AD AD7947 3mw, 100ksps, 14-bit adc in 6-lead sot-23 Datasheet

3 mW, 100 kSPS,
14-Bit ADC in 6-Lead SOT-23
AD7940
FUNCTIONAL BLOCK DIAGRAM
FEATURES
APPLICATIONS
Battery-powered systems
Personal digital assistants
Medical instruments
Mobile communications
Instrumentation and control systems
Remote data acquisition systems
VDD
VIN
T/H
14-BIT SUCCESSIVE
APPROXIMATION
ADC
AD7940
CONTROL
LOGIC
SCLK
SDATA
CS
03305-0-001
Fast throughput rate: 100 kSPS
Specified for VDD of 2.5 V to 5.5 V
Low power
4 mW typ at 100 kSPS with 3 V supplies
17 mW typ at 100 kSPS with 5 V supplies
Wide input bandwidth:
81 dB SINAD at 10 kHz input frequency
Flexible power/serial clock speed management
No pipeline delays
High speed serial interface
SPI®/QSPI™/MICROWIRE™/DSP compatible
Standby mode: 0.5 µA max
6-Lead SOT-23 and 8-Lead MSOP packages
GND
Figure 1.
Table 1. 16-Bit and 14-Bit ADC (MSOP and SOT-23)
Type
16-Bit True Differential
16-Bit Pseudo Differential
16-Bit Unipolar
14-Bit True Differential
14-Bit Pseudo Differential
14-Bit Unipolar
100 kSPS
AD7684
AD7683
AD7680
250 kSPS
AD7687
AD7685
500 kSPS
AD7688
AD7686
AD7944
AD7942
AD7947
AD7946
AD7940
GENERAL DESCRIPTION
The AD79401 is a 14-bit, fast, low power, successive approximation ADC. The part operates from a single 2.50 V to 5.5 V power
supply and features throughput rates up to 100 kSPS. The part
contains a low noise, wide bandwidth track-and-hold amplifier
that can handle input frequencies in excess of 7 MHz.
The conversion process and data acquisition are controlled
using CS and the serial clock, allowing the devices to interface
with microprocessors or DSPs. The input signal is sampled on
the falling edge of CS and the conversion is also initiated at this
point. There are no pipelined delays associated with the part.
The AD7940 uses advanced design techniques to achieve very
low power dissipation at fast throughput rates. The reference for
the part is taken internally from VDD, which allows the widest
dynamic input range to the ADC. Thus, the analog input range
for this part is 0 V to VDD. The conversion rate is determined by
the SCLK frequency.
1
This part features a standard successive approximation ADC
with accurate control of the sampling instant via a CS input and
once off conversion control.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
5.
First 14-bit ADC in a SOT-23 package.
High throughput with low power consumption.
Flexible power/serial clock speed management. The conversion rate is determined by the serial clock, allowing the
conversion time to be reduced through the serial clock
speed increase. This allows the average power consumption
to be reduced when a power-down mode is used while not
converting. The part also features a shutdown mode to
maximize power efficiency at lower throughput rates.
Power consumption is 0.5 µA max when in shutdown.
Reference derived from the power supply.
No pipeline delay.
Protected by U.S. Patent No. 6,681,332.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
© 2004 Analog Devices, Inc. All rights reserved.
AD7940
TABLE OF CONTENTS
Specifications..................................................................................... 3
Normal Mode.............................................................................. 13
Timing Specifications....................................................................... 5
Power-Down Mode.................................................................... 14
Absolute Maximum Ratings............................................................ 6
Power vs. Throughput Rate ........................................................... 15
ESD Caution.................................................................................. 6
Serial Interface ................................................................................ 16
Pin Configurations and Function Descriptions ........................... 7
Microprocessor Interfacing........................................................... 17
Terminology ...................................................................................... 8
AD7940 to TMS320C541 .......................................................... 17
Typical Performance Characteristics ............................................. 9
AD7940 to ADSP-218x.............................................................. 17
Circuit Information ........................................................................ 11
AD7940 to DSP563xx ................................................................ 18
Converter Operation.................................................................. 11
Application Hints ........................................................................... 19
Analog Input ............................................................................... 11
Grounding and Layout .............................................................. 19
ADC Transfer Function ................................................................. 12
Evaluating the AD7940 Performance ...................................... 19
Typical Connection Diagram ................................................... 12
Outline Dimensions ....................................................................... 20
Modes of Operation ....................................................................... 13
Ordering Guide .......................................................................... 20
