AD AD5379ABCZ 40-channel, 14-bit, parallel Datasheet

40-Channel, 14-Bit, Parallel and
Serial Input, Bipolar Voltage-Output DAC
AD5379
FEATURES
Interface options:
Parallel interface
DSP/microcontroller-compatible, 3-wire serial interface
2.5 V to 5.5 V JEDEC-compliant digital levels
SDO daisy-chaining option
Power-on reset
Digital reset (RESET pin and soft reset function)
40-channel DAC in 13 mm × 13 mm 108-lead CSPBGA
Guaranteed monotonic to 14 bits
Buffered voltage outputs
Output voltage span of 3.5 V × VREF(+)
Maximum output voltage span of 17.5 V
System calibration function allowing user-programmable
offset and gain
Pseudo differential outputs relative to REFGND
Clear function to user-defined REFGND (CLR pin)
Simultaneous update of DAC outputs (LDAC pin)
DAC increment/decrement mode
Channel grouping and addressing features
APPLICATIONS
Level setting in automatic test equipment (ATE)
Variable optical attenuators (VOA)
Optical switches
Industrial control systems
FUNCTIONAL BLOCK DIAGRAM
VCC
VDD
VSS
AGND
DGND
LDAC
VBIAS VREF1(+) VREF1(–) REFGND A1
AD5379
POWER-ON
RESET
VBIAS
CLR
RESET
FIFOEN
DCEN/WR
14
/
FIFO
REG0
REG1
SER/PAR
DIN
SCLK
SDO
INPUT 14
REG
2
14
DAC
14
REG
0–1
/
DAC 0–1
/
DAC 14
REG
2
/
DAC 2
VOUT1
m REG2
c REG2
/
/
14
/
14
STATE MACHINE
A0
INTERFACE
A7
/
VOUT0
/
m REG0–1
c REG0–1
/
14
14
/
14
DB13
SCLK/DB12
DIN/DB11
DB0
INPUT
14
REG
0–1
VOUT3
VOUT4
VOUT5
14
/
INPUT
14
REG
7
14
/
VOUT6
/
DAC
14
REG
7
/
DAC 7
/
/
DAC
14
REG
8–9
/
DAC 8–9
REFGND B1
14
/
REFGND C1
INPUT
14
REG
8–9
/
REFGND C2
14
/
REFGND D1
VOUT7
m REG7
c REG7
14
REFGND B2
VOUT2
14
m REG8–9
c REG8–9
REFGND D2
VOUT8
VOUT9
VOUT10
×4
BUSY
VOUT39
VREF2(+) VREF2(–) REFGND A2
03165-001
SYNC/CS
Figure 1.
AD5379—Protected by U.S. Patent No. 5,969,657.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
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DOCUMENTATION
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AD5379
TABLE OF CONTENTS
Features .............................................................................................. 1
Calibration................................................................................... 20
Applications ....................................................................................... 1
Clear Function ............................................................................ 20
General Description ......................................................................... 3
BUSY and LDAC Functions...................................................... 20
Specifications..................................................................................... 4
FIFO vs. Non-FIFO Operation................................................. 21
AC Characteristics........................................................................ 5
BUSY Input Function ................................................................ 21
Timing Characteristics..................................................................... 6
Power-On Reset Function ......................................................... 21
Serial Interface .............................................................................. 6
RESET Input Function .............................................................. 21
Parallel Interface ........................................................................... 9
Increment/Decrement Function .............................................. 21
Absolute Maximum Ratings.......................................................... 11
Interfaces.......................................................................................... 22
ESD Caution ................................................................................ 11
Parallel Interface ......................................................................... 22
Pin Configuration and Function Descriptions ........................... 12
Serial Interface ............................................................................ 22
Terminology .................................................................................... 15
Data Decoding ................................................................................ 24
Typical Performance Characteristics ........................................... 16
Address Decoding .......................................................................... 25
Functional Description .................................................................. 18
Power Supply Decoupling ............................................................. 26
DAC Architecture—General ..................................................... 18
Power-On .................................................................................... 26
Channel Groups .......................................................................... 18
Typical Application Circuit ........................................................... 27
Transfer Function ....................................................................... 18
Outline Dimensions ....................................................................... 28
VBIAS Function ............................................................................. 19
Ordering Guide .......................................................................... 28
Reference Selection .................................................................... 19
REVISION HISTORY
7/09—Rev. A t o Rev. B
Changes to Table 14 ........................................................................ 24
1/05—Rev. 0 to Rev. A
Changes to Table 1 ............................................................................ 3
Change to Transfer Function Equation ....................................... 18
4/04—Revision 0: Initial Version
Rev. B | Page 2 of 28
AD5379
GENERAL DESCRIPTION
The AD5379 contains 40 14-bit DACs in one CSPBGA package.
The AD5379 provides a bipolar output range determined by the
voltages applied to the VREF(+) and VREF(−) inputs. The maximum output voltage span is 17.5 V, corresponding to a bipolar
output range of −8.75 V to +8.75 V, and is achieved with reference
voltages of VREF(−) = −3.5 V and VREF(+) = +5 V.
The AD5379 offers guaranteed operation over a wide VSS/VDD
supply range from ±11.4 V to ±16.5 V. The output amplifier
headroom requirement is 2.5 V operating with a load current of
1.5 mA, and 2 V operating with a load current of 0.5 mA.
The AD5379 contains a double-buffered parallel interface in
which 14 data bits are loaded into one of the input registers
under the control of the WR, CS, and DAC Channel Address
Pins A0 to A7. It also has a 3-wire serial interface that is compatible with SPI®, QSPI™, MICROWIRE™, and DSP® interface
standards and can handle clock speeds of up to 50 MHz.
The DAC outputs are updated upon reception of new data into
the DAC registers. All the outputs can be simultaneously updated
by taking the LDAC input low. Each channel has a programmable
gain and an offset adjust register.
Each DAC output is gained and buffered on-chip with respect
to an external REFGND input. The DAC outputs can also be
switched to REFGND via the CLR pin.
Table 1. High Channel Count, Low Voltage, Single-Supply DACs
Model
AD5380BST-5
AD5380BST-3
AD5381BST-5
AD5381BST-3
AD5384BBC-5
AD5384BBC-3
AD5382BST-5
AD5382BST-3
AD5383BST-5
AD5383BST-3
