104 103 102 101 100
Pin #1
Index
1
99
2
98
3
97
4
96
5
95
6
94
7
93
8
92
132-Pin
CQFP
25
75
26
74
27
73
28
72
29
71
30
70
31
69
32
68
33
67
34 35 36 37 38 39 40 41 42
59 60 61 62 63 64 65 66
Note: This is the top view
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
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3- 14
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
CQ132
CQ132
Pin Number
A1425 Function
Pin Number
A1425 Function
1
NC
67
NC
2
GND
74
GND
3
SDI, I/O
75
VCC
9
MODE
78
VCC
10
GND
89
VCC
11
VCC
90
GND
22
VCC
91
VCC
26
GND
92
GND
27
VCC
98
IOCLK, I/O
34
NC
99
NC
36
GND
100
NC
42
GND
101
GND
43
VCC
106
GND
48
PRB, I/O
107
VCC
50
HCLK, I/O
116
CLKA, I/O
58
GND
117
CLKB, I/O
59
VCC
118
PRA, I/O
63
SDO
122
GND
64
IOPCL, I/O
123
VCC
65
GND
131
DCLK, I/O
66
NC
132
NC
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3- 15
Package Pin Assignments
CQ196
196 195 194 193 192 191 190 189 188
155 154 153 152 151 150 149 148
Pin #1
Index
1
147
2
146
3
145
4
144
5
143
6
142
7
141
8
140
196-Pin
CQFP
41
107
42
106
43
105
44
104
45
103
46
102
47
101
48
100
49
99
50 51 52 53 54 55 56 57 58
91 92 93 94 95 96 97 98
Note: This is the top view.
