Aeroflex ACT-S1M32T-100F14M Act-f1m32 high speed 32 megabit boot block flash multichip module Datasheet

ACT–F1M32 High Speed 32 Megabit
Boot Block
FLASH Multichip Module
CIRCUIT TECHNOLOGY
www.aeroflex.com/act1.htm
Features
■ 4 Low Voltage/Power Intel 1M x 8 FLASH Die in One
MCM Package
■ Overall Configuration is 1M x 32
■ +5V Operation (Standard) or +3.3V (Consult Factory)
■ Access Times of 80, 100 and 120 nS ( 5V VCC)
■ +5V or +12V Programing
■ Erase/Program Cycles
● 100,000 Commercial
● 10,000 Military and Industrial
■ Sector Architecture (Each Die)
● One 16K Protected Boot Block (Bottom Boot Block
Standard, Top Boot Block Special Order)
● Two 8K Parameter Blocks
● One 96K Main Block
● Seven 128K Main Blocks
Block Diagram – CQFP(F14)
■
■
■
■
■
Single Block Erase (All bits set to 1)
Hardware Data Protection Feature
Independent Boot Block Locking
MIL-PRF-38534 Compliant MCMs Available
Packaging – Hermetic Ceramic
● 68 Lead, .94" x .94" x .180" Dual-Cavity Small
Outline Gull Wing, Aeroflex code# "F14" (Drops into
the 68 Lead JEDEC .99"SQ CQFJ footprint)
■ Internal Decoupling Capacitors for Low Noise
Operation
■ Commercial, Industrial and Military Temperature
Ranges
Pin Description
Standard Configuration
CE1
I/O0-31
CE4 A0–19
CE3
CE2
WP
WE
OE
A0 – A19
RP
1Mx8
1Mx8
1Mx8
1Mx8
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
Data I/O
Address Inputs
WE
Write Enables
CE1-4
Chip Enables
OE
Output Enable
WP
Write Protect
RP
Reset/Powerdown
VCC
Power Supply
GND
Ground
NC
Not Connected
Block Diagram – CQFP(F14)
Pin Description
Optional Configuration
WE1 CE1 WE2 CE2 WE3 CE3 WE4 CE4
RP
OE
A0 – A19
1Mx8
1Mx8
1Mx8
1Mx8
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
I/O0-31
Data I/O
A 0–19
Address Inputs
WE1-4
Write Enable
CE1-4
Chip Enables
OE
Output Enable
RP
Reset/Powerdown
VCC
Power Supply
GND
Ground
NC
Not Connected
General Description
Utilizing Intel’s SmartVoltage
Boot Block Flash Memory
SmartDie™, the ACT–F1M32 is
a high speed, 32 megabit CMOS
flash multichip module (MCM)
designed for full temperature
range military, space, or high
reliability applications.
The ACT-F1M32 consists of
four high-performance Intel
X28F800BV 8 Mbit (8,388,608
bit) memory die. Each die
contains separately erasable
blocks, including a hardware
lockable boot block (16,384
bytes), two parameter blocks
(8,192 bytes each), and 8 main
blocks (one block of 98,304
bytes and seven blocks of
131,072 bytes) This defines the
boot
block
flash
family
architecture.
The command register is
written by bringing WE to a logic
low level (VIL), while CE is low
and OE is high (VIH). Reading is
eroflex Circuit Technology - Advanced Multichip Modules © SCD1661B REV A 1/16/97
General Description, Cont’d,
accomplished by chip Enable (CE) and
Output Enable (OE) being logically active.
Access time grades of 80nS, 100nS and
120nS maximum are standard.
The ACT–F1M32 is packaged in a
hermetically sealed co-fired ceramic 68
lead, .94" SQ Ceramic Gull Wing CQFP
package. This allows operation in a military
environment temperature range of -55°C to
+125°C.
The ACT–F1M32 provides program and
erase capability at 5V or 12V and allows
reads with Vcc at 5V or 3.3V(Not tested).
Since many designs read from flash
memory a large percentage of the time,
read operation using 3.3V can provide
great power savings. Consult the factory for
3.3V tested parts. In applications where
read performance is critical, faster access
times are obtainable with the 5V VCC part
detailed herein.