AD5390BST-5
AD5390BCP-5
AD5390BST-3
AD5390BCP-3
AD5391BST-5
AD5391BCP-5
AD5391BST-3
AD5391BCP-3
AD5392BST-5
AD5392BCP-5
AD5392BST-3
AD5392BCP-3
Resolution
14 bits
14 bits
12 bits
12 bits
14 bits
14 bits
14 bits
14 bits
12 bits
12 bits
14 bits
14 bits
14 bits
14 bits
12 bits
12 bits
12 bits
12 bits
14 bits
14 bits
14 bits
14 bits
AVDD Range
4.5 V to 5.5 V
2.7 V to 3.6 V
4.5 V to 5.5 V
2.7 V to 3.6 V
4.5 V to 5.5 V
2.7 V to 3.6 V
4.5 V to 5.5 V
2.7 V to 3.6 V
4.5 V to 5.5 V
2.7 V to 3.6 V
4.5 V to 5.5 V
4.5 V to 5.5 V
2.7 V to 3.6 V
2.7 V to 3.6 V
4.5 V to 5.5 V
4.5 V to 5.5 V
2.7 V to 3.6 V
2.7 V to 3.6 V
4.5 V to 5.5 V
4.5 V to 5.5 V
2.7 V to 3.6 V
2.7 V to 3.6 V
Output Channels
40
40
40
40
40
40
32
32
32
32
16
16
16
16
16
16
16
16
8
8
8
8
Linearity Error (LSB)
±4
±4
±1
±1
±4
±4
±4
±4
±1
±1
±3
±3
±4
±4
±1
±1
±1
±1
±3
±3
±4
±4
Rev. B | Page 3 of 28
Package Description
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead CSPBGA
100-Lead CSPBGA
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
52-Lead LQFP
64-Lead LFCSP
52-Lead LQFP
64-Lead LFCSP
52-Lead LQFP
64-Lead LFCSP
52-Lead LQFP
64-Lead LFCSP
52-Lead LQFP
64-Lead LFCSP
52-Lead LQFP
64-Lead LFCSP
Package Option
ST-100
ST-100
ST-100
ST-100
BC-100
BC-100
ST-100
ST-100
ST-100
ST-100
ST-52
CP-64
ST-52
CP-64
ST-52
CP-64
ST-52
CP-64
ST-52
CP-64
ST-52
CP-64
AD5379
SPECIFICATIONS
VCC = 2.7 V to 5.5 V; VDD = 11.4 V to 16.5 V; VSS = −11.4 V to −16.5 V; VREF(+) = 5 V; VREF(−) = −3.5 V; AGND = DGND = REFGND = 0 V;
VBIAS = 5 V; CL = 200 pF to GND; RL = 11 kΩ to 3 V; gain = 1; offset = 0 V; all specifications TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
ACCURACY
Resolution
Relative Accuracy
Differential Nonlinearity
Zero-Scale Error
Full-Scale Error
Gain Error
VOUT Temperature Coefficient
DC Crosstalk2
REFERENCE INPUTS2
VREF(+) DC Input Impedance
VREF(−) DC Input Impedance
VREF(+) Input Current
VREF(+) Range
VREF(−) Range
REFGND INPUTS2
DC Input Impedance
Input Range
OUTPUT CHARACTERISTICS2
Output Voltage Range
Short-Circuit Current
Load Current
Capacitive Load
DC Output Impedance
DIGITAL INPUTS
Input High Voltage
Input Low Voltage
Input Current (with pull-up/pull-down)
Input Current (no pull-up/pull-down)
Input Capacitance2
DIGITAL OUTPUTS (BUSY, SDO)
Output Low Voltage
Output High Voltage (SDO)
High Impedance Leakage Current
High Impedance Output Capacitance2
POWER REQUIREMENTS
VCC
VDD
VSS
A Version 1
Unit
Test Conditions/Comments 2
14
±3
±2.5
−1/+1.5
±12
±5
±12
±8
±8
±1/±5
5
0.5
Bits
LSB max
LSB max
LSB max
mV max
mV max
mV max
mV max
mV max
mV typ/max
ppm FSR/°C typ
mV max
−40°C to +85°C
0°C to 70°C
Guaranteed monotonic by design over temperature
−40°C to +85°C
0°C to 70°C
−40°C to +85°C
0°C to 70°C
−40°C to +85°C
0°C to 70°C
Includes linearity, offset, and gain drift (see Figure 11)
Typically 100 μV
1
8
±10
1.5/5
−3.5/0
MΩ min
kΩ min
μA max
V min/max
V min/max
Typically 100 MΩ
Typically 12 kΩ
Per input (typically ±30 nA)
±2% for specified operation
±2% for specified operation
80
±0.5
kΩ min
V min/max
Typically 120 kΩ
VSS + 2/VSS + 2.5
VDD − 2/VDD − 2.5
15
±1.5
2200
1
V min
V max
mA max
mA max
pF max
Ω max
ILOAD = ±0.5 mA/±1.5 mA
ILOAD = ±0.5 mA/±1.5 mA
1.7
2.0
0.8
±8
±1
10
V min
V min
V max
μA max
μA max
pF max
0.5
VCC − 0.5
−70
10
V max
V min
μA max
pF typ
2.7/5.5
8.5/16.5
−3/−16.5
V min/max
V min/max
V min/max
Rev. B | Page 4 of 28
JEDEC compliant
VCC = 2.7 V to 3.6 V
VCC = 3.6 V to 5.5 V
VCC = 2.7 V to 5.5 V
SER/PAR, FIFOEN, and RESET pins only
All other digital input pins
Sinking 200 μA
Sourcing 200 μA
SDO only
AD5379
Parameter
Power Supply Sensitivity2
∆ Full Scale/∆ VDD
∆ Full Scale/∆ VSS
∆ Full Scale/∆ VCC
ICC
IDD
ISS
Power Dissipation
Power Dissipation Unloaded (P)
Power Dissipation Loaded (PTOTAL)
Junction Temperature
A Version 1
Unit
Test Conditions/Comments 2
−75
−75
−90
5
28
23
dB typ
dB typ
dB typ
mA max
mA max
mA max
VCC = 5.5 V, VIH = VCC, VIL = GND
Outputs unloaded (typically 20 mA)
Outputs unloaded (typically 15 mA)
850
2000
130
mW max
mW max
°C max
VDD = 16.5 V, VSS = −16.5 V
PTOTAL = P + Σ(VDD − VO) × ISOURCE + Σ(VO − VSS) × ISINK
TJ = TA + PTOTAL × θJ 3
1
Temperature range for A Version: −40°C to +85°C. Typical specifications are at 25°C.
Guaranteed by design and characterization, not production tested.
3
Where θJ represents the package thermal impedance.
2
AC CHARACTERISTICS
VCC = 2.7 V to 5.5 V; VDD = 11.4 V to 16.5 V; VSS = −11.4 V to −16.5 V; VREF(+) = 5 V; VREF(−) = −3.5 V; AGND = DGND = REFGND = 0 V;
VBIAS = 5 V; CL = 220 pF; RL = 11 kΩ to 3 V; gain = 1; offset = 0 V.
Table 3.
Parameter
DYNAMIC PERFORMANCE
Output Voltage Settling Time
Slew Rate
Digital-to-Analog Glitch Energy
Glitch Impulse Peak Amplitude
Channel-to-Channel Isolation
DAC-to-DAC Crosstalk
Digital Crosstalk
Digital Feedthrough
Output Noise Spectral Density @ 1 kHz
1
A Version 1
Unit
Test Conditions/Comments
20
30
1
20
15
100
40
10
0.1
1
350
μs typ
μs max
V/μs typ
nV-s typ
mV max
dB typ
nV-s typ
nV-s typ
nV-s typ
nV-s typ
nV/(Hz)1/2 typ
Full-scale change to ±1/2 LSB
DAC latch contents alternately loaded with all 0s and all 1s
VREF(+) = 2 V p-p, (1 VBIAS) 1 kHz, VREF(−) = −1 V
Between DACs inside a group (see the Terminology section)
Between DACs from different groups
Effect of input bus activity on DAC output under test
VREF(+) = VREF(−) = 0 V
Guaranteed by design and characterization, not production tested.
Rev. B | Page 5 of 28
AD5379
TIMING CHARACTERISTICS
SERIAL INTERFACE
VCC = 2.7 V to 5.5 V; VDD = 11.4 V to 16.5 V; VSS = −11.4 V to −16.5 V; VREF(+) = 5 V; VREF(−) = −3.5 V; AGND = DGND = REFGND = 0 V;
VBIAS = 5 V, FIFOEN = 0 V; all specifications TMIN to TMAX, unless otherwise noted.
Table 4.
Parameter 1, 2, 3
t1
t2
t3
t4
t5 4
t64
t7
t8
t9
t104, 5
t11
t124
t13
t14
t15
t16
t17
t18
t19
t20 6, 7
t217
t227
t237
t245
t25
t26
Limit at TMIN, TMAX
20
8
8
10
15
25
10
5
4.5
30
330
20
20
150
0
100
20/30
10
350
25
5
5
20
30
10
120
Unit
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns max
ns max
ns min
ns min
ns typ
ns min
ns min
μs typ/max
ns min
ns max
ns max
ns min
ns min
ns min
ns min
ns min
μs max
Description
SCLK cycle time.
SCLK high time.
SCLK low time.
SYNC falling edge to SCLK falling edge setup time.
24th SCLK falling edge to SYNC falling edge.
Minimum SYNC low time.
Minimum SYNC high time.
Data setup time.
Data hold time.
24th SCLK falling edge to BUSY falling edge.
BUSY pulse width low (single-channel update). See Table 10.
24th SCLK falling edge to LDAC falling edge.
LDAC pulse width low.
BUSY rising edge to DAC output response time.
BUSY rising edge to LDAC falling edge.
LDAC falling edge to DAC output response time.
DAC output settling time.
CLR pulse width low.
CLR/RESET pulse activation time.
SCLK rising edge to sdo valid.
SCLK falling edge to SYNC rising edge.
SYNC rising edge to SCLK rising edge.
SYNC rising edge to LDAC falling edge.
SYNC rising edge to BUSY falling edge.
RESET pulse width low.
RESET time indicated by BUSY low.
1
Guaranteed by design and characterization, not production tested.
All input signals are specified with tr = tf = 2 ns (10% to 90% of VCC), and timed from a voltage level of 1.2 V.
See Figure 4 and Figure 5.
4
Standalone mode only.
5
This is measured with the load circuit shown in Figure 2.
6
This is measured with the load circuit shown in Figure 3.
7
Daisy-chain mode only.