Note
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3- 16
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
CQ196
CQ196
Pin Number
A1460 Function
Pin Number
A1460 Function
1
GND
101
GND
2
SDI, I/O
110
VCC
11
MODE
111
VCC
12
VCC
112
GND
13
GND
137
VCC
37
GND
138
GND
38
VCC
139
GND
39
VCC
140
VCC
51
GND
148
IOCLK, I/O
52
GND
149
GND
59
VCC
155
VCC
64
GND
162
GND
77
HCLK, I/O
172
CLKA, I/O
79
PRB, I/O
173
CLKB, I/O
86
GND
174
PRA, I/O
94
VCC
183
GND
98
GND
189
VCC
99
SDO
193
GND
100
IOPCL, I/O
196
DCLK, I/O
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3- 17
Package Pin Assignments
CQ256
256 255 254 253 252 251 250 249 248
200 199 198 197 196 195 194 193
Pin #1
Index
1
192
2
191
3
190
4
189
5
188
6
187
7
186
8
185
256-Pin
CQFP
56
137
57
136
58
135
59
134
60
133
61
132
62
131
63
130
64
129
65 66 67 68 69 70 71 72 73
121 122 123 124 125 126 127 128
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
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3- 18
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
CQ256
CQ256
Pin Number
A14100 Function
Pin Number
A14100 Function
1
GND
141
VCC
2
SDI, I/O
158
GND
11
MODE
159
VCC
28
VCC
160
GND
29
GND
161
VCC
30
VCC
174
VCC
31
GND
175
GND
46
VCC
176
GND
59
GND
188
IOCLK, I/O
90
PRB, I/O
189
GND
91
GND
219
CLKA, I/O
92
VCC
220
CLKB, I/O
93
GND
221
VCC
94
VCC
222
GND
96
HCLK, I/O
223
VCC
110
GND
224
GND
126
SDO
225
PRA, I/O
127
IOPCL, I/O
240
GND
128
GND
256
DCLK, I/O
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3- 19
Package Pin Assignments
BG225
1
2
3
4
5
6
7
8
9
10
11 12
13 14
15
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
M
N
N
P
P
R
R
1
2
3
4
5
6
7
8
9
10
11 12
13 14
15
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
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3- 20
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
BG225
A1460 Function
Location
CLKA or I/O
C8
CLKB or I/O
B8
DCLK or I/O
B2
GND
A1, A15, D15, F8, G7, G8, G9, H6, H7, H8, H9, H10, J7, J8, J9, K8, P2, R15
HCLK or I/O
P9
IOCLK or I/O
B14
IOPCL or I/O
P14
MODE
D1
NC
A11, B5, B7, D8, D12, F6, F11, H1, H12, H14, K11, L1, L13, N8, P5, R1, R8, R11, R14
PRA or I/O
A7
PRB or I/O
L7
SDI or I/O
D4
SDO
N13
VCC
A8, B12, D5, D14, E3, E8, E13, H2, H3, H11, H15, K4, L2, L12, M8, M15, P4, P8, R13
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
4. The BG225 package has been discontinued.
Revision 3
3- 21
Package Pin Assignments
BG313
1
2
3
4
5
6
7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
J
H
K
K
L
L
M
M
N
N
P
P
R
R
T
U
T
V
V
W
W
Y
AA
Y
AA
J
U
AB
AB
AC
AC
AD
AD
AE
AE
1
2
3
4
5
6
7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx
3- 22
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
BG313
A14100, A14V100
Function
Location
CLKA or I/O
J13
CLKB or I/O
G13
DCLK or I/O
B2
GND
A1, A25, AD2, AE25, J21, L13, M12, M14, N11, N13, N15, P12, P14, R13
HCLK or I/O
T14
IOCLK or I/O
B24
IOPCL or I/O
AD24
MODE
NC
G3
A3, A13, A23, AA5, AA9, AA23, AB2, AB4, AB20, AC13, AC25, AD22, AE1, AE21, B14, C5,
C25, D4, D24, E3, E21, F6, F10, F16, G1, G25, H18, H24, J1, J7, J25, K12, L15, L17, M6, N1,
N5, N7, N21, N23, P20, R11, T6, T8, U9, U13, U21, V16, W7, Y20, Y24
PRA or I/O
H12
PRB or I/O
AD12
SDI or I/O
C1
SDO
AE23
VCC
AB18, AD6, AE13, C13, C19, E13, G9, H22, K8, K20, M16, N3, N9, N25, U5, W13, V2, V22,
V24
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3- 23
Package Pin Assignments
PG100
1
2
3
4
5
6
7
8
9
10 11
A
A
B
B
C
C
D
D
E
E
100-Pin
CPGA
F
F
G
G
H
H
J
J
K
K
L
L
1
2
3
4
5
6
7
8
9
10 11
Orientation Pin
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
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3- 24
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
PG100
A1415 Function
Location
CLKA or I/O
C7
CLKB or I/O
D6
DCLK or I/O
C4
GND
C3, C6, C9, E9, F3, F9, J3, J6, J8, J9
HCLK or I/O
H6
IOCLK or I/O
C10
IOPCL or I/O
K9
MODE
C2
PRA or I/O
A6
PRB or I/O
L3
SDI or I/O
B3
SDO
L9
VCC
B6, B10, E11, F2, F10, G2, K2, K6, K10
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
4. The PG100 package has been discontinued.
Revision 3
3- 25
Package Pin Assignments
PG133
1
2
3
4
5
6
7
8
9
10 11 12 13
A
A
B
B
C
C
D
D
E
E
F
F
133-Pin
CPGA
G
G
H
H
J
J
K
K
L
L
M
M
N
N
1
2
3
4
5
6
7
8
9
10 11 12 13
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx
3- 26
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
PG133
A1425 Function
Location
CLKA or I/O
D7
CLKB or I/O
B6
DCLK or I/O
D4
GND
A2, C3, C7, C11, C12, F10, G3, G11, L3, L7, L11, M3, N12
HCLK or I/O
K7
IOCLK or I/O
C10
IOPCL or I/O
L10
MODE
E3
NC
A1, A7, A13, G1, G13, N1, N7, N13
PRA or I/O
A6
PRB or I/O
L6
SDI or I/O
C2
SDO
M11
VCC
B2, B7, B12, E11, G2, G12, J2, J12, M2, M7, M12
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
4. The PG133 package has been discontinued.
Revision 3
3- 27
Package Pin Assignments
PG175
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
1
2
2
3
3
4
4
5
5
6
6
7
7
175-Pin
CPGA
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx
3- 28
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
PG175
A1440 Function
Location
CLKA or I/O
C9
CLKB or I/O
A9
DCLK or I/O
D5
GND
D4, D8, D11, D12, E4, E14, H4, H12, L4, L12, M4, M8, M12
HCLK or I/O
R8
IOCLK or I/O
E12
IOPCL or I/O
P13
MODE
NC
F3
A1, A2, A15, B2, B3, P2, P14, R1, R2, R14, R15
PRA or I/O
B8
PRB or I/O
R7
SDI or I/O
D3
SDO
N12
VCC
C3, C8, C13, E15, H3, H13, L1, L14, N3, N8, N13
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
4. The PG175 package has been discontinued.
Revision 3
3- 29
Package Pin Assignments
PG207
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
207-Pin
CPGA
J
K
L
L
M
M
N
N
P
P
R
R
S
S
T
T
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx
3- 30
J
K
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
PG207
A1460 Function
Location
CLKA or I/O
K1
CLKB or I/O
J3
DCLK or I/O
E4
GND
C14, D4, D5, D9, D14, J4, J14, P3, P4, P7, P9, P14, R15
HCLK or I/O
J15
IOCLK or I/O
P5
IOPCL or I/O
N14
MODE
D7
NC
A1, A2, A16, A17, B1, B17, C1, C2, S1, S3, S17, T1, T2, T16, T17
PRA or I/O
H1
PRB or I/O
K16
SDI or I/O
C3
SDO
P15
VCC
B2, B9, B16, D11, J2, J16, P12, S2, S9, S16, T5
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3- 31
Package Pin Assignments
PG257
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
257-Pin
CPGA
K
L
L
M
M
N
N
P
P
R
R
T
T
V
V
X
X
Y
Y
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19
Note: This is the top view.
