(V = +5 V ⴞ 5%; AGND = DGND = O V; AD7776/AD7777/AD7778–SPECIFICATIONS CLKIN = 8 MHz; RTN = O V; C = 10 nF; all specifications T to T unless otherwise noted.) CC REFIN MIN MAX Parameter A Versions1 Units Conditions/Comments DC ACCURACY Resolution2 Relative Accuracy Differential Nonlinearity Bias Offset Error Bias Offset Error Match Plus or Minus Full-Scale Error Plus or Minus Full-Scale Error Match 10 ±1 ±1 ± 12 10 ± 12 10 Bits LSB max LSB max LSB max LSB max LSB max LSB max See Terminology No Missing Codes; See Terminology See Terminology Between Channels, AD7777/AD7778 Only; See Terminology See Terminology Between Channels, AD7777/AD7778 Only; See Terminology ANALOG INPUTS Input Voltage Range All Inputs Input Current VBIAS ± VSWING +200 V min/V max µA max VIN = VBIAS ± VSWING; Any Channel REFERENCE INPUT REFIN REFIN Input Current 1.9/2.1 +200 V min/V max µA max For Specified Performance 1.9/2.1 5 ±2 ±5 V min/V max Ω typ mV max mV max Nominal REFOUT = 2.0 V 20 mA max LOGIC OUTPUTS DB0–DB9, BUSY/INT VOL, Output Low Voltage VOH, Output High Voltage Floating State Leakage Current Floating State Capacitance3 ADC Output Coding 0.4 4.0 ± 10 10 Twos Complement V max V min µA max pF max LOGIC INPUTS DB0–DB9, CS, WR, RD, CLKIN Input Low Voltage, VINL Input High Voltage, VINH Input Leakage Current Input Capacitance3 0.8 2.4 10 10 V max V min µA max pF max 4.5 tCLKIN 5.5 tCLKIN + 70 14 tCLKIN 28 tCLKIN 125/500 50 40 ns min ns max ns max ns max ns min/ns max ns min ns min Period of Input Clock CLKIN Minimum High Time for CLKIN Minimum Low Time for CLKIN 4.75/5.25 15 1.5 V min/V max mA max mA max For Specified Performance CS = RD = +5 V, CR8 = 0 CR8 = 1. All Linear Circuitry OFF 500 µs max From Power-Down Mode REFERENCE OUTPUT REFOUT DC Output Impedance Reference Load Change Short Circuit Current3 CONVERSION TIMING Acquisition Time Single Conversion Double Conversion tCLKIN tCLKIN High tCLKIN Low POWER REQUIREMENTS VCC Range ICC, Normal Mode ICC, Power-Down Mode Power-Up Time to Operational Specifications DYNAMIC PERFORMANCE Signal to Noise and Distortion S/(N+D) Ratio Total Harmonic Distortion (THD) Intermodulation Distortion (IMD) Channel-to-Channel Isolation For Reference Load Current Change of 0 to ± 500 µA For Reference Load Current Change of 0 to ± 1 mA Reference Load Should Not Change During Conversion See Terminology ISINK = 1.6 mA ISOURCE = 200 µA See Terminology See Terminology –56 –60 –75 dB min dB min dB typ –90 dB typ VIN = 99.88 kHz Full-Scale Sine Wave with fSAMPLING = 380.95 kHz VIN = 99.88 kHz Full-Scale Sine Wave with fSAMPLING = 380.95 kHz fa = 103.2 kHz, fb = 96.5 kHz with fSAMPLING = 380.95 kHz. Both Signals Are Sine Waves at Half-Scale Amplitude VIN = 100 kHz Full-Scale Sine Wave with fSAMPLING = 380.95 kHz NOTES 1 Temperature range as follows: A = –40°C to +85°C. 2 1 LSB = (2 × VSWING)/1024 = 1.95 mV for V SWING = 1.0 V. 3 Guaranteed by design, not production tested. Specifications subject to change without notice. –2– REV. A AD7776/AD7777/AD7778 TIMING SPECIFICATIONS1, 2 (V CC = +5 V ⴞ 5%; AGND = DGND = 0 V; all specifications TMIN to TMAX, unless otherwise noted.) Parameter Label Limit at TMIN to TMAX Unit INTERFACE TIMING CS Falling Edge to WR or RD Falling Edge WR or RD Rising Edge to CS Rising Edge WR Pulsewidth CS or RD Active to Valid Data 3, 4 Bus Relinquish Time after RD3, 5 t1 t2 t3 t4 t5 0 0 53 60 10 45 55 10 1.5 tCLKIN 2.5 tCLKIN + 70 ns min ns min ns min ns max ns min ns max ns min ns min ns min ns max 19.5 tCLKIN + 70 33.5 tCLKIN + 70 60 ns max ns max ns max Data Valid to WR Rising Edge Data Valid after WR Rising Edge WR Rising Edge to BUSY Falling Edge WR Rising Edge to BUSY Rising Edge or INT Falling Edge WR or RD Falling Edge to INT Rising Edge t6 t7 t8 t9 t10 t11 Test Conditions/Comments Timed from Whichever Occurs Last CR9 = 0 Single Conversion, CR6 = 0 Double Conversion, CR6 = 1 CR9 = 1 NOTES 1 See Figures 1 to 3. 2 All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a voltage level of 1.6 V. 3 100% production tested. All other times are guaranteed by design, not production tested. 