AD ADG3233BRM-REEL

Data Sheet
Low Voltage 1.65 V to 3.6 V, Bidirectional
Logic Level Translation, Bypass Switch
ADG3233
FEATURES
FUNCTIONAL BLOCK DIAGRAM
VCC1
Operates from 1.65 V to 3.6 V supply rails
Bidirectional level translation, unidirectional signal path
8-lead SOT-23 and MSOP packages
Bypass or normal operation
Short circuit protection
VCC2
VCC1
A1
Y1
VCC1
APPLICATIONS
VCC1 VCC2
VCC2
0
JTAG chain bypassing
Daisy-chain bypassing
Digital switching
Y2
1
A2
EN
GND
03297-001
ADG3233
Figure 1.
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG3233 is a bypass switch designed on a submicron
process that operates from supplies as low as 1.65 V. The device
is guaranteed for operation over the supply range 1.65 V to 3.6 V. It
operates from two supply voltages, allowing bidirectional level
translation, that is, it translates low voltages to higher voltages
and vice versa. The signal path is unidirectional, meaning data
may only flow from A → Y.
1.
1
This type of device may be used in applications that require a
bypassing function. It is ideally suited to bypassing devices in
a JTAG chain or in a daisy-chain loop. One switch could be
used for each device or a number of devices, thus allowing
easy bypassing of one or more devices in a chain. This may
be particularly useful in reducing the time overhead in testing
devices in the JTAG chain or in daisy-chain applications where
the user does not wish to change the settings of a particular device.
2.
3.
4.
Bidirectional level translation matches any voltage level
from 1.65 V to 3.6 V.
The bypass switch offers high performance and is fully
guaranteed across the supply range.
Short circuit protection.
Tiny 8-lead SOT-23 package and 8-lead MSOP.
Table 1. Truth Table
EN
L
H
Signal Path
A1 → Y2, Y1 → VCC1
A1 → Y1, A2 → Y2
Function
Enable bypass mode
Enable normal mode
The bypass switch is packaged in two of the smallest footprints
available for its required pin count. The 8-lead SOT-23 package
requires only 2.9 mm × 2.8 mm board space, while the MSOP
package occupies approximately 3 mm × 4.9 mm board area.
1
U.S. Patent Number: 7,369,385 B2.
Rev. B
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2003–2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADG3233
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
ESD Caution...................................................................................6
Applications ....................................................................................... 1
Pin Configuration and Function Descriptions..............................7
Functional Block Diagram .............................................................. 1
Typical Performance Characteristics ..............................................8
General Description ......................................................................... 1
Theory of Operation ...................................................................... 13
Product Highlights ........................................................................... 1
A1 and EN Input ........................................................................ 13
Revision History ............................................................................... 2
Normal Operation ...................................................................... 13
