NXP ADC1210S080HN/C1 Single 12-bit adc; 65 msps, 80 msps, 105 msps or 125 msps; cmos or lvds ddr digital output Datasheet

ADC1210S series
Single 12-bit ADC; 65 Msps, 80 Msps, 105 Msps or 125 Msps;
CMOS or LVDS DDR digital outputs
Rev. 01 — 9 April 2010
Preliminary data sheet
1. General description
The ADC1210S is a single-channel 12-bit Analog-to-Digital Converter (ADC) optimized for
high dynamic performances and low power consumption at sample rates up to 125 Msps.
Pipelined architecture and output error correction ensure the ADC1210S is accurate
enough to guarantee zero missing codes over the entire operating range. Supplied from a
single 3 V source, it can handle output logic levels from 1.8 V to 3.3 V in CMOS mode,
thanks to a separate digital output supply. It supports the Low Voltage Differential
Signalling (LVDS) Double Data Rate (DDR) output standard. An integrated
Serial Peripheral Interface (SPI) allows the user to easily configure the ADC. The device
also includes a SPI programmable full-scale to allow flexible input voltage range from 1 V
to 2 V (peak-to-peak). With excellent dynamic performance from the baseband to input
frequencies of 170 MHz or more, the ADC1210S is ideal for use in communications,
imaging and medical applications.
2. Features and benefits
„
„
„
„
SNR, 70 dBFS; SFDR, 86 dBc
Sample rate up to 125 Msps
12-bit pipelined ADC core
Clock input divider by 2 for less jitter
contribution
„ Single 3 V supply
„ Flexible input voltage range: 1 V p-p to
2 V p-p
„ CMOS or LVDS DDR digital outputs
„ Pin compatible with the ADC1410S
series and the ADC1010 series
„ HVQFN40 package
„
„
„
„
Input bandwidth, 600 MHz
Power dissipation, 430 mW at 80 Msps
Serial Peripheral Interface (SPI)
Duty cycle stabilizer
„ Fast OuT of Range (OTR) detection
„ INL ±0.25 LSB, DNL ±0.12 LSB
„ Offset binary, two’s complement, gray
code
„ Power-down and Sleep modes
3. Applications
„ Wireless and wired broadband
communications
„ Spectral analysis
„ Ultrasound equipment
„ Portable instrumentation
„ Imaging systems
„ Software define radio
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
4. Ordering information
Table 1.
Ordering information
Type number
fs (Msps) Package
Name
Description
Version
ADC1210S125HN/C1 125
HVQFN40 plastic thermal enhanced very thin quad flat package;
no leads; 40 terminals; body 6 × 6 × 0.85 mm
SOT618-6
ADC1210S105HN/C1 105
HVQFN40 plastic thermal enhanced very thin quad flat package;
no leads; 40 terminals; body 6 × 6 × 0.85 mm
SOT618-6
ADC1210S080HN/C1 80
HVQFN40 plastic thermal enhanced very thin quad flat package;
no leads; 40 terminals; body 6 × 6 × 0.85 mm
SOT618-6
ADC1210S065HN/C1 65
HVQFN40 plastic thermal enhanced very thin quad flat package;
no leads; 40 terminals; body 6 × 6 × 0.85 mm
SOT618-6
5. Block diagram
SDIO/ODS
SCLK/DFS
CS
ADC1210S
ERROR
CORRECTION AND
DIGITAL
PROCESSING
SPI INTERFACE
OTR
INP
T/H
INPUT
STAGE
ADC CORE
12-BIT
PIPELINED
OUTPUT
DRIVERS
INM
OUTPUT
DRIVERS
CLOCK INPUT
STAGE AND DUTY
CYCLE CONTROL
CLKP
CLKM
SYSTEM
REFERENCE AND
POWER
MANAGEMENT
CMOS:
D11 to D0
or
LVDS/DDR:
D11_M to D0_M
D11_P to D0_P
CMOS:
DAV
or
LVDS/DDR:
DAVP
DAVM
PWD
OE
VCM
SENSE
REFT
VREF
REFB
005aaa131
Fig 1. Block diagram
ADC1210S_SER_1
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
2 of 36
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
6. Pinning information
5
AGND
6
INM
7
INP
8
23 D5
AGND
9
22 D6
VDDA 10
21 D7
26 D2
D8 20
D9 19
D10 18
D11 17
PWD 16
OE 15
DEC 14
CLKM 13
CLKP 12
VDDA 11
31 DAVM
32 DAVP
33 VDDO
INM
7
24 D4_D5_P
INP
8
23 D4_D5_M
AGND
9
22 D6_D7_P
VDDA 10
21 D6_D7_M
005aaa132
Transparent top view
Fig 2.
34 OGND
6
25 D3
24 D4
35 OTR
AGND
27 D0_D1_M
26 D2_D3_P
ADC1210S
HVQFN40
25 D2_D3_M
D8_D9_P 20
VDDA
36 SCLK/DFS
5
D8_D9_M 19
27 D1
37 SDIO/ODS
VDDA
D10_D11_P 18
4
38 CS
4
D10_D11_M 17
VCM
39 SENSE
28 D0_D1_P
VCM
28 D0
ADC1210S
HVQFN40
40 VREF
31 DAV
32 n.c.
33 VDDO
34 OGND
35 OTR
36 SCLK/DFS
37 SDIO/ODS
3
PWD 16
3
29 n.c.
AGND
OE 15
AGND
29 n.c.
30 n.c.
2
DEC 14
2
1
REFT
CLKM 13
REFT
30 n.c.
REFB
CLKP 12
1
terminal 1
index area
VDDA 11
REFB
38 CS
terminal 1
index area
39 SENSE
40 VREF
6.1 Pinning
005aaa133
Transparent top view
Pin configuration with CMOS digital outputs
selected
Fig 3.
Pin configuration with LVDS/DDR digital
outputs selected
6.2 Pin description
Table 2.
ADC1210S_SER_1
Preliminary data sheet
Pin description (CMOS digital outputs)
Symbol
Pin
Type [1]
Description
REFB
1
O
bottom reference
REFT
2
O
top reference
AGND
3
G
analog ground
VCM
4
O
common-mode output voltage
VDDA
5
P
analog power supply
AGND
6
G
analog ground
INM
7
I
complementary analog input
INP
8
I
analog input
AGND
9
G
analog ground
VDDA
10
P
analog power supply
VDDA
11
P
analog power supply
CLKP
12
I
clock input
CLKM
13
I
complementary clock input
DEC
14
O
regulator decoupling node
OE
15
I
output enable, active LOW
PWD
16
I
power down, active HIGH
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
3 of 36
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Table 2.
Pin description (CMOS digital outputs) …continued
Symbol
Pin
Type [1]
Description
D11
17
O
data output bit 11 (MSB)
D10
18
O
data output bit 10
D9
19
O
data output bit 9
D8
20
O
data output bit 8
D7
21
O
data output bit 7
D6
22
O
data output bit 6
D5
23
O
data output bit 5
D4
24
O
data output bit 4
D3
25
O
data output bit 3
D2
26
O
data output bit 2
D1
27
O
data output bit 1
D0
28
O
data output bit 0 (LSB)
n.c.
29
-
not connected
n.c.
30
-
not connected
DAV
31
O
data valid output clock
n.c.