4 t4 is measured with the load circuit of Figure 4 and defined as the time required for an output to cross 0.8 V or 2.4 V. 5 t5 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 4. The measured time is then extrapolated back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time t 5 quoted above is the true bus relinquish time of the device and, as such, is independent of the external bus loading capacitance. Specifications subject to change without notice. FIRST CONVERSION FINISHED (CR6 = 0) SECOND CONVERSION FINISHED (CR6 = 1) AD7777/AD7778 ONLY t3 WR, RD t1 t2 t9 t8 CS BUSY (CR8 = 0) t11 RD t5 t4 t10 t9 INT (CR8 = 1) DB0–DB9 t10 Figure 3. BUSY/INT Timing Figure 1. Read Cycle Timing t1 IOL 1.6mA t2 CS t3 DB n WR t6 t7 +2.1V COUT 100pF DB0–DB9 IOH 200µA Figure 2. Write Cycle Timing Figure 4. Load Circuit for Bus Timing Characteristics REV. A –3– AD7776/AD7777/AD7778 ABSOLUTE MAXIMUM RATINGS* PQFP Package, Power Dissipation . . . . . . . . . . . . . . 500 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C (TA = +25°C unless otherwise noted) VCC to AGND or DGND . . . . . . . . . . . . . . . . . . –0.3 V, +7 V AGND, RTN to DGND . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V CS, RD, WR, CLKIN, DB0–DB9, BUSY/INT to DGND . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V Analog Input Voltage to AGND . . . . . . . –0.3 V, VCC + 0.3 V REFOUT to AGND . . . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V REFIN to AGND . . . . . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V Operating Temperature Range All Versions . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C DIP Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C SOIC Packages, Power Dissipation . . . . . . . . . . . . . . 875 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C *Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ORDERING GUIDE Model Temperature Range No. of Channels Package Option* AD7776AR AD7777AN AD7777AR AD7778AS –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 1 4 4 8 RW-24 N-28 RW-28 S-44 *R = SOIC, N = PDIP, S = PQFP CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7776/AD7777/AD7778 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE PIN CONFIGURATIONS 24-Lead SOIC DGND 5 DB4 6 DB5 TOP VIEW 7 (Not to Scale) 18 REFOUT DB6 8 17 VCC DB7 9 16 CLKIN 15 WR 13 RD 28-Lead PDIP and SOIC DB1 DB1 44 43 42 41 40 39 38 37 36 35 34 NC 1 33 AIN 8 NC 2 32 AIN 7 DB2 3 31 AIN 6 DB3 4 30 AIN 5 DGND 5 AD7778 DB4 6 TOP VIEW (Not to Scale) DB5 7 DB6 8 DB7 14 CS 11 BUSY/INT 12 DB0 NC 19 AGND NC 20 AIN AD7776 DB8 10 (MSB) DB9 44-Lead PQFP NC 21 REFIN RTN 4 REFIN 22 RTN DB3 AGND 3 CREFIN 23 AGND DB2 NC 24 CREFIN 2 DB0 1 DB1 NC DB0 28 CREFIN 1 27 AGND 2 29 AIN 4 28 AIN 3 27 AIN 2 26 AIN 1 9 25 AGND 6 23 AIN 3 DB4 7 DB5 8 DB6 AD7777 22 AIN2 TOP VIEW 21 AIN 1 (Not to Scale) 20 AGND 9 DB7 10 19 REFOUT DB8 11 18 VCC (MSB) DB9 12 BUSY/INT 13 RD 14 13 14 15 16 17 18 19 20 21 22 NC DGND 12 WR 24 AIN 4 CLKIN 5 CS VCC DB3 RD REFOUT 23 BUSY/INT 24 11 NC 10 NC (MSB) DB9 NC DB8 26 RTN 25 REFIN NC 3 4 NC NC DB2 NC = NO CONNECT 17 CLKIN 16 WR 15 CS NC = NO CONNECT –4– REV. A AD7776/AD7777/AD7778 PIN FUNCTION DESCRIPTION Mnemonic Description VCC +5 V Power Supply. AGND Analog Ground. DGND Digital Ground. Ground reference for digital circuitry. DB0–DB9 Input/Output Data Bus. This is a bidirectional data port from which ADC output data may be read and to which control register data may be written. BUSY/INT Busy/Interrupt Output. Active low logic output indicating A/D converter status. This logic output has two modes of operation depending on whether location CR9 of the control register has been set low or high: If CR9 is set low, the BUSY/INT output behaves as a BUSY signal. The BUSY signal goes low and stays low for the duration of a single conversion, or if simultaneous sampling has been selected, BUSY stays low for the duration of both conversions. If CR9 is set high, BUSY/INT output behaves as an INTERRUPT signal. The INT signal goes low and remains low after either a single conversion is completed or after a double conversion is completed if simultaneous sampling has been selected. With CR9 high, the falling edge of WR or RD resets