2
3
VCC
VOL
CL
50pF
IOL
VOH(min) + VOL(max)
CL
2
50pF
200μA
IOH
Figure 3. Load Circuit for SDO Timing Diagram
(Serial Interface, Daisy-Chain Mode)
Figure 2. Load Circuit for BUSY Timing Diagram
Rev. B | Page 6 of 28
03165-003
TO
OUTPUT
PIN
TO
OUTPUT
PIN
2.2kΩ
03165-002
RL
200μA
AD5379
t1
SCLK
1
2
24
t3
t4
SYNC
t7
24
t2
t5
t6
t8 t9
DB23
DIN
DB0
t10
t11
BUSY
t12
t13
t17
LDAC1
t14
VOUT
t15
t13
LDAC2
t16
VOUT
t17
t18
CLR
t19
VOUT
1LDAC
2LDAC
ACTIVE DURING BUSY
ACTIVE AFTER BUSY
t25
RESET
BUSY
t19
03165-004
VOUT
t26
Figure 4. Serial Interface Timing Diagram (Standalone Mode)
Rev. B | Page 7 of 28
AD5379
t1
SCLK
24
t3
t7
48
t22
t2
t21
t4
SYNC
t8
DIN
t9
D23
D0
D23'
INPUT WORD FOR DAC N
D0'
INPUT WORD FOR DAC N+1
t20
SDO
D23
UNDEFINED
D0
INPUT WORD FOR DAC N
t23
t13
LDAC
t11
BUSY
Figure 5. Serial Interface Timing Diagram (Daisy-Chain Mode)
Rev. B | Page 8 of 28
03165-005
t24
AD5379
PARALLEL INTERFACE
VCC = 2.7 V to 5.5 V; VDD = 11.4 V to 16.5 V; VSS = −11.4 V to −16.5 V; AGND = DGND = DUTGND = 0 V; VREF(+) = 5 V;
VREF(−) = −3.5 V, FIFOEN = 0 V; all specifications TMIN to TMAX, unless otherwise noted.
Table 5.
Parameter 1, 2, 3
t0
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10 4
t114
t12
t13
t14
t154
t16
t17
t18
t19
t20
t21
t22
t23
Limit at TMIN to TMAX
4.5
4.5
10
10
0
0
4.5
4.5
20
240
0/30
330
0
30
20
150
20
0
100
20/30
10
350
10
120
Unit
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min/max
ns max
ns min
ns min
ns min
ns typ
ns min
ns min
ns typ
μs typ/ max
ns min
ns max
ns min
μs max
Description
REG0, REG1, address to WR rising edge setup time.
REG0, REG1, address to WR rising edge hold time.
CS pulse width low.
WR pulse width low.
CS to WR falling edge setup time.
WR to CS rising edge hold time.
Data to WR rising edge setup time.
Data to WR rising edge hold time.
WR pulse width high.
Minimum WR cycle time (single-channel write).
WR rising edge to BUSY falling edge.
BUSY pulse width low (single-channel update). See Table 10.
BUSY rising edge to WR rising edge.
WR rising edge to LDAC falling edge.
LDAC pulse width low.
BUSY rising edge to DAC output response time.
LDAC rising edge to WR rising edge.
BUSY rising edge to LDAC falling edge.
LDAC falling edge to DAC output response time.
DAC output settling time.
CLR pulse width low.
CLR/RESET pulse activation time.
RESET pulse width low.
RESET time indicated by BUSY low.
1
Guaranteed by design and characterization, not production tested.
All input signals are specified with tr = tf = 2 ns (10% to 90% of VCC), and timed from a voltage level of 1.2 V.
3
See Figure 6.
4
Measured with load circuit shown in Figure 2.
2
Rev. B | Page 9 of 28
AD5379
t0
t1
REG0,
REG1,
A7–A02
t4
t5
t2
CS
t9
t3
WR
t8
t6
t16
t7
DB12–DB0
t12
t10
t11
BUSY
t13
t14
t19
LDAC1
t15
VOUT
t17
t14
LDAC2
t18
VOUT
t19
t20
CLR
t21
VOUT
1LDAC
2LDAC
ACTIVE DURING BUSY
ACTIVE AFTER BUSY
t22
RESET
t21
t23
BUSY
Figure 6. Parallel Interface Timing Diagram
Rev. B | Page 10 of 28
03165-006
VOUT
AD5379
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Transient currents of up to 100 mA do not cause SCR latch-up.
Table 6.
Parameter
VDD to AGND
VSS to AGND
VCC to DGND
Digital Inputs to DGND
Digital Outputs to DGND
VREF1(+), VREF2(+) to AGND
VREF1(−), VREF2(−) to AGND
VBIAS to AGND
VOUT0–VOUT39 to AGND
REFGND to AGND
AGND to DGND
Operating Temperature Range (TA)
Industrial (A Version)
Storage Temperature Range
Junction Temperature (TJ max)
108-Lead CSPBGA Package
θJA Thermal Impedance
θJC Thermal Impedance
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Rating
−0.3 V to +17 V
−17 V to +0.3 V
−0.3 V to +7 V
−0.3 V to VCC + 0.3 V
−0.3 V to VCC + 0.3 V
−0.3 V to +7 V
VSS − 0.3 V to VDD + 0.3 V
−0.3 V to +7 V
VSS − 0.3 V to VDD + 0.3 V
VSS − 0.3 V to VDD + 0.3 V
−0.3 V to +0.3 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only, and functional operation of the device at these or
any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
−40°C to +85°C
−65°C to +150°C
150°C
37.5°C/W
8.5°C/W
230°C
10 sec to 40 sec
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to
high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.
Rev. B | Page 11 of 28
AD5379
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9 10 11 12
A
A
B
B
C
C
D
D
E
F
AD5379
F
G
TOP VIEW
G
H
H
J
J
K
K
L
L
M
M
1
2
3
4
5
6
7
8
9 10 11 12
03165-007
E
Figure 7. Pin Configuration
Table 7. 108-Lead CSPBGA Ball Configuration
CSPBGA
Number
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
B1
B2
B3
B4
Ball Name
REG0
VCC3
DB10
AGND4
VBIAS
VOUT5
AGND3
REFGNDA1
VDD5
VSS5
VSS4
VDD4
REG1
DGND4
DB9
CLR
B5
B6
B7
B8
B9
B10
B11
B12
C1
C2
C3
C4
VOUT7
VOUT6
VOUT0
VOUT1
VOUT2
VOUT31
REFGNDD1
VOUT30
DB13
DB12/SCLK
DB11/DIN
SER/PAR1
CSPBGA
Number
C5
LDAC
C6
C7
C8
C9
C10
C11
C12
D1
D2
D3
D10
D11
D12
E1
E2
E3
E10
E11
E12
F1
F2
F3
F10
F11
F12
G1
G2
VOUT8
VOUT3
VOUT4
VOUT9
VOUT34
VOUT32
VOUT33
DB7
DB8
DGND1
VREF1(−)
VOUT35
VOUT36
DB5
DB6
VCC1
REFGNDB2
VOUT37
VOUT38
DB4
DB3
DB2
VDD3
REFGNDD2
VOUT39
DB1
DB0
Ball Name
CSPBGA
Number
G3
Ball Name
BUSY
G10
G11
G12
H1
VSS3
VOUT29
REFGNDC2
WR/DCEN
H2
H3
SDO2
CS/SYNC
H10
H11
H12
J1
J2
J3
J10
J11
J12
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
K11
VOUT28
VOUT26
VOUT27
A0
A1
A2
VOUT19
VOUT24
VOUT25
A4
A5
A3
DGND2
REFGNDA2
VREF2(−)
VOUT12
VOUT13
VOUT16
VOUT18
VOUT22
1
An internal 1 MΩ pull-down device is located on this logic input; therefore, it can be left floating and defaults to a logic low condition.
An internal 1 MΩ pull-up device is located on this logic input; therefore, it can be left floating and defaults to a logic high condition.
3
N/C—Do not connect to this pin. Internal active pull-up device on these logic inputs. They default to a logic high condition.
2
Rev. B | Page 12 of 28
CSPBGA
Number
K12
L1
L2
L3
L4
Ball Name
VOUT23
A7
A6
N/C3
RESET2
L5
L6
L7
L8
L9
L10
L11
L12
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
VOUT17
AGND2
VOUT14
VOUT10
VDD1
VREF2(+)
VOUT20
VOUT21
DGND3
VCC2
FIFOEN1
AGND1
VOUT15
VOUT11
REFGNDB1
VREF1(+)
VSS1
VSS2
VDD2
REFGNDC1
AD5379
Table 8. Pin Function Descriptions
Pin
VCC(1–3)
VSS(1–5)
VDD(1–5)
AGND(1–4)
DGND(1–4)
VREF1(+), VREF1(−)
VREF2(+), VREF2(−)
VBIAS
VOUT0 to VOUT39
SER/PAR
SYNC 1
SCLK1
DIN1
SDO1
DCEN1
CS
WR
DB13 to DB0
A0 to A7
REG0
CLR
BUSY
LDAC
Function
Logic Power Supply; 2.7 V to 5.5 V. These pins should be decoupled with 0.1 μF ceramic capacitors and 10 μF
capacitors.
