AIC AIC1734-52XXA 300ma low dropout linear regulator Datasheet

AIC1734
300mA Low Dropout Linear Regulator


FEATURES
DESCRIPTION

Low Dropout Voltage of 470mV at 300mA
Output Current (3.0V Output Version).
The AIC1734 is a 3-pin low dropout linear

Guaranteed 300mA Output Current.
AIC1734 include zero base current loss, very

Low Ground Current at 55A.
low dropout voltage, and 2% accuracy output

2% Accuracy Output Voltage of 1.8V/ 2.0V
/2.5V /2.7V/ 3.0V/ 3.3V/ 3.5V/ 3.7V/ 3.8V/ 5.0V/
5.2V.
voltage.

Only needs 1F Output Capacitor for Stability.
output current is exceptionally low. Built-in

Current and Thermal Limiting.
output current limiting and thermal limiting

regulator. The superior characteristics of the
Typical
ground
current
remains
approximately 55A, for loading ranging from
zero to maximum. Dropout voltage at 300mA
provide maximal protection to the AIC1734
APPLICATIONS
against fault conditions.

CD-ROM Drivers.
The AIC1734 is available in popular SOT-23,

LAN Cards.
SOT-89 and TO-92 packages.

Microprocessor.

RAM Module.

Wireless Communication Systems.
Battery Powered Systems.

 TYPICAL APPLICATION CIRCUIT
VOUT
VIN
AIC1734
VIN
+
CIN
1F
GND
VOUT
+
COUT
1F
(Note1)
Low Dropout Linear Regulator
Analog Integrations Corporation
Si-Soft Research Center
DS-1734G-05 20120615
3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
1
AIC1734

ORDERING INFORMATION
AIC1734-XXXXX XX
PIN CONFIGURATION
PACKING TYPE
TR: REEL
BG: BAG
PACKAGE TYPE
U: SOT-23
XA: SOT-89
XT: SOT-89
ZT: TO-92
ZL: TO-92
P: Lead Free Commercial
G: Green Package
OUTPUT VOLTAGE
18: 1.8V
20: 2.0V
25: 2.5V
27: 2.7V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
50: 5.0V
52: 5.2V
Example:
AIC1734-18PXATR
 1.8V Version, in Lead Free SOT-89
Package & Reel Packing Type
3
SOT-23(U)
TOP VIEW
1: GND
2: VOUT
3: VIN
1
SOT-89(XA)
TOP VIEW
1: GND
2. VIN
3. VOUT
SOT-89(XT)
TOP VIEW
1: VOUT
2. GND
3. VIN
TO-92(ZTBG)
TOP VIEW
1: GND
2. VIN
3. VOUT
Package & Reel Packing Type
1
2
3
1
2
3
1
2
3
1 23
* Straight lead option available in bag packing type only.
* Refer to physical dimensions for lead pitch.
TO-92(ZTTR)
TOP VIEW
1: GND
2. VIN
3. VOUT
1
2
3
AIC1734-18GUTR
 1.8V Version, in Green SOT-23
2
1 2 3
* Formed lead option available in reel packing type.
* Refer to physical dimensions for lead pitch.
TO-92(ZLBG)
TOP VIEW
1: VIN
2. GND
3. VOUT
1
2
3
1 23
* Straight lead option available in bag packing type only.
* Refer to physical dimensions for lead pitch.
TO-92(ZLTR)
TOP VIEW
1: VIN
2. GND
3. VOUT
1
2
3
1 2 3
* Formed lead option available in reel packing type.
* Refer to physical dimensions for lead pitch.
2
AIC1734