Specifications..................................................................................... 3
Bypass Operation ....................................................................... 14
Test Waveforms ............................................................................. 5
Outline Dimensions ....................................................................... 15
Absolute Maximum Ratings ............................................................ 6
Ordering Guide .......................................................................... 16
REVISION HISTORY
7/13—Rev. A to Rev. B
Changes to Table 1 ............................................................................ 1
7/11—Rev. 0 to Rev. A
Changes to Patent Number, General Description Section, and
Product Highlights Section ............................................................. 1
Changes to VCC = VCC1 = VCC2 = 2.5 V ± 0.2 V, ENABLE Time
EN → Y1, Table 2 ............................................................................. 4
Changes to Table 3 ............................................................................ 6
Updated Outline Dimensions ....................................................... 15
Changes to Ordering Guide .......................................................... 16
5/03—Revision 0: Initial Version
Rev. B | Page 2 of 16
Data Sheet
ADG3233
SPECIFICATIONS
VCC1 = VCC2 = 1.65 V to 3.6 V, GND = 0 V, all specifications TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter 1
LOGIC INPUTS/OUTPUTS 3
Input High Voltage 4
Symbol
VIH
Input Low Voltage4
VIL
Output High Voltage (Y1)
VOH
Output Low Voltage (Y1)
VOL
LOGIC OUTPUTS3
Output High Voltage (Y2)
VOH
Output Low Voltage (Y2)
VOL
SWITCHING CHARACTERISTICS 4, 5
VCC = VCC1 = VCC2 = 3.3 V ± 0.3 V
Propagation Delay, tPD
A1 → Y1 Normal Mode
A2 →Y2 Normal Mode
A1 → Y2 Bypass Mode
ENABLE Time EN → Y1
Test Conditions/Comments
VCC2 = 1.65 V to 3.6 V, GND = 0 V
VCC1 = 3.0 V to 3.6 V
VCC1 = 2.3 V to 2.7 V
VCC1 = 1.65 V to 1.95 V
VCC1 = 3.0 V to 3.6 V
VCC1 = 2.3 V to 2.7 V
VCC1 = 1.65 V to 1.95 V
IOH = −100 µA, VCC1 = 3.0 V to 3.6 V
IOH = −100 µA, VCC1 = 2.3 V to 2.7 V
IOH = −100 µA, VCC1 = 1.65 V to 1.95 V
IOH = −4 mA, VCC1 = 2.3 V to 2.7 V
IOH = −4 mA, VCC1 = 1.65 V to 1.95 V
IOH = −8 mA, VCC1 = 3.0 V to 3.6 V
IOL = 100 µA, VCC1 = 3.0 V to 3.6 V
IOL = 100 µA, VCC1 = 2.3 V to 2.7 V
IOL = 100 µA, VCC1 = 1.65 V to 1.95 V
IOL = 4 mA, VCC1 = 2.3 V to 2.7 V
IOL = 4 mA, VCC1 = 1.65 V to 1.95 V
IOL = 8 mA, VCC1 = 3.0 V to 3.6 V
VCC1 = 1.65 V to 3.6 V, GND = 0 V
IOH = −100 µA, VCC2 = 3.0 V to 3.6 V
IOH = −100 µA, VCC2 = 2.3 V to 2.7 V
IOH = −100 µA, VCC2 = 1.65 V to 1.95 V
IOH = −4 mA, VCC2 = 2.3 V to 2.7 V
IOH = −4 mA,VCC2 = 1.65 V to 1.95 V
IOH = −8 mA, VCC2 = 3.0 V to 3.6 V
IOL = 100 µA, VCC2 = 3.0 V to 3.6 V
IOL = 100 µA, VCC2 = 2.3 V to 2.7 V
IOL = 100 µA, VCC2 = 1.65 V to 1.95 V
IOL = 4 mA, VCC2 = 2.3 V to 2.7 V
IOL = 4 mA, VCC2 = 1.65 V to 1.95 V
IOL = 8 mA, VCC2 = 3.0 V to 3.6 V
Min
Typ 2
Max
1.35
1.35
0.65 × VCC
Unit
0.40
0.40
0.45
0.40
0.45
0.40
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
0.40
0.40
0.45
0.40
0.45
0.40
V
V
V
V
V
V
V
V
V
V
V
V
0.8
0.7
0.35 × VCC
2.4
2.0
VCC − 0.45
2.0
VCC – 0.45
2.4
2.4
2.0
VCC − 0.45
2.0
VCC – 0.45
2.4
tPHL, tPLH
tPHL, tPLH
tPHL, tPLH
tEN
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
3.5
3.5
4
4
5.4
5.4
6.5
6
ns
ns
ns
ns
DISABLE Time EN → Y1