Negative Analog Power Supply; −11.4 V to −16.5 V for Specified Performance. These pins should be decoupled with
0.1 μF ceramic capacitors and 10 μF capacitors.
Positive Analog Power Supply; +11.4 V to +16.5 V for Specified Performance. These pins should be decoupled with
0.1 μF ceramic capacitors and 10 μF capacitors.
Ground for All Analog Circuitry. All AGND pins should be connected to the AGND plane.
Ground for All Digital Circuitry. All DGND pins should be connected to the DGND plane.
Reference Inputs for DACs 0 to 7, 10 to 17, 20 to 27, and 30 to 37. These voltages are referred to AGND.
Reference Inputs for DACs 8, 9, 18, 19, 28, 29, 38, and 39. These reference voltages are referred to AGND.
DAC Bias Voltage Input/Output. This pin provides an access to the on-chip voltage generator voltage and is provided
for bypassing and overdriving purposes only. If VREF(+) > 4.25 V, VBIAS must be pulled high externally to an equal or
higher potential (for example, 5 V). If VREF(+) < 4.25 V, the on-chip bias generator can be used. In this case, the VBIAS pin
should be decoupled with a 10 nF capacitor to AGND.
DAC Outputs. Buffered analog outputs for each of the 40 DAC channels. Each analog output is capable of driving an
output load of 5 kΩ to ground. Typical output impedance of these amplifiers is 1 Ω.
Interface Select Input. This pin allows the user to select whether the serial or parallel interface is used. This pin has an
internal 1 MΩ pull-down resistor, meaning that the default state at power-on is parallel mode. If this pin is tied high,
the serial interface is used.
Active Low Input. This is the frame synchronization signal for the serial interface.
Serial Clock Input. Data is clocked into the shift register on the falling edge of SCLK. This pin operates at clock speeds
up to 50 MHz.
Serial Data Input. Data must be valid on the falling edge of SCLK.
Serial Data Output. CMOS output. SDO can be used for daisy-chaining a number of devices together. Data is clocked
out on SDO on the rising edge of SCLK and is valid on the falling edge of SCLK.
Daisy-Chain Select Input (Level Sensitive, Active High). When high, this signal is used in conjunction with SER/PAR
high to enable serial interface daisy-chain mode.
Parallel Interface Chip Select Input (Level Sensitive, Active Low). If this pin is low, the device is selected.
Parallel Interface Write Input (Edge Sensitive). The rising edge of WR is used in conjunction with CS low and the
address bus inputs to write to the selected AD5379 registers.
Parallel Data Inputs. The AD5379 can accept a straight 14-bit parallel word on DB0 to DB13, where DB13 is the MSB
and DB0 is the LSB.
Parallel Address Inputs. A7 to A4 are decoded to select one group or multiple groups of registers (input registers, gain
registers (m) or offset registers (c)) for a data transfer. This pin is used in conjunction with the REG1 and REG0 pins to
determine the destination register for the input data. See the Parallel Interface section for details of the address
decoding.
Parallel Interface Register Select Input. This pin is used together with REG1 to select data registers, gain registers,
offset registers, increment/decrement mode, or the soft reset function. See Table 11.
Asynchronous Clear Input (Level Sensitive, Active Low). When CLR is low, the input to each of the DAC output buffer
stages, VOUT0 to VOUT39, is switched to the externally set potential on the relevant REFGND pin. While CLR is low, all
LDAC pulses are ignored. When CLR is taken high again, the DAC outputs remain cleared until LDAC is taken low. The
contents of input registers and DAC registers 0 to 39 are not affected by taking CLR low.
Digital Input/Open-Drain Output. This pin must be pulled high with a pull-up resistor for correct operation. BUSY goes
low during internal calculations of x2. During this time, the user can continue writing new data to additional ×1, c,
and m registers (these are stored in a FIFO), but no further updates to the DAC registers and DAC outputs can take
place. If LDAC is taken low while BUSY is low, this event is stored. Because BUSY is bidirectional, it can be pulled low
externally to delay LDAC action. BUSY also goes low during power-on reset or when the RESET pin is low. During a
RESET operation, the parallel interface is disabled and any events on LDAC are ignored.
Load DAC Logic Input (Active Low). If LDAC is taken low while BUSY is inactive (high), the contents of the input
registers are transferred to the DAC registers and the DAC outputs are updated. If LDAC is taken low while BUSY is
active and internal calculations are taking place, the LDAC event is stored and the DAC registers are updated when
BUSY goes inactive. However, any events on LDAC during power-on reset or RESET are ignored.
Rev. B | Page 13 of 28
AD5379
Pin
FIFOEN
RESET
REFGNDA1
REFGNDA2
REFGNDB1
REFGNDB2
REFGNDC1
REFGNDC2
REFGNDD1
REFGNDD2
1
Function
FIFO Enable (Level Sensitive, Active High). When connected to DVDD, the internal FIFO is enabled, allowing the user to
write to the device at full speed. FIFO is available in both serial and parallel mode. The FIFOEN pin has an internal
1 MΩ pull-down resistor connected to ground, meaning that the FIFO is disabled by default.
Asynchronous Digital Reset Input (Falling Edge Sensitive). If unused, RESET may be left unconnected; an internal pullup resistor (1 MΩ) ensures that the RESET input is held high. The function of this pin is equivalent to that of the poweron reset generator. When this pin is taken low, the AD5379 state machine initiates a reset sequence to digitally reset
x1, m, c, and x2 registers to their default power-on values. This sequence takes 100 μs (typ). Furthermore, the input to
each of the DAC output buffer stages, VOUT0 to VOUT39, is switched to the externally set potential on the relevant
REFGND pin. During RESET, BUSY goes low and the parallel interface is disabled. All LDAC pulses are ignored until
BUSY goes high. When RESET is taken high again, the DAC ouputs remain at REFGND until LDAC is taken low.
Reference Ground for DACs 0 to 7. VOUT0 to VOUT7 are referenced to this voltage.
Reference Ground for DACs 8 and 9. VOUT8 and VOUT9 are referenced to this voltage.
Reference Ground for DACs 10 to 17. VOUT10 to VOUT17 are referenced to this voltage.
Reference Ground for DACs 18 and 19. VOUT18 and VOUT19 are referenced to this voltage.
Reference Ground for DACs 20 to 27. VOUT20 to VOUT27 are referenced to this voltage.
Reference Ground for DACs 28 and 29. VOUT28 and VOUT29 are referenced to this voltage.
Reference Ground for DACs 30 to 37. VOUT30 to VOUT37 are referenced to this voltage.
Reference Ground for DACs 38 and 39. VOUT38 and VOUT39 are referenced to this voltage.
These serial interface signals do not require separate pins, but share parallel interface pins.
Rev. B | Page 14 of 28
AD5379
TERMINOLOGY
Relative Accuracy
Relative accuracy, or endpoint linearity, is a measure of the
maximum deviation from a straight line passing through the
endpoints of the DAC transfer function. It is measured after
adjusting for zero-scale error and full-scale error and is
expressed in least significant bits (LSB).
Differential Nonlinearity
Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of 1 LSB maximum
ensures monotonicity.
Zero-Scale Error
Zero-scale error is the error in the DAC output voltage when all
0s are loaded into the DAC register.
Ideally, with all 0s loaded to the DAC and m is all 1s,
c is 10 0000 0000 0000:
VOUT(zero scale) = 2.5 × (VREF(−) − AGND) + REFGND
Zero-scale error is a measure of the difference between VOUT
(actual) and VOUT (ideal) expressed in mV. Zero-scale error is
mainly due to offsets in the output amplifier.
Full-Scale Error
Full-scale error is the error in DAC output voltage when all 1s
are loaded into the DAC register.
Ideally, with all 1s loaded to the DAC and m is all 1s,
c is 10 0000 0000 0000:
VOUT(full scale) = 3.5 × (VREF(+) − AGND) + 2.5 ×
(VREF(−)− AGND) + REFGND
Full-scale error is a measure of the difference between VOUT
(actual) and VOUT (ideal) expressed in mV. It does not include
zero-scale error.
Gain Error
Gain error is the difference between full-scale error and zeroscale error. It is expressed in mV.
Gain Error = Full-Scale Error − Zero-Scale Error
VOUT Temperature Coefficient
This includes output error contributions from linearity, offset,
and gain drift.