32
-
not connected
VDDO
33
P
output power supply
OGND
34
G
output ground
OTR
35
O
out of range
SCLK/DFS
36
I
SPI clock
data format select
SDIO/ODS
37
I/O
SPI data IO
output data standard
CS
38
I
SPI chip select
SENSE
39
I
reference programming pin
VREF
40
I/O
voltage reference input/output
[1]
P: power supply; G: ground; I: input; O: output; I/O: input/output.
Table 3.
Pin description (LVDS/DDR) digital outputs)
Symbol
ADC1210S_SER_1
Preliminary data sheet
Pin [1]
Type [2]
Description
D10_D11_M
17
O
differential output data D10 and D11 multiplexed, complement
D10_D11_P
18
O
differential output data D10 and D11 multiplexed, true
D8_D9_M
19
O
differential output data D8 and D9 multiplexed, complement
D8_D9_P
20
O
differential output data D8 and D9 multiplexed, true
D6_D7_M
21
O
differential output data D6 and D7 multiplexed, complement
D6_D7_P
22
O
differential output data D6 and D7 multiplexed, true
D4_D5_M
23
O
differential output data D4 and D5 multiplexed, complement
D4_D5_P
24
O
differential output data D4 and D5 multiplexed, true
D2_D3_M
25
O
differential output data D2 and D3 multiplexed, complement
D2_D3_P
26
O
differential output data D2 and D3 multiplexed, true
D0_D1_M
27
O
differential output data D0 and D1 multiplexed, complement
D0_D1_P
28
O
differential output data D0 and D1 multiplexed, true
n.c.
29
-
not connected
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
4 of 36
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Table 3.
Pin description (LVDS/DDR) digital outputs) …continued
Symbol
Pin [1]
Type [2]
Description
n.c.
30
-
not connected
DAVM
31
O
data valid output clock, complement
DAVP
32
O
data valid output clock, true
[1]
Pins 1 to 16 and pins 33 to 40 are the same for both CMOS and LVDS DDR outputs (see Table 2)
[2]
P: power supply; G: ground; I: input; O: output; I/O: input/output.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VO
output voltage
pins D11 to D0 or
pins D11P to D0P
and D11M to D0M
−0.4
+3.9
V
VDDA
analog supply voltage
−0.4
+3.9
V
VDDO
output supply voltage
−0.4
+3.9
V
Tstg
storage temperature
−55
+125
°C
Tamb
ambient temperature
−40
+85
°C
Tj
junction temperature
-
125
°C
8. Thermal characteristics
Table 5.
Symbol
Preliminary data sheet
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to ambient
[1]
Rth(j-c)
thermal resistance from junction to case
[1]
[1]
ADC1210S_SER_1
Thermal characteristics
Typ
Unit
22.5
K/W
11.7
K/W
Value for six layers board in still air with a minimum of 25 thermal vias.
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
5 of 36
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
9. Static characteristics
Table 6.
Symbol
Static characteristics[1]
Parameter
Conditions
Min
Typ
Max
Unit
2.85
3.0
3.4
V
Supplies
VDDA
analog supply voltage
VDDO
output supply voltage
CMOS mode
1.65
1.8
3.6
V
LVDS DDR mode
2.85
3.0
3.6
V
IDDA
analog supply current
fclk = 125 Msps; fi =70 MHz
-
210
-
mA
IDDO
output supply current
CMOS mode; fclk = 125 Msps;
fi =70 MHz
-
12
-
mA
LVDS DDR mode:
fclk = 125 Msps; fi =70 MHz
-
39
-
mA
ADC1210S125;
analog supply only
-
630
-
mW
ADC1210S105;
analog supply only
-
550
-
mW
ADC1210S080;
analog supply only
-
430
-
mW
ADC1210S065;
analog supply only
-
380
-
mW
power-down mode
-
2
-
mW
sleep mode
-
40
-
mW
differential clock input voltage
peak-to-peak
-
±1.6
-
V
differential clock input voltage
peak-to-peak
-
±0.70
-
V
differential clock input voltage
peak-to-peak
±0.8
±3.0
-
V
P
power dissipation
Clock inputs: pins CLKP and CLKM
LVPECL
Vi(clk)dif
LVDS
Vi(clk)dif
SINE wave
Vi(clk)dif
LVCMOS
VIL
LOW-level input voltage
-
-
0.3VDDA V
VIH
HIGH-level input voltage
0.7VDDA
-
-
V
Logic inputs: pins PWD and OE
VIL
LOW-level input voltage
0
-
0.8
V
VIH
HIGH-level input voltage
2
-
VDDA
V
IIL
LOW-level input current
<tbd>
-
<tbd>
μA
IIH
HIGH-level input current
−10
-
+10
μA
Serial peripheral interface: pins CS, SDIO/ODS, SCLK/DFS
VIL
LOW-level input voltage
0
-
0.3VDDA V
VIH
HIGH-level input voltage
0.7VDDA
-
VDDA
V
IIL
LOW-level input current
−10
-
+10
μA
IIH
HIGH-level input current
−50
-
+50
μA
CI
input capacitance
-
4
-
pF
ADC1210S_SER_1
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
6 of 36
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Table 6.
Symbol
Static characteristics[1] …continued
Parameter
Conditions
Min
Typ
Max
Unit
0.2VDDO V
Digital outputs, CMOS mode: pins D11 to D0, OTR, DAV
Output levels, VDDO = 3 V
VOL
LOW-level output voltage
IOL = <tbd>
OGND
-
VOH
HIGH-level output voltage
IOH = <tbd>
0.8VDDO
-
VDDO
V
IOL
LOW-level output current
3-state; output level = 0 V
-
<tbd>
-
μA
IOH
HIGH-level output current
3-state; output level = VDDA
-
<tbd>
-
μA
CO
output capacitance
high impedance; OE = HIGH
-
3
-
pF
Output levels, VDDO = 1.8 V
VOL
LOW-level output voltage
IOL = <tbd>
OGND
-
0.2VDDO V
VOH
HIGH-level output voltage
IOH = <tbd>
0.8VDDO
-
VDDO
V
Digital outputs, LVDS mode: pins D11P to D0P, D11M to D0M, DAVP and DAVM
Output levels, VDDO = 3 V only, RL = 100 Ω
VO(offset)
output offset voltage
output buffer current set to
3.5 mA
-
1.2
-
V
VO(dif)
differential output voltage
output buffer current set to
3.5 mA
-
350
-
mV
CO
output capacitance
-
<tbd>
-
pF
−5
-
+5
μA
Analog inputs: pins INP and INM
II
input current
RI
input resistance
-
<tbd>
-
Ω
CI
input capacitance
-
5
-
pF
VI(cm)
common-mode input voltage
0.9
1.5
2
V
Bi
input bandwidth
-
600
-
MHz
VI(dif)
differential input voltage
1
2
V
VINP = VINM
peak-to-peak
Common mode output voltage: pin VCM
VO(cm)
common-mode output voltage
-
VDDA / 2 -
V
IO(cm)
common-mode output current
-
<tbd>
-
μA
output
0.5
-
1
V
input
0.5
-
1
V
−1.25
±0.25
+1.25
LSB
−0.25
±0.12
+0.25
LSB
-
±2
-
mV
I/O reference voltage: pin VREF
VVREF
voltage on pin VREF
Accuracy
INL
integral non-linearity
DNL
differential non-linearity
Eoffset
offset error
EG
gain error
full-scale
power supply rejection ratio
100 mV (p-p) on VDDA
guaranteed no missing codes
±0.5
%
Supply
PSRR
[1]
-
35
-
dBc
Typical values measured at VDDA = 3 V, VDDO = 1.8 V, Tamb = 25 °C and CL = 5 pF; minimum and maximum values are across the full
temperature range Tamb = −40 °C to +85 °C at VDDA = 3 V, VDDO = 1.8 V; VINP − VINM = −1 dBFS; internal reference mode; applied to
CMOS and LVDS interface; unless otherwise specified.