For program and erase operations, 5V
Vpp operation eliminates the need for in
system voltage converters. The 12V Vpp
operation provides reduced (approx 60%)
program and erase times where 12V is
available in the system. For design
simplicity, however, connect Vcc and Vpp
to the same 5V ±10% source.
Each block can be independently
erased and programmed 100,000 times at
commercial temperature or 10,000 times at
extended temperature.
The boot block is located at either the
bottom (Standard) or the top (Special
Order) of the address map in order to
accommodate different microprocessor
protocols for boot code location. Locking
and unlocking of the boot block is controlled
by WP and/or RP.
Intel's boot block architecture provides a
flexible solution for the different design
needs of various applications. The
asymmetrically-blocked
memory
map
allows the integration of several memory
components into a single flash device. The
boot block provides a secure boot PROM;
the parameter blocks can emulate
EEPROM functionality for parameter store
with proper software techniques; and the
main blocks provide code and data storage
with access times fast enough to execute
code
in
place,
decreasing
RAM
requirements.
For Detail Information regarding the
operation of the 28F800BV Memory die,
see the Intel datasheet (order number
290539-002).
SmartDie™ is a Trademark of Intel Corporation
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SCD1661B REV A 1/16/97 Plainview NY (516) 694-6700
Absolute Maximum Ratings
Parameter
Range
Units
-55 to +125
°C
Storage Temperature Range
-65 to +150
°C
Voltage on Any Pin with Respect to GND (except VCC, VPP, A9 and RP) (1)
-2.0 to +7.0
V
-2.0 to +13.5
V
-2.0 to +14.0
V
Case Operating Temperature Range
Voltage on Pins A9 or RP with Respect to GND (except VCC, VPP, A9 and RP)
(1,2)
VPP Program Voltage with Respect to GND during Block Erase/ and Word/Byte Write (1,2)
Vcc Supply Voltage with Respect to Ground
(1)
-2.0 to +7.0
V
100
mA
Output Short Circuit Current (3)
Notes:
1. Minimum DC voltage is -0.5V on input/output pins. During Transitions, inputs may undershoot to -2.0V for periods < 20nS. Maximum DC voltage on input/output
pins is Vcc + 0.5V, which may overshoot to Vcc + 2.0V for periods < 20nS.
2. Maximum DC voltage on Vpp may overshoot to +14.0V for periods < 20nS. Maximum DC voltage on RP or A9 may overshoot to VCC + 0.5V for periods <20nS
3. Output shorted for no more than 1 second. No more than one output shorted at one time.
NOTICE: Stresses above those listed under "Absolute Maximums Rating" may cause permanent damage. These are stress rating only. Operation beyond the "Operation Conditions" is not recommended and extended exposure beyond the "Operation Conditions" may effect device reliability.
Recommended Operating Conditions
Symbol
VCC
Parameter
Minimum
Maximum
Units
+4.5
+5.5
V
5V Power Supply Voltage (10%)
3.3V Power Supply Voltage (±0.3V) (Consult Factory)
+3.0
+3.6
V
VIH
Input High Voltage (3.3V & 5V VCC)
+2.0
Vcc + 0.5
V
V IL
Input Low Voltage (3.3V & 5V VCC)
-0.5
+0.8
V
Operating Temperature (Military)
-55
+125
°C
TA
Capacitance
(f = 1MHz, TA = 25°C)
Symbol
Maximum
Units
A0 – A19 Capacitance
50
pF
COE
OE Capacitance
50
pF
CCE
CAD
Parameter
CE Capacitance
20
pF
CRP
RP Capacitance
50
pF
CWE
WE Capacitance
60
pF
CWP
WP Capacitance
50
pF
CI/O
I/O0 – I/O31 Capacitance
20
pF
Capacitance Guaranteed by design, but not tested.
