Superworld A4K300-RE-10 Ferrite chip beads 4 line array Datasheet

FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
1. PART NO. EXPRESSION :
A4K300-RE-10
(a) Series code
(e) R : Reel
(a)(b)(c) (d)
(b) Dimension code
(f) Current code : E = 500mA
(c) Material code
(g) 10 : Lead Free
(e) (f)
(g)
(d) Impedance code : 300 = 30ȍ
2. CONFIGURATION & DIMENSIONS :
A
L
G
D2
J
C
I
H
PCB Pattern
D1
B
P
A
B
D1
C
Unit:m/m
D2
P
3.20±0.20 1.60±0.20 0.90±0.20 0.40±0.15 0.20±0.10 0.80±0.10
G
H
I
J
L
0.80 Ref.
0.40 Ref.
0.80 Ref.
2.80 Ref.
2.20~2.60
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Temp. rise : 30°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -55°C to +125°C
d) Operating temp. : -55°C to +125°C
e) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
6. ELECTRICAL CHARACTERISTICS :
Part Number
Impedance
(ȍ)
Test
Frequency
( MHz )
DC Resistance
(ȍ)
Max.
Rated Current
( mA )
Max.
A4K300-RE-10
30 ±25%
100
0.20
500
A4K600-RD-10
60 ±25%
100
0.25
400
A4K121-RD-10
120 ±25%
100
0.30
350
A4K301-RC-10
300 ±25%
100
0.40
250
A4K601-RB-10
600 ±25%
100
0.50
200
A4K102-RB-10
1000 ±25%
100
0.75
150
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
7. IMPEDANCE VS. FREQUENCY CURVES :
A4K300-RE-10
A4K600-RD-10
A4K121-RD-10
A4K301-RC-10
A4K601-RB-10
A4K102-RB-10
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Impedance
Refer to standard electrical characteristics list
DC Resistance
HP4291A, HP4287A+16192A
HP4338B
Rated Current
Temperature Rise Test
30°C max. (ǻt)
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Solder Heat Resistance
Appearance : No significant abnormality
Impedance change : Within ±30%
No mechanical damage
Remaining terminal electrode : 70% Min.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
260°C
150°C
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 230±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
230°C
More than 90% of the terminal electrode
should be covered with solder.
Solderability
150°C
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Preheating Dipping
60
seconds
10±0.5
seconds
Preheating Dipping
60
seconds
Natural
cooling
Natural
cooling
4±1.0
seconds
For A Series :
Size
Force (Kfg)
Time (sec)
4
0.5
> 25
W
W
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Appearance : No damage.
Impedance : Within ±30% of initial value.
Loading at High
Temperature
Humidity
Temperature : 125±5°C
Applied Current : rated current
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Humidity : 90~95% RH.
Temperature : 40±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Appearance : No damage.
Impedance : Within ±30% of initial value.
Thermal Shock
Phase
Temperature (°C)
Times (min.)
1
-55±2°C
30±3
2
+125±5°C
30±3
For A Series :
Condition for 1 cycle
Step1 : -55±2°C 30±3 min.
Step2 : +125±5°C 30±3 min.
Number of cycles : 5
Measured at room temperature after placing for 2 to 3hrs.
Measured : 5 times
Low temperature storage test
Temperature : -55±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
0.8
2.2 - 2.6
2.8
0.8
0.4
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering
is shown in Fig. 2
9-2.3 Soldering Iron (Figure 3) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150°C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350°C tip temperature (max)
f) Limit soldering time to 3 secs.
c) Never contact the ceramic with the iron tip
Soldering
10s max.
Natural
cooling
Preheating
TEMPERATURE °C
TEMPERATURE °C
Preheating
250 ~ 260
230
180
150
60~120s
30~60s
Time(sec.)
Soldering
Natural
cooling
260
245
150
Gradual
Cooling
Over 2min.
Figure 1. Re-flow Soldering
TEMPERATURE °C
Preheating
Soldering
3s
(max.)
350
Natural
cooling
Within 3s
Figure 2. Wave Soldering
10s
(max.)
330
150
Over 1min.
Gradual
Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
9-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit
t
Recommendable
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
10. PACKAGING INFORMATION :
10-1. Reel Dimension
C(mm)
D(mm)
Type
A(mm)
B(mm)
7" x 8mm
9.0±0.5
60.0±2.0
13.5±0.5 178.0±2.0
7" x 12mm 13.5±0.5
60.0±2.0
13.5±0.5 178.0±2.0
C
D
B
A
13.5±0.5
2±0.5
7" x 8mm
7" x 12mm
R10.5
R1.9
R0.5
120°
10-2 Tape Dimension / 8mm
t
Series
P
Ao
A
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
1
1.12±0.05 0.67±0.05 0.54±0.05
2.0±0.1
0.23±0.05
none
2
1.80±0.10 1.01±0.10 1.02±0.10
4.0±0.1
0.22±0.05
none
3 (09)
2.25±0.10 1.42±0.10 1.04±0.10
4.0±0.1
0.22±0.05
1.0±0.1
3 (12)
2.35±0.10 1.50±0.10 1.45±0.10
4.0±0.1
0.22±0.05
1.0±0.1
4
3.50±0.10 1.88±0.10 1.27±0.10
4.0±0.1
0.22±0.05
1.0±0.1
5
3.42±0.10 2.77±0.10 1.55±0.10
4.0±0.1
0.22±0.05
1.0±0.1
A
4
3.40±0.10 1.77±0.10 1.04±0.10
4.0±0.1
0.22±0.05
1.0±0.1
Series
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
6
4.95±0.1
1.93±0.1
1.93±0.1
4.0±0.1
0.24±0.05
1.5±0.1
7
4.95±0.1
3.66±0.1
1.85±0.1
8.0±0.1
0.24±0.05
1.5±0.1
8
6.10±0.1
5.40±0.1
2.00±0.1
8.0±0.1
0.30±0.05
1.5±0.1
Bo
W:8.0±0.1
A
F:3.5±0.05
E:1.75±0.1
D:1.5+0.1
Po:4±0.1
P2:2±0.05
Z
Ko
Section A-A
D1:1±0.1
10-2.1 Tape Dimension / 12mm
Po:4±0.1
P2:2±0.05
t
Ao
P
A
Z
Bo
W:12.0±0.1
A
F:5.5±0.05
E:1.75±0.1
D:1.5+0.1
Ko
Section A-A
D1:1.5±0.1
10-3. Packaging Quantity
Chip Size
8
7
6
5
4
3 (12)
3 (09)
2
1
Chip / Reel
1000
1000
2000
2500
3000
2000
4000
4000
10000
Inner Box
4000
4000
8000
12500
15000
10000
20000
20000
50000
Middle Box
20000
20000
40000
62500
75000
50000
100000
100000
250000
Carton
40000
40000
80000
125000
150000
100000
200000
200000
500000
Bulk (Bags)
7000
12000
20000
30000
50000
100000
150000
200000
300000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
10-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Top cover tape
Room Temp.
(°C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9
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