REVISION HISTORY
6/04—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
AD7940
SPECIFICATIONS1
VDD = 2.50 V to 5.5 V, fSCLK = 2.5 MHz, fSAMPLE = 100 kSPS, unless otherwise noted; TA = TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
DYNAMIC PERFORMANCE
Signal-to-Noise + Distortion (SINAD)2
Total Harmonic Distortion (THD)2
Peak Harmonic or Spurious Noise (SFDR)2
Intermodulation Distortion (IMD)2
Second-Order Terms
Third-Order Terms
Aperture Delay
Aperture Jitter
Full Power Bandwidth
B Version
Unit
81
−98
−95
dB min
dB typ
dB typ
−94
−100
20
30
7
2
dB typ
dB typ
ns max
ps typ
MHz typ
MHz typ
Offset Error2
Gain Error2
ANALOG INPUT
Input Voltage Ranges
DC Leakage Current
Input Capacitance
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
14
13
±1
±2
±6
±8
Bits min
Bits min
LSB max
LSB max
LSB max
LSB max
0 to VDD
±0.3
30
V
µA max
pF typ
Input Current, IIN
Input Capacitance, CIN2, 3
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Leakage Current
Floating-State Output Capacitance2, 3
Output Coding
CONVERSION RATE
Conversion Time
Track-and-Hold Acquisition Time
2.4
0.4
0.8
±0.3
10
V min
V max
V max
µA max
pF max
VDD – 0.2
V min
0.4
V max
±0.3
µA max
10
pF max
Straight (Natural) Binary
ISOURCE = 200 µA; VDD = 2.50 V to 5.25 V
ISINK = 200 µA
Throughput Rate
POWER REQUIREMENTS
VDD
IDD
Normal Mode (Static)
8
500
400
100
µs max
ns max
ns max
kSPS max
16 SCLK cycles
Full-scale step input
Sine wave input ≤ 10 kHz
See the Serial Interface section
2.50/5.5
V min/V max
5.2
2
4.8
1.9
0.5
0.3
mA max
mA max
mA max
mA max
µA max
µA max
DC ACCURACY
Resolution
Integral Nonlinearity2
Normal Mode (Operational)
Full Power-Down Mode
1
Rev. 0 | Page 3 of 20
Test Conditions/Comments
fIN = 10 kHz sine wave
@ −3 dB
@ −0.1 dB
VDD = 2.5 V to 4.096 V
VDD > 4.096 V
VDD = 2.5 V to 4.096 V
VDD > 4.096 V
VDD = 3 V
VDD = 5 V
Typically 10 nA, VIN = 0 V or VDD
Digital I/PS = 0 V or VDD
VDD = 5.5 V; SCLK on or off
VDD = 3.6 V; SCLK on or off
VDD = 5.5 V; fSAMPLE = 100 kSPS; 3.3 mA typ
VDD = 3.6 V; fSAMPLE = 100 kSPS; 1.29 mA typ
SCLK on or off. VDD = 5.5 V
SCLK on or off. VDD = 3.6 V
AD7940
Parameter
Power Dissipation4
Normal Mode (Operational)
Full Power-Down
B Version
Unit
26.4
6.84
2.5
1.08
mW max
mW max
µW max
µW max
1
1
Temperature range for B Version is –40°C to +85°C.
See the Terminology section.
Sample tested at initial release to ensure compliance.
4
See the Power vs. Throughput Rate section.
2
3
Rev. 0 | Page 4 of 20
Test Conditions/Comments
VDD = 5.5 V
VDD = 5.5 V; fSAMPLE = 100 kSPS
VDD = 3.6 V; fSAMPLE = 100 kSPS
VDD = 5.5 V
VDD = 3.6 V
AD7940
TIMING SPECIFICATIONS
Sample tested at initial release to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from
a voltage level of 1.6 V.
VDD = 2.50 V to 5.5 V; TA = TMIN to TMAX, unless otherwise noted.
Table 3.
tCONVERT
tQUIET
Limit at TMIN, TMAX
3V
5V
250
250
2.5
2.5
16 × tSCLK
16 × tSCLK
50
50
Unit
kHz min
MHz max
min
ns min
t1
t2
t32
t42
t5
t6
t7
t83
tPOWER-UP4
10
10
48
120
0.4 tSCLK
0.4 tSCLK
10
45
1
ns min
ns min
ns max
ns max
ns min
ns min
ns min
ns max
µs typ
Parameter
fSCLK1
10
10
35
80
0.4 tSCLK
0.4 tSCLK
10
35
1
Description
Minimum quiet time required between bus relinquish and start of
next conversion
Minimum CS pulse width
CS to SCLK setup time
Delay from CS until SDATA three-state disabled
Data access time after SCLK falling edge
SCLK low pulse width
SCLK high pulse width
SCLK to data valid hold time
SCLK falling edge to SDATA high impedance
Power up time from full power-down
1
Mark/space ratio for the SCLK input is 40/60 to 60/40.
Measured with the load circuit of Figure 2 and defined as the time required for the output to cross 0.8 V or 2.0 V.
3
t8 is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 2. The measured number is then extrapolated
back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t8, quoted in the timing characteristics is the true bus relinquish
time of the part and is independent of the bus loading.
4
See the Power vs. Throughput Rate section.
2
200µA
1.6V
CL
50pF
200µA
IOH
03305-0-002
TO OUTPUT
PIN
IOL
Figure 2. Load Circuit for Digital Output Timing Specification
Rev. 0 | Page 5 of 20
AD7940
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
VDD to GND
Analog Input Voltage to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Input Current to Any Pin Except Supplies1
Operating Temperature Range
Commercial (B Version)
Storage Temperature Range
Junction Temperature
SOT-23 Package, Power Dissipation
θJA Thermal Impedance
θJC Thermal Impedance
MSOP Package, Power Dissipation
θJA Thermal Impedance
θJC Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 secs)
Infared (15 secs)
ESD
1
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
±10 mA
−40°C to +85°C
−65°C to +150°C
150°C
450 mW
229.6°C/W
91.99°C/W
450 mW
205.9°C/W
43.74°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
215°C
220°C
4 kV
Transient currents of up to 100 mA will not cause SCR latch-up.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 6 of 20
AD7940
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
SOT-23
6
CS
5
SDATA
TOP VIEW
VIN 3 (Not to Scale) 4 SCLK
VDD 1
GND 2
8
AD7490
CS
SDATA
TOP VIEW
GND 3 (Not to Scale) 6 NC
VIN 4
5 SCLK
Figure 3. SOT-23 Pin Configuration
7
NC = NO CONNECT
03305-0-003
AD7940
03305-0-023
VDD 1
GND 2
MSOP
Figure 4. MSOP Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
SOT-23
1
2
Pin No.