SOT-23 MARKING
Part No.
PU
AIC1734-18XU
GU
Part No.
PU
GU
CD18P CD18G AIC1734-35XU
CD35P
CD35G
AIC1734-20XU
CD20P CD20G AIC1734-37XU
CD37P
CD37G
AIC1734-25XU
CD25P CD25G AIC1734-38XU
CD38P
CD38G
AIC1734-27XU
CD27P CD27G AIC1734-50XU
CD50P
CD50G
AIC1734-30XU
CD30P CD30G AIC1734-52XU
CD52P
CD52G
AIC1734-33XU
CD33P CD33G
SOT-89 MARKING
Part No.
PXA
GXA
Part No.
PXT
GXT
AIC1734-18XXA
CA18P
CA18G
AIC1734-18XXT
CB18P
CB18G
AIC1734-20XXA
CA20P
CA20G
AIC1734-20XXT
CB20P
CB20G
AIC1734-25XXA
CA25P
CA25G
AIC1734-25XXT
CB25P
CB25G
AIC1734-27XXA
CA27P
CA27G
AIC1734-27XXT
CB27P
CB27G
AIC1734-30XXA
CA30P
CA30G
AIC1734-30XXT
CB30P
CB30G
AIC1734-33XXA
CA33P
CA33G
AIC1734-33XXT
CB33P
CB33G
AIC1734-35XXA
CA35P
CA35G
AIC1734-35XXT
CB35P
CB35G
AIC1734-37XXA
CA37P
CA37G
AIC1734-37XXT
CB37P
CB37G
AIC1734-38XXA
CA38P
CA38G
AIC1734-38XXT
CB38P
CB38G
AIC1734-50XXA
CA50P
CA50G
AIC1734-50XXT
CB50P
CB50G
AIC1734-52XXA
CA52P
CA52G
AIC1734-52XXT
CB52P
CB52G
ABSOLUTE MAXIMUM RATINGS
Input Supply Voltage
-0.3 ~12V
Operating Temperature Range
-40C~ 85C
Storage Temperature Range
Maximum Junction Temperature
-65C~150C
150C
260C
Lead Temperature (Soldering 10 sec.)
Thermal Resistance Junction to Case
SOT-89 Package
100C/W
TO-92 Package
120C/W
SOT-23 Package
130C/W
Thermal Resistance Junction to Ambient
SOT-89 Package
160C/W
(Assume no Ambient Airflow, no Heatsink)
TO-92 Package
150C/W
SOT-23 Package
180C/W
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.

TEST CIRCUIT
Refer to the TYPICAL APPLICATION CIRCUIT
3
AIC1734

ELECTRICAL CHARACTERISTICS
(TA=25C, CIN=1F, COUT=1F, unless
otherwise specified.) (Note2)
PARAMETER
TEST CONDITIONS
Output Voltage
No Load
AIC1734-52
AIC1734-50
AIC1734-38
AIC1734-37
AIC1734-35
AIC1734-33
AIC1734-30
AIC1734-27
AIC1734-25
AIC1734-20
AIC1734-18
Output Voltage
Temperature
Coefficiency
(Note 3)
Line Regulation
Load Regulation
(Note 4)
Current Limit
(Note 5)
Dropout Voltage
(Note 6)
VIN=5.5~12V
VIN=5.5~12V
VIN=4.1~12V
VIN=4.0~12V
VIN=4.0~12V
VIN=4.0~12V
VIN=4.0~12V
VIN=4.0~12V
VIN=4.0~12V
VIN=4.0~12V
VIN=4.0~12V
TYP.
MAX.
UNIT
5.100
4.900
3.725
3.625
3.430
3.235
2.940
2.646
2.450
1.960
1.764
5.200
5.000
3.800
3.700
3.500
3.300
3.000
2.700
2.500
2.000
1.800
5.300
5.100
3.875
3.775
3.570
3.365
3.060
2.754
2.550
2.040
1.836
V
50
IL=1mA,
1.4VVOUT3.2V
3.3VVOUT5.2V
IL=0.1~300mA
1.4VVOUT3.9V
4.0VVOUT5.2V
PPM/C
VIN=4V~12V
VIN=5.5V~12V
3
3
10
10
mV
VIN=5V
VIN=7V
7
15
20
40
mV
VIN=7V, VOUT=0V
IL=300mA
MIN.
4.0VVOUT5.2V
3.0VVOUT3.9V
2.5VVOUT2.9V
2.0VVOUT2.4V
1.4VVOUT1.9V
300
mA
400
470
570
800
1260
500
570
670
900
1360
mV
IO=0.1mA~IMAX
Ground Current
1.4VVOUT3.9V
VIN=5~12V
55
80
A
4.0VVOUT5.2V
VIN=7~12V
55
80
Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic
capacitor is not suggested.
Note 2: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
Note 3: Guaranteed by design.
Note 4: Regulation is measured at constant junction temperature, using pulse testing with a low ON time.
Note 5: Current limit is measured by pulsing a short time.
Note 6: Dropout voltage is defined as the input to output differential at which the output voltage drops
100mV.
4
AIC1734