DC Characteristics – CMOS Compatible
(TA = -55°C to +125°C, VCC = +4.5V to + 5.5V(5V Operation), or +3.0V to +3.6V(3.3V Operation), Unless otherwise specified)
+3.3V VCC (1)
Parameter
Input Load Current
Output Leakage Current
Sym
Conditions
Typical
+5.0V VCC
Standard
Min
Max
Min
Max
+1
IIL
VCC = VCCMax., VIN = VCC or GND
-1
+1
-1
ILO
VCC = VCCMax., VIN = VCC or GND
-10
+10
-10
Units
µA
+10
µA
VCC = VCCMax., CE = RP = WP = VCC ± 0.2V
440
600
µA
VCC = VCCMax., VIN = VCC or GND, RP = GND ± 0.2V
32
32
µA
VCC = VCCMax., CE = GND, f = 10MHz (5V), 5MHz (3.3V),
IOUT = 0 mA, Inputs = GND ± 0.2V or VCC ± 0.2V
120
260
mA
ICCW1
VPP = VPPH 1 (at 5V), Word Write in Progress (x32)
120
200
mA
ICCW2
Vcc Standby Current
ICCS
Vcc Deep Power-Down Current
ICCD
Vcc Read Current
ICCR
Vcc Write Current
VPP = VPPH 2 (at 12V), Word Write in Progress (x32)
100
180
mA
Vcc Erase Current
ICCE1
VPP = VPPH 1 (at 5V),Block Erase in Progress
120
180
mA
ICCE2
VPP = VPPH 2 (at 12V),Block Erase in Progress
100
160
mA
Vcc Erase Suspend Current
ICCES
CE = VIH, Block Erase Suspend
32
48
mA
VPP < VPPH 2
60
60
µA
VPP Standby Current
Aeroflex Circuit Technology
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SCD1661B REV A 1/16/97 Plainview NY (516) 694-6700
DC Characteristics – CMOS Compatible
(TA = -55°C to +125°C, VCC = +4.5V to + 5.5V(5V Operation), or +3.0V to +3.6V(3.3V Operation), Unless otherwise specified)
+3.3V VCC (1)
Parameter
Sym
Conditions
+5.0V VCC
Typical
Min
Standard
Max
Min
Units
Max
µA
IPPD
RP = GND ± 0.2V
40
40
VPP Read Current
IPPR
VPP > VPPH 2
800
800
µA
VPP Write Current
IPPW1
VPP = VPPH 1 (at 5V), Word Write in Progress (x32)
120
120
mA
VPP Deep Power Down Current
IPPW2
VPP = VPPH 2 (at 12V), Word Write in Progress (x32)
100
100
mA
VPP Erase Current
IPPE1
VPP = VPPH 1 (at 5V), Block Erase in Progress
120
100
mA
IPPE2
VPP = VPPH 2 (at 12V), Block Erase in Progress
100
80
mA
VPP Erase Suspend Current
IPPES
VPP = VPPH , Block Erase Suspend in Progress
800
800
µA
2
2
mA
0.45
0.45
V
RP Boot Block Unlock Current
IRP
RP = VHH , VPP = 12V
Output Low Voltage
VOL
VCC = VCCMin., IOL = 5.8 mA (5V), 2 mA (3.3V)
VOH1
VCC = VCCMin., IOH = -2.5 mA
0.85 x
VCC
VOH2
VCC = VCCMin., IOH = -100 µA
VCC 0.4V
VPP Lock-Out Voltage
VPPLK
Complete Write Protection
0.0
1.5
0.0
1.5
V
VPP (Program/Erase Operations)
VPPH1
VPP = at 5V
4.5
5.5
4.5
5.5
V
11.4
12.6
11.4
12.6
V
0
2.0
0
2.0
V
11.4
12.6
11.4
12.6
V
Output High Voltage
VPP (Program/Erase Operations)
VPPH2
VPP = at 12V
VCC Erase/Write Lock Voltage
VLKO
Locked Condition
RP Unlock Voltage
VHH
Boot Block Write/Erase, VPP = 12V
0.85 x
VCC
V
VCC 0.4V
V
Notes:
1. Performance at VCC = +4.5V to +5.5V is guaranteed. Performance at VCC = +3.3V is typical (Not tested).
AC Characteristics – Write/Erase/Program Operations – WE Controlled
(TA = -55°C to +125°C, VCC = +4.5V to + 5.5V(5V Operation), or +3.0V to +3.6V(3.3V Operation), Unless otherwise specified)
+3.3V VCC
Symbol
Parameter
(2)
+4.5V to +5.5V VCC
Typical
JEDEC
Standard
120nS
80nS
100nS
120nS
Min Max
Min Max
Min Max
Min Max
Units
Write Cycle Time
tAVAV
120
80
100
120
nS
RP High Recovery to WE Going Low
tPHWL
1.5
.45
.45
.45
µS
CE Setup to WE Going Low
Boot Block Unlock Setup to WE Going High(1)
tELWL
0
0
0
0
nS
tPHHWH
200
100
100
100
nS
tVPWH
200
100
100
100
nS
tAVWH
90
60
60
60
nS
Data Setup to WE Going High
tDVWH
70
60
60
60
nS
WE Pulse Width
tWLWH
90
60
60
60
nS
Data Hold Time from WE High
tWHDX
0
0
0
0
nS
Address Hold Time from WE High
tWHAX
0
0
0
0
nS
VPP Setup to WE Going High
(1)
Address Setup to WE Going High
CE Hold Time from WE High
tWHEH
0
0
0
0
nS
WE Pulse Width High
tWHWL
30
20
20
20
nS
tWHQV1
6
6
6
6
µS
Duration of Erase Operation (Boot) (1)
tWHQV2
0.3
0.3
0.3
0.3
Sec
Duration of Erase Operation (Parameter) (1)
tWHQV3
0.3
0.3
0.3
0.3
Sec
Duration of Erase Operation (Main) (1)
tWHQV4
0.6
0.6
0.6
0.6
Sec
tQVVL
tQVPH
tPHBR
0
0
0
0
nS
0
0
0
0
nS
Duration of Word Write Operation
VPP Hold from Valid SRD
(1)
RP VHH Hold from Valid SRD (1)
Boot Block Lock Delay
(1)
(1)
(x32)
200
100
100
100
nS
Notes:
1. Guaranteed by design, not tested.
2. Performance at VCC = +4.5V to +5.5V is guaranteed. Performance at VCC = +3.3V is typical (Not tested).
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SCD1661B REV A 1/16/97 Plainview NY (516) 694-6700
AC Characteristics – Write/Erase/Program Operations, CE Controlled
(TA = -55°C to +125°C, VCC = +4.5V to + 5.5V(5V Operation), or +3.0V to +3.6V(3.3V Operation), Unless otherwise specified)
+3.3V
VCC (2)
Symbol
Parameter
JEDEC
Standard
+4.5V to +5.5V VCC
Typical
Units
120nS
80nS
100nS
120nS
Min Max
Min Max
Min Max
Min Max
Write Cycle Time
tAVAV
120
80
100
120
nS
RP High Recovery to CE Low
tPHEL
1.5
.45
.45
.45
µS
WE Setup to CE Going Low
Boot Block Unlock Setup to CE Going High
(1)
tWLEL
0
0
0
0
nS
tPHHEH
200
100
100
100
nS
tVPEH
200
100
100
100
nS
Address Setup to CE Going High
tAVEH
90
60
60
60
nS
Data Setup to CE Going High
tDVEH
70
60
60
60
nS
CE Pulse Width
tELEH
90
60
60
60
nS
V PP Setup to CE Going High
(1)
Data Hold Time from CE High
tEHDX
0
0
0
0
nS
Address Hold Time from CE High
tEHAX
0
0
0
0
nS
WE Hold Time from CE High
tEHWH
0
0
0
0
nS
CE Pulse Width High
tEHEL
20
20
20
20
nS
Duration of Word Write Operation
(1)
Duration of Erase Operation (Boot)
(x32)
(1)
Duration of Erase Operation (Parameter)
Duration of Erase Operation (Main)
V PP Hold from Valid SRD
(1)
(1)
(1)
RP VHH Hold from Valid SRD (1)
Boot Block Lock Delay
(1)
tEHQV1
6
6
6
6
µS
tEHQV2
0.3
0.3
0.3
0.3
Sec
tEHQV3
0.3
0.3
0.3
0.3
Sec
tEHQV4
0.6
0.6
0.6
0.6
Sec
tQVVL
0
0
0
0
nS
tQVPH
0
0
0
0
nS
tPHBR
200
100
100
100
nS
NOTES:
1. Sampled, but not 100% tested.
2. Performance at VCC = +4.5V to +5.5V is guaranteed. Performance at VCC = +3.3V is typical (Not Tested).
AC Characteristics – Read Only Operations
(TA = -55°C to +125°C, VCC = +4.5V to + 5.5V(5V Operation), or +3.0V to +3.6V(3.3V Operation), Unless otherwise specified)
+3.3V
VCC (2)
Symbol
Parameter
JEDEC
Standard
Read Cycle Time
tAVAV
+4.5V to +5.5V VCC
Typical
Units
120nS
80nS
Min Max
Min Max
120
80
100nS
Min Max
100
120nS
Min Max
120
nS
Address to Output Delay
tAVQV
120
80
100
120
nS
CE to Output Delay
tELQV
120
80
100
120
nS
RP to Output Delay
tPHQV
1.5
.45
.45
.45
µS
OE to Output Delay
tGLQV
65
40
40
40
nS
30
nS
30
nS
CE to Output in Low Z (1)
tELQX
CE to Output in High Z (1)
tEHQZ
OE to Output in Low Z (1)
tGLQX
OE to Output in High Z (1)
tGHQZ
Output Hold from Address, CE, or OE Change,
Whichever Occurs First (1)
0
0
55
0
0
45
tOH
0
0
30
0
30
0
30
0
0
30
0
nS
0
nS
nS
Notes:
1. Guaranteed by design, but not tested.
2. Performance at VCC = +4.5V to +5.5V is guaranteed. Performance at VCC = +3.3V is typical (Not Tested).
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AC Test Circuit
Test Configuration Component Values
VCC
Test Configuration
CL
(pF)
R1
(Ω)
R2
(Ω)
3.3V Standard Test
50
990
770
5V Standard Test
50
580
390
R1
Device
Under
Test
NOTES:
CL includes jig capacitance.
OUT
CL
R2
Parameter
Typical
Units
Input Pulse Level
0 – 3.0
V
5
nS
1.5
V
Input Rise and Fall
Input and Output Timing Reference Level
AC Waveforms for Write and Erase Operations, WE Controlled
VCC
Power-up
Standby
Write
Write Program or
Valid Address & Data (Program)
Erase Setup Command
or Erase Confirm Command
Automated Program
or Erase Delay
Read Status
Register Data
Write Read Array
Command
V IH
Addresses
AIN
AIN
V IL
tAVAV
tAVWH
tWHAX
V IH
CE
V IL
tELWL
tWHEH
V IH
OE
V IL
tWHWL
tWHQV1,2,3,4
V IH
WE
V IL
tWLWH
tWHDX
t DVWH
V IH
Data
V IL
High Z
tPHWL
DIN
Valid
SRD
DIN
tPHHWH
tQVPH
tVPWH
tQVVL
DIN
V HH
6.5V
V IH
RP
V IL
V IH
WP
V IL
V PPH2
VPP
V PPH1
V PPLK
V IL
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SCD1661B REV A 1/16/97 Plainview NY (516) 694-6700
AC Waveforms for Write and Erase Operations, CE Controlled
Write
Write Program or
Valid Address & Data (Program)
Erase Setup Command
or Erase Confirm Command
V CC
Power-up
Standby
Automated Program
or Erase Delay
Read Status
Register Data
Write Read Array
Command
V IH
Addresses
AIN
AIN
VIL
tAVAV
tAVEH
tEHAX
V IH
WE
VIL
tWLEL
tEHWH
V IH
OE
VIL
tEHEL
tEHQV1,2,3,4
V IH
CE
VIL
tELEH
tEHDX
tDVEH
V IH
High Z
Data
tPHEL
VIL
DIN
Valid
SRD
DIN
tPHHEH
tQVPH
tVPEH
tQVVL
DIN
V HH
6.5V
V IH
RP
VIL
V IH
WP
VIL
V PPH2
VPP
V PPH1
V PPLK
VIL
AC Waveform For Read Operations
V IH
Standby
Device and
Address Selection
Addresses
Outputs Enabled
Data Valid
Standby
Addresses Stable
V IL
tAVAV
V IH
CE
V IL
tEHQZ
V IH
OE
V IL
tGHQZ
V IH
tGLQV
WE
V IL
tELQV
tGLQX
tELQX
V OH
Data
tOH
High Z
High Z
Valid Output
V OL
tAVQV
V IH
tPHQV
RP
V IL
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SCD1661B REV A 1/16/97 Plainview NY (516) 694-6700