MSOP
1
2, 3
Mnemonic
VDD
GND
3
4
4
5
VIN
SCLK
5
7
SDATA
6
8
CS
N/A
6
NC
Function
Power Supply Input. The VDD range for the AD7940 is from 2.5 V to 5.5 V.
Analog Ground. Ground reference point for all circuitry on the AD7940. All analog input signals should
be referred to this GND voltage.
Analog Input. Single-ended analog input channel. The input range is 0 V to VDD.
Serial Clock. Logic input. SCLK provides the serial clock for accessing data from this part. This clock
input is also used as the clock source for the AD7940's conversion process.
Data Out. Logic output. The conversion result from the AD7940 is provided on this output as a serial
data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream from the
AD7940 consists of two leading zeros followed by 14 bits of conversion data that are provided MSB
first. This will be followed by four trailing zeroes if CS is held low for a total of 24 SCLK cycles. See the
Serial Interface section.
Chip Select. Active low logic input. This input provides the dual function of initiating conversions on
the AD7940 and framing the serial data transfer.
No Connect. This pin should be left unconnected.
Rev. 0 | Page 7 of 20
AD7940
TERMINOLOGY
Integral Nonlinearity
This is the maximum deviation from a straight line passing
through the endpoints of the ADC transfer function. The endpoints of the transfer function are zero scale, a point 1/2 LSB
below the first code transition, and full scale, a point 1/2 LSB
above the last code transition.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of harmonics to the fundamental. For the AD7940, it is defined as
Differential Nonlinearity
This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
where V1 is the rms amplitude of the fundamental and V2, V3,
V4, V5, and V6 are the rms amplitudes of the second through the
sixth harmonics.
Offset Error
This is the deviation of the first code transition (00 . . . 000) to
(00 . . . 001) from the ideal, i.e., AGND + 1 LSB.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to fS/2, excluding dc) to the rms value of the fundamental. Normally, the value of this specification is determined by the largest harmonic in the spectrum, but for ADCs
where the harmonics are buried in the noise floor, it will be a
noise peak.
Gain Error
This is the deviation of the last code transition (111 . . . 110) to
(111 . . . 111) from the ideal (i.e., VREF − 1 LSB) after the offset
error has been adjusted out.
Track-and-Hold Acquisition Time
The track-and-hold amplifier returns to track mode at the end
of conversion. The track-and-hold acquisition time is the time
required for the output of the track-and-hold amplifier to reach
its final value, within ±1 LSB, after the end of the conversion.
See the Serial Interface section for more details.
Signal-to-(Noise + Distortion) Ratio
This is the measured ratio of signal-to-(noise + distortion) at
the output of the ADC. The signal is the rms amplitude of the
fundamental. Noise is the sum of all nonfundamental signals up
to half the sampling frequency (fS/2, excluding dc). The ratio
depends on the number of quantization levels in the digitization
process; the more levels, the smaller the quantization noise. The
theoretical signal-to-(noise + distortion) ratio for an ideal N-bit
converter with a sine wave input is given by
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB
Thus, for a 14-bit converter, this is 86.04 dB.
THD (dB) = 20 log
V2 2 + V3 2 + V4 2 + V5 2 + V6 2
V1
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and fb,
any active device with nonlinearities will create distortion products at sum and difference frequencies of mfa ± nfb where m, n =
0, 1, 2, 3. Intermodulation distortion terms are those for which
neither m nor n are equal to zero. For example, the second-order
terms include (fa + fb) and (fa − fb), while the third-order terms
include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa −2fb).
The AD7940 is tested using the CCIF standard where two input
frequencies near the top end of the input bandwidth are used.
In this case, the second-order terms are usually distanced in
frequency from the original sine waves, while the third-order
terms are usually at a frequency close to the input frequencies.
As a result, the second- and third-order terms are specified
separately. The calculation of the intermodulation distortion is
as per the THD specification where it is the ratio of the rms
sum of the individual distortion products to the rms amplitude
of the sum of the fundamentals expressed in dBs.
Rev. 0 | Page 8 of 20
AD7940
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 5 shows a typical FFT plot for the AD7940 at 100 kSPS
sample rate and 10 kHz input frequency. Figure 6 shows the
signal-to-(noise + distortion) ratio performance versus the
input frequency for various supply voltages while sampling at
100 kSPS with an SCLK of 2.5 MHz.
Figure 7 shows a graph of the total harmonic distortion versus
the analog input frequency for various supply voltages, while
Figure 8 shows a graph of the total harmonic distortion versus
the analog input frequency for various source impedances (see
the Analog Input section). Figure 9 and Figure 10 show the
typical INL and DNL plots for the AD7940.