ADC1210S_SER_1
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
7 of 36
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NXP Semiconductors
ADC1210S_SER_1
Preliminary data sheet
10. Dynamic characteristics
10.1 Dynamic characteristics
Table 7.
Dynamic characteristics[1]
Symbol
Parameter
Conditions
ADC1210S065
Min
Typ
ADC1210S080
Max
Min
Typ
ADC1210S105
Max
Min
Typ
ADC1210S125
Max
Min
Typ
Unit
Max
Analog signal processing
α2H
THD
ENOB
8 of 36
© NXP B.V. 2010. All rights reserved.
SFDR
total harmonic
distortion
effective number
of bits
signal-to-noise
ratio
spurious-free
dynamic range
-
87
-
-
87
-
-
86
-
-
88
-
dBc
fi = 30 MHz
-
86
-
-
86
-
-
86
-
-
87
-
dBc
fi = 70 MHz
-
85
-
-
85
-
-
84
-
-
85
-
dBc
fi = 170 MHz
-
82
-
-
82
-
-
81
-
-
83
-
dBc
fi = 3 MHz
-
86
-
-
86
-
-
85
-
-
87
-
dBc
fi = 30 MHz
-
85
-
-
85
-
-
85
-
-
86
-
dBc
fi = 70 MHz
-
84
-
-
84
-
-
83
-
-
84
-
dBc
fi = 170 MHz
-
81
-
-
81
-
-
80
-
-
82
-
dBc
fi = 3 MHz
-
85
-
-
85
-
-
84
-
-
86
-
dBc
fi = 30 MHz
-
84
-
-
84
-
-
84
-
-
85
-
dBc
fi = 70 MHz
-
83
-
-
83
-
-
82
-
-
83
-
dBc
fi = 170 MHz
-
80
-
-
80
-
-
79
-
-
81
-
dBc
fi = 3 MHz
-
11.3
-
-
11.3
-
-
11.3
-
-
11.3
-
bits
fi = 30 MHz
-
11.3
-
-
11.3
-
-
11.3
-
-
11.2
-
bits
fi = 70 MHz
-
11.2
-
-
11.2
-
-
11.2
-
-
11.2
-
bits
fi = 170 MHz
-
11.1
-
-
11.1
-
-
11.1
-
-
11.1
-
bits
fi = 3 MHz
-
70.0
-
-
69.9
-
-
69.8
-
-
69.6
-
dBFS
fi = 30 MHz
-
69.5
-
-
69.5
-
-
69.5
-
-
69.4
-
dBFS
fi = 70 MHz
-
69.2
-
-
69.2
-
-
69.1
-
-
69.0
-
dBFS
fi = 170 MHz
-
68.8
-
-
68.8
-
-
68.7
-
-
68.6
-
dBFS
fi = 3 MHz
-
86
-
-
86
-
-
85
-
-
87
-
dBc
fi = 30 MHz
-
85
-
-
85
-
-
85
-
-
86
-
dBc
fi = 70 MHz
-
84
-
-
84
-
-
83
-
-
84
-
dBc
fi = 170 MHz
-
81
-
-
81
-
-
80
-
-
82
-
dBc
ADC1210S series
SNR
third harmonic
level
fi = 3 MHz
ADC1210S series; CMOS or LVDS DDR digital outputs
Rev. 01 — 9 April 2010
All information provided in this document is subject to legal disclaimers.
α3H
second harmonic
level
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Dynamic characteristics[1] …continued
Symbol
Parameter
Conditions
ADC1210S065
Min
IMD
[1]
Intermodulation
distortion
Typ
ADC1210S080
Max
Min
Typ
ADC1210S105
Max
Min
Typ
ADC1210S125
Max
Min
Typ
NXP Semiconductors
ADC1210S_SER_1
Preliminary data sheet
Table 7.
Unit
Max
fi = 3 MHz
-
89
-
-
89
-
-
88
-
-
89
-
dBc
fi = 30 MHz
-
88
-
-
88
-
-
88
-
-
88
-
dBc
fi = 70 MHz
-
87
-
-
87
-
-
86
-
-
86
-
dBc
fi = 170 MHz
-
84
-
-
85
-
-
83
-
-
84
-
dBc
Typical values measured at VDDA = 3 V, VDDO = 1.8 V, Tamb = 25 °C and CL = 5 pF; minimum and maximum values are across the full temperature range Tamb = −40 °C to +85 °C
at VDDA = 3 V, VDDO = 1.8 V; VINP − VINM = −1 dBFS; internal reference mode; applied to CMOS and LVDS interface; unless otherwise specified.
ADC1210S series
9 of 36
© NXP B.V. 2010. All rights reserved.
ADC1210S series; CMOS or LVDS DDR digital outputs
Rev. 01 — 9 April 2010
All information provided in this document is subject to legal disclaimers.
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Table 8.
Clock and digital output timing characteristics[1]
Symbol
Parameter
Conditions
ADC1210S065
Min
Typ
ADC1210S080
Max
Min
Typ
ADC1210S105
Max
Min
Typ
ADC1210S125
Max
Min
Typ
NXP Semiconductors
ADC1210S_SER_1
Preliminary data sheet
10.2 Clock and digital output timing
Unit
Max
Clock timing input: pins CLKP and CLKM
fclk
clock frequency
20
tlat(data)
data latency time
clock cycles
-
δclk
clock duty cycle
DCS_EN = 1
30
DCS_EN = 0
45
-
65
60
-
-
50
70
30
50
55
45
14
-
80
75
-
-
50
70
30
50
55
45
14
-
105
100
-
125
MHz
-
-
14
-
clock
cycle
50
70
30
50
70
%
50
55
45
50
55
%
14
sampling delay
time
-
0.8
-
-
0.8
-
-
0.8
-
-
0.8
-
ns
twake
wake-up time
-
<tbd>
-
-
<tbd>
-
-
<tbd>
-
-
<tbd>
-
ns
CMOS mode timing output: pins D11 to D0 and DAV
tPD
propagation delay
DATA
-
3.9
-
-
3.9
-
-
3.9
-
-
3.9
-
ns
DAV
-
4.2
-
-
4.2
-
-
4.2
-
-
4.2
-
ns
tsu
set-up time
-
7.7
-
-
6.5
-
-
4.7
-
-
4.3
-
ns
th
hold time
-
6.7
-
-
5.5
-
-
3.8
-
-
3.5
-
ns
tr
rise time[2]
DATA
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
ns
DAV
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
ns
DATA
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
ns
tf
fall
time[2]
LVDS DDR mode timing output: pins D11P to D0P, D11M to D0M, DAVP and DAVM
propagation delay
DATA
-
3.9
-
-
3.9
-
-
3.9
-
-
3.9
-
ns
DAV
-
4.2
-
-
4.2
-
-
4.2
-
-
4.2
-
ns
10 of 36
© NXP B.V. 2010. All rights reserved.
tsu
set-up time
-
5.1
-
-
3.5
-
-
2.1
-
-
1.4
-
ns
th
hold time
-
2.0
-
-
2.0
-
-
2.0
-
-
2.0
-
ns
tr
rise time[3]
DATA
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
ns
DAV
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
ns
DATA
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
0.5
-
2.4
ns
tf
fall
time[3]
[1]
Typical values measured at VDDA = 3 V, VDDO = 1.8 V, Tamb = 25 °C and CL = 5 pF; minimum and maximum values are across the full temperature range Tamb = −40 °C to +85 °C
at VDDA = 3 V, VDDO = 1.8 V; VINP − VINM = −1 dBFS; internal reference mode; applied to CMOS and LVDS interface; unless otherwise specified.