tDIS
CL = 30 pF, VT = VCC/2
2.8
4
ns
ENABLE Time EN → Y2
tEN
CL = 30 pF, VT = VCC/2
4.5
6.5
ns
DISABLE Time EN → Y2
tDIS
CL = 30 pF, VT = VCC/2
4
6.5
ns
Rev. B | Page 3 of 16
ADG3233
Parameter 1
VCC = VCC1 = VCC2 = 2.5 V ± 0.2 V
Propagation Delay, tPD
A1 → Y1 Normal Mode
A2 → Y2 Normal Mode
A1 → Y2 Bypass Mode
ENABLE Time EN → Y1
Data Sheet
Symbol
Test Conditions/Comments
tPHL, tPLH
tPHL, tPLH
tPHL, tPLH
tEN
DISABLE Time EN → Y1
Typ 2
Max
Unit
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
4.5
4.5
4.5
5
6.2
6.2
6.5
7.2
ns
ns
ns
ns
tDIS
CL = 30 pF, VT = VCC/2
3.2
4.7
ns
ENABLE Time EN → Y2
tEN
CL = 30 pF, VT = VCC/2
5
7.7
ns
DISABLE Time EN → Y2
VCC = VCC1 = VCC2 = 1.8 V ± 0.15 V
Propagation Delay, tPD
A1 → Y1 Normal Mode
A2 → Y2 Normal Mode
A1 → Y2 Bypass Mode
ENABLE Time EN → Y1
tDIS
CL = 30 pF, VT = VCC/2
4.8
7.2
ns
tPHL, tPLH
tPHL, tPLH
tPHL, tPLH
tEN
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
CL = 30 pF, VT = VCC/2
6.7
6.5
6.5
7
10
10
10.25
10.5
ns
ns
ns
ns
DISABLE Time EN → Y1
tDIS
CL = 30 pF, VT = VCC/2
4.4
6.5
ns
ENABLE Time EN → Y2
tEN
CL = 30 pF, VT = VCC/2
7
12
ns
DISABLE Time EN → Y2
Input Leakage Current
Output Leakage Current
POWER REQUIREMENTS
Power Supply Voltages
tDIS
CL = 30 pF, VT = VCC/2
6.5
II
IO
0 ≤ VIN ≤ 3.6 V
0 ≤ VIN ≤ 3.6 V
Quiescent Power Supply Current
Increase in ICC per Input
VCC1
VCC2
ICC1
ICC2
ΔICC1
Min
1.65
1.65
Digital inputs = 0 V or VCC
Digital inputs = 0 V or VCC
VCC = 3.6 V, one input at 3.0 V; others at
VCC or GND
10.5
ns
±1
±1
µA
µA
3.6
3.6
2
2
0.75
V
V
µA
µA
µA
Temperature range is as follows: B Version: −40°C to +85°C.
All typical values are at VCC = VCC1 = VCC2, TA = 25°C, unless otherwise stated.
3
VIL and VIH levels are specified with respect to VCC1, VOH, and VOL levels for Y1 are specified with respect to VCC1, and VOH, and VOL levels are specified for Y2 with respect to
VCC2.
4
Guaranteed by design, not subject to production test.
5
See the Test Waveforms section.
1
2
Rev. B | Page 4 of 16
Data Sheet
ADG3233
TEST WAVEFORMS
VCC1
INPUT
VT
0V
tPHL
VOH
OUTPUT
VT
VOL
03297-032
tPLH
Figure 2. Propagation Delay
VCC1
VT
EN
0V
tEN
tDIS
VT
VT
VOL
03297-033
VOH
Y1
(A1 AT GND)
Figure 3. Y1 Enable and Disable Times
VCC1
VT
EN
0V
tEN
tDIS
VCC1
A1
0V
VCC1
A2
0V
Y2
VT
VT
VOL
Figure 4. Y2 Enable and Disable Times
Rev. B | Page 5 of 16
03297-034
VOLH
ADG3233
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VCC to GND
Digital Inputs to GND
A1, EN
A2
DC Output Current
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
8-Lead MSOP
θJA Thermal Impedance
θJC Thermal Impedance
8-Lead SOT-23
θJA Thermal Impedance
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
Soldering (Pb-Free)
Reflow, Peak Temperature
Time at Peak Temperature
Rating
–0.3 V to +4.6 V
–0.3 V to +4.6 V
–0.3 V to +4.6 V
–0.3 V to VCC1 + 0.3 V
25 mA
–40°C to +85°C
–65°C to +150°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
ESD CAUTION
206°C/W
43°C/W
211°C/W
300°C
235°C
260(+0/−5)°C
20 sec to 40 sec
Rev. B | Page 6 of 16
Data Sheet
ADG3233
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VCC2
EN 4
VCC2 1
7
5
GND
Y1 2
ADG3233
Y2 3
TOP VIEW
(Not to Scale)
GND 4
Figure 5. 8-Lead SOT-23 Package (RJ-8)
8
VCC1
7
A1
6
A2
5
EN
03297-003
8
ADG3233
Y1
TOP VIEW
A2 3 (Not to Scale) 6 Y2
A1 2
03297-002
VCC1 1
Figure 6. 8-Lead MSOP Package (RM-8)
Table 4. Pin Function Descriptions
Pin No.