the INT line high. CS Chip Select Input. The device is selected when this input is low. WR Write Input (Active Low). It is used in conjunction with CS to write data to the control register. Data is latched to the registers on the rising edge of WR. Following the rising edge of WR, the analog input is acquired and a conversion is started. RD Read Input (Active Low). It is used in conjunction with CS to enable the data outputs from the ADC registers. AIN1–8 Analog Inputs 1–8. The analog input range is VBIAS ± VSWING where VBIAS and VSWING are defined by the reference voltage applied to REFIN. Input resistance between any of the analog input pins and AGND is 10 kΩ or greater. REFIN Voltage Reference Input. The AD7776/AD7777/AD7778 are specified over a voltage reference range of 1.9 V to 2.1 V with a nominal value of 2.0 V. This REFIN voltage provides the VBIAS and VSWING levels for the input channel(s). VBIAS is equal to REFIN and VSWING is nominally equal to REFIN/2. Input resistance between this REFIN pin and AGND is 10 kΩ or greater. REFOUT Voltage Reference Output. This pin provides the internal voltage reference, which is nominally 2.0 V. It can provide the bias voltage (VBIAS) for the input channel(s). CREFIN Reference Decoupling Capacitor. A 10 nF capacitor must be connected from this pin to AGND to ensure correct operation of the high speed ADC. RTN Signal Return Path for the input channel(s). Normally RTN is connected to AGND at the package. CIRCUIT DESCRIPTION ADC Transfer Function 1FF 1FE For all versions, an input signal of the form VBIAS ± VSWING is expected. This VBIAS signal level operates as a pseudo ground to which all input signals must be referred. The VBIAS level is determined by the voltage applied to the REFIN pin. This can be driven by an external voltage source or, alternatively, by the onboard 2 V reference, available at REFOUT. The magnitude of the input signal swing is equal to VBIAS/2 (or REFIN/2) and is set internally. With a REFIN of 2 V, the analog input signal level varies from 1 V to 3 V, i.e., 2 ± 1 V. Figure 5 shows the transfer function of the ADC and its relationship to VBIAS and VSWING. The half-scale two's complement code of the ADC, 000 Hex (00 0000 0000 Binary), occurs at an input voltage equal to VBIAS. The input full-scale range of the ADC is equal to 2 VSWING, so that the Plus Full-Scale transition (1FE to 1FF) occurs at a voltage equal to VBIAS + VSWING – 1.5 LSBs, and the minus full-scale code transition (200 to 201) occurs at a voltage VBIAS – VSWING + 0.5 LSBs. REV. A ADC OUTPUT CODE (HEX) 000 202 201 200 VBIAS VBIAS –V SWING ANALOG INPUT, V IN VBIAS +V SWING Figure 5. ADC Transfer Function –5– AD7776/AD7777/AD7778 CONTROL REGISTER AD7778 The control register is 10-bit wide and can only be written to. On power-on, all locations in the control register are automatically loaded with 0s. For the single channel AD7776, locations CR0 to CR6 of the control register are “don’t cares.” For the quad channel AD7777, locations CR2 and CR5 are “don’t cares.” Individual bit functions are described below. CR5 0 0 0 0 1 1 1 1 CR0–CR2: Channel Address Locations. Determines which channel is selected and converted for single-channel operation. For simultaneous sampling operation, CR0–CR2 holds the address of one of the two channels to be sampled. CR0 Function X* X Select AIN1 X *X = Don’t Care AD7777 CR2 X* X X X CR1 0 0 1 1 CR0 0 1 0 1 CR0 0 1 0 1 0 1 0 1 Function Select AIN1 Select AIN2 Select AIN3 Select AIN4 Select AIN5 Select AIN6 Select AIN7 Select AIN8 CR3 0 1 0 1 CR7 Function 0 1 Normal Operating Mode Half-Scale Test Mode CR8: Determines whether the device is in the normal operating mode or in the power-down mode. CR8 Function 0 1 Normal Operating Mode Power-Down Mode In the power-down mode all linear circuitry is turned off and the REFOUT output is weakly (5 kΩ) pulled to AGND. The input impedance of the analog inputs and of the REFIN input remains the same in either normal mode or power-down mode. See under Circuit Description—Power-Down Mode. AD7777 CR4 0 0 1 1 Single channel operation. Channel select address is contained in locations