[2]
Measured between 20 % to 80 % of VDDO.
[3]
Rise time measured from −50 mV to +50 mV; fall time measured from +50 mV to −50 mV.
ADC1210S series
tPD
ADC1210S series; CMOS or LVDS DDR digital outputs
Rev. 01 — 9 April 2010
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td(s)
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
N+1
N
td(s)
N+2
tclk
CLKP
CLKM
tPD
(N − 14)
(N − 13)
(N − 12)
(N − 11)
DATA
tsu
tPD
th
DAV
tclk
005aaa060
Fig 4.
CMOS mode timing
N+1
N
td(s)
N+2
tclk
CLKP
CLKM
tPD
(N − 14)
(N − 13)
(N − 12)
(N − 11)
Dx_Dx + 1_P
Dx
Dx + 1
Dx
Dx + 1
Dx
Dx + 1
Dx
Dx + 1
Dx
Dx + 1
Dx_Dx + 1_M
tsu th tsu th
tPD
DAVP
DAVM
tclk
Fig 5.
ADC1210S_SER_1
Preliminary data sheet
005aaa061
LDVS DDR mode timing
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
10.3 SPI timings
Table 9.
SPI timings characteristics
Symbol
Parameter
tw(SCLK)
Conditions
Min
Typ
Max
Unit
SCLK pulse width
40
-
-
ns
tw(SCLKH)
SCLK HIGH pulse width
16
-
-
ns
tw(SCLKL)
SCLK LOW pulse width
tsu
set-up time
th
hold time
fclk(max)
maximum clock frequency
16
-
-
ns
data to SCLK HIGH
5
-
-
ns
CS to SCLK HIGH
5
-
-
ns
data to SCLK HIGH
2
-
-
ns
CS to SCLK HIGH
[1]
2
-
-
ns
-
-
25
MHz
Typical values measured at VDDA = 3 V, VDDO = 1.8 V, Tamb = 25 °C and CL = 5 pF; minimum and maximum
values are across the full temperature range Tamb = −40 °C to +85 °C at VDDA = 3 V, VDDO = 1.8 V.
tsu
tsu
th
CS
tw(SCLKL)
th
tw(SCLKH)
tw(SCLK)
SCLK
SDIO
R/W
W1
W0
A12
A11
D2
D1
D0
005aaa065
Fig 6.
SPI timing
11. Application information
11.1 Device control
The ADC1210S can be controlled via SPI or directly via the I/O pins (Pin control mode).
11.1.1 SPI and Pin control modes
The device enters Pin control mode at power-up, and remains in this mode as long as pin
CS is held HIGH. In Pin control mode, the SPI pins SDIO, CS and SCLK are used as
static control pins.
SPI control mode is enabled by forcing pin CS LOW. Once SPI control mode has been
enabled, the device will remain in this mode. The transition from Pin control mode to SPI
control mode is illustrated in Figure 7.
ADC1210S_SER_1
Preliminary data sheet
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
CS
Pin control mode
SCLK/DFS
Data format
two's complement
SDIO/ODS
SPI control mode
Data format
offset binary
LVDS DDR
CMOS
R/W
W1
W0
A12
005aaa039
Fig 7. Control mode selection
When the device enters SPI control mode, the output data standard and data format are
determined by the level on pin SDIO at the instant a transition is triggered by a falling
edge on CS.
11.1.2 Operating mode selection
The active ADC1210S operating mode (Power-up, Power-down or Sleep) can be selected
via the SPI interface (see Table 20) or using pins PWD and OE in Pin control mode, as
described in Table 10.
Table 10.
Operating mode selection via pin PWD and OE
Pin PWD
Pin OE
Operating mode
Output high-Z
0
0
Power-up
no
0
1
Power-up
yes
1
0
Sleep
yes
1
1
Power-down
yes
11.1.3 Selecting the output data standard
The output data standard (CMOS or LVDS DDR) can be selected via the SPI interface
(see Table 23) or using pin ODS in Pin control mode. LVDS DDR is selected when ODS is
HIGH, otherwise CMOS is selected.
11.1.4 Selecting the output data format
The output data format can be selected via the SPI interface (offset binary, two’s
complement or gray code; see Table 23) or using pin DFS in Pin control mode (offset
binary or two’s complement). Offset binary is selected when DFS is LOW. When DFS is
HIGH, two’s complement is selected.
11.2 Analog inputs
11.2.1 Input stage
The analog input of the ADC1210S supports differential or single-ended input drive.
Optimal performance is achieved using differential inputs with the common-mode input
voltage (VI(cm)) on pins INP and INM set to 0.5VDDA.
The full-scale analog input voltage range is configurable between 1 V (p-p) and 2 V (p-p)
via a programmable internal reference (see Section 11.3 and Table 22 further details).
The equivalent circuit of the sample and hold input stage, including Electrostatic
Discharge (ESD) protection and circuit and package parasitics, is shown in Figure 8.
ADC1210S_SER_1
Preliminary data sheet
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Package
ESD
Parasitics
Switch
Ron = 15 Ω
8
INP
Internal
clock
4 pF
Sampling
capacitor
Switch
INM
Ron = 15 Ω
7
Internal
clock
4 pF
Sampling
capacitor
005aaa043
Fig 8.
Input sampling circuit
The sample phase occurs when the internal clock (derived from the clock signal on pin
CLKP/CLKM) is HIGH. The voltage is then held on the sampling capacitors. When the
clock signal goes LOW, the stage enters the hold phase and the voltage information is
transmitted to the ADC core.
11.2.2 Anti-kickback circuitry
Anti-kickback circuitry (R-C filter in Figure 9) is needed to counteract the effects of a
charge injection generated by the sampling capacitance.
The RC filter is also used to filter noise from the signal before it reaches the sampling
stage. The value of the capacitor should be chosen to maximize noise attenuation without
degrading the settling time excessively.
R
INP
C
R
INM
005aaa073
Fig 9.
Anti-kickback circuit
The component values are determined by the input frequency and should be selected so
as not to affect the input bandwidth.
ADC1210S_SER_1
Preliminary data sheet
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Table 11.
RC coupling versus input frequency, typical values
Input frequency
R
C
3 MHz
25 Ω
12 pF
70 MHz
12 Ω
8 pF
170 MHz
12 Ω
8 pF
11.2.3 Transformer
The configuration of the transformer circuit is determined by the input frequency. The
configuration shown in Figure 10 would be suitable for a baseband application.
ADT1-1WT
100 nF
Analog
input
25 Ω
100 nF
INP
25 Ω
12 pF
100 nF
100 nF
25 Ω
25 Ω
INM
VCM
100 nF
100 nF
005aaa044
Fig 10. Single transformer configuration suitable for baseband applications
The configuration shown in Figure 11 is recommended for high frequency applications. In
both cases, the choice of transformer will be a compromise between cost and
performance.