DC Output Impedance
DC output impedance is the effective output source resistance.
It is dominated by package lead resistance.
DC Crosstalk
The 40 DAC outputs are buffered by op amps that share
common VDD and VSS power supplies. If the dc load current
changes in one channel (due to an update), this can result in a
further dc change in one or more channel outputs. This effect is
more significant at high load currents and reduces as the load
currents are reduced. With high impedance loads, the effect is
virtually unmeasurable. Multiple VDD and VSS terminals are
provided to minimize dc crosstalk.
Output Voltage Settling Time
The amount of time it takes for the output of a DAC to settle to
a specified level for a full-scale input change.
Digital-to-Analog Glitch Energy
The amount of energy injected into the analog output at the
major code transition. It is specified as the area of the glitch in
nV-s. It is measured by toggling the DAC register data between
0x1FFF and 0x2000.
Channel-to-Channel Isolation
Channel-to-channel isolation refers to the proportion of input
signal from one DAC’s reference input that appears at the
output of another DAC operating from another reference. It is
expressed in dB and measured at midscale.
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse that appears at the
output of one converter due to both the digital change and
subsequent analog output change at another converter. It is
specified in nV-s.
Digital Crosstalk
The glitch impulse transferred to the output of one converter
due to a change in the DAC register code of another converter is
defined as the digital crosstalk and is specified in nV-s.
Digital Feedthrough
When the device is not selected, high frequency logic activity
on the device’s digital inputs can be capacitively coupled both
across and through the device to show up as noise on the
VOUT pins. It can also be coupled along the supply and ground
lines. This noise is digital feedthrough.
Output Noise Spectral Density
Output noise spectral density is a measure of internally
generated random noise. Random noise is characterized as a
spectral density (voltage per √Hz). It is measured by loading all
DACs to midscale and measuring noise at the output. It is
measured in nV/(Hz)1/2.
Rev. B | Page 15 of 28
AD5379
TYPICAL PERFORMANCE CHARACTERISTICS
1.5
3
VDD = +12V
VSS = –12V
VREF(+) = +5V
VREF(–) = –3.5V
TMAX = +85C
2
1.0
1
FS
ERROR (mV)
0
0
–1
ZC
–0.5
–2
VDD = +12V
VSS = –12V
VREF(+) = +5V
VREF(–) = –3.5V
TA = 25C
–3
–1.5
0
2
4
6
8
10
12
14
16
AD5379 CODE (103)
–4
–40
03165-008
–1.0
–20
0
20
40
60
80
TEMPERATURE (C)
Figure 8. Typical INL Plot
03165-011
INL (LSB)
0.5
Figure 11. Typical Full-Scale and Zero-Scale Errors vs. Temperature
1400
19.0
VDD = +12V
VSS = –12V
VREF(+) = +5V
VREF(–) = –3.5V
1200
18.9
VDD = +12V VREF(+) = +5V
VSS = –12V VREF(–) = –3.5V
18.8
+85C
1000
800
IDD (mA)
FREQUENCY
18.7
600
18.6
+25C
18.5
18.4
400
–40C
18.3
200
–3
–2
–1
0
1
2
3
INL ERROR (LSB)
18.1
10.0
03165-009
0
10.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
Figure 12. IDD vs. VDD over Temperature
3
–14.6
VDD = +12V
VSS = –12V
VREF(+) = +5V
VREF(–) = –3.5V
TMAX = +85C
VDD = +12V VREF(+) = +5V
VSS = –12V VREF(–) = –3.5V
–14.8
1
–40C
ISS (mA)
–15.0
0
–15.2
+25C
–1
–15.4
–2
–15.6
–3
–40
–15.8
10.0
–20
0
20
40
60
TEMPERATURE (C)
80
Figure 10. Typical INL Error vs. Temperature
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
VDD (V)
Figure 13.ISS vs. VDD over Temperature
Rev. B | Page 16 of 28
14.5
15.0
03165-013
+85C
03165-010
INL ERROR (LSB)
11.5
VDD (V)
Figure 9. INL Error Distribution
(−40°C, +25°C, +85°C Superimposed)
2
11.0
03165-012
18.2
AD5379
3.5
VDD = +12V
VSS = –12V
VREF(+) = +5V
VREF(–) = –3.5V
3.0
TA = 25°C
VDD = +12V
VSS = –12V
VREF(+) = +5V
VREF(–) = –3.5V
VOUT
ICC (mA)
2.5
2.0
1.5
+85°C
1.0
–40°C
3.0
3.5
4.0
4.5
5.0
5.5
FREQUENCY (MHz)
10V
Figure 14. ICC vs. Supply
Figure 17. DAC-to-DAC Crosstalk
–0.208
1.75
TA = 25°C
VDD = +12V
VSS = –12V
VREF(+) = +5V
VREF(–) = –3.5V
–0.211
TA = 25°C
VDD = +12V
VSS = –12V
VREF(+) = +5V
VREF(–) = –3.5V
VCC = +3.3V
1.70
1.65
1.60
–0.214
ICC (mA)
AMPLITUDE (V)
5mV
03165-017
0
2.5
+25°C
03165-014
0.5
–0.217
1.55
1.50
1.45
1.40
–0.220
0
4
8
12
16
20
TIME (μs)
Figure 15. Major Code Transition Glitch Energy
–0.209
–0.210
–0.211
2.8
4.2
TIME (μs)
5.6
6.0
03165-016
AMPLITUDE (V)
TA = 25°C VSS = –12V VREF(–) = –3.5V
VDD = +12V VREF(+) = +5V
1.4
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
INPUT VOLTAGE (V)
Figure 18. Supply Current vs. Digital Input Voltage
–0.208
0
1.30
Figure 16. Digital Feedthrough
Rev. B | Page 17 of 28
3.2
03165-018
–0.223
03165-015
1.35
AD5379
FUNCTIONAL DESCRIPTION
The AD5379 contains 40 DAC channels and 40 output
amplifiers in a single package. The architecture of a single DAC
channel consists of a 14-bit resistor-string DAC followed by an
output buffer amplifier. The resistor-string section is simply a
string of resistors, each of value R, from VREF(+) to AGND. This
type of architecture guarantees DAC monotonicity. The 14-bit
binary digital code loaded to the DAC register determines at
which node on the string the voltage is tapped off before being
fed into the output amplifier. The output amplifier translates the
output of the DAC to a wider range. The DAC output is gained
up by a factor of 3.5 and offset by the voltage on the VREF(−) pin.
See the Transfer Function section for more information.
Figure 19 shows a single DAC channel and its associated
registers. The power-on values for the m and c registers are full
scale and 0x2000, respectively. The user can individually adjust
the voltage range on each DAC channel by overwriting the
power-on values of m and c. The AD5379 has digital overflow
and underflow detection circuitry to clamp the DAC output at
full scale or zero scale when the values chosen for x1, m, and c
result in x2 being out of range.
DAC
x1 INPUT
REG
INPUT
DATA
CHANNEL GROUPS
The 40 DAC channels on the AD5379 are arranged into four
groups (A, B, C, D) of 10 channels. In each group, eight
channels are connected to VREF1(+) and VREF1(−), and the
remaining two channels are connected to VREF2(+) and
VREF2(−). Each group has two individual REFGND pins. For
example, in Group A, eight channels are connected to
REFGNDA1, and the remaining two channels are connected to
REFGNDA2. In addition to an input register (x1) and a DAC
register (x2), each channel has a gain register (m) and an offset
register (c). See Table 17. The inclusion of these registers allows
the user to calibrate out errors in the complete signal chain,
including the DAC errors.
Table 9 shows the reference and REFGND inputs, and the
m and c registers for Group A. Groups B, C, and D are similar.
Table 9. Inputs and Registers for Group A
Channel
0 to 7
Reference
VREF1(+), VREF1(−)
REFGND
REFGNDA1
8 and 9
VREF2(+), VREF2(−)
REFGNDA2
m, c Registers
m REG0 to REG7
c REG0 to REG7
m REG8 and REG9
c REG8 and REG9
VREF(+)
LDAC
x2
m REG
x2
REG
DAC
REG
DAC
VDAC
c REG
AGND
03165-019
DAC ARCHITECTURE—GENERAL
Figure 19. Single DAC Channel
The complete transfer function for the AD5379 can be
represented as
VOUT = 3.5 × ((VREF(+)− AGND) × x2/214) +
2.5 × (VREF(−)− AGND) + REFGND
where:
x2 is the data word loaded to the resistor string DAC.
VREF(+) is the voltage at the positive reference pin.
VREF(−) is the voltage at the negative reference pin.
