a IN A 1 IN B 2 9 OUT B IN C 3 8 OUT C IN D 4 7 OUT D IN E 5 6 OUT E GND 16-Lead LFCSP (CP Suffix) PIN 1 INDICATOR IN A 1 IN B 2 IN C 3 IN D 4 AD8560 TOP VIEW IN E 5 The AD8560 is specified over the –40°C to +85°C temperature range. They are available on tape and reel in a 16-lead LFCSP. 16 V+ The AD8560 is a low cost, five-channel, single-supply buffer amplifier with rail-to-rail input and output capability. The AD8560 is optimized for LCD monitor applications. These LCD buffers have high slew rates, a 35 mA continuous output drive, and high capacitive load drive capability. They have wide supply range and offset voltages below 10 mV. 10 OUT A 12 OUT A 11 OUT B 10 OUT C 9 OUT D OUT E 8 GENERAL DESCRIPTION V+ 15 NC 14 NC 13 GND APPLICATIONS LCD Reference Drivers Portable Electronics Communications Equipment BLOCK DIAGRAM NC 6 NC 7 FEATURES Single-Supply Operation: 4.5 V to 16 V Dual-Supply Capability from ⴞ2.25 V to ⴞ8 V Input Capability Beyond the Rails Rail-to-Rail Output Swing Continuous Output Current: 35 mA Peak Output Current: 250 mA Offset Voltage: 10 mV Max Slew Rate: 8 V/s Stable with 1 F Loads Supply Current 16 V Rail-to-Rail Buffer Amplifier AD8560 NC = NO CONNECT REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2002 AD8560–SPECIFICATIONS ELECTRICAL CHARACTERISTICS (4.5 V ≤ V ≤ 16 V, V S CM = VS/2, TA = 25C, unless otherwise noted.) Parameter Symbol Conditions INPUT CHARACTERISTICS Offset Voltage Offset Voltage Drift Input Bias Current VOS ∆VOS/∆T IB –40°C ≤ TA ≤ +85°C Input Voltage Range Input Impedance Input Capacitance OUTPUT CHARACTERISTICS Output Voltage High Output Voltage Low Continuous Output Current Peak Output Current TRANSFER CHARACTERISTICS Gain Gain Linearity POWER SUPPLY Supply Voltage Power Supply Rejection Ratio Supply Current/Amplifier DYNAMIC PERFORMANCE Slew Rate Bandwidth Phase Margin Channel Separation NOISE PERFORMANCE Voltage Noise Density Current Noise Density Min Typ Max Unit 2 5 80 10 mV µV/°C nA nA V kΩ pF –40°C ≤ TA ≤ +85°C –0.5 400 1 ZIN CIN VOH VOL IOUT IPK AVCL NL VS PSRR ISY 600 800 VS + 0.5 IL = 100 µA VS = 16 V, IL = 5 mA –40°C ≤ TA ≤ +85°C VS = 4.5 V, IL = 5 mA –40°C ≤ TA ≤ +85°C IL = 100 µA VS = 16 V, IL = 5 mA –40°C ≤ TA ≤ +85°C VS = 4.5 V, IL = 5 mA –40°C ≤ TA ≤ +85°C 15.85 15.75 4.2 4.1 VS – 0.005 15.95 4.38 5 42 95 150 250 300 400 35 250 VS = 16 V RL = 2 kΩ –40°C ≤ TA ≤ +85°C RL = 2 kΩ, VO = 0.5 to (VS – 0.5 V) 0.995 0.995 0.9985 0.9980 0.01 4.5 VS = 4 V to 17 V –40°C ≤ TA ≤ +85°C VO = VS/2, No Load –40°C ≤ TA ≤ +85°C SR BW Øo RL = 10 kΩ, CL = 200 pF –3 dB, RL = 10 kΩ, CL = 10 pF RL = 10 kΩ, CL = 10 pF en en in f = 1 kHz f = 10 kHz f = 10 kHz 70 4.5 90 780 V V V V V mV mV mV mV mV mA mA 1.005 1.005 V/V V/V % 16 V 1,000 1,200 dB µA µA 8 8 65 75 V/µs MHz Degrees dB 27 25 0.8 nV/√Hz nV/√Hz pA/√Hz Specifications subject to change without notice. –2– REV. 0 AD8560 ABSOLUTE MAXIMUM RATINGS* Supply Voltage (VS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V Input Voltage . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VS + 0.5 V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . VS Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Operating Temperature Range . . . . . . . . . . . –40°C to +85°C Junction Temperature Range . . . . . . . . . . . . –65°C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300°C ESD Tolerance (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 kV ESD Tolerance (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV Package Type JA1 16-Lead LFCSP (CP) 35 JC JB2 Unit 13 °C/W NOTES 1 θJA is specified for worst-case conditions, i.e., θJA is specified for device soldered onto a circuit board for surface-mount packages. 2 ⌿JB is applied for calculating the junction temperature by reference to the board temperature. *Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ORDERING GUIDE Model Temperature Range Package Description Package Option AD8560ACP –40°C to +85°C 16-Lead LFCSP CP-16 Available in reels only. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8560 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. 0 –3– WARNING! ESD SENSITIVE DEVICE AD8560 –Typical Performance Characteristics 100 90 0 TA = 25C 4.5V < VS < 16V VCM = VS/2 50 INPUT BIAS CURRENT – nA QUANTITY – Amplifiers 80 70 60 50 40 30 VS = 16V 100 150 VS = 4.5V 200 250 20 300 10 0 12 9 0 3 6 6 3 INPUT OFFSET VOLTAGE – mV 9 350 12 +25 TEMPERATURE – C +85 TPC 4. Input Bias Current vs. Temperature TPC 1. Input Offset Voltage Distribution 5 300 4.5V < VS < 16V 4 INPUT OFFSET CURRENT – nA 250 QUANTITY – Amplifiers 40 200 150 100 50 3 2 1 VS = 4.5V 0 VS = 16V 1 2 3 4 0 0 10 20 30 40 50 60 TCVOS – V/C 70 80 90 5 100 TPC 2. Input Offset Voltage Drift Distribution +85 4.46 15.96 ILOAD = 5mA VCM = VS/2 4.45 15.95 VS = 16V 0.25 OUTPUT VOLTAGE – V INPUT OFFSET VOLTAGE – mV +25 TEMPERATURE – C TPC 5. Input Offset Current vs. Temperature 0 0.50 VS = 16V 0.75 1.00 VS = 4.5V 1.25 1.50 40 40 15.94 4.44 15.93 4.43 15.92 4.42 15.91 4.41 15.90 4.40 15.89 4.38 15.87 4.37 15.86 +25 TEMPERATURE – C +85 TPC 3. Input Offset Voltage vs. Temperature 4.39 VS = 4.5V 15.88 40 4.36 +25 TEMPERATURE – C +85 TPC 6. Output Voltage Swing vs. Temperature –4– REV. 0 AD8560 150 0.85 ILOAD = 5mA VCM = VS/2 SUPPLY CURRENT/AMPLIFIER – mA 135 OUTPUT VOLTAGE – mV 120 105 90 VS = 4.5V 75 60 45 VS = 16V 30 0.80 VS = 16V 0.75 0.70 0.65 VS = 4.5V 0.60 15 0 40 +25 TEMPERATURE – C 0.55 +85 TPC 7. Output Voltage Swing vs. Temperature +25 TEMPERATURE – C +85 TPC 10. Supply Current/Amplifier vs. Temperature 0.9999 8 RL = 10k CL = 200pF 4.5V < VS < 16V VOUT = 0.5V TO 15V 7 SLEW RATE – V/s RL = 2k GAIN ERROR – V/V 40 0.9997 VS = 16V 6 VS = 4.5V 5 4 3 2 RL = 600 0.9995 40 +25 TEMPERATURE – C 1 +85 TPC 8. Voltage Gain vs. Temperature +25 TEMPERATURE – C +85 TPC 11. Slew Rate vs. Temperature 1k 1.1 TA = 25C 100 VS = 4.5V 10 TA = 25C AV = 1 VO = VS /2 1.0 SUPPLY CURRENT/AMPLIFIER – mA OUTPUT VOLTAGE – mV 40 VS = 16V 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.001 0.01 0.1 1 LOAD CURRENT – mA 10 0.1 100 2 4 6 8 10 12 SUPPLY VOLTAGE – V 14 16 18 TPC 12. Supply Current/Amplifier vs. Supply Voltage TPC 9. Output Voltage to Supply Rail vs. Load Current REV. 0 0 –5– AD8560 10 18 5 10k 15 20 TA = 25C VS = 8V VIN = 50mV rms CL = 40pF AV = 1 560 150 25 8 6 35 2 0 1M 10 100M 10M FREQUENCY – Hz 15 10 1k 10k 100k 1M 10M TPC 16. Closed-Loop Output Swing vs. Frequency 160 TA = 25C VS = 8V VIN = 50mV rms RL = 10k AV = 1 5 50pF 0 5 10 1040pF 100pF 15 540pF 20 25 100k 1M 120 100 80 +PSRR 60 40 0 20 