0
110
VDD = 4.75V
FSAMPLE = 100kSPS
FIN = 10kHz
SNR = 84.48dB
SINAD = 84.35dB
THD = –98.97dB
SFDR = –100.84dB
–40
105
VDD = 3V
VDD = 3.6V
VDD = 2.7V
100
THD (dB)
–80
VDD = 4.3V
95
–100
90
VDD = 5.25V
VDD = 2.5V
VDD = 4.75V
–120
85
03305-0-019
–140
–160
0
10k
20k
30k
40k
80
10
50k
FREQUENCY (kHz)
100
INPUT FREQUENCY (kHz)
Figure 5. AD7940 Dynamic Performance at 100 kSPS
Figure 7. AD7940 THD vs. Analog Input Frequency
for Various Supply Voltages at 100 kSPS
90
110
FSAMPLE = 100kSPS
TA = 25°C
105
VDD = 5.25V
03305-0-021
(dB)
–60
FSAMPLE = 100kSPS
TA = 25°C
FSAMPLE = 100kSPS
TA = 25°C
VDD = 4.75V
100
VDD = 4.75V
85
RIN = 10Ω
SINAD (dB)
95
THD (dB)
VDD = 4.3V
VDD = 3.6V
80
RIN = 100Ω
VDD = 3V
85
VDD = 2.7V
80
03305-0-020
VDD = 2.5V
RIN = 50Ω
90
75
10
75
RIN = 1000Ω
70
10
100
INPUT FREQUENCY (kHz)
100
INPUT FREQUENCY (kHz)
Figure 6. AD7940 SINAD vs. Analog Input Frequency
for Various Supply Voltages at 100 kSPS
Figure 8. AD7940 THD vs. Analog Input Frequency
for Various Source Impedances
Rev. 0 | Page 9 of 20
03305-0-022
–20
AD7940
0.8
VDD = 3.00V
TEMP = 25°C
0.6
0.6
0.4
DNL ERROR (LSB)
0.8
0.4
0.2
0
VDD = 3.00V
TEMP = 25°C
0.2
0
–0.2
–0.4
–0.4
–0.6
0
2000
4000
6000
03305-0-017
–0.2
03305-0-018
INL ERROR (LSB)
1.0
–0.6
–0.8
8000 10000 12000 14000 16000 18000
0
CODE
2000
4000
6000
8000 10000 12000 14000 16000 18000
CODE
Figure 9. AD7940 Typical INL
Figure 10. AD7940 Typical DNL
Rev. 0 | Page 10 of 20
AD7940
CIRCUIT INFORMATION
The AD7940 is a fast, low power, 14-bit, single-supply ADC. The
part can be operated from a 2.50 V to 5.5 V supply. When operated
at either 5 V or 3 V supply, the AD7940 is capable of throughput
rates of 100 kSPS when provided with a 2.5 MHz clock.
The AD7940 also features a power-down option to save power
between conversions. The power-down feature is implemented
across the standard serial interface as described in the Modes of
Operation section.
CONVERTER OPERATION
The AD7940 is a 14-bit, successive approximation ADC based
around a capacitive DAC. The AD7940 can convert analog
input signals in the 0 V to VDD range. Figure 11 and Figure 12
show simplified schematics of the ADC. The ADC comprises of
control logic, SAR, and a capacitive DAC. Figure 11 shows the
ADC during its acquisition phase. SW2 is closed and SW1 is in
Position A. The comparator is held in a balanced condition and
the sampling capacitor acquires the signal on the selected VIN
channel.
CAPACITIVE
DAC
SAMPLING
CAPACITOR
CONTROL
LOGIC
B
ACQUISITION SW2
PHASE
VDD/2
COMPARATOR
SW1
CONTROL
LOGIC
B
CONVERSION SW2
PHASE
COMPARATOR
VDD/2
Figure 12. ADC Conversion Phase
ANALOG INPUT
Figure 13 shows an equivalent circuit of the analog input structure of the AD7940. The two diodes, D1 and D2, provide ESD
protection for the analog inputs. Care must be taken to ensure
that the analog input signal never exceeds the supply rails by
more than 300 mV. This will cause these diodes to become
forward-biased and to start conducting current into the substrate. The maximum current these diodes can conduct without
causing irreversible damage to the part is 10 mA. Capacitor C1
in Figure 13 is typically about 5 pF and primarily can be attributed to pin capacitance. Resistor R1 is a lumped component
made up of the on resistance of a switch (track-and-hold
switch). This resistor is typically about 25 Ω. Capacitor C2 is the
ADC sampling capacitor and has a capacitance of 25 pF typically. For ac applications, removing high frequency components
from the analog input signal is recommended by use of an RC
low-pass filter on the relevant analog input pin. In applications
where harmonic distortion and signal-to-noise ratio are critical,
the analog input should be driven from a low impedance source.
Large source impedances will significantly affect the ac performance of the ADC. This may necessitate the use of an input
buffer amplifier. The choice of the op amp will be a function of
the particular application. When no amplifier is used to drive
the analog input, the source impedance should be limited to low
values. The maximum source impedance will depend on the
amount of total harmonic distortion (THD) that can be tolerated. The THD will increase as the source impedance increases,
and performance will degrade (see Figure 8).
VDD
Figure 11. ADC Acquisition Phase
D1
When the ADC starts a conversion, SW2 will open and SW1
will move to Position B, causing the comparator to become
unbalanced (Figure 12). The control logic and the capacitive
DAC are used to add and subtract fixed amounts of charge
from the sampling capacitor to bring the comparator back into
a balanced condition. When the comparator is rebalanced, the
conversion is complete. The control logic generates the ADC
output code (see the ADC Transfer Function section).