RJ-8 RM-8
1
8
8
1
2
7
3
6
7
2
6
3
Mnemonic
VCC1
VCC2
A1
A2
Y1
Y2
4
5
EN
GND
5
4
Description
Supply Voltage 1, can be any supply voltage from 1.65 V to 3.6 V.
Supply Voltage 2, can be any supply voltage from 1.65 V to 3.6 V.
Input Referred to VCC1.
Input Referred to VCC2.
Output Referred to VCC1.
Output Referred to VCC2. Voltage levels appearing at Y2 will be translated from a VCC1 voltage level to a VCC2
voltage level.
Active Low Device Enable. When low, bypass mode is enabled; when high, the device is in normal mode.
Device Ground.
Rev. B | Page 7 of 16
ADG3233
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
30
5.0
VCC1 = 3.3V
TA = 25°C
4.5
25
4.0
20
3.0
ICC2 (nA)
ICC1 (nA)
3.5
2.5
2.0
VCC2 = 3.3V
15
VCC2 = 2.5V
VCC2 = 1.8V
10
1.5
5
VCC2 = 2.5V
VCC2 = 3.3V
1.0
VCC2 = 1.8V
0
2.0
3.0
2.5
3.5
4.0
VCC1 (V)
–5
03297-004
0
1.5
0
20
30
40
50
TEMPERATURE (°C)
60
70
80
Figure 10. ICC2 vs. Temperature
Figure 7. ICC1 vs. VCC1
2000
5.0
TA = 25°C
TA = 25°C
4.5
1800
4.0
1600
3.5
1400
3.0
1200
ICC1 (µA)
2.5
VCC1 = VCC2 = 3.3V
1000
VCC1 = VCC2 = 1.8V
800
2.0
600
1.5
VCC1 = 3.3V
VCC1 = 2.5V
400
1.0
200
0.5
VCC1 = 1.8V
2.5
2.0
3.5
3.0
4.0
VCC2 (V)
0
10k
03297-005
0
1.5
100k
1M
10M
03297-008
ICC2 (nA)
10
03297-007
0.5
100M
FREQUENCY (Hz)
Figure 11. ICC1 vs. Frequency, Normal Mode
Figure 8. ICC2 vs. VCC2
80
30
TA = 25°C
VCC2 = 3.3V
70
25
VCC1 = VCC2 = 3.3V
60
50
ICC1 (µA)
VCC1 = 3.3V
VCC1 = 2.5V
15
VCC1 = 1.8V
40
VCC1 = VCC2 = 1.8V
30
10
20
5
0
0
10
20
30
40
50
TEMPERATURE (°C)
60
70
80
0
10k
100k
1M
10M
FREQUENCY (Hz)
Figure 12. ICC1 vs. Frequency, Bypass Mode
Figure 9. ICC1 vs. Temperature
Rev. B | Page 8 of 16
100M
03297-009
10
03297-006
ICC1 (nA)
20
Data Sheet
ADG3233
2000
10
TA = 25°C
1800
1600
8
1400
TIME (ns)
1000
VCC1 = VCC2 = 1.8V
800
6
tEN
4
tDIS
600
400
2
TA = 25°C
VCC1 = VCC2
200
1M
100k
10M
100M
FREQUENCY (Hz)
0
1.5
03297-010
0
10k
2.0
Figure 13. ICC2 vs. Frequency, Normal Mode
2.5
3.0
SUPPLY (V)
3.5
4.0
03297-013
ICC2 (µA)
VCC1 = VCC2 = 3.3V
1200
Figure 16. Y2 Enable, Disable Time vs. Supply
2000
6
TA = 25°C
1800
5
1600
1400
TIME (ns)
1000
VCC1 = VCC2 = 1.8V
3
tDIS
2
600
400
1
VCC1 = VCC2 = 3.3V
200
100k
1M
10M
100M
FREQUENCY (Hz)
0
–40
03297-011
0
10k
Figure 14. ICC2 vs. Frequency, Bypass Mode
0
–20
20
40
TEMPERATURE (°C)
60
80
03297-014
ICC2 (µA)
1200
800
tEN
4
VCC1 = VCC2 = 3.3V
Figure 17. Y1 Enable, Disable Time vs. Temperature