CR0–CR2. Two channels simultaneously sampled and sequentially converted. Channel select addresses contained in locations CR0–CR2 and CR3–CR5. In the half-scale test mode, REFIN is internally connected as an analog input(s). In this mode, locations CR0–CR2 and CR3–CR5 are all “don’t cares” since it is REFIN which is converted. For the AD7777 and AD7778, the contents of location CR6 still determine whether a single or a double conversion is carried out on the REFIN level. CR3–CR5: Channel Address Locations. Only applicable for simultaneous sampling with the AD7777 or AD7778 when CR3–CR5 holds the address of the second channel to be sampled. CR5 X* X X X Function 0 CR7: Determines whether the device is in the normal operating mode or in the half-scale test mode. AD7778 CR1 0 0 1 1 0 0 1 1 Function Select AIN1 Select AIN2 Select AIN3 Select AIN4 Select AIN5 Select AIN6 Select AIN7 Select AIN8 CR6 1 Function Select AIN1 Select AIN2 Select AIN3 Select AIN4 *X = Don’t Care CR2 0 0 0 0 1 1 1 1 CR3 0 1 0 1 0 1 0 1 CR6: Determines whether operation is on a single channel or simultaneous sampling on two channels. Location CR6 is a “don’t care” for the AD7776. AD7776 CR2 CR1 CR4 0 0 1 1 0 0 1 1 Function Select AIN1 Select AIN2 Select AIN3 Select AIN4 CR9: Determines whether BUSY/INT output flag goes low and remains low during conversion(s) or else goes low and remains low after the conversion(s) is (are) complete. *X = Don’t Care CR9 BUSY/INT Functionality 0 Output goes low and remains low during conversion(s). Output goes low and remains low after conversion(s) is (are) complete. 1 –6– REV. A AD7776/AD7777/AD7778 ADC Conversion Start Timing Power-Down Figure 6 shows the operating waveforms for the start of a conversion cycle. On the rising edge of WR, the conversion cycle starts with the acquisition and tracking of the selected ADC channel, AIN1–8. The analog input voltage is held 40 ns (typically) after the first rising edge of CLKIN following four complete CLKIN cycles. If tD in Figure 6 is greater than 12 ns, the falling edge of CLKIN as shown is seen as the first falling clock edge. If tD is less than 12 ns, the first falling clock edge to be recognized does not occur until one cycle later. The AD7776/AD7777/AD7778 can be placed in a power-down mode simply by writing a logic high to location CR8 of the control register. The following changes are effected immediately upon writing a “1” to location CR8: Following the “hold” on the analog input(s), two complete CLKIN cycles are allowed for settling purposes before the MSB decision is made. The actual decision point occurs approximately 40 ns after the rising edge of CLKIN as shown in Figure 6. Two more CLKIN cycles are allowed for the second MSB decision. The succeeding bit decisions are made approximately 40 ns after each rising edge of CLKIN until the conversion is complete. At the end of conversion, if a single conversion has been requested (CR6 = 0), the BUSY/INT line changes state (as programmed by CR9) and the SAR contents are transferred to the first register ADCREG1. The SAR is then reset in readiness for a new conversion. If simultaneous sampling has been requested (CR6 = 1), no change occurs in the status of the BUSY/INT output, and the ADC automatically starts the second conversion. At the end of this conversion, the BUSY/INT line changes state (as programmed by CR9) and the SAR contents are transferred to the second register, ADCREG2. • The REFOUT output stops being driven and is weakly (5 kΩ) pulled to analog ground. • Any conversion in progress is terminated. • If a conversion is in progress, the leading edge of WR immediately drives the BUSY/INT output high. • All the linear circuitry is turned off. Control inputs CS, WR, and RD retain their purpose while the AD7776/AD7777/AD7778 is in power-down mode. If no conversions are in progress when the AD7776/AD7777/AD7778 is placed into power-down mode, the contents of the ADC registers, ADCREG1 and ADCREG2, are retained during power-down and can be read as normal. On returning to normal operating mode, a new conversion (or conversions, dependent on CR6) is automatically