Rev. 0 | Page 11 of 20
R1
C2
30pF
VIN
C1
4pF
D2
CONVERSION PHASE - SWITCH OPEN
TRACK PHASE - SWITCH CLOSED
Figure 13. Equivalent Analog Input Circuit
03305-0-006
SW1
03305-0-004
A
VIN
SAMPLING
CAPACITOR
A
VIN
03305-0-005
The AD7940 provides the user with an on-chip track-and-hold
ADC and a serial interface housed in a tiny 6-lead SOT-23
package or in an 8-lead MSOP package, which offer the user
considerable space-saving advantages over alternative solutions.
The serial clock input accesses data from the part and also provides the clock source for the successive approximation ADC.
The analog input range for the AD7940 is 0 V to VDD. An external
reference is not required for the ADC nor is there a reference onchip. The reference for the AD7940 is derived from the power
supply and thus gives the widest dynamic input range.
CAPACITIVE
DAC
AD7940
ADC TRANSFER FUNCTION
The output coding of the AD7940 is straight binary. The designed code transitions occur at successive integer LSB values,
i.e., 1 LSB, 2 LSBs. The LSB size is VDD/16384. The ideal transfer
characteristic for the AD7940 is shown in Figure 14.
111...111
111...110
111...000
1 LSB = VDD/16384
011...111
In fact, because the supply current required by the AD7940 is so
low, a precision reference can be used as the supply source to
the AD7940. For example, a REF19x voltage reference (REF195
for 5 V or REF193 for 3 V) or an AD780 can be used to supply
the required voltage to the ADC (see Figure 15). This configuration is especially useful if the power supply available is quite
noisy, or if the system supply voltages are at some value other
than the required operating voltage of the AD7940, e.g., 15 V.
The REF19x or AD780 will output a steady voltage to the
AD7940. Recommended decoupling capacitors are a 100 nF low
ESR ceramic (Farnell 335-1816) and a 10 µF low ESR tantalum
(Farnell 197-130).
3V
10µF
TANT
000...010
0V
1 LSB
+VDD–1 LSB
ANALOG INPUT
0.1µF
VDD
0V TO VDD
INPUT
Figure 14. AD7940 Transfer Characteristic
VIN
10µF
0.1µF
SCLK
AD7940
SDATA
µC/µP
CS
GND
TYPICAL CONNECTION DIAGRAM
Figure 15 shows a typical connection diagram for the AD7940.
VREF is taken internally from VDD and as such should be well
decoupled. This provides an analog input range of 0 V to VDD.
The conversion result is output in a 16-bit word. This 16-bit
data stream consists of two leading zeros, followed by the 14 bits
of conversion data, MSB first. For applications where power
consumption is a concern, the power-down mode should be
used between conversions or bursts of several conversions to
improve power performance (see the Modes of Operation
section).
SERIAL
INTERFACE
03305-0-008
000...000
03305-0-007
000...001
5V
SUPPLY
REF193
Figure 15. Typical Connection Diagram
Digital Inputs
The digital inputs applied to the AD7940 are not limited by the
maximum ratings that limit the analog inputs. Instead, the digital inputs applied can go to 7 V and are not restricted by the
VDD + 0.3 V limit as on the analog inputs. For example, if the
AD7940 were operated with a VDD of 3 V, 5 V logic levels could
be used on the digital inputs. However, it is important to note
that the data output on SDATA will still have 3 V logic levels
when VDD = 3 V.
Another advantage of SCLK and CS not being restricted by the
VDD + 0.3 V limit is the fact that power supply sequencing issues
are avoided. If one of these digital inputs is applied before VDD,
there is no risk of latch-up as there would be on the analog
inputs if a signal greater than 0.3 V were applied prior to VDD.
Rev. 0 | Page 12 of 20
AD7940
MODES OF OPERATION
The mode of operation of the AD7940 is selected by controlling
the (logic) state of the CS signal during a conversion. There are
two possible modes of operation, normal and power-down. The
point at which CS is pulled high after the conversion has been
initiated will determine whether or not the AD7940 will enter
power-down mode. Similarly, if already in power-down, CS can
control whether the device will return to normal operation or
remain in power-down. These modes of operation are designed
to provide flexible power management options. These options
can optimize the power dissipation/throughput rate ratio for
differing application requirements.
NORMAL MODE
This mode provides the fastest throughput rate performance
because the user does not have to worry about the power-up
times with the AD7940 remaining fully powered all the time.
Figure 16 shows the general diagram of the operation of the
AD7940 in this mode.
The conversion is initiated on the falling edge of CS as
described in the Serial Interface section. To ensure that the part
remains fully powered up at all times, CS must remain low until
at least 10 SCLK falling edges have elapsed after the falling edge
of CS. If CS is brought high any time after the 10th SCLK falling
edge, but before the 16th SCLK falling edge, the part will remain
powered up, but the conversion will be terminated and SDATA
will go back into three-state. At least 16 serial clock cycles are
required to complete the conversion and access the complete
conversion result. CS may idle high until the next conversion or
may idle low until CS returns high sometime prior to the next
conversion, effectively idling CS low.
Once a data transfer is complete (SDATA has returned to threestate), another conversion can be initiated after the quiet time,
tQUIET, has elapsed by bringing CS low again.