Figure 20 shows the output amplifier stage of a single channel.
VDAC is the voltage output from the resistor string DAC. The
nominal range of VDAC is 1 LSB to full scale.
VDAC
VOUT
TRANSFER FUNCTION
The digital input transfer function for each DAC can be
represented as
VREF(–)
R
2.5R
R
x2 = [(m + 1)/213 × x1] + (c − 2n−1)
R
REFGND
Rev. B | Page 18 of 28
2.5R
AGND
Figure 20. Output Amplifier Stage
03165-020
where:
x2 is the data-word loaded to the resistor string DAC.
(Default is 10 0000 0000 0000.)
x1 is the 14-bit data-word written to the DAC input register.
(Default is 10 0000 0000 0000.)
m is the 13-bit gain coefficient. (Default is 1 1111 1111 1111.)
c is the 14-bit offset coefficient. (Default is 10 0000 0000 0000.)
n is the DAC resolution (n = 14).
AD5379
VBIAS FUNCTION
The AD5379 has an on-chip voltage generator that provides a
bias voltage of 4.25 V (minimum). The VBIAS pin is provided for
bypassing and overdriving purposes only. It is not intended to
be used as a supply or a reference. If VREF(+) > 4.25 V, VBIAS must
be pulled high externally to an equal or higher potential (such
as 5 V). The external voltage source should be capable of
driving a 50 μA (typical) current sink load.
REFERENCE SELECTION
The voltages applied to VREF(+) and VREF(−) determine the
output voltage range and span on VOUT0 to VOUT39. If the
offset and gain features are not used (m and c are left at their
power-on values), the required reference levels can be
calculated as follows:
VREF(+)min = (VOUTmax − VOUTmin)/3.5
VREF(−)max = (AGND + VOUTmin)/2.5
If the offset and gain features of the AD5379 are used, then the
required output range is slightly different. The chosen output
range should take into account the offset and gain errors that
need to be trimmed out. Therefore, the chosen output range
should be larger than the actual, required range.
The required reference levels can be calculated as follows:
If this offset error is too large to calibrate, then adjust the
negative reference value to account for this using the following
equation:
VREF(−)NEW = VREF(−)A − VOFFSET/2.625
Reference Selection Example
Nominal Output Range = 10 V; (−2 V to +8 V)
Offset Error = ±100 mV;
Gain Error = ±3%;
REFGND = AGND = 0 V;
1) Gain Error = ±3%;
=> Maximum Positive Gain Error = +3%
=> Output Range incl. Gain Error = 10 + 0.03(10) = 10.3 V
2) Offset Error = ±100 mV;
=> Maximum Offset Error Span = 2(100) mV = 0.2 V
=> Output Range including Gain Error and
Offset Error = 10.3 + 0.2 = 10.5 V
3) VREF(+) and VREF(−) Calculation:
Actual Output Range = 10.5 V, that is, −2.25 V to +8.25 V
(centered);
=> VREF(+) = (8.25 + 2.25)/3.5 = 3 V
VREF(−) = −2.25/+2.5 = −0.9 V
If the solution yields inconvenient reference levels, the user can
adopt one of three approaches:
1.
Identify the nominal output range on VOUT.
2.
Identify the maximum offset span and the maximum gain
required on the full output signal range.
•
Use a resistor divider to divide down a convenient, higher
reference level to the required level.
3.
Calculate the new maximum output range on VOUT
including the expected, maximum offset and gain errors.
•
4.
Choose the new required VOUTmax and VOUTmin, keeping
the new VOUT limits centered on the nominal values and
assuming REFGND is zero (or equal to AGND). Note that
VDD and VSS must provide sufficient headroom.
Select convenient reference levels above VREF(+)min or below
VREF(−)max. Modify the gain and offset registers to digitally
downsize the references. In this way, the user can use
almost any convenient reference level, but may reduce
performance by overcompaction of the transfer function.
•
Use a combination of these two approaches.
5.
Calculate the values of VREF(+) and VREF(−) as follows:
VREF(+)min = (VOUTmax − VOUTmin)/3.5
VREF(−)max = (AGND + VOUTmin)/2.5
In addition, when using reference values other than those
suggested (VREF(+) = 5 V and VREF(−) = −3.5 V), the expected
offset error component changes to
VOFFSET = 0.125 × (VREF(−)A + 0.7 × VREF(+)A)
where:
VREF(−)A is the new negative reference value.
VREF(+)A is the new positive reference value.
Rev. B | Page 19 of 28
AD5379
CALIBRATION
Software Clear
The user can perform a system calibration by overwriting the
default values in the m and c registers for any individual DAC
channel as follows:
Loading a clear code to the x1 registers also enables the user to
set VOUT0 to VOUT39 to the REFGND level. The default clear
code corresponds to m at full-scale and c at midscale (x2 = x1).
•
Calculate the nominal offset and gain coefficients for the
new output range (see previous example).
•
Calculate the new m and c values for each channel based
on the specified offset and gain errors.
Default Clear Code
= 214 × (−Output Offset)/(Output Range)
= 214 × 2.5 × (AGND − VREF(−))/(3.5 × (VREF(+)− AGND))
The more general expression for the clear code is as follows:
Clear Code = (214)/(m + 1) × (Default Clear Code − c)
Calibration Example
BUSY AND LDAC FUNCTIONS
Nominal Offset Coefficient = 0
Nominal Gain Coefficient =
10/10.5 × 8191 = 0.95238 × 8191 = 7801
Example 1: Channel 0, Gain Error = 3%, Offset Error = 100 mV
1) Gain Error (3%) Calibration: 7801 × 1.03 = 8035
=> Load Code “1 1111 0110 0011” to m Register 0
2) Offset Error (100 mV) Calibration:
LSB Size = 10.5/16384 = 641 μV;
Offset Coefficient for 100 mV Offset = 100/0.64 = 156 LSBs
=> Load “10 0000 1001 1100” to c Register 0
Example 2: Channel 1, Gain Error = −3%, Offset Error = −100 mV
1) Gain Error (−3%) Calibration: 7801 × 0.97 = 7567
=> Load Code “1 1110 1000 1111” to m Register 1
2) Offset Error (−100 mV) Calibration:
LSB Size = 10.5/16384 = 641 μV;
Offset Coefficient for −100 mV Offset = −100/0.64 = −156 LSBs
=> Load “01 1111 0110 0100” to c Register 1
CLEAR FUNCTION
The clear function on the AD5379 can be implemented in
hardware or software.
Hardware Clear
Bringing the CLR pin low switches the outputs, VOUT0 to
VOUT39, to the externally set potential on the REFGND pin.
This is achieved by switching in REFGND and reconfiguring
the output amplifier stages into unity gain buffer mode, thus
ensuring VOUT = REFGND. The contents of the input registers
and DAC registers are not affected by taking CLR low. When
CLR is brought high, the DAC outputs remain cleared until
LDAC is taken low. While CLR is low, the value of LDAC is
ignored.
The value of x2 is calculated each time the user writes new data
to the corresponding x1, c, or m registers. During the calculation of x2, the BUSY output goes low. While BUSY is low, the
user can continue writing new data to the x1, m, or c registers,
but no DAC output updates can take place. The DAC outputs
are updated by taking the LDAC input low. If LDAC goes low
while BUSY is active, the LDAC event is stored and the DAC
outputs update immediately after BUSY goes high. A user can
also hold the LDAC input permanently low. In this case, the
DAC outputs update immediately after BUSY goes high.
Table 10. BUSY Pulse Width
BUSY Pulse Width (ns max)
Action
Loading x1, c, or m to 1 channel
Loading x1, c, or m to 2 channels
Loading x1, c, or m to 3 channels
Loading x1, c, or m to 4 channels
Loading x1, c, or m to all
40 channels
FIFO
Enabled
530
700
900
1050
FIFO
Disabled
330
500
700
850
5500
5300
The value of x2 for a single channel or group of channels is
recalculated each time there is a write to any x1 register(s),
c register(s), or m register(s). During the calculation of x2,
BUSY goes low. The duration of this BUSY pulse depends on
the number of channels being updated. For example, if x1, c, or
m data is written to one DAC channel, BUSY goes low for
550 ns (maximum). However, if data is written to two DAC
channels, BUSY goes low for 700 ns (maximum). As shown in
Table 10, there are approximately 200 ns of overhead due to
FIFO access.
The AD5379 contains an extra feature whereby a DAC register
is not updated unless its x2 register has been written to since the
last time LDAC was brought low. Normally, when LDAC is
brought low, the DAC registers are filled with the contents of
the x2 registers. However the AD5379 updates the DAC register
only if the x2 data has changed, thereby removing unnecessary
digital crosstalk.