100M 10M FREQUENCY – Hz 140 POWER SUPPLY REJECTION – dB 160 450 400 350 VS = 4.5V 250 200 150 100 50 10k 100k FREQUENCY – Hz 1M 10k 100k FREQUENCY – Hz 1M 10M TA = 25C VS = 4.5V 120 100 +PSRR 80 60 PSRR 40 20 0 20 VS = 16V 1k 1k TPC 17. Power Supply Rejection Ratio vs. Frequency 500 300 PSRR 20 40 100 TPC 14. Frequency Response vs. Capacitive Loading 0 100 TA = 25C VS = 16V 140 POWER SUPPLY REJECTION – dB 20 100 FREQUENCY – Hz 25 GAIN – dB 10 4 TPC 13. Frequency Response vs. Resistive Loading IMPEDANCE – 12 30 40 100k TA = 25C VS = 16V AV = 1 RL = 10k DISTORTION < 1% 14 OUTPUT SWING – Vp-p GAIN – dB 5 10 16 1k 0 40 100 10M TPC 15. Closed-Loop Output Impedance vs. Frequency 1k 10k 100k FREQUENCY – Hz 1M 10M TPC 18. Power Supply Rejection Ratio vs. Frequency –6– REV. 0 AD8560 1,000 100 VOLTAGE NOISE DENSITY – nV/ Hz TA = 25C 4.5V VS 16V TA = 25C VS = 4.5V VCM = 2.25V VIN = 100mV p-p AV = 1 RL = 10k 90 80 70 OVERSHOOT – % 100 10 60 50 40 OS 30 +OS 20 10 1 10 1k 100 FREQUENCY – Hz 0 10 10k 20 15 TA = 25C 4.5V < VS < 16V OUTPUT SWING FROM 0V TO V CHANNEL SEPARATION – dB 1k TPC 22. Small Signal Overshoot vs. Load Capacitance TPC 19. Voltage Noise Density vs. Frequency 0 100 LOAD CAPACITANCE – pF 20 40 60 80 100 120 140 TA = 25C VS = 8V RL = 10k 10 5 OVERSHOOT SETTLING TO 0.1% 0 5 UNDERSHOOT SETTLING TO 0.1% 10 160 180 100 1k 10k 100k 1M FREQUENCY – Hz 10M 15 100M 0 TPC 20. Channel Separation vs. Frequency OVERSHOOT – % 70 0 50 40 OS 0 0 0 10 100 LOAD CAPACITANCE – pF 0 0 1k 0 0 0 0 0 TIME – 2s/DIV 0 0 TPC 24. Large Signal Transient Response TPC 21. Small Signal Overshoot vs. Load Capacitance REV. 0 0 0 +OS 20 0 10 TA = 25C VS = 16V AV = 1 RL = 10k CL = 300pF 0 60 30 2.0 1.5 0 TA = 25C VS = 16V VCM = 8V VIN = 100mV p-p AV = 1 RL = 10k VOLTAGE – 2V/DIV 80 1.0 SETTLING TIME – s TPC 23. Settling Time vs. Step Size 100 90 0.5 –7– 0 AD8560 0 0 TA = 25C VS = 4.5V AV = 1 RL = 10k CL = 300pF VOLTAGE – 1V/DIV 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 TIME – 2s/DIV 0 0 0 0 0 TPC 25. Large Signal Transient Response 0 0 0 0 TIME – 1s/DIV 0 0 0 0 TA = 25C VS = 16V AV = 1 RL = 10k CL = 100pF 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 TIME – 1s/DIV 0 0 TA = 25C VS = 16V AV = 1 RL = 10k 0 VOLTAGE – 3V/DIV 0 0 0 0 TPC 27. Small Signal Transient Response 0 VOLTAGE – 50mV/DIV 0 0 0 0 TA = 25C VS = 4.5V AV = 1 RL = 10k CL = 100pF 0 VOLTAGE – 50mV/DIV 0 0 0 0 TPC 26. Small Signal Transient Response 0 0 0 0 0 TIME – 40s/DIV 0 0 0 TPC 28. No Phase Reversal –8– REV. 0 AD8560 APPLICATIONS Theory of Operation Short Circuit Output Conditions These buffers are designed to drive large capacitive loads in LCD applications. Each has a high output current drive and rail-torail input/output operation and can be powered from a single 16 V supply. They are also intended for other applications where low distortion and high output current drive are needed. Input Overvoltage Protection As with any semiconductor device, whenever the input exceeds either supply voltage, attention needs to be paid to the input overvoltage characteristics. As an overvoltage occurs, the amplifier could be damaged depending on the voltage level and the magnitude of the fault current. When the input voltage exceeds either supply by more than 0.6 