started. Upon completion, the invalid conversion results are loaded into the ADC registers, losing the previous valid results. To achieve the lowest possible power consumption in the power-down mode, special attention must be paid to the state of the digital and analog inputs and outputs: • Because each analog input channel sees a resistive divider to AGND, the input resistance of which does not change between normal and power-down modes, driving the analog input signals to 0 V or as close as possible to 0 V minimizes the power dissipated in the input signal conditioning circuitry. WR tD * CLKIN 40ns TYP 40ns TYP • Similarly, the REFIN input sees a resistive divider to AGND, the input resistance of which does not change between normal and power-down modes. If an external reference is being used, then driving this reference input to 0 V or as close as possible to 0 V minimizes the power dissipated in the input signal conditioning circuitry. VIN CHANNEL ACQUISITION 'HOLD' DB9 (MSB) * TIMING SHOWN FOR tD GREATER THAN 12ns Figure 6. ADC Conversion Start Timing • Since the REFOUT pin is pulled to AGND via, typically, a 5 kΩ resistor, any voltage above 0 V that this output may be pulled to by external circuitry dissipates unnecessary power. Track-and-Hold The track-and-hold (T/H) amplifiers on the analog input(s) of the AD7776/AD7777/AD7778 allow the ADC to accurately convert an input sine wave of 2 V peak-peak amplitude up to a frequency of 189 kHz, the Nyquist frequency of the ADC when operated at its maximum throughput rate of 378 kHz. This maximum rate of conversion includes conversion time and the time between conversions. Because the input bandwidth of the track-and-hold is much greater than 189 kHz, the input signal should be band limited to avoid folding unwanted signals into the band of interest. REV. A • Digital inputs CS, WR, and RD should all be held at VCC or as close as possible. CLKIN should be held as close as possible to either 0 V or VCC. • Since the BUSY/INT output is actively driven to a logic high, any loading on this pin to 0 V dissipates power. The AD7776/AD7777/AD7778 comes out of the power-down mode when a Logic “0” is written to location CR8 of the control register. Note that the contents of the other locations in the control register are retained when the device is placed in power-down and are valid when power is restored. However, coming out of power-down provides an opportunity to reload the complete contents of the control register without any extra instructions. –7– AD7776/AD7777/AD7778 Figure 10 shows the interface with the 80C196KB at 12 MHz and the 80C196KC at 16 MHz. One wait state is required with the 16 MHz machine. The 80C196 is configured to operate with a 16-bit multiplexed address/data bus. Microprocessor Interfacing Circuits The AD7776/AD7777/AD7778 family of ADCs is intended to interface to DSP machines such as the ADSP-2101, ADSP-2105, the TMS320 family and microcontrollers such as the 80C196 family. Table I provides a truth table for the AD7776/AD7777/AD7778 and summarizes their microprocessor interfacing features. Note that a read instruction to any of the devices while a conversion is in progress immediately stops that conversion and returns unreliable data over the data bus. Figure 7 shows the AD7776/AD7777/AD7778 interfaced to the TMS320C10 at 20.5 MHz and the TMS320C14 at 25 MHz. Figure 8 shows the interface with the TMS320C25 at 40 MHz. Note that one wait state is required with this interface. The ADSP-2101-50 and the ADSP-2105-40 interface is shown in Figure 9. One wait state is required with these machines. A11–A0 TMS320C10-20.5 TMS320C14-25 ADDRESS BUS ADDR DECODE WE A13–A0 CS AD7776/ AD7777/ AD7778* ADDR DECODE IS READY RD ADDR DECODE STRB R/W DATA BUS D23–D6 *ADDITIONAL PINS OMITTED FOR CLARITY Figure 9. AD7776/AD7777/AD7778 to ADSP-2101 and ADSP-2105 Interface ADDRESS BUS MSC AD15–AD6 (PORT 4) CS AD7776/ AD7777/ AD7778* DB9–DB0 PINS OMITTED FOR CLARITY Figure 7. AD7776/AD7777/AD7778 to TMS320C10 and TMS320C14 Interface A15–A0 WR RD ADSP-2101-50 ADSP-2105-40 DATA BUS *ADDITIONAL CS WR RD DB9–DB0 D15–D0 EN DMS WR (C10) DEN (C14) REN ADDRESS BUS AD7776/ AD7777/ AD7778* ALE 80C196KB-12 80C196KC-16 WR ADDRESS BUS ‘373 LATCH ADDR DECODER CS AD7776/ AD7777/ AD7778* RD TMS320C25-40 DB9–DB0 WR WR RD RD DATA BUS (10) D15–D0 AD7–AD0 (PORT 3) DATA BUS *ADDITIONAL DB9–DB0 *ADDITIONAL PINS OMITTED FOR CLARITY PINS OMITTED FOR CLARITY Figure 8. AD7776/AD7777/AD7778 to TMS320C25 Interface Figure 10. AD7776/AD7777/AD7778 to 80C196 Interface –8– REV. A AD7776/AD7777/AD7778 Table I. AD7776/AD7777/AD7778 Truth Table for Microprocessor Interfacing CS RD WR DB0–DB9 Function/Comments 1 X* X* High Z Data Port High Impedance 0 1 j CR Data Load control register (CR) data to control register and start a conversion. 0 k 1 ADC Data ADC data placed on data bus. Depending upon location CR6 of the control register, one or two Read instructions are required. If CR6 is low, i.e., single-channel conversion selected, a read instruction returns the contents of ADCREG1. Succeeding read instructions continue to return the contents of ADCREG1. If CR6 is high, i.e., simultaneous sampling (double conversion) selected, the first read instruction returns the contents of ADCREG1 while the second read instruction returns the contents of ADCREG2. A third read instruction returns ADCREG1 again, the fourth ADCREG2, etc. *X = Don’t Care DESIGN INFORMATION Layout Hints TERMINOLOGY Relative Accuracy Ensure that the layout for the printed circuit board has the digital and analog grounds separated as much as possible. Take care not to run any digital track alongside an analog signal track. Guard (screen) the analog input(s) with RTN. For the AD7776/AD7777/AD7778, relative accuracy or endpoint nonlinearity is the maximum deviation, in LSBs, of the ADC’s actual code transition points from a straight line drawn between the endpoints of the ADC transfer function. Establish a single-point analog ground separate from the logic system ground and as close as possible to the AD7776/AD7777/ AD7778. Both the RTN and AGND pins on the AD7776/ AD7777/AD7778 and all other signal grounds should be connected to this single point analog ground. In turn, this star ground should be connected to the digital ground at one point only—preferably at the low impedance power supply itself. Differential Nonlinearity Low impedance analog and digital power supply common returns are important for correct operation of the devices, so make the foil width for these tracks as wide as possible. To ensure a low impedance +5 V power supply at the actual VCC pin, it is necessary to use bypass capacitors from the pin itself to DGND. A 4.7 µF tantalum capacitor in parallel with a 0.1 µF ceramic capacitor is sufficient. ADC Corruption Executing a read instruction to the AD7776/AD7777/AD7778 while a conversion is in progress immediately halts the conversion and returns invalid data over the data bus. The BUSY/ INT output pin should be monitored closely and all read instructions to the AD7776/AD7777/AD7778 prevented while this output shows that a conversion is in progress. Executing a write instruction to the AD7776/AD7777/AD7778 while a conversion is in progress immediately halts the conversion, while the falling edge of WR driving the BUSY/INT output high. The analog input(s) is sampled as normal, and a new conversion sequence (dependent upon CR6) is started. ADC Conversion Time Although each conversion takes only 14 CLKIN cycles, it can take between 4.5 and 5.5 CLKIN cycles to acquire the analog input(s) after the WR input goes high and before any conversions start. REV. A Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified maximum differential nonlinearity of ± 1 LSB ensures no missed codes. Bias Offset Error For an ideal 10-bit ADC, the output code for an input voltage equal to VBIAS should be midscale. The bias offset error is the difference between the actual midpoint voltage for midscale code and VBIAS, expressed in LSBs. Bias Offset Error Match This is a measure of how closely the bias offset errors of all channels track each other. The bias offset error match of any channel must be no further away than 10 LSBs from the bias offset error of any other channel, regardless