ADT1-1WT
Analog
input
100 nF
ADT1-1WT
50 Ω
12 Ω
INP
50 Ω
8.2 pF
50 Ω
100 nF
50 Ω
12 Ω
INM
VCM
100 nF
100 nF
005aaa045
Fig 11. Dual transformer configuration suitable for high intermediate frequency
application
ADC1210S_SER_1
Preliminary data sheet
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
11.3 System reference and power management
11.3.1 Internal/external references
The ADC1210S has a stable and accurate built-in internal reference voltage to adjust the
ADC full-scale. This reference voltage can be set internally via SPI or with pins VREF and
SENSE (programmable in 1 dB steps between 0 dB and −6 dB via control bits
INTREF[2:0] when bit INTREF_EN = 1; see Table 22). See Figure 13, Figure 14,
Figure 15 and Figure 16. The equivalent reference circuit is shown in Figure 12. External
reference is also possible by providing a voltage on pin VREF as described in Figure 15.
REFT
REFERENCE
AMP
REFB
VREF
EXT_ref
EXT_ref
BUFFER
BANDGAP
REFERENCE
ADC CORE
SENSE
SELECTION
LOGIC
005aaa164
Fig 12. Reference equivalent schematic
If bit INTREF_EN is set to 0, the reference voltage will be determined either internally or
externally as detailed in Table 12.
Table 12.
SPI bit
INTREF_EN
SENSE pin
VREF pin
full-scale (p-p)
internal
(Figure 13)
0
AGND
330 pF capacitor to AGND
2V
internal
(Figure 14)
0
pin VREF connected to pin SENSE and via 1 V
a 330 pF capacitor to AGND
external
(Figure 15)
0
VDDA
internal via SPI
(Figure 16)
1
pin VREF connected to pin SENSE and via 1 V to 2 V
330 pF capacitor to AGND
[1]
ADC1210S_SER_1
Preliminary data sheet
Reference selection
Selection
external voltage between
0.5 V and 1 V[1]
1 V to 2 V
The voltage on pin VREF is doubled internally to generate the internal reference voltage.
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Figure 13 to Figure 16 illustrate how to connect the SENSE and VREF pins to select the
required reference voltage source.
VREF
VREF
330 pF
330
pF
REFERENCE
EQUIVALENT
SCHEMATIC
REFERENCE
EQUIVALENT
SCHEMATIC
SENSE
SENSE
005aaa116
005aaa117
Fig 13. Internal reference, 2 V (p-p) full-scale
Fig 14. Internal reference, 1 V (p-p) full-scale
VREF
VREF
V
0.1 μF
330 pF
REFERENCE
EQUIVALENT
SCHEMATIC
REFERENCE
EQUIVALENT
SCHEMATIC
SENSE
SENSE
VDDA
005aaa119
005aaa118
Fig 15. External reference, 1 V (p-p) to 2 V (p-p)
full-scale
Fig 16. Internal reference via SPI, 1 V (p-p) to 2 V (p-p)
full-scale
11.3.2 Reference gain control
The reference gain is programmable between 0 dB to −6 dB in 1 dB steps via the SPI
(see Table 22). The corresponding full-scale input voltage range varies between 2 V (p-p)
and 1 V (p-p), as shown in Table 13:
Table 13.
ADC1210S_SER_1
Preliminary data sheet
Reference SPI gain control
INTREF[2:0]
Gain (dB)
Full-scale (V (p-p))
000
0 dB
2V
001
−1 dB
1.78 V
010
−2 dB
1.59 V
011
−3 dB
1.42 V
100
−4 dB
1.26 V
101
−5 dB
1.12 V
110
−6 dB
1V
111
reserved
x
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
11.3.3 Common-mode output voltage (VO(cm))
A 0.1 μF filter capacitor should be connected between pin VCM and ground to ensure a
low-noise common-mode output voltage. When AC-coupled, pin VCM can then be used to
set the common-mode reference for the analog inputs, for instance via a transformer
middle point.
PACKAGE
ESD
PARASITICS
COMMON MODE
REFERENCE
1.5 V
VCM
0.1 μF
ADC CORE
005aaa051
Fig 17. Equivalent schematic of the common-mode reference circuit
11.3.4 Biasing
The common-mode input voltage (VI(cm)) on pins INP and INM should be set externally to
0.5VDDA for optimal performance and should always be between 0.9 V and 2 V.
11.4 Clock input
11.4.1 Drive modes
The ADC1210S can be driven differentially (SINE, LVPECL or LVDS) with little or no
influence on the dynamic performances. It can also be driven by a single-ended LVCMOS
signal connected to pin CLKP (CLKM should be connected to ground via a capacitor) or
CLKM (CLKP should be connected to ground via a capacitor).
LVCMOS
clock input
CLKP
CLKP
CLKM
LVCMOS
clock input
005aaa174
a. Rising edge LVCMOS
CLKM
005aaa053
b. Falling edge LVCMOS
Fig 18. LVCMOS single-ended clock input
ADC1210S_SER_1
Preliminary data sheet
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Sine
clock input
CLKP
Sine
clock input
CLKP
CLKM
CLKM
005aaa054
005aaa173
a. Sine clock input
b. Sine clock input (with transformer)
CLKP
CLKP
LVPECL
clock input
LVDS
clock input
CLKM
CLKM
005aaa172
005aaa055
c. LVDS clock input
d. LVPECL clock input
Fig 19. Differential clock input
11.4.2 Equivalent input circuit
The equivalent circuit of the input clock buffer is shown in Figure 20. The common-mode
voltage of the differential input stage is set via internal 5 kΩ resistors.
PACKAGE
ESD
PARASITICS
CLKP
Vcm(clk)
SE_SEL
SE_SEL
5 kΩ
5 kΩ
CLKM
005aaa056
Fig 20. Equivalent input circuit
ADC1210S_SER_1
Preliminary data sheet
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Single-ended or differential clock inputs can be selected via the SPI interface (see
Table 21). If single-ended is enabled, the input pin (CLKM or CLKP) is selected via control
bit SE_SEL.
If single-ended is implemented without setting SE_SEL to the appropriate value, the
unused pin should be connected to ground via a capacitor.
11.4.3 Duty cycle stabilizer
The duty cycle stabilizer can improve the overall performances of the ADC by
compensating the duty cycle of the input clock signal. When the duty cycle stabilizer is
active (bit DCS_EN = 1; see Table 21), the circuit can handle signals with duty cycles of
between 30 % and 70 % (typical). When the duty cycle stabilizer is disabled
(DCS_EN = 0), the input clock signal should have a duty cycle of between 45 % and
55 %.
11.4.4 Clock input divider
The ADC1210S contains an input clock divider that divides the incoming clock by a factor
of 2 (when bit CLKDIV = 1; see Table 21). This feature allows the user to deliver a higher
clock frequency with better jitter performance, leading to a better SNR result once
acquisition has been performed.
11.5 Digital outputs
11.5.1 Digital output buffers: CMOS mode
The digital output buffers can be configured as CMOS by setting bit LVDS/CMOS to 0
(see Table 23).
