Vishay ACAC0612110RJ22K1P5 Precision thin film chip resistor array Datasheet

ACAC 0612, ACAS 0612 - Precision
Vishay Beyschlag
Precision Thin Film Chip Resistor Array
FEATURES
•
•
•
•
•
ACAC 0612 (concave terminations) and ACAS 0612 (convex
terminations) thin chip resistor arrays combine the proven
reliability of precision thin film chip resistor products with the
advantages of chip resistor arrays. Defined tolerance
matching and TCR tracking makes this product perfectly
suited for applications with outstanding requirements
towards stable fixed resistor ratios. A small package enables
the design of high density circuits in combination with
reduction of assembly costs. Four equal resistor values or
two pairs are available.
Advanced thin film technology
Two pairs or four equal resistor values
TCR tracking down to 10 ppm/K (± 5 ppm/K)
Tolerance matching down to 0.1 % (± 0.05 %)
Pure Sn termination on Ni barrier layer
• RoHS compliant component, compatible with lead (Pb)-free
and lead containing soldering processes
APPLICATIONS
• Precision analogue circuits
• Voltage divider
• Feedback circuits
• Signal conditioning
TECHNICAL SPECIFICATIONS
DESCRIPTION
EIA size
Metric size
Configuration, isolated
Design:
All Equal
Two Pairs
Resistance values
Absolute tolerance
ACAC 0612, ACAS 0612
0612
RR1632M
4 x 0603
Tolerance matching
Absolute temperature coefficient
Temperature coefficient tracking
Max. resistance ratio Rmin./Rmax.
Rated dissipation: P70 (3)
Element
Package, 4 x 0603
Operating voltage
Film temperature
Insulation voltage (Uins) against ambient and between isolated
resistors, continuous
AE
TP
47 Ω to 221 kΩ (1)
± 0.5 %; ± 0.25 %
0.5 % (equivalent to ± 0.25 %)
0.25 % (equivalent to ± 0.125 %)
0.1 % (equivalent to ± 0.05 %)
± 50 ppm/K; ± 25 ppm/K
50 ppm/K (equivalent to ± 25 ppm/K)
25 ppm/K (equivalent to ± 12.5 ppm/K)
15 ppm/K (equivalent to ± 7.5 ppm/K)
10 ppm/K (equivalent to ± 5 ppm/K)
1:5 (2)
0.1 W
0.3 W
75 V
125 °C (4)
75 V
Notes
(1) Resistance values to be selected from E24, E48 and E96
(2) Higher resistance ratio is available on request
(3) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat-flow support of the printed
circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high
level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board
materials may be required to maintain the reliability of the assembly.
(4) For higher max. film temperature and AEC-Q200 qualification please refer to data sheet “Automotive Precision Thin Film Chip Resistor Array“
available on our web site at www.vishay.com
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
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For technical questions, contact: [email protected]
Document Number: 28751
Revision: 11-Sep-08
ACAC 0612, ACAS 0612 - Precision
Precision Thin Film Chip Resistor Array
Vishay Beyschlag
PART NUMBER AND PRODUCT DESCRIPTION (1)
PART NUMBER: ACASA1100A2200P500
A
C
A
S
A
1
1
0
RESISTANCE
VALUE (2) (3)
MODEL
TERMINAL
SIZE
ACA
C = Concave
S = Convex
A = 0612
0
A
ACCURACY
GRADE (4)
3 digit
TCR, Tracking,
resistance
Tolerance and
value R1, R4
Matching
1 digit multiplier
A, B, E, F,
MULTIPLIER
J, K, N or P
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
2
2
0
RESISTANCE
VALUE (2) (3)
0
P
5
0
0
PACKAGING (5)