Rev. B | Page 20 of 28
AD5379
FIFO VS. NON-FIFO OPERATION
Two modes of operation are available for loading data to the
AD5379 registers: operation with FIFO disabled and operation
with FIFO enabled. Operation with FIFO disabled is optimum
for single writes to the device. If the system requires significant
data transfers to the AD5379, however, then operation with
FIFO enabled is more efficient.
When FIFO is enabled, the AD5379 uses an internal FIFO
memory to allow high speed successive writes in both serial and
parallel modes. This optimizes the interface speed and efficiency,
minimizes the total conversion time due to internal digital
efficiencies, and minimizes the overhead on the master controller when managing the data transfers. The BUSY signal goes
low while instructions in the state machine are being executed.
Table 10 compares operation with FIFO enabled and FIFO
disabled for different data transfers to the AD5379. Operation
with FIFO enabled is more efficient for all operations except
single write operations. When using the FIFO, the user can
continue writing new data to the AD5379 while write instructions are being executed. Up to 128 successive instructions can
be written to the FIFO at maximum speed. When the FIFO is
full, additional writes to the AD5379 are ignored.
BUSY INPUT FUNCTION
If required, because the BUSY pin is bidirectional and opendrain 1 , a second AD5379 (or other device, such as a system
controller), can pull BUSY low to delay DAC update(s). This is a
means of delaying any LDAC action. This feature allows
synchronous updates of multiple AD5379 devices in a system, at
maximum speed. As soon as the last device connected to the
BUSY pin is ready, all DACs update automatically. Tying the
BUSY pin of multiple devices together enables synchronous
updating of all DACs without extra hardware.
POWER-ON RESET FUNCTION
The AD5379 contains a power-on reset generator and state
machine. During power-on, CLR becomes active (internally),
the power-on state machine resets all internal registers to their
default values, and BUSY goes low. This sequence takes 8 ms
(typical). The outputs, VOUT0 to VOUT39, are switched to the
externally set potential on the REFGND pin. During power-on,
the parallel interface is disabled, so it is not possible to write to
the part. Any transitions on LDAC during the power-on period
are ignored in order to reject initial LDAC pin glitching. A
rising edge on BUSY indicates that power-on is complete and
that the parallel interface is enabled. All DACs remain in their
power-on state until LDAC is used to update the DAC outputs.
RESET INPUT FUNCTION
The AD5379 can be placed in its power-on reset state at any
time by activating the RESET pin. The AD5379 state machine
initiates a reset sequence to digitally reset the x1, m, c, and x2
registers to their default power-on values. This sequence takes
95 μs (typical), 120 μs (maximum), 70 μs (minimum). During
this sequence, BUSY goes low. While RESET is low, any
transitions on LDAC are ignored. As with the CLR input, while
RESET is low, the DAC outputs are switched to REFGND. The
outputs remain at REFGND until an LDAC pulse is applied.
This reset function can also be implemented via the parallel
interface by setting the REG0 and REG1 pins low and writing
all 1s to DB13 to DB0 (see Table 16 for soft reset).
INCREMENT/DECREMENT FUNCTION
The AD5379 has a special function register that enables the user
to increment or decrement the internal 14-bit input register
data (x1) in steps of 0 to 127 LSBs. The increment/decrement
function is selected by setting both REG1 and REG0 pins (or
bits) low. Address Pins (or Bits) A7 to A0 are used to select a
DAC channel or group of channels. The amount by which the
x1 register is incremented or decremented is determined by the
DB6 to DB0 bits/pins. For example, for a 1 LSB increment or
decrement, DB6 to DB0 = 0000001, while for a 7 LSB increment
or decrement, DB6 to DB0 = 0000111. DB8 determines whether
the input register data is incremented (DB8 = 1) or decremented (DB8 = 0). The maximum amount by which the user is
allowed to increment or decrement the data is 127 LSBs, that is,
DB6 to DB0 = 1111111. The 0 LSB step is included to facilitate
software loops in the user’s application. See Table 15.
The AD5379 has digital overflow and underflow detection
circuitry to clamp at full scale or zero scale when the values
chosen for increment or decrement mode are out of range.
1
For correct operation, use pull-up resistor to digital supply.
Rev. B | Page 21 of 28
AD5379
INTERFACES
A7 to A0 Pins
The AD5379 contains a serial and a parallel interface. The
active interface is selected via the SER/PAR pin.
The AD5379 uses an internal FIFO memory to allow high
speed successive writes in both serial and parallel modes. The
user can continue writing new data to the AD5379 while write
instructions are being executed. The BUSY signal goes low while
instructions in the FIFO are being executed. Up to 120 successive
instructions can be written to the FIFO at maximum speed.
When the FIFO is full, additional writes to the AD5379 are
ignored.
To minimize both the power consumption of the device and
on-chip digital noise, the active interface powers up fully only
when the device is being written to, that is, on the falling edge
of WR or on the falling edge of SYNC.
All digital interfaces are 2.5 V LVTTL-compatible when
operating from a 2.7 V to 3.6 V VCC supply.
Each of the 40 DAC channels can be individually addressed. In
addition, several channel groupings enable the user to simultaneously write the same data to multiple DAC channels. Address
Bits A7 to A4 are decoded to select one group or multiple
groups of registers. Address Bits A3 to A0 select one of ten
input data registers (x1), offset registers (c), or gain registers
(m). See Table 17.
SERIAL INTERFACE
The SER/PAR pin must be tied high to enable the serial interface and disable the parallel interface. The serial interface is
controlled by five pins, as follows.
SYNC, DIN, SCLK
Standard 3-wire interface pins.
DCEN
Selects standalone mode or daisy-chain mode.
PARALLEL INTERFACE
SDO
A pull-down on the SER/PAR pin makes the parallel interface
the default. If using the parallel interface, the SER/PAR pin can
be left unconnected. Figure 6 shows the timing diagram for a
parallel write to the AD5379. The parallel interface is controlled
by the following pins.
CS Pin
Data out pin for daisy-chain mode.
Figure 4 and Figure 5 show the timing diagrams for a serial
write to the AD5379 in standalone and daisy-chain modes,
respectively.
The 24-bit data word format for the serial interface is shown in
Figure 21.
MSB
WR Pin
On the rising edge of WR, with CS low, the address values at
Pin A7 to Pin A0 are latched, and data values at Pin DB13 to
Pin DB0 are loaded into the selected AD5379 input registers.
A7–A0
Table 11. Register Selection
REG1
1
1
0
0
REG0
1
0
1
0
Register Selected
Input data register (x1)
Offset register (c)
Gain register (m)
Special function register
DB13 to DB0 Pins
The AD5379 accepts a straight, 14-bit parallel word on Pin DB0
to Pin DB13, where Pin DB13 is the MSB and Pin DB0 is the
LSB. See Table 12, Table 13, Table 14, Table 15, and Table 16.
REG1
REG0
GROUP/CHANNEL REGISTER SELECT
SELECT BITS
BITS
REG1, REG0 Pins
The REG1 and REG0 pins determine the destination register of
the data being written to the AD5379. See Table 11.
LSB
DB13–DB0
REGISTER DATA BITS
03165-021
Active low device select pin.
Figure 21. Serial Data Format
Standalone Mode
By connecting the DCEN (daisy-chain enable) pin low,
standalone mode is enabled. The serial interface works with
both a continuous and a burst serial clock. The first falling edge
of SYNC starts the write cycle and resets a counter that counts
the number of serial clocks to ensure that the correct number of
bits is shifted into the serial shift register. Additional edges on
SYNC are ignored until 24 bits are shifted into the register.
Once 24 bits are shifted into the serial shift register, the SCLK is
ignored. In order for another serial transfer to take place, the
counter must be reset by the falling edge of SYNC.
Rev. B | Page 22 of 28
AD5379
Daisy-Chain Mode
For systems that contain several DACs, the SDO pin can be
used to daisy-chain several devices together. This daisy-chain
mode can be useful in system diagnostics and in reducing the
number of serial interface lines.
Connecting the DCEN (daisy-chain enable) pin high enables
daisy-chain mode. The first falling edge of SYNC starts the
write cycle. The SCLK is continuously applied to the input shift
register when SYNC is low. If more than 24 clock pulses are
applied, the data ripples out of the shift register and appears on
the SDO line. This data is clocked out on the rising edge of
SCLK and is valid on the falling edge. By connecting this line to
the DIN input on the next device in the chain, a multidevice
interface is constructed. For each AD5379 in the system,
24 clock pulses are required. Therefore, the total number of
clock cycles must equal 24N, where N is the total number of
AD5379 devices in the chain. If fewer than 24 clocks are
applied, the write sequence is ignored.