of whether the channels are independently sampled or simultaneously sampled. Plus and Minus Full-Scale Error The input channels of the ADC can be considered to have bipolar (positive and negative) input ranges, but are referred to VBIAS (or REFIN) instead of AGND. Positive full-scale error for the ADC is the difference between the actual input voltage required to produce the plus full-scale code transition and the ideal input voltage (VBIAS + VSWING –1.5 LSB), expressed in LSBs. Minus full-scale error is similarly specified for the minus full-scale code transition, relative to the ideal input voltage for this transition (VBIAS – VSWING + 0.5 LSB). Note that the full-scale errors for the ADC input channels are measured after their respective bias offset errors have been adjusted out. Plus and Minus Full-Scale Error Match This is a measure of how closely the full-scale errors of all channels track each other. The full-scale error match of any channel must be no further away than 10 LSBs from the respective full-scale error of any other channel, regardless of whether the channels are independently sampled or simultaneously sampled. –9– AD7776/AD7777/AD7778 Short Circuit Current Figure 11 shows a 2048-point FFT plot for a single channel of the AD7778 with an input signal of 99.88 kHz. The SNR is 58.71 dB. It can be seen that most of the harmonics are buried in the noise floor. It should be noted that the harmonics are taken into account when calculating the S/(N+D). This is defined as the maximum current which flows either into or out of the REFOUT pin if this pin is shorted to any potential between 0 V and VCC. This condition can be allowed for up to 10 seconds provided that the power dissipation of the package is not exceeded. 0 Signal-to-Noise and Distortion Ratio, S/(N+D) SIGNAL AMPLITUDE – dB Signal-to-noise and distortion ratio, S/(N+D), is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics, but excluding dc. The value for S/(N+D) is given in decibels. Total Harmonic Distortion, THD Total harmonic distortion is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal and is expressed in decibels. For the AD7776/AD7777/ AD7778, total harmonic distortion (THD) is defined as: 20 log (V 2 2 + V3 2 + V4 2 + V5 2 + V6 INPUT FREQUENCY = 99.88kHz SAMPLE FREQUENCY = 380.95kHz SNR = 58.7dB TA = 25ⴗC –20 –40 –60 –80 ) 2 12 –90 0 99.88 FREQUENCY – kHz V1 Figure 11. ADC FFT Plot where V1 is the rms amplitude of the fundamental and V2, V3, V4, V5, and V6 are the rms amplitudes of the individual harmonics. The relationship between S/(N+D) and resolution (n) is expressed by the following equation: Intermodulation Distortion, IMD With inputs consisting of sine waves at two frequencies, fa and fb, any active device with nonlinearities creates distortion products, of order (m + n), at sum and difference frequencies of mfa + nfb, where m, n = 0, 1, 2, 3. Intermodulation terms are those for which m or n is not equal to zero. For example, the second order terms include (fa + fb) and (fa – fb) and the third order terms include (2 fa + fb), (2 fa – fb), (fa + 2 fb), and (fa – 2 fb). S ( N + D ) = (6.02n + 1.76) dB This is for an ideal part with no differential or integral linearity errors. These errors cause a degradation in S/(N+D). By working backwards from the above equation, it is possible to get a measure of ADC performance expressed in effective number of bits (n). Channel-to-Channel Isolation DIGITAL SIGNAL PROCESSING APPLICATIONS n (effective ) = S ( N + D ) (dB ) − 1.76 6.02 The effective number of bits plotted versus frequency for a single channel of the AD7778 is shown in Figure 12. The effective number of bits is typically 9.5. In digital signal processing (DSP) application areas like voice recognition, echo cancellation, and adaptive filtering, the dynamic characteristics S/(N+D), THD, and IMD of the ADC are critical. The AD7776/AD7777/AD7778 are specified dynamically as well as with standard dc specifications. Because the track/hold amplifier has a wide bandwidth, an antialiasing filter should be placed on the analog inputs to avoid aliasing high frequency noise back into