CS
1
12
16
SDATA
1 LEADING ZERO + CONVERSION RESULT
Figure 16. Normal Mode Operation
Rev. 0 | Page 13 of 20
03305-0-009
SCLK
AD7940
POWER-DOWN MODE
This mode is intended for use in applications where slower
throughput rates are required. Either the ADC is powered down
between each conversion, or a series of conversions may be
performed at a high throughput rate, and then the ADC is powered down for a relatively long duration between these bursts of
several conversions. When the AD7940 is in power-down, all
analog circuitry is powered down.
To enter power-down, the conversion process must be interrupted by bringing CS high anywhere after the second falling
edge of SCLK and before the 10th falling edge of SCLK as
shown in Figure 17. Once CS has been brought high in this
window of SCLKs, the part will enter power-down, the
conversion that was initiated by the falling edge of CS will be
terminated, and SDATA will go back into three-state. If CS is
brought high before the second SCLK falling edge, the part will
remain in normal mode and will not power down. This will
avoid accidental power-down due to glitches on the CS line.
In order to exit this mode of operation and power up the
AD7940 again, a dummy conversion is performed. On the falling edge of CS, the device will begin to power up and will
continue to power up as long as CS is held low until after the
falling edge of the 10th SCLK. The device will be fully powered
up once at least 16 SCLKs (or approximately 6 µs) have elapsed
and valid data will result from the next conversion as shown in
Figure 18. If CS is brought high before the 10th falling edge of
SCLK, regardless of the SCLK frequency, the AD7940 will go
back into power-down again. This avoids accidental power-up
due to glitches on the CS line or an inadvertent burst of 8 SCLK
cycles while CS is low. So although the device may begin to
power-up on the falling edge of CS, it will power down again on
the rising edge of CS as long as it occurs before the 10th SCLK
falling edge.
CS
1
2
10
16
THREE-STATE
SDATA
03305-0-010
SCLK
Figure 17. Entering Power-Down Mode
THE PART IS FULLY POWERED
UP WITH VIN FULLY ACQUIRED
THE PART BEGINS
TO POWER UP
tPOWER UP
CS
1
10
16
1
16
SDATA
INVALID DATA
VALID DATA
Figure 18. Exiting Power-Down Mode
Rev. 0 | Page 14 of 20
03305-0-011
SCLK
AD7940
POWER VS. THROUGHPUT RATE
Figure 19 shows the power dissipation versus the throughput
rate when using the power-down mode with 3.6 V supplies and
a 2.5 MHz SCLK.
(7.4/100) × (6.84 mW) + (92.6/100) × (1.08 µW) = 0.51 mW
Rev. 0 | Page 15 of 20
VDD = 3.6V
FSCLK = 2.5MHz
1
0.1
03305-0-012
For example, if the AD7940 is operated in a continuous sampling mode, with a throughput rate of 10 kSPS and an SCLK of
2.5 MHz (VDD = 3.6 V), and the device is placed in power-down
mode between conversions, the power consumption is calculated as follows. The maximum power dissipation during normal operation is 6.84 mW (VDD = 3.6 V). If the power-up time
from power-down is 1 µs, and the remaining conversion time is
6.4 µs, (using a 16 SCLK transfer), then the AD7940 can be said
to dissipate 6.84 mW for 7.4 µs during each conversion cycle.
With a throughput rate of 10 kSPS, the cycle time is 100 µs. For
the remainder of the conversion cycle, 92.6 µs, the part remains
in power-down mode. The AD7940 can be said to dissipate
1.08 µW for the remaining 92.6 µs of the conversion cycle.
Therefore, with a throughput rate of 10 kSPS, the average power
dissipated during each cycle is
10
POWER (mW)
By using the power-down mode on the AD7940 when not
converting, the average power consumption of the ADC
decreases at lower throughput rates. Figure 19 shows how as the
throughput rate is reduced, the part remains in its shutdown
state longer, and the average power consumption over time
drops accordingly.
0.01
0
5
10
15
20
25
30
35
40
45
50
THROUGHPUT (kSPS)
Figure 19. Power vs. Throughput Using Power-Down Mode at 3.6 V
AD7940
SERIAL INTERFACE
Figure 20 shows the detailed timing diagram for serial interfacing to the AD7940. The serial clock provides the conversion
clock and also controls the transfer of information from the
AD7940 during conversion.
The CS signal initiates the data transfer and conversion process.
The falling edge of CS puts the track-and-hold into hold mode,
takes the bus out of three-state, and samples the analog input.
The conversion is also initiated at this point and will require at
least 16 SCLK cycles to complete. Once 15 SCLK falling edges
have elapsed, the track-and-hold will go back into track mode
on the next SCLK rising edge as shown in Figure 20 at Point B.
On the 16th SCLK falling edge, the SDATA line will go back
into three-state. If the rising edge of CS occurs before 16 SCLKs
have elapsed, the conversion will be terminated and the SDATA
line will go back into three-state; otherwise SDATA returns to
three-state on the 16th SCLK falling edge as shown in Figure 20.
Sixteen serial clock cycles are required to perform the conversion process and to access data from the AD7940. CS going low
provides the first leading zero to be read in by the microcontroller
or DSP. The remaining data is then clocked out by subsequent
SCLK falling edges beginning with the second leading zero, thus
the first falling clock edge on the serial clock has the first leading
zero provided and also clocks out the second leading zero. The
data transfer will consist of two leading zeros followed by the 14
bits of data. The final bit in the data transfer is valid on the 16th
falling edge, having been clocked out on the previous (15th)
falling edge.