When the serial transfer to all devices has been completed,
SYNC is taken high. This latches the input data in each device
in the daisy chain and prevents any additional data from being
clocked into the input shift register.
A continuous SCLK source can be used if SYNC is held low for
the correct number of clock cycles. Alternatively, a burst clock
containing the exact number of clock cycles can be used and
SYNC taken high after the final clock to latch the data.
When the transfer to all input registers is complete, a common
LDAC signal updates all DAC registers, and all analog outputs
are simultaneously updated.
Rev. B | Page 23 of 28
AD5379
DATA DECODING
The AD5379 contains a 14-bit data bus, DB13 to DB0. Depending on the values of REG1 and REG0, this data is loaded into
the addressed DAC input register(s), offset (c) register(s), gain
(m) register(s), or the special function register.
Table 12. DAC Data Format (REG1 = 1, REG0 = 1)
DB13 to DB0
11 1111 1111 1111
11 1111 1111 1110
10 0000 0000 0001
10 0000 0000 0000
01 1111 1111 1111
00 0000 0000 0001
00 0000 0000 0000
DAC Output
(16383/16384) VREF(+) V
(16382/16384) VREF(+) V
(8193/16384) VREF(+) V
(8192/16384) VREF(+) V
(8191/16384) VREF(+) V
(1/16384) VREF(+) V
0V
Table 13. Offset Data Format (REG1 = 1, REG0 = 0)
DB13 to DB0
11 1111 1111 1111
11 1111 1111 1110
10 0000 0000 0001
10 0000 0000 0000
01 1111 1111 1111
00 0000 0000 0001
00 0000 0000 0000
Offset (LSB)
+8191
+8190
+1
+0
−1
−8191
−8192
Table 14. Gain Data Format (REG1 = 0, REG0 = 1)
DB13 to DB1
1 1111 1111 1111
1 1111 1111 1110
1 0000 0000 0001
1 0000 0000 0000
0 1111 1111 1111
0 0000 0000 0001
0 0000 0000 0000
Gain
8192/8192
8191/8192
4098/8192
4097/8192
4096/8192
2/8192
1/8192
Table 15. Special Function Data Format (REG1 = 0, REG0 = 0)
DB13 to DB0
00000 10 1111111
00000 10 0000111
00000 10 0000001
00000 X0 0000000
00000 00 0000001
00000 00 0000111
00000 00 1111111
Increment/Decrement Step (LSB)
+127
+7
+1
0
−1
−7
−128
Table 16. Soft Reset (REG1 = 0, REG0 = 0)
DB13 to DB0
11 1111 1111 1111
Rev. B | Page 24 of 28
DAC Output
REFGND
AD5379
ADDRESS DECODING
The AD5379 contains an 8-bit address bus, A7 to A0. This
address bus allows each DAC input register (x1), each offset (c)
register, and each gain (m) register to be individually updated.
The REG1 and REG0 bits in the special function register (SFR)
(see Table 9) show the decoding for data, offset, and gain
registers. Note that when all 40 DAC channels are selected,
Address Bit A3 to Address Bit A0 are ignored.
Table 17. DAC Group Addressing
A7
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
A6
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A5
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A4
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Group
All 40 DACs
Group A
Group B
Groups A, B
Group C
Groups A, C
Groups B, C
Groups A, B, C
Group D
Groups A, D
Groups B, D
Groups A, B, D
Groups C, D
Groups A, C, D
Groups B, C, D
Groups A, B, C, D
A3
0
0
0
0
0
0
0
0
1
1
A2
0
0
0
0
1
1
1
1
0
0
A1
0
0
1
1
0
0
1
1
0
0
Rev. B | Page 25 of 28
A0
0
1
0
1
0
1
0
1
0
1
Data/Offset/Gain/INC-DEC Register
Register 0
Register 1
Register 2
Register 3
Register 4
Register 5
Register 6
Register 7
Register 8
Register 9
AD5379
POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to
ensure the rated performance. The printed circuit board on
which the AD5379 is mounted should be designed so that the
analog and digital sections are separated and confined to
certain areas of the board. If the AD5379 is in a system where
multiple devices require an AGND-to-DGND connection, the
connection should be made at one point only. The star ground
point should be established as close as possible to the device.
For supplies with multiple pins (VSS, VDD, VCC), it is recommended to tie these pins together and to decouple each
supply once.
The AD5379 should have ample supply decoupling of 10 μF in
parallel with 0.1 μF on each supply located as close to the
package as possible, ideally right up against the device. The
10 μF capacitors are the tantalum bead type. The 0.1 μF capacitor should have low effective series resistance (ESR) and
effective series inductance (ESI), such as the common ceramic
types that provide a low impedance path to ground at high
frequencies, to handle transient currents due to internal
logic switching.
Digital lines running under the device should be avoided,
because these couple noise onto the device. The analog ground
plane should be allowed to run under the AD5379 to avoid
noise coupling. The power supply lines of the AD5379 should
use as large a trace as possible to provide low impedance paths
and reduce the effects of glitches on the power supply line. Fast
switching digital signals should be shielded with digital ground
to avoid radiating noise to other parts of the board, and should
never be run near the reference inputs. It is essential to minimize noise on all VREF(+) and VREF(−) lines. The VBIAS pin should
be decoupled with a 10 nF capacitor to AGND.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A microstrip technique is by far the best, but not always
possible with a double-sided board. In this technique, the
component side of the board is dedicated to ground plane,
while signal traces are placed on the solder side.
As is the case for all thin packages, care must be taken to avoid
flexing the CSPBGA package and to avoid a point load on the
surface of this package during the assembly process.
POWER-ON
An on-chip power supply monitor makes the AD5379 robust to
power sequencing. The supply monitor powers up the analog
section after (VDD − VSS) is greater than 7 V (typical). The
output buffers power-up in CLR mode forced to the DUTGND
potential, even if VCC remains at 0 V. After VSS is applied, the
analog circuitry powers up, and the buffered DAC output level
settles linearly within the supply range.
Rev. B | Page 26 of 28
AD5379
TYPICAL APPLICATION CIRCUIT
The high channel count of the AD5379 makes it well-suited to
applications requiring high levels of integration such as optical
and automatic test equipment (ATE) systems. Figure 22 shows
the AD5379 as it would be used in an ATE system. Shown here
is one pin of a typical logic tester. It is apparent that a number of
discrete levels are required for the pin driver, active load circuit,
parametric measurement unit, comparators, and clamps.
In addition to the DAC levels required in the ATE system as
shown in Figure 22, drivers, loads, comparators, and parametric
measurement unit functions are also required. Analog Devices
provides solutions for all these functions.
DRIVEN SHIELD
DAC
CENTRAL PMU
ADC
GUARD AMP
DAC
DAC
PPMU
VCH
DAC
TIMING DATA
MEMORY
DAC
ADC
VTERM
VH
RELAYS
TIMING
GENERATOR
DLL LOGIC
50Ω COAX
DUT
FORMATTER DE-SKEW
DRIVER
DAC
VL
DAC
VCL
DAC
GND SENSE
VTH
FORMATTER DE-SKEW
COMP
VTL
DAC
DEVICE POWER
SUPPLY
DAC
ACTIVE LOAD
DAC
DAC
DAC
ADC
IOL
VCOM
03165-022
COMPARE
MEMORY
IOH
Figure 22. Typical Application Circuit for Logic Tester
Rev. B | Page 27 of 28
AD5379
OUTLINE DIMENSIONS
A1 CORNER
INDEX AREA
13.00
BSC SQ
12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
BALL A1
INDICATOR
11.00
BSC SQ
TOP VIEW
BOTTOM
VIEW
1.00 BSC
*1.85
1.70
1.55
DETAIL A
DETAIL A
1.05
1.00
0.90
0.75
0.70
0.65
SEATING
PLANE
*0.64 TYP
0.12 MAX
COPLANARITY
*COMPLIANT WITH JEDEC STANDARDS MO-192-AAD-1 WITH
THE EXCEPTION OF PACKAGE HEIGHT AND BALL DIAMETER.
012006-0
BALL DIAMETER
Figure 23. 108-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-108-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD5379ABC
AD5379ABCZ 1
EVAL-AD5379EBZ1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Linearity Error (LSBs)
±3
±3
Z = RoHS Compliant Part.
©2004–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03165-0-7/09(B)
Rev. B | Page 28 of 28
Package Description
108-Ball CSP_BGA
108-Ball CSP_BGA
Evaluation Board and Software
Package Option
BC-108-2
BC-108-2
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