SPECIAL
P1
P5
PW
00 = Standard
3 digit
resistance
value R2, R3
1 digit multiplier
MULTIPLIER
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
PRODUCT DESCRIPTION: ACAS 0612 110R A 220R P5
ACA
S
0612
110R
A
220R
P5
MODEL
TERMINATION
SIZE
RESISTANCE
VALUE R1, R4 (2) (3)
ACCURACY
GRADE (4)
RESISTANCE
VALUE R2, R3 (2) (3)
PACKAGING (5)
ACA = Chip
Array
C = Concave
S = Convex
0612
110R = 110 Ω
1K1 = 1.1 kΩ
22K1 = 22.1 kΩ
TCR, Tracking,
Tolerance and
Matching
A, B, E, F,
J, K, N or P
220R = 220 Ω
1K1 = 1.1 kΩ
22K1 = 22.1 kΩ
P1
P5
PW
Notes
(1) Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
(2) R = R ≤ R = R ; please refer to APPLICATION INFORMATION, see below
1
4
2
3
(3) Different resistance values are available on request
(4) Please refer to table TEMPERATURE COEFFICIENT AND RESISTANCE RANGE, see below
(5) Please refer to table PACKAGING, see below
PACKAGING
MODEL
PACKAGING CODE
TAPE WIDTH
DIAMETER
PIECES
PITCH
8 mm
180 mm/7"
1000
4 mm
8 mm
180 mm/7"
5000
4 mm
P5
8 mm
330 mm/13"
10 000
4 mm
PW
ACAC 0612
ACAS 0612
PAPER TAPE
P1
DIMENSIONS ACAC 0612 in millimeters
WT
WT
I1
I2
T1
T2
Top view
Bottom view
DIMENSIONS - chip resistor array, mass and relevant physical dimensions
TYPE
ACAC 0612
L
(mm)
W
(mm)
H
(mm)
P
(mm)
WT
(mm)
T1
(mm)
T2
(mm)
d
(mm)
l1
(mm)
l2
(mm)
1.6 ± 0.15 3.2 ± 0.15 0.55 ± 0.1 0.8 ± 0.1 0.5 ± 0.15 0.3 ± 0.15 0.4 ± 0.15 0.3 ± 0.1 min. 0.15 min. 0.25
Document Number: 28751
Revision: 11-Sep-08
For technical questions, contact: [email protected]
MASS
(mg)
9.53
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ACAC 0612, ACAS 0612 - Precision
Precision Thin Film Chip Resistor Array
Vishay Beyschlag
DIMENSIONS ACAS 0612 in millimeters
A
T2
T1
H
A1
A
DIMENSIONS - chip resistor array, mass and relevant physical dimensions
TYPE
ACAS 0612
W
(mm)
L
(mm)
H
(mm)
P
(mm)
A1
(mm)
A
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
1.5 ± 0.15
3.2 ± 0.15
0.45 ± 0.1
0.8 ± 0.1
0.6 ± 0.15
0.4 ± 0.15
0.3 ± 0.15
0.4 ± 0.15
6.59
Z
Dimensions in mm
limits for solder resistance
PATTERN STYLES FOR CHIP RESISTOR ARRAYS
ACAC 0612
ACAS 0612
U
I
X
0.1
Y
Z
G
G
Y
X
I
P
P
0.1
RECOMMENDED SOLDER PAD DIMENSIONS FOR CHIP RESISTOR ARRAYS
G
(mm)
Y
(mm)
X
(mm)
U
(mm)
Z
(mm)
I
(mm)
P
(mm)
ACAC 0612
0.7
0.7
0.5
-
2.1
0.3
0.8
ACAS 0612
0.8
1.15
0.64
0.44
3.1
0.36
0.8
TYPE
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
DESCRIPTION
RESISTANCE VALUE
ACCURACY
GRADE
ABSOLUTE TCR
TCR TRACKING (1)
ABSOLUTE
TOLERANCE
TOLERANCE
MATCHING (1)
ACAC 0612, ACAS 0612
A
± 25 ppm/K
10 ppm/K
± 0.25 %
0.1 %
47 Ω to 221 kΩ
B
± 25 ppm/K
10 ppm/K
± 0.5 %
0.25 %
47 Ω to 221 kΩ
E
± 25 ppm/K
15 ppm/K
± 0.25 %
0.1 %
47 Ω to 221 kΩ
F
± 25 ppm/K
15 ppm/K
± 0.5 %
0.25 %
47 Ω to 221 kΩ
J
± 25 ppm/K
25 ppm/K
± 0.25 %
0.1 %
47 Ω to 221 kΩ
K
± 25 ppm/K
25 ppm/K
± 0.5 %
0.25 %
47 Ω to 221 kΩ
N
± 50 ppm/K
25 ppm/K
± 0.5 %
0.5 %
47 Ω to 221 kΩ
P
± 50 ppm/K
50 ppm/K
± 0.5 %
0.5 %
47 Ω to 221 kΩ
Note
(1) In applications with defined resistance ratios like voltage dividers or feedback circuits, an array with a defined tracking of e.g. 10 ppm/K is
required to replace discrete resistors with a temperature coefficient of ± 5 ppm/K. Furthermore, in order to achieve the same tolerance of
± 0.05 % of individual resistors, an array requires a matching of 0.1 %.