the bands of interest. The dynamic performance of the ADC is evaluated by applying a sine wave signal of very low distortion to a single analog input which is sampled at 380.95 kHz. A fast Fourier transform (FFT) plot or histogram plot is then generated from which the signal to noise and distortion, harmonic distortion, and dynamic differential nonlinearity data can be obtained. Similarly, for intermodulation distortion, an input signal consisting of two pure sine waves at different frequencies is applied to the AD7776/AD7777/AD7778. –10– 10.0 EFFECTIVE NUMBER OF BITS Channel-to-channel isolation is a measure of the level of cross-talk between channels. It is measured by applying a full-scale 100 kHz sine wave signal to any one of the input channels and monitoring the remaining channels. The figure given is the worst case across all channels. 9.5 SAMPLE FREQUENCY = 378.4kHz TA = 24ⴗC 9.0 8.5 8.0 7.5 0 189.2 INPUT FREQUENCY – kHz Figure 12. Effective Number of Bits vs. Frequency REV. A AD7776/AD7777/AD7778 Changing the Analog Input Voltage Range By biasing the RTN pin above AGND, it is possible to change the analog input voltage range from its VBIAS ± VSWING format to a more traditional 0 V to VREF range. The new input range can be described as VOFFSET to (VOFFSET + REFIN ) where 0 V ≤ VOFFSET ≤ 1 V. To produce this range, the RTN pin must be biased to (REFIN – 2 VOFFSET). For instance, if RTN is tied to REFOUT, then the analog input range becomes 0 V to 2 V. The fixed 2 V analog input voltage span of the ADC can range from 1 V to 3 V (RTN = 0 V) to 0 V to 2 V (RTN = 2 V), i.e., with proper biasing, an input signal range from 0.3 V to 2.3 V can be covered. Both the relative accuracy and differential nonlinearity performance remain essentially unchanged in this mode, while the SNR and THD performance are typically 2 dB to 3 dB worse than standard. OUTLINE DIMENSIONS 24-Lead Standard Small Outline Package [SOIC] Wide Body (RW-24) Dimensions shown in millimeters and (inches) 15.60 (0.6142) 15.20 (0.5984) 24 13 7.60 (0.2992) 7.40 (0.2913) 1 10.65 (0.4193) 10.00 (0.3937) 12 2.65 (0.1043) 2.35 (0.0925) 0.75 (0.0295) ⴛ 45ⴗ 0.25 (0.0098) 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 1.27 (0.0500) BSC 0.51 (0.020) 0.33 (0.013) 8ⴗ 0ⴗ SEATING 0.32 (0.0126) PLANE 0.23 (0.0091) 1.27 (0.0500) 0.40 (0.0157) COMPLIANT TO JEDEC STANDARDS MS-013AD CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 28-Lead Standard Small Outline Package [SOIC] Wide Body (RW-28) Dimensions shown in millimeters and (inches) 18.10 (0.7126) 17.70 (0.6969) 28 15 7.60 (0.2992) 7.40 (0.2913) 1 14 10.65 (0.4193) 10.00 (0.3937) 2.65 (0.1043) 2.35 (0.0925) 0.75 (0.0295) ⴛ 45ⴗ 0.25 (0.0098) 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 8ⴗ 0ⴗ 1.27 (0.0500) 0.51 (0.0201) SEATING 0.32 (0.0126) BSC 0.33 (0.0130) PLANE 0.23 (0.0091) 1.27 (0.0500) 0.40 (0.0157) COMPLIANT TO JEDEC STANDARDS MS-013AE CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN REV. A –11– AD7776/AD7777/AD7778 OUTLINE DIMENSIONS 28-Lead Plastic Dual-in-Line Package [PDIP] (N-28) C01196–0–10/02(A) Dimensions shown in millimeters and (inches) 39.70 (1.5630) 35.10 (1.3819) 28 15 14.73 (0.5799) 12.32 (0.4850) 1 14 1.52 (0.0598) 0.38 (0.0150) 6.35 (0.2500) MAX 15.87 (0.6248) 15.24 (0.6000) 3.81 (0.1500) MIN 5.05 (0.1988) 1.77 0.56 (0.0220) 2.54 3.18 (0.1252) 0.36 (0.0142) (0.1000) (0.0697) MAX BSC 4.95 (0.1949) 3.18 (0.1252 ) 0.38 (0.0150) 0.20 (0.0079) SEATING PLANE CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 44-Lead Plastic Quad Flatpack [PQFP] (S-44) Dimensions shown in millimeters 13.20 BSC SQ 1.03 0.88 0.73 10.00 BSC SQ 2.45 MAX 8ⴗ 0.8ⴗ SEATING PLANE 33 23 34 22 TOP VIEW COPLANARITY 0.10 (PINS DOWN) PIN 1 12 44 1 0.25 MAX 2.20 2.00 1.80 0.80 BSC 11 0.45 0.29 PRINTED IN U.S.A. COMPLIANT TO JEDEC STANDARDS MS-022-AB Revision History Location Page 10/02—Data Sheet changed from REV. 0 to REV. A. Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Changes to Total Harmonic Distortion, THD section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Changes to OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 –12– REV. A