Pin Numbers & Functions
68 Pins — Dual-Cavity CQFP (Standard Configuration)
Pin #
Function
Pin #
Function
Pin #
Function
Pin #
Function
1
GND
18
GND
35
OE
52
GND
2
CE3
19
I/O8
36
CE2
53
I/O23
3
A5
20
I/O9
37
A17
54
I/O22
4
A4
21
I/O10
38
WP
55
I/O21
5
A3
22
I/O11
39
NC
56
I/O20
6
A2
23
I/O12
40
NC
57
I/O19
7
A1
24
I/O13
41
A18
58
I/O18
8
A0
25
I/O14
42
A19
59
I/O17
9
RP
26
I/O15
43
VPP
60
I/O16
10
I/O0
27
VCC
44
I/O31
61
VCC
11
I/O1
28
A11
45
I/O30
62
A10
12
I/O2
29
A12
46
I/O29
63
A9
13
I/O3
30
A13
47
I/O28
64
A8
14
I/O4
31
A14
48
I/O27
65
A7
15
I/O5
32
A15
49
I/O26
66
A6
16
I/O6
33
A16
50
I/O25
67
WE
17
I/O7
34
CE1
51
I/O24
68
CE4
Consult Factory for Special order (Optional Configuration): Pin 38 - WE2, Pin 39 - WE3, Pin 40 - WE4 and
Pin 67 - WE1
"F14" — CQFP Dual-Cavity Flat Package
Pin 9
0.990 SQ
±.010
0.940 SQ
±.010
Pin 10
0.180
MAX
0.01R
Pin 61
Pin 60
0.015
±.002
.010
±.008
.040
.008
+.002
-.001
0.750
Detail “A”
Pin 26
Pin 44
Pin 27
0.800 REF
Pin 43
See Detail “A”
All dimensions in inches
Aeroflex Circuit Technology
8
SCD1661B REV A 1/16/97 Plainview NY (516) 694-6700
CIRCUIT TECHNOLOGY
Ordering Information
Model Number
Screening
Speed
Package
ACT–F1M32B–080F14C
Commercial (0°C to +70°C)
80 nS
CQFP
ACT–F1M32B–100F14C
Commercial (0°C to +70°C)
100 nS
CQFP
ACT–F1M32B–120F14C
Commercial (0°C to +70°C)
120 nS
CQFP
ACT–F1M32B–080F14I
Industrial (-40°C to +85°C)
80 nS
CQFP
ACT–F1M32B–100F14I
Industrial (-40°C to +85°C)
100 nS
CQFP
ACT–F1M32B–120F14I
Industrial (-40°C to +85°C)
120 nS
CQFP
ACT–F1M32B–080F14M
Military (-55°C to +125°C)
80 nS
CQFP
ACT–F1M32B–100F14M
Military (-55°C to +125°C)
100 nS
CQFP
ACT–F1M32B–120F14M
Military (-55°C to +125°C)
120 nS
CQFP
ACT–F1M32B–080F14Q
DESC Drawing Pending
MIL-PRF-38534 Compliant
80 nS
CQFP
ACT–F1M32B–100F14Q
DESC Drawing Pending
MIL-PRF-38534 Compliant
100 nS
CQFP
ACT–F1M32B–120F14Q
DESC Drawing Pending
MIL-PRF-38534 Compliant
120 nS
CQFP
Part Number Breakdown
ACT– F 1M 32 B– 080 F14 M
Aeroflex Circuit
Technology
Screening
Memory Type
C = Commercial Temp, 0°C to +70°C
I = Industrial Temp, -40°C to +85°C
T = Military Temp, -55°C to +125°C
M = Military Temp, -55°C to +125°C, Screened *
Q = MIL-PRF-38534 Compliant/SMD if applicable
S = SRAM
F = FLASH EEPROM
E = EEPROM
D = Dynamic RAM
Memory Depth, Locations
Package Type & Size
Surface Mount Packages
F14 = .94" SQ 68 Lead\Dual-Cavity CQFP
Memory Width, Bits
Pinout Options
B = Bottom Boot Block (Standard),
T= Top Boot Block (Special Order)
* Screened to the individual test methods of MIL-STD-883
Memory Speed, ns (+5V VCC)
Specifications subject to change without notice
Aeroflex Circuit Technology
35 South Service Road
Plainview New York 11830
www.aeroflex.com/act1.htm
Aeroflex Circuit Technology
Telephone: (516) 694-6700
FAX:
(516) 694-6715
Toll Free Inquiries: (800) 843-1553
E-Mail: [email protected]
9
SCD1661B REV A 1/16/97 Plainview NY (516) 694-6700
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