10
6
5
8
tEN
TIME (ns)
tEN
tDIS
4
tDIS
3
2
2
1
TA = 25°C
VCC1 = VCC2
2.0
VCC1 = VCC2 = 3.3V
2.5
3.0
SUPPLY (V)
3.5
4.0
0
–40
Figure 15. Y1 Enable, Disable Time vs. Supply
–20
0
20
40
TEMPERATURE (°C)
60
Figure 18. Y2 Enable, Disable Time vs. Temperature
Rev. B | Page 9 of 16
80
03297-015
0
1.5
03297-012
TIME (ns)
4
6
ADG3233
Data Sheet
16
10
VCC1 = 3.3V
VCC2 = 1.8V
TA = 25°C
DATA RATE = 10Mbps
14
VCC1 = 1.8V
VCC2 = 3.3V
TA = 25°C
DATA RATE = 10Mbps
9
8
RISE/FALL TIME (ns)
10
8
tPLH, LOW-TO-HIGH TRANSITION
6
7
tPLH, LOW-TO-HIGH TRANSITION
6
5
4
3
4
tPHL, HIGH-TO-LOW TRANSITION
2
tPHL, HIGH-TO-LOW TRANSITION
22
32
42
72
52
62
CAPACITIVE LOAD (pF)
82
92
102
0
22
Figure 19. Rise/Fall Time vs. Capacitive Load, A1 → Y1, A2 → Y2
72
52
62
CAPACITIVE LOAD (pF)
82
92
102
8
VCC1 = 3.3V
VCC2 = 1.8V
TA = 25°C
DATA RATE = 10Mbps
12
10
tPLH, LOW-TO-HIGH TRANSITION
8
6
4
tPHL, HIGH-TO-LOW TRANSITION
32
42
72
52
62
CAPACITIVE LOAD (pF)
tPLH, LOW-TO-HIGH TRANSITION
5
4
tPHL, HIGH-TO-LOW TRANSITION
3
2
82
92
102
0
22
Figure 20. Rise/Fall Time vs. Capacitive Load, A1 → Y2, Bypass Mode
32
42
72
52
62
CAPACITIVE LOAD (pF)
82
92
102
03297-020
0
22
6
1
03297-017
2
VCC1 = 3.3V
VCC2 = 3.3V
TA = 25°C
DATA RATE = 10Mbps
7
PROPAGATION DELAY (ns)
14
RISE/FALL TIME (ns)
42
Figure 22. Rise/Fall Time vs. Capacitive Load, A1 → Y2, Bypass Mode
16
Figure 23. Propagation Delay vs. Capacitive Load A1 → Y1
10
8
VCC1 = 1.8V
VCC2 = 3.3V
TA = 25°C
DATA RATE = 10Mbps
8
7
PROPAGATION DELAY (ns)
9
RISE/FALL TIME (ns)
32
03297-019
1
0
03297-016
2
7
tPLH, LOW-TO-HIGH TRANSITION
6
5
4
3
tPHL, HIGH-TO-LOW TRANSITION
tPLH, LOW-TO-HIGH TRANSITION
6
5
tPHL, HIGH-TO-LOW TRANSITION
4
3
2
VCC1 = 3.3V
VCC2 = 3.3V
TA = 25°C
DATA RATE = 10Mbps
2
1
1
22
32
42
72
62
52
CAPACITIVE LOAD (pF)
82
92
102
0
03297-018
0
22
Figure 21. Rise/Fall Time vs. Capacitive Load, A1 → Y1, A2 → Y2
32
42
72
62
52
CAPACITIVE LOAD (pF)
82
92
102
Figure 24. Propagation Delay vs. Capacitive Load A2 → Y2
Rev. B | Page 10 of 16
03297-021
RISE/FALL TIME (ns)
12
Data Sheet
ADG3233
8
4.0
7
3.5
PROPAGATION DELAY (ns)
6
tPLH, LOW-TO-HIGH TRANSITION
5
tPHL, HIGH-TO-LOW TRANSITION
3
2
VCC1 = 3.3V
VCC2 = 3.3V
TA = 25°C
DATA RATE = 10Mbps
1
32
42
2.0
tPLH, A1 → Y1
tPLH, A2 → Y2
1.5
1.0
0.5
VCC1 = VCC2 = 3.3V
0
22
2.5
72
52
62
CAPACITIVE LOAD (pF)
82
92
102
0
–40
Figure 25. Propagation Delay vs. Capacitive Load A1 → Y2, Bypass Mode