Each digital output has a dedicated output buffer. The equivalent circuit of the CMOS
digital output buffer is shown in Figure 21. The buffer is powered by a separate power
supply, pins OGND and VDDO, to ensure 1.8 V to 3.3 V compatibility and is isolated from
the ADC core. Each buffer can be loaded by a maximum of 10 pF.
VDDO
PARASITICS
ESD
PACKAGE
50 Ω
LOGIC
DRIVER
Dx
OGND
005aaa057
Fig 21. CMOS digital output buffer
ADC1210S_SER_1
Preliminary data sheet
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
The output resistance is 50 Ω and is the combination of the an internal resistor and the
equivalent output resistance of the buffer. There is no need for an external damping
resistor. The drive strength of both data and DAV buffers can be programmed via the SPI
in order to adjust the rise and fall times of the output digital signals (see Table 30):
11.5.2 Digital output buffers: LVDS DDR mode
The digital output buffers can be configured as LVDS DDR by setting bit LVDS/CMOS to 1
(see Table 23).
VCCO
3.5 mA
typ
−
+
DnP/Dn + 1P
100 Ω
RECEIVER
DnM/Dn + 1M
−
+
OGND
005aaa058
Fig 22. LVDS DDR digital output buffer - externally terminated
Each output should be terminated externally with a 100 Ω resistor (typical) at the receiver
side (Figure 22) or internally via SPI control bits LVDS_INT_TER[2:0] (see Figure 23 and
Table 32).
VCCO
3.5 mA
typ
−
+
DxP/Dx + 1P
100 Ω
RECEIVER
DxM/Dx + 1M
+
−
OGND
005aaa059
Fig 23. LVDS DDR digital output buffer - internally terminated
The default LVDS DDR output buffer current is set to 3.5 mA. It can be programmed via
the SPI (bits DAVI[1:0] and DATAI[1:0]; see Table 31) in order to adjust the output logic
voltage levels.
ADC1210S_SER_1
Preliminary data sheet
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ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Table 14.
LVDS DDR output register 2
LVDS_INT_TER[2:0]
Resistor value (Ω)
000
no internal termination
001
300
010
180
011
110
100
150
101
100
110
81
111
60
11.5.3 Data valid (DAV) output clock
A data valid output clock signal (DAV) can be used to capture the data delivered by the
ADC1210S. Detailed timing diagrams for CMOS and LVDS DDR modes are shown in
Figure 4 and Figure 5 respectively.
11.5.4 Out-of-Range (OTR)
An out-of-range signal is provided on pin OTR. The latency of OTR is fourteen clock
cycles. The OTR response can be speeded up by enabling Fast OTR (bit FASTOTR = 1;
see Table 29). In this mode, the latency of OTR is reduced to only four clock cycles. The
Fast OTR detection threshold (below full-scale) can be programmed via bits
FASTOTR_DET[2:0].
Table 15.
Fast OTR register
FASTOTR_DET[2:0]
Detection level (dB)
000
−20.56
001
−16.12
010
−11.02
011
−7.82
100
−5.49
101
−3.66
110
−2.14
111
−0.86
11.5.5 Digital offset
By default, the ADC1210S delivers output code that corresponds to the analog input.
However it is possible to add a digital offset to the output code via the SPI (bits
DIG_OFFSET[5:0]; see Table 25).
11.5.6 Test patterns
For test purposes, the ADC1210S can be configured to transmit one of a number of
predefined test patterns (via bits TESTPAT_SEL[2:0]; see Table 26). A custom test pattern
can be defined by the user (TESTPAT_USER; see Table 27 and Table 28) and is selected
when TESTPAT_SEL[2:0] = 101. The selected test pattern will be transmitted regardless
of the analog input.
ADC1210S_SER_1
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ADC1210S series; CMOS or LVDS DDR digital outputs
11.5.7 Output codes versus input voltage
Table 16.
Output codes
VINP − VINM
Offset binary
Two’s complement
OTR pin
< −1
0000 0000 0000
1000 0000 0000
1
−1.0000000
0000 0000 0000
1000 0000 0000
0
−0.9995117
0000 0000 0001
1000 0000 0001
0
−0.9990234
0000 0000 0010
1000 0000 0010
0
−0.9985352
0000 0000 0011
1000 0000 0011
0
−0.9980469
0000 0000 0100
1000 0000 0100
0
....
....
....
0
−0.0009766
0111 1111 1110
1111 1111 1110
0
−0.0004883
0111 1111 1111
1111 1111 1111
0
0.0000000
1000 0000 0000
0000 0000 0000
0
+0.0004883
1000 0000 0001
0000 0000 0001
0
+0.0009766
1000 0000 0010
0000 0000 0010
0
....
....
....
0
+0.9980469
1111 1111 1011
0111 1111 1011
0
+0.9985352
1111 1111 1100
0111 1111 1100
0
+0.9990234
1111 1111 1101
0111 1111 1101
0
+0.9995117
1111 1111 1110
0111 1111 1110
0
+1.0000000
1111 1111 1111
0111 1111 1111
0
> +1
1111 1111 1111
0111 1111 1111
1
11.6 Serial peripheral interface
11.6.1 Register description
The ADC1210S serial interface is a synchronous serial communications port that allows
for easy interfacing with many commonly-used microprocessors. It provides access to the
registers that control the operation of the chip.
This interface is configured as a 3-wire type (SDIO as bidirectional pin)
Pin SCLK is the serial clock input and CS is the chip select pin.
Each read/write operation is initiated by a LOW level on CS. A minimum of three bytes will
be transmitted (two instruction bytes and at least one data byte). The number of data
bytes is determined by the value of bits W1 and W2 (see Table 18).
Table 17.
Instruction bytes for the SPI
MSB
ADC1210S_SER_1
Preliminary data sheet
LSB
Bit
7
6
5
4
3
2
1
0
Description
R/W[1]
W1[2]
W0[2]
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
[1]
Bit R/W indicates whether it is a read (1) or a write (0) operation.
[2]
Bits W1 and W0 indicate the number of bytes to be transferred after the instruction byte (see Table 18).
All information provided in this document is subject to legal disclaimers.
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© NXP B.V. 2010. All rights reserved.
23 of 36
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Table 18.
Number of data bytes to be transferred after the instruction bytes
W1
W0
Number of bytes transmitted
0
0
1 byte
0
1
2 bytes
1
0
3 bytes
1
1
4 bytes or more
Bits A12 to A0 indicate the address of the register being accessed. In the case of a
multiple byte transfer, this address is the first register to be accessed. An address counter
is increased to access subsequent addresses.
The steps involved in a data transfer are as follows:
1. A falling edge on CS in combination with a rising edge on SCLK determine the start of
communications.
2. The first phase is the transfer of the 2-byte instruction.
3. The second phase is the transfer of the data which can vary in length but will always
be a multiple of 8 bits. The MSB is always sent first (for instruction and data bytes).
4. A rising edge on CS indicates the end on data transmission.
CS
SCLK
SDIO
R/W W1
W0
A12 A11 A10
A9
A8
A7
A6
A5
A4
A3
A2
Instruction bytes
A1
A0
D7
D6
D5
D4
D3
D2
Register N (data)
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
Register N + 1 (data)
005aaa062
Fig 24. SPI mode timing
11.6.2 Default modes at start-up
During circuit initialization, it does not matter which output data standard has been
selected. At power-up, the device starts to Pin control mode.