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx
3- 32
K
R e visio n 3
Accelerator Series FPGAs – ACT 3 Family
PG257
A14100 Function
Location
CLKA or I/O
L4
CLKB or I/O
L5
DCLK or I/O
E4
GND
B16, C4, D4, D10, D16, E11, J5, K4, K16, L15, R4, T4, T10, T16, T17, X7
HCLK or I/O
J16
IOCLK or I/O
T5
IOPCL or I/O
R16
MODE
A5
NC
E5
PRA or I/O
J1
PRB or I/O
J17
SDI or I/O
B4
SDO
R17
VCC
C3, C10, C13, C17, K3, K17, V3, V7, V10, V17, X14
Notes:
1. All unlisted pin numbers are user I/Os.
2. NC denotes no connection.
3. MODE should be terminated to GND through a 10K resistor to enable Actionprobe usage; otherwise it can be
terminated directly to GND.
Revision 3
3- 33
4 – Datasheet Information
List of Changes
The following table lists critical changes that were made in each version of the datasheet.
Revision
Revision 3
(January 2012)
Revision 2
(September 2011)
Changes
Page
The description for SDO pins had earlier been removed from the datasheet and has
now been included again, in the "Pin Descriptions" section (SAR 35820).
2-21
SDO pin numbers had earlier been removed from package pin assignment tables in
the datasheet, and have now been restored to the pin tables (SAR 35820).
3-1
The ACT 3 datasheet was formatted newly in the style used for current datasheets.
The same information is present (other than noted in the list of changes for this
revision) but divided into chapters.
N/A
The datasheet was revised to note in multiple places that speed grades –2 and –3
have been discontinued. The following device/package combinations have been
discontinued for all speed grades and temperatures (SAR 33872):
I and
others
A1415 PG100
A1425 PG133
A1440 PG175
A1460 BG225
Refer to PDN 0104, PDN 0203, PDN 0604, and PDN 1004.
The "Features" section was revised to state the clock-to-ouput time and on-chip
performance for –1 speed grade as 9.0 ns and 186 MHz. The "General Description"
section was revised in accordance (SAR 33872).
I
The maximum performance values were updated in Table 1 • ACT 3 Family Product
Information, and now reflect worst-case commercial for the –1 speed grade (SAR
33872).
I
The "Product Plan" table was updated as follows to conform to current offerings (SAR
33872):
III
The A1415A device is offered in PL84, PG100, and VQ100 packages for Military
application.
The A1440A device is offered in TQ176 and VQ100 packages for Industrial
application.
Table 1-1 • Chip-to-Chip Performance (worst-case commercial) was updated to
include data for all speed grades instead of only –3 (SAR 33872).
1-2
Figure 1-1 • Predictable Performance (worst-case commercial, –1 speed grade) was
revised to reflect values for the –1 speed grade (SAR 33872).
1-1
Figure 2-10 • Timing Model was updated to show data for the –1 speed grade instead
of –3 (SAR 33872).
2-16
Table 2-14 • Logic Module and Routing Delay by Fanout (ns); Worst-Case Commercial
Conditions was updated to include data for all speed grades instead of only –3 (SAR
33872).
2-20
Package names used in the "Package Pin Assignments" section and throughout the
document were revised to match standards given in Package Mechanical Drawings
(SAR 27395).
3-1
Revision 3
4 -1
Datasheet Information
Revision
Revision 2
(continued)
Changes
In the "Package Pin Assignments" section, notes were added to the pin tables for the
following packages, stating that they are discontinued:
3-20
3-24
3-26
3-28
"BG225"
"PG100"
"PG133"
"PG175"
Revision 1
(June 2006)
4-2
Page
RoHS compliant information was added to the "Ordering Information" section.
R e vi s i o n 3
II
Accelerator Series FPGAs – ACT 3 Family
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device is
designated as either "Product Brief," "Advance," "Preliminary," or "Production." The definitions of these
categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Production
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR).
They could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
Safety Critical, Life Support, and High-Reliability Applications
Policy
The products described in this advance status document may not have completed the Microsemi
qualification process. Products may be amended or enhanced during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the responsibility of
each customer to ensure the fitness of any product (but especially a new product) for a particular
purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications.
Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating
to life-support applications. A reliability report covering all of the SoC Products Group’s products is
available at http://www.microsemi.com/soc/documents/ORT_Report.pdf. Microsemi also offers a variety
of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for
additional reliability information.
Revision 3
4 -3
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solutions for: aerospace, defense and security; enterprise and communications; and industrial
and alternative energy markets. Products include high-performance, high-reliability analog and
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