–20
0
20
40
TEMPERATURE (°C)
60
03297-025
4
tPHL, A1 → Y1
3.0
03297-022
PROPAGATION DELAY (ns)
tPHL, A2 → Y2
80
Figure 28. Propagation Delay vs. Temperature, Normal Mode
8
4
tPHL, A1 → Y2
7
PROPAGATION DELAY (ns)
6
tPHL, A2 → Y2
4
3
tPHL, A1 → Y1
tPLH, A2 → Y2
2
2
1
TA = 25°C
VCC1 = VCC2
1
VCC1 = VCC2 = 3.3V
0
1.5
2.0
tPLH, A1 → Y2
3.0
2.5
SUPPLY (V)
3.5
4.0
0
–40
Figure 26. Propagation Delay vs. Supply, Normal Mode
–20
0
20
40
TEMPERATURE (°C)
60
03297-026
5
3
03297-023
PROPAGATION DELAY (ns)
tPLH, A1 → Y1
80
Figure 29. Propagation Delay vs. Temperature, Bypass Mode
8
6
3.3V
A1
Y1
1.8V
tPHL, A1 → Y2
4
3
1
tPLH, A1 → Y2
3.3V
A2
Y2
2
TA = 25°C
VCC1 = VCC2
2
1.5
2.0
2.5
3.0
SUPPLY (V)
3.5
4.0
4
CH1 1.00V
CH2 500mV
CH3 1.00VΩ CH4 1.00VΩ
Figure 27. Propagation Delay vs. Supply, Bypass Mode
M5.00ns
CH1
1.48V
Figure 30. Normal Mode VCC1 = 3.3 V, VCC2 = 1.8 V
Rev. B | Page 11 of 16
03297-027
DATA RATE = 10MHz
0
03297-024
PROPAGATION DELAY (ns)
TA = 25°C
EN = HIGH
ADG3233
Data Sheet
1.8V
TA = 25°C
DATA RATE = 10MHz
3.3V
A1
A1
3
1.8V
3.3V
Y2
2
1.8V
Y2
Y1
3
2
1
M5.00ns
CH2
1.47V
CH1 1.00V
CH2 2.00V
CH3 1.00VΩ
Figure 31. Bypass Mode, VCC1 = 3.3 V, VCC2 = 1.8 V
M5.00ns
CH3
900mV
03297-030
CH2 1.00VΩ CH2 500mV
03297-028
TA = 25°C
DATA RATE = 10MHz
Figure 33. Bypass Mode, VCC1 = 1.8 V, VCC2 = 3.3 V
3.5
VCC = 3.3V
3.3V
TA = 25°C
VCC = VCC1 = VCC2
3.0
1.8V
A1
3
VCC = 2.5V
2.5
Y1
VOLTAGE (V)
SOURCE
1
1.8V
A2
3.3V
2.0
VCC = 1.8V
1.5
1.0
Y2
TA = 25°C
DATA RATE = 10MHz
CH1 1.00V
CH2 2.00V
CH3 5.00VΩ CH4 1.00VΩ
M5.00ns
CH1
1.48V
VCC = 3.3V
VCC = 2.5V
SINK
0
03297-029
2
VCC = 1.8V
0.5
0
Figure 32. Normal Mode, VCC1 = 1.8 V, VCC2 = 3.3 V
5
10
CURRENT (mA)
15
Figure 34. Y1 and Y2 Source and Sink Current
Rev. B | Page 12 of 16
20
03297-031
4
Data Sheet
ADG3233
THEORY OF OPERATION
NORMAL OPERATION
The ADG3233 is a bypass switch designed on a submicron
process that operates from supplies as low as 1.65 V. The device
is guaranteed for operation over the supply range 1.65 V to 3.6 V. It
operates from two supply voltages, allowing bidirectional level
translation, that is, it translates low voltages to higher voltages
and vice versa. The signal path is unidirectional, meaning data
may only flow from A → Y.
Figure 35 shows the bypass switch being used in normal mode.
In this mode, the signal paths are from A1 → Y1 and A2 → Y2.