A falling edge on CS will trigger a transition to SPI control mode. When the ADC1210S
enters SPI control mode, the output data standard (CMOS/LVDS DDR) is determined by
the level on pin SDIO (see Figure 25). Once in SPI control mode, the output data standard
can be changed via bit LVDS/CMOS in Table 23.
When the ADC1210S enters SPI control mode, the output data format (two’s complement
or offset binary) is determined by the level on pin SCLK (gray code can only be selected
via the SPI). Once in SPI control mode, the output data format can be changed via bit
DATA_FORMAT[1:0] in Table 23.
ADC1210S_SER_1
Preliminary data sheet
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Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
24 of 36
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
CS
SCLK
(Data format)
SDIO
(CMOS LVDS DDR)
Offset binary, LVDS DDR
default mode at start-up
005aaa063
Fig 25. Default mode at start-up: SCLK LOW = offset binary; SDIO HIGH = LVDS DDR
CS
SCLK
(Data format)
SDIO
(CMOS LVDS DDR)
two's complement, CMOS
default mode at start-up
005aaa064
Fig 26. Default mode at start-up: SCLK HIGH = two’s complement; SDIO LOW = CMOS
ADC1210S_SER_1
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
25 of 36
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Table 19.
NXP Semiconductors
ADC1210S_SER_1
Preliminary data sheet
11.6.3 Register allocation map
Register allocation map
R/W
Bit definition
0005
Reset and
operating mode
R/W
SW_RST
0006
Clock
R/W
-
-
-
0008
Internal reference R/W
-
-
0011
Output data
standard
R/W
-
0012
Output clock
R/W
0013
Offset
0014
Bit 7
Default
Bit 6 Bit 5
Bit 4
Bit 3
Bit 2
RESERVED[2:0]
Bit 1
-
-
SE_SEL
DIFF_SE
-
-
-
INTREF_EN
-
-
LVDS_
CMOS
OUTBUF
-
-
-
-
DAVINV
R/W
-
-
Test pattern 1
R/W
-
-
0015
Test pattern 2
R/W
0016
Test pattern 3
R/W
0017
Fast OTR
R/W
-
-
-
-
0020
CMOS output
R/W
-
-
-
-
0021
LVDS DDR O/P 1 R/W
-
-
DAVI_x2_EN
0022
LVDS DDR O/P 2 R/W
-
-
-
Bit 0
Bin
OP_MODE[1:0]
CLKDIV
DCS_EN 0000
0001
INTREF[2:0]
OUTBUS_SWAP
0000
0000
DATA_FORMAT[1:0]
DAVPHASE[2:0]
-
0000
0000
-
TESTPAT_SEL[2:0]
0000
0000
TESTPAT_USER[11:4]
TESTPAT_USER[3:0]
0000
0000
-
-
FASTOTR
BI_BYTE_WISE
-
FASTOTR_DET[2:0]
DATAI_x2_EN
0000
0000
0000
0000
DATA_DRV[1:0]
0000
1110
DATAI[1:0]
0000
0000
LVDS_INT_TER[2:0]
0000
0000
26 of 36
© NXP B.V. 2010. All rights reserved.
ADC1210S series
-
-
DAV_DRV[1:0]
DAVI[1:0]
0000
0000
0000
1110
DIG_OFFSET[5:0]
-
0000
0000
ADC1210S series; CMOS or LVDS DDR digital outputs
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 April 2010
AddrHex Register name
ADC1210S series
NXP Semiconductors
ADC1210S series; CMOS or LVDS DDR digital outputs
Table 20.
Reset and operating mode control register (address 0005h) bit description
Bit
Symbol
Access
7
SW_RST
R/W
Value
Description
reset digital section
0
no reset
1
performs a reset of the digital section
6 to 4
RESERVED[2:0]
000
reserved
3 to 2
-
00
not used
1 to 0
OP_MODE[1:0]
Table 21.
Symbol
7 to 5
-
4
SE_SEL
DIF_SE
2
-
1
CLKDIV
0
operating mode
00
normal (power-up)
01
power-down
10
sleep
11
normal (power-up)
Clock control register (address 0006h) bit description
Bit
3
R/W
DCS_EN
ADC1210S_SER_1
Preliminary data sheet
Access
Value
Description
000
not used
R/W
single-ended clock input pin select
0
CLKM
1
CLKP
R/W
differential/single ended clock input select
0
fully differential
1
single-ended
0
R/W
not used
clock input divide by 2
0
disabled
1
enabled
R/W
duty cycle stabilizer
0
disabled
1
enabled
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ADC1210S series; CMOS or LVDS DDR digital outputs
Table 22.
Internal reference control register (address 0008h) bit description
Bit
Symbol
7 to 4
-
3
INTREF_EN
2 to 0
INTREF[2:0]
Table 23.
Value
Description
0000
not used
R/W
programmable internal reference enable
0
disable
1
active
R/W
programmable internal reference
000
0 dB (FS = 2 V)
001
−1 dB (FS = 1.78 V)
010
−2 dB (FS = 1.59 V)
011
−3 dB (FS = 1.42 V)
100
−4 dB (FS = 1.26 V)
101
−5 dB (FS = 1.12 V)
110
−6 dB (FS = 1 V)
111
reserved
Output data standard control register (address 0011h) bit description
Bit
Symbol
7 to 5
-
4
LVDS_CMOS
3
Access
OUTBUF
Access
Value
Description
000
not used
R/W
output data standard: LVDS DDR or CMOS
0
CMOS
1
LVDS DDR
R/W
output buffers enable
0
1
2
1 to 0
OUTBUS_SWAP
DATA_FORMAT[1:0]
ADC1210S_SER_1
Preliminary data sheet
R/W
output enabled
output disabled (high Z)
output bus swapping
0
no swapping
1
output bus is swapping (MSB becomes LSB and vice
versa)
R/W
output data format
00
offset binary
01
two’s complement
10
gray code
11
offset binary
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ADC1210S series
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ADC1210S series; CMOS or LVDS DDR digital outputs
Table 24.
Output clock register (address 0012h) bit description
Bit
Symbol
7 to 4
-
3
DAVINV
2 to 0
DAVPHASE[2:0]
Table 25.
Access
Value
Description
0000
not used
R/W
output clock data valid (DAV) polarity
0
normal
1
inverted
R/W
DAV phase select
000
output clock shifted (ahead) by 3 ns
001
output clock shifted (ahead) by 2.5 ns
010
output clock shifted (ahead) by 2 ns
011
output clock shifted (ahead) by 1.5 ns
100
output clock shifted (ahead) by 1 ns
101
output clock shifted (ahead) by 0.5 ns
110
default value as defined in timing section
111
output clock shifted (delayed) by 0.5 ns
Offset register (address 0013h) bit description
Bit
Symbol
7 to 6
-
5 to 0
DIG_OFFSET[5:0]
Access
Value
Description
00
not used
R/W
digital offset adjustment
011111
...
000000
0
...
...
100000
Table 26.
+31 LSB
...
−32 LSB
Test pattern register 1 (address 0014h) bit description
Bit
Symbol
7 to 3
-
2 to 0
TESTPAT_SEL[2:0]
Table 27.
Access
Value
Description
00000
not used
R/W
digital test pattern select
000
off
001
mid scale
010
−FS
011
+FS
100
toggle ‘1111..1111’/’0000..0000’
101
custom test pattern
110
‘1010..1010.’