It is also possible to take valid data on each SCLK rising edge
rather than falling edge, since the SCLK cycle time is long
enough to ensure the data is ready on the rising edge of SCLK.
However, the first leading zero will still be driven by the CS
falling edge, and so it can be taken only on the first SCLK falling
edge. It may be ignored, and the first rising edge of SCLK after
the CS falling edge would have the second leading zero provided and the 15th rising SCLK edge would have DB0 provided.
This method may not work with most microcontrollers/DSPs, but
could possibly be used with FPGAs and ASICs.
CS
t6
1
SCLK
2
3
4
tCONVERT
B
5
13
14
SDATA
3-STATE
16
t5
t7
t3
15
t8
tQUIET
t4
0
ZERO
DB13
DB12
DB11
DB10
DB2
2 LEADING ZEROS
Figure 20. AD7940 Serial Interface Timing Diagram
Rev. 0 | Page 16 of 20
DB1
DB0
3-STATE
03305-0-013
t2
AD7940
MICROPROCESSOR INTERFACING
The serial interface on the AD7940 allows the part to be directly
connected to a range of many different microprocessors. This
section explains how to interface the AD7940 with some of the
more common microcontroller and DSP serial interface
protocols.
AD7940 TO ADSP-218x
The ADSP-218x family of DSPs can be interfaced directly to the
AD7940 with no glue logic required. The SPORT control register should be set up as follows:
TFSW = RFSW = 1, Alternate Framing
AD7940 TO TMS320C541
INVRFS = INVTFS = 1, Active Low Frame Signal
The serial interface on the TMS320C541 uses a continuous
serial clock and frame synchronization signals to synchronize
the data transfer operations with peripheral devices such as the
AD7940. The CS input allows easy interfacing between the
TMS320C541 and the AD7940 with no glue logic required. The
serial port of the TMS320C541 is set up to operate in burst
mode with internal CLKX (TX serial clock) and FSX (TX frame
sync). The serial port control register (SPC) must have the
following setup:
DTYPE = 00, Right Justify Data
SLEN = 1111, 16-Bit Data-Words
ISCLK = 1, Internal Serial Clock
TFSR = RFSR = 0, Frame First Word
IRFS = 0
ITFS = 1
FO = 0
To implement power-down mode, SLEN should be set to 0111
to issue an 8-bit SCLK burst.
FSM = 1
MCM = 1
The format bit, FO, must be set to 1 to set the word length to
8 bits, in order to implement the power-down mode on the
AD7940. The connection diagram is shown in Figure 21. It
should be noted that for signal processing applications, it is
imperative that the frame synchronization signal from the
TMS320C541 provide equidistant sampling.
AD7940*
SCLK
The connection diagram is shown in Figure 22. The ADSP-218x
has the TFS and RFS of the SPORT tied together, with TFS set
as an output and RFS set as an input. The DSP operates in alternate framing mode, and the SPORT control register is set up as
described. The frame synchronization signal generated on the
TFS is tied to CS, and, as with all signal processing applications,
equidistant sampling is necessary. In this example, the timer
interrupt is used to control the sampling rate of the ADC.
AD7940*
TMS320C541*
SCLK
CLKX
SDATA
CLKR
CS
DR
FSX
FSR
CS
03305-0-014
SDATA
ADSP-218x*
SCLK
DR
RFS
TFS
03305-0-015
TXM = 1
*ADDITIONAL PINS OMITTED FOR CLARITY
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 22. Interfacing to the ADSP-218x
Figure 21. Interfacing to the TMS320C541
The timer register is loaded with a value that provides an
interrupt at the required sample interval. When an interrupt is
received, the values in the transmit autobuffer start to be transmitted and TFS is generated. The TFS is used to control the
RFS and, therefore, the reading of data. The data is stored in the
receive autobuffer for processing or to be shifted later. The frequency of the serial clock is set in the SCLKDIV register. When
the instruction to transmit with TFS is given, i.e., TX0 = AX0,
the state of the SCLK is checked. The DSP waits until the SCLK
has gone high, low, and high before transmission will start. If
the timer and SCLK values are chosen such that the instruction
to transmit occurs on or near the rising edge of SCLK, the data
may be transmitted, or it may wait until the next clock edge.
Rev. 0 | Page 17 of 20
AD7940
For example, if the ADSP-2189 had a 20 MHz crystal, such that
it had a master clock frequency of 40 MHz, the master cycle
time would be 25 ns. If the SCLKDIV register is loaded with the
value 7, then a SCLK of 2.5 MHz is obtained, and 16 master
clock periods will elapse for every 1 SCLK period. Depending
on the throughput rate selected, if the timer register was loaded
with the value 803 (803 + 1 = 804), then 50.25 SCLKs will occur
between interrupts and subsequently between transmit instructions. This situation will result in nonequidistant sampling since the
transmit instruction is occurring on a SCLK edge. If the number of
SCLKs between interrupts is a whole integer figure of N, then equidistant sampling will be implemented by the DSP.