The device will level translate the signal applied to A1 to a VCC1
logic level (this level translation can be either to a higher or
lower supply) and route the signal to the Y1 output, which
will have standard VOL/VOH levels for VCC1 supplies. The signal
is then passed through Device 1 and back to the A2 input pin
of the bypass switch.
A1 AND EN INPUT
The A1 and enable (EN) inputs have VIL/VIH logic levels so that
the part can accept logic levels of VOL/VOH from Device 0 or the
controlling device independent of the value of the supply being
used by the controlling device. These inputs (A1, EN) are
capable of accepting inputs outside the VCC1 supply range. For
example, the VCC1 supply applied to the bypass switch could be
1.8 V while Device 0 could be operating from a 2.5 V or 3.3 V
supply rail, there are no internal diodes to the supply rails, so
the device can handle inputs above the supply but inside the
absolute maximum ratings.
The logic level inputs of A2 are with respect to the VCC1 supply.
The signal will be level translated from VCC1 to VCC2 and routed
to the Y2 output pin of the bypass switch. Y2 output logic levels
are with respect to the VCC2 supply.
VCC0
VCC1
DEVICE 0
VCC2
DEVICE 1
DEVICE 2
SIGNAL INPUT
SIGNAL OUTPUT
VCC1
VCC2
Y1
A2
Y2
03297-035
A1
EN
LOGIC 1
BYPASS SWITCH
Figure 35. Bypass Switch in Normal Mode
Rev. B | Page 13 of 16
ADG3233
Data Sheet
BYPASS OPERATION
The three supplies in Figure 35 and Figure 36 may be any
combination of supplies, that is., VCC0, VCC1, and VCC2 may be
any combination of supplies, for example, 1.8 V, 2.5 V, and 3.3 V.
Figure 36 illustrates the device as used in bypass mode. The
signal path is now from A1 directly to Y2, thus bypassing
Device 1 completely. The signal will be level translated to a VCC2
logic level and available on Y2, where it may be applied directly
to the input of Device 2. In bypass mode, Y1 is pulled up to VCC1.
VCC0
VCC1
DEVICE 0
VCC2
DEVICE 1
DEVICE 2
SIGNAL INPUT
SIGNAL OUTPUT
VCC1
VCC2
Y1
A2
Y2
03297-036
A1
EN
LOGIC 0
BYPASS SWITCH
Figure 36. Bypass Switch in Bypass Mode
Rev. B | Page 14 of 16
Data Sheet
ADG3233
OUTLINE DIMENSIONS
3.20
3.00
2.80
5.15
4.90
4.65
5
8
3.20
3.00
2.80
1
4
PIN 1
IDENTIFIER
0.65 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.80
0.55
0.40
0.23
0.09
6°
0°
0.40
0.25
10-07-2009-B
0.15
0.05
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 37. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
3.00
2.90
2.80
1.70
1.60
1.50
8
7
6
5
1
2
3
4
3.00
2.80
2.60
PIN 1
INDICATOR
0.65 BSC
1.95
BSC
1.45 MAX
0.95 MIN
0.15 MAX
0.05 MIN
0.38 MAX
0.22 MIN
0.22 MAX
0.08 MIN
SEATING
PLANE
8°
4°
0°
0.60
BSC
COMPLIANT TO JEDEC STANDARDS MO-178-BA
Figure 38. 8-Lead Small Outline Transistor Package [SOT-23]
(RJ-8)
Dimensions shown in millimeters
Rev. B | Page 15 of 16
0.60
0.45
0.30
12-16-2008-A
1.30
1.15
0.90
ADG3233
Data Sheet
ORDERING GUIDE
Model 1
ADG3233BRJ-REEL
ADG3233BRJ-REEL7
ADG3233BRJZ-REEL7
ADG3233BRM
ADG3233BRM-REEL
ADG3233BRM-REEL7
ADG3233BRMZ
ADG3233BRMZ-REEL7
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
Z = RoHS Compliant Part.
©2003–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03297-0-7/13(B)
Rev. B | Page 16 of 16
Branding
W1B
W1B
S1S
W1B
W1B
W1B
S1S
S1S
Package Option
RJ-8
RJ-8
RJ-8
RM-8
RM-8
RM-8
RM-8
RM-8