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For technical questions, contact: [email protected]
Document Number: 28751
Revision: 11-Sep-08
ACAC 0612, ACAS 0612 - Precision
Precision Thin Film Chip Resistor Array
APPLICATION INFORMATION
R1
R2
R3
Vishay Beyschlag
ASSEMBLY
R4
Circuit Type 03
DESCRIPTION
The production of the components is strictly controlled and
follows an extensive set of instructions established for
reproducibility. A homogeneous film of metal alloy is
deposited on a high grade (96 % Al2O3) ceramic substrate
and conditioned to achieve the desired temperature
coefficient. Specially designed inner contacts are realised on
both sides. A special laser is used to achieve the target value
by smoothly cutting a meander groove in the resistive layer
without damaging the ceramics.
The resistor elements are covered by a protective coating
designed for electrical, mechanical and climatic protection.
The terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with IEC 60286-3*.
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using reflow or vapour phase as shown in
IEC 61760-1*. For ACAC resistor arrays automatic soldering
using wave can also be used. The encapsulation is resistant
to all cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, if applied, shall be
qualified by appropriate means to ensure the long-term
stability of the whole system. The resistors are RoHS
compliant; the pure tin plating provides compatibility with
lead (Pb)-free and lead-containing soldering processes. The
permitted storage time is 20 years, whereas the solderability
is specified for 2 years after production or requalification. The
immunity of the plating against tin whisker growth has been
proven under extensive testing.
All products comply with the GADSL (1) and the
CEFIC-EECA-EICTA (2) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2002/95/EC Restriction of
Substances directive (RoHS)
the
use
of
Hazardous
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
APPROVALS
Where applicable, the resistors are tested in accordance with
EN 140401-801 which refers to EN 60115-1 and EN 140400.
Notes
(1) Global Automotive Declarable Substance List, see www.gadsl.org
(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org → issues →
environment policy → chemicals → chemicals for electronics
• The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents
Document Number: 28751
Revision: 11-Sep-08
For technical questions, contact: [email protected]
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ACAC 0612, ACAS 0612 - Precision
Vishay Beyschlag
Precision Thin Film Chip Resistor Array
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
EN 60115-1, Generic specification (includes tests)
EN 140400, Sectional specification (includes schedule for
qualification approval)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068*
and under standard atmospheric conditions according to
IEC 60068-1*, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
In the following table only the tests and requirements are
listed with reference to the relevant clauses of EN 60115-1
and IEC 60068-2*; a short description of the test procedure
is also given.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2*
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS (1)
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
4.5
-
Resistance
4.8.4.2
-
Temperature coefficient
4.25.1
-
Endurance
4.25.3
-
Endurance at upper
category temperature
Damp heat,
steady state
ACAC 0612, ACAS 0612
Climatic category
(LCT/UCT/duration)
At 20/LCT/ 20 °C and
20/UCT/20 °C
U = P 70 x R or U = Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
125 °C; 1000 h
4.24
78 (Cab)
4.13
-
Short time overload (2)
4.19
14 (Na)
Rapid change of
temperature
4.18.2
58 (Td)
Resistance to soldering
heat
4.17.2
58 (Td)
Solderability
4.32
21 (Ue3)
Shear (adhesion)
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
U = 2.5 x P 70 x R or
U = 2 x Umax.; 5 s
30 min at LCT and
30 min at UCT;
5 cycles
Reflow method 2
(IR/forced gas convention);
(260 ± 5) °C;
(10 ± 1) s
Solder bath method;
SnPb; non-activated flux
accelerated ageing 4 h/155 °C
(215 ± 3) °C; (3 ± 0.3) s
Solder bath method;
SnAgCu; non-activated flux
accelerated ageing 4 h/155 °C
(235 ± 3) °C; (2 ± 0.2) s
45 N
4.33
21 (Ue1)
Substrate bending
Depth 2 mm, 3 times
4.7
-
Voltage proof
Urms = Uins
60 ± 5 s; against ambient,
between adjacent resistors
47 Ω to 221 kΩ
- 55 °C/+ 125 °C/56 days
± 0.5 %; ± 0.25 %
± 50 ppm/K; ± 25 ppm/K
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω)
no visible damage
± (0.1 % R + 0.01 Ω)
no visible damage
± (0.1 % R + 0.01 Ω)
no visible damage
Good tinning (≥ 95 % covered);
no visible damage
No visible damage
± (0.1 % R + 0.01 Ω)
no visible damage;
no open circuit in bent position
No flashover or breakdown
Notes
(1) Figures are given for equal values
(2) For a single element
• The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents
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For technical questions, contact: [email protected]
Document Number: 28751
Revision: 11-Sep-08
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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