AD7940 TO DSP563xx
The connection diagram in Figure 23 shows how the AD7940
can be connected to the ESSI (synchronous serial interface) of
the DSP-563xx family of DSPs from Motorola. Each ESSI (two
on board) is operated in synchronous mode (SYN bit in CRB =
1) with internally generated 1-bit clock period frame sync for
both Tx and Rx (Bits FSL1 = 0 and FSL0 = 0 in CRB). Normal
operation of the ESSI is selected by making MOD = 0 in the
CRB. Set the word length to 16 by setting bits WL1 = 1 and WL0
= 0 in CRA. The FSP bit in the CRB should be set to 1 so that
the frame sync is negative. It should be noted that for signal
processing applications, it is imperative that the frame synchronization signal from the DSP-563xx provide equidistant
sampling.
In the example shown in Figure 23, the serial clock is taken from
the ESSI so the SCK0 pin must be set as an output, SCKD = 1.
DSP-563xx*
SCLK
SCK
DOUT
SRD
CS
STD
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 23. Interfacing to the DSP-563xx
Rev. 0 | Page 18 of 20
03305-0-016
AD7940*
AD7940
APPLICATION HINTS
GROUNDING AND LAYOUT
The printed circuit board that houses the AD7940 should be
designed such that the analog and digital sections are separated
and confined to certain areas of the board. This facilitates the
use of ground planes that can be separated easily. A minimum
etch technique is generally best for ground planes, since it gives
the best shielding. Digital and analog ground planes should be
joined at only one place. If the AD7940 is in a system where
multiple devices require an AGND to DGND connection, the
connection should still be made at one point only, a star ground
point that should be established as close as possible to the AD7940.
Avoid running digital lines under the device since these will
couple noise onto the die. The analog ground plane should be
allowed to run under the AD7940 to avoid noise coupling. The
power supply lines to the AD7940 should use as large a trace as
possible to provide low impedance paths and reduce the effects
of glitches on the power supply line. Fast switching signals, such
as clocks, should be shielded with digital ground to avoid radiating noise to other sections of the board, and clock signals
should never be run near the analog inputs. Avoid crossover of
digital and analog signals. Traces on opposite sides of the board
should run at right angles to each other, which will reduce the
effects of feedthrough through the board. A microstrip technique is by far the best but is not always possible with a doublesided board. In this technique, the component side of the board
is dedicated to ground planes while the signals are placed on the
solder side.
Good decoupling is also very important. All analog supplies
should be decoupled with 10 µF tantalum in parallel with 0.1 µF
capacitors to AGND, as discussed in the Typical Connection
Diagram section. To achieve the best performance from these
decoupling components, the user should attempt to keep the
distance between the decoupling capacitors and the VDD and
GND pins to a minimum, with short track lengths connecting
the respective pins.
EVALUATING THE AD7940 PERFORMANCE
The recommended layout for the AD7940 is outlined in the
evaluation board for the AD7940. The evaluation board package
includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from the PC
via the evaluation board controller. The evaluation board controller can be used in conjunction with the AD7940 evaluation
board, as well as many other Analog Devices evaluation boards
ending in the CB designator, to demonstrate/evaluate the ac and
dc performance of the AD7940.
The software allows the user to perform ac (fast Fourier transform) and dc (histogram of codes) tests on the AD7940. The
software and documentation are on a CD shipped with the
evaluation board.
Rev. 0 | Page 19 of 20
AD7940
OUTLINE DIMENSIONS
2.90 BSC
6
5
4
1
2
3
2.80 BSC
1.60 BSC
PIN 1
INDICATOR
0.95 BSC
1.90
BSC
1.30
1.15
0.90
1.45 MAX
0.50
0.30
0.15 MAX
0.22
0.08
10°
4°
0°
SEATING
PLANE
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178AB
Figure 24. 6-Lead Small Outline Transistor Package [SOT-23] (RJ-6). Dimensions shown in millimeters.
3.00
BSC
8
5
4.90
BSC
3.00
BSC
4
PIN 1
0.65 BSC
1.10 MAX
0.15
0.00
0.38
0.22
COPLANARITY
0.10
0.23
0.08
8°
0°
0.80
0.60
0.40
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-187AA
Figure 25. 8-Lead Micro Small Outline Package [MSOP] (RM-8). Dimensions shown in millimeters.
ORDERING GUIDE
Models
AD7940BRJ-R2
AD7940BRJ-REEL7
AD7940BRM
AD7940BRM-REEL7
EVAL-AD7940CB2
EVAL-CONTROL BRD23
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Linearity
Error (LSB)1
14 Bits min
14 Bits min
14 Bits min
14 Bits min
Package
Description
Small Outline Transistor Package (SOT-23)
Small Outline Transistor Package (SOT-23)
Micro Small Outline Package (MSOP)
Micro Small Outline Package (MSOP)
Evaluation Board
Controller Board
1
Package
Option
RJ-6
RJ-6
RM-8
RM-8
Branding
CRB
CRB
CRB
CRB
Linearity error here refers to no missing codes.
This can be used as a standalone evaluation board or in conjunction with the Evaluation Controller Board for evaluation/demonstration purposes.
3
This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators. To order a complete
evaluation kit, the particular ADC evaluation board needs to be ordered, e.g., EVAL-AD7940CB, the EVAL-CONTROL BRD2, and a 12 V ac transformer. See the Evaluation
Board application note for more information.
2
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
D03305–0–6/04(0)
Rev. 0 | Page 20 of 20
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