111
‘010..1010’
Test pattern register 2 (address 0015h) bit description
Bit
Symbol
Access
Value
7 to 0
TESTPAT_USER[11:4]
R/W
00000000 custom digital test pattern (bits 11 to 4)
ADC1210S_SER_1
Preliminary data sheet
Description
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ADC1210S series; CMOS or LVDS DDR digital outputs
Table 28.
Test pattern register 3 (address 0016h) bit description
Bit
Symbol
Access
Value
Description
7 to 4
TESTPAT_USER[3:0]
R/W
0000
custom digital test pattern (bits 3 to 0)
3 to 0
-
0000
not used
Table 29.
Fast OTR register (address 0017h) bit description
Bit
Symbol
7 to 4
-
3
FASTOTR
2 to 0
Value
Description
0000
not used
R/W
FASTOTR_DET[2:0]
Table 30.
fast Out-of-Range (OTR) detection
0
disabled
1
enabled
R/W
set fast OTR detect level
000
−20.56 dB
001
−16.12 dB
010
−11.02 dB
011
−7.82 dB
100
−5.49 dB
101
−3.66 dB
110
−2.14 dB
111
−0.86 dB
CMOS output register (address 0020h) bit description
Bit
Symbol
7 to 4
-
3 to 2
DAV_DRV[1:0]
1 to 0
Access
DATA_DRV[1:0]
ADC1210S_SER_1
Preliminary data sheet
Access
Value
Description
0000
not used
R/W
drive strength for DAV CMOS output buffer
00
low
01
medium
10
high
11
very high
R/W
drive strength for DATA CMOS output buffer
00
low
01
medium
10
high
11
very high
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ADC1210S series
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ADC1210S series; CMOS or LVDS DDR digital outputs
Table 31.
LVDS DDR output register 1 (address 0021h) bit description
Bit
Symbol
7 to 6
-
5
DAVI_x2_EN
4 to 3
2
1 to 0
DAVI[1:0]
DATAI_x2_EN
DATAI[1:0]
Table 32.
Value
Description
00
not used
R/W
double LVDS current for DAV LVDS buffer
0
disabled
1
enabled
R/W
LVDS current for DAV LVDS buffer
00
3.5 mA
01
4.5 mA
10
1.25 mA
11
2.5 mA
R/W
double LVDS current for DATA LVDS buffer
0
disabled
1
enabled
R/W
LVDS current for DATA LVDS buffer
00
3.5 mA
01
4.5 mA
10
1.25 mA
11
2.5 mA
LVDS DDR output register 2 (address 0022h) bit description
Bit
Symbol
7 to 4
-
3
BIT_BYTE_WISE
2 to 0
Access
LVDS_INTTER[2:0]
ADC1210S_SER_1
Preliminary data sheet
Access
Value
Description
0000
not used
R/W
DDR mode for LVDS output
0
bit wise (even data bits output on DAV rising edge/odd data
bits output on DAV falling edge)
1
byte wise (MSB data bits output on DAV rising edge/LSB data
bits output on DAV falling edge)
R/W
internal termination for LVDS buffer (DAV and DATA)
000
no internal termination
001
300 Ω
010
180 Ω
011
110 Ω
100
150 Ω
101
100 Ω
110
81 Ω
111
60 Ω
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12. Package outline
HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6 x 6 x 0.85 mm
A
B
D
SOT618-6
terminal 1
index area
E
A
A1
c
detail X
e1
1/2 e
e
11
20
C
C A B
C
v
w
b
y1 C
y
L
21
10
e
e2
Eh
1/2 e
1
terminal 1
index area
30
40
31
X
Dh
0
2.5
scale
Dimensions
Unit
mm
5 mm
A(1)
A1
b
max 1.00 0.05 0.30
nom 0.85 0.02 0.21
min 0.80 0.00 0.18
c
D(1)
Dh
E(1)
Eh
0.2
6.1
6.0
5.9
4.55
4.40
4.25
6.1
6.0
5.9
4.55
4.40
4.25
e
e1
0.5
4.5
e2
L
v
4.5
0.5
0.4
0.3
0.1
w
y
0.05 0.05
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
SOT618-6
References
IEC
JEDEC
JEITA
MO-220
---
sot618-6_po
European
projection
Issue date
09-02-23
09-03-04
Fig 27. Package outline SOT618-6 (HVQFN40)
ADC1210S_SER_1
Preliminary data sheet
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Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
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ADC1210S series; CMOS or LVDS DDR digital outputs
13. Revision history
Table 33.
Revision history
Document ID
Release date
Data sheet status
Change
notice
Supersedes
ADC1210S_SER_1
20100409
Preliminary data sheet
-
-
ADC1210S_SER_1
Preliminary data sheet
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Rev. 01 — 9 April 2010
© NXP B.V. 2010. All rights reserved.
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14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
ADC1210S_SER_1
Preliminary data sheet
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© NXP B.V. 2010. All rights reserved.
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ADC1210S series
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Preliminary data sheet
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© NXP B.V. 2010. All rights reserved.
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16. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
10.1
10.2
10.3
11
11.1
11.1.1
11.1.2
11.1.3
11.1.4
11.2
11.2.1
11.2.2
11.2.3
11.3
11.3.1
11.3.2
11.3.3
11.3.4
11.4
11.4.1
11.4.2
11.4.3
11.4.4
11.5
11.5.1
11.5.2
11.5.3
11.5.4
11.5.5
11.5.6
11.5.7
11.6
11.6.1
11.6.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Clock and digital output timing . . . . . . . . . . . . 10
SPI timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 12
Device control . . . . . . . . . . . . . . . . . . . . . . . . . 12
SPI and Pin control modes . . . . . . . . . . . . . . . 12
Operating mode selection. . . . . . . . . . . . . . . . 13
Selecting the output data standard . . . . . . . . . 13
Selecting the output data format. . . . . . . . . . . 13
Analog inputs . . . . . . . . . . . . . . . . . . . . . . . . . 13
Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Anti-kickback circuitry . . . . . . . . . . . . . . . . . . . 14
Transformer . . . . . . . . . . . . . . . . . . . . . . . . . . 15
System reference and power management . . 16
Internal/external references . . . . . . . . . . . . . . 16
Reference gain control . . . . . . . . . . . . . . . . . . 17
Common-mode output voltage (VO(cm)) . . . . . 18
Biasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Drive modes . . . . . . . . . . . . . . . . . . . . . . . . . 18
Equivalent input circuit . . . . . . . . . . . . . . . . . . 19
Duty cycle stabilizer . . . . . . . . . . . . . . . . . . . . 20
Clock input divider . . . . . . . . . . . . . . . . . . . . . 20
Digital outputs . . . . . . . . . . . . . . . . . . . . . . . . . 20
Digital output buffers: CMOS mode . . . . . . . . 20
Digital output buffers: LVDS DDR mode . . . . . 21
Data valid (DAV) output clock . . . . . . . . . . . . . 22
Out-of-Range (OTR) . . . . . . . . . . . . . . . . . . . . 22
Digital offset . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Test patterns . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Output codes versus input voltage . . . . . . . . . 23
Serial peripheral interface. . . . . . . . . . . . . . . . 23
Register description . . . . . . . . . . . . . . . . . . . . 23
Default modes at start-up . . . . . . . . . . . . . . . . 24
11.6.3
12
13
14
14.1
14.2
14.3
14.4
15
16
Register allocation map . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
32
33
34
34
34
34
35
35
36
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 9 April 2010
Document identifier: ADC1210S_SER_1
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