V, internal pin junctions will allow current to flow from the input to the supplies. This input current is not inherently damaging to the device as long as it is limited to 5 mA or less. If a condition exists using the buffers where the input exceeds the supply by more than 0.6 V, a series external resistor should be added. The size of the resistor can be calculated by using the maximum overvoltage divided by 5 mA. This resistance should be placed in series with the input exposed to an overvoltage. Output Phase Reversal The buffer family is immune to phase reversal. Although the device’s output will not change phase, large currents due to input overvoltage could damage the device. In applications where the possibility exists of an input voltage exceeding the supply voltage, overvoltage protection should be used as described in the previous section. The buffer family does not have internal short circuit protection circuitry. As a precautionary measure, do not short the output directly to the positive power supply or to the ground. It is not recommended to operate the AD8560 with more than 35 mA of continuous output current. The output current can be limited by placing a series resistor at the output of the amplifier whose value can be derived using the following equation: RX ≥ VS 35 mA For a 5 V single-supply operation, RX should have a minimum value of 143 Ω. Recommended Land Pattern for the AD8560 Figure 2 is a recommended land pattern for the AD8560 PCB design. The recommended thermal pad size for the PCB design matches the dimensions of the exposed pad on the bottom of the package. The solder mask design for improved thermal pad contact to the exposed pad and reliability uses a stencil pattern for approximately 85% solder coverage. A minimum clearance of 0.25 mm is maintained on the PCB between the outer edges of the thermal pad and the inner edges of the pattern for the land to avoid shorting. For better thermal performance, thermal vias should also be used. Since the AD8560 is relatively a low power part, just soldering the exposed package pad to the PCB thermal pad should provide sufficient electrical performance. SYMM CL Total Harmonic Distortion (THD+N) 0.28 0.75 TYP 16 PL The buffer family features low total harmonic distortion. The total harmonic distortion plus noise for the buffer over the entire supply range is below 0.08%. When the device is powered from a 16 V supply, the THD + N stays below 0.03%. Figure 1 shows the AD8560’s THD + N versus the frequency performance. 0.9 0.4 2.1 1.95 0.65 SYMM CL 10 0.05 0.1 THD + N – % 1 0.875 0.20 0.1 VS = 2.5V 0.25 SOLDER MASK VS = 8V BOARD METALLIZATION Figure 2. 16-Lead 4 x 4 Land Pattern 0.01 20 100 1k FREQUENCY – Hz 10k 30k Figure 1. THD + N vs. Frequency REV. 0 –9– AD8560 OUTLINE DIMENSIONS 16-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm 4 mm Body (CP-16) Dimensions shown in millimeters 4.0 BSC SQ PIN 1 INDICATOR 0.60 MAX 0.65 BSC 13 12 3.75 BSC SQ TOP VIEW 0.75 0.60 0.50 12 MAX PIN 1 INDICATOR 0.60 MAX 16 1 BOTTOM VIEW 4 9 8 5 2.25 2.10 SQ 1.95 1.95 BSC 0.80 MAX 0.65 NOM 0.05 MAX 0.02 NOM 1.00 0.90 0.80 SEATING PLANE 0.35 0.28 0.25 0.20 REF COPLANARITY 0.08 COMPLIANT TO JEDEC STANDARDS MO-220-VGGC –10– REV. 0 –11– –12– C03016–0–3/03(0)