TYPICAL PERFORMANCE CHARACTERISTICS
5.40
3.50
AIC1734-52
5.30
3.40
5.25
3.35
5.20
5.15
3.30
3.25
5.10
3.20
5.05
3.15
5.00
-50
-30
AIC1734-33
3.45
V OUT (V)
V OUT (V)
5.35
-10
10
30
50
70
3.10
-50
90
-30
-10
Temperature (C)
Fig. 1
Fig. 2
VOUT vs. Temperature
AIC1734-18
50
70
90
VOUT vs. Temperature
AIC1734-52
Ground Current (A)
1.95
VOUT (V)
30
50
2.00
1.90
1.85
1.80
1.75
1.70
48
ILOAD=300mA
46
44
42
ILOAD=100mA
40
1.65
1.60
-40
-20
20
0
40
60
80
Fig. 4
44
44
42
ILOAD=100mA
40
Ground Current (A)
AIC1734-33
ILOAD=300mA
42
38
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Temperature (C)
Fig. 5
Ground Current vs. Temperature
10 20 30 40 50 60 70 80 90
Ground Current vs. Temperature
AIC1734-18
ILOAD = 300mA
40
38
36
ILOAD= 0mA
0
Temperature (C)
48
46
ILOAD= 0mA
38
-40 -30 -20 -10
100
Temperature (C)
Fig 3 VOUT vs. Temperature
Ground Current (A)
10
Temperature (C)
ILOAD =100mA
ILOAD =0mA
34
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Temperature (C)
Fig. 6 Ground Current vs. Temperature
5
AIC1734
TYPICAL PERFORMANCE CHARACTERISTIC
AIC1734-33
50
50
Ground Current (A)
Ground Current (A)
AIC1734-52
40
30
20
40
30
20
10
10
0
(Continued)
60
60
0
1
2
3
4
5
6
7
8
9
10
11
0
12
0
1
2
3
4
VIN (V)
Fig. 7
Ground Current vs. VIN
Fig. 8
AIC1734-18
6
7
8
9
10
11
12
Ground Current vs. VIN
AIC1734-52
450
50
T= 80C
400
VDROP (mV)
Ground Current (A)
5
VIN (V)
500
60
40
30
20
350
T= 50C
300
250
T= 20C
200
T=-40C
150
100
10
50
0
0
1
2
3
4
5
6
7
8
9
10 11
00
12
1000
T= 80C
VDROP (V)
T= 20C
200
200
250
300
350
400
VDROP vs. ILOAD
T=20C
T=-40C
900
T= 50C
300
150
AIC1734-18
AIC1734-33
400
100
Fig. 10
600
500
50
ILOAD (mA)
VIN (V)
Fig. 9 Ground Current vs. VIN
VDROP (mV)

T=50C
800
T=80C
700
600
T=-40C
100
500
0
0
50
100
150
200
250
300
ILOAD (mA)
Fig. 11
VDROP vs. ILOAD
350
400
400
0
50
100
150
200
250
300
350 400
ILOAD (mA)
Fig. 12 VDROP vs. ILOAD
6
AIC1734

TYPICAL PERFORMANCE CHARACTERISTIC
100
500
490
AIC1734 -18
VIN=5V ; COUT=1uF
AIC1734
VIN = 8V
10
470
VIN = 7V
460
ESR(O)
Crrent Limit (mA)
480
450
440
1
Stable Region
430
410
400
-40
0.1
VIN = 6V
420
VIN = 5V
-20
0
20
40
60
0.01
80
100
Temperature (C)
Fig. 13
200
300
IOUT(mA)
Current Limit vs. Temperature
Fig. 14 Region of Stable COUT ESR vs. Load Current
100
100
AIC1734 -18
VIN=5V ; COUT=10uF
AIC1734 -18
VIN=5V ; COUT= 4.7uF
10
10
ESR(O)
ESR(O)
(Continued)
1
Stable Region
0.1
1
Stable Region
0.1
0.01
0.01
100
200
300
IOUT(mA)
Fig. 15 Region of Stable COUT ESR vs. Load Current
100
200
300
IOUT(mA)
Fig. 16 Region of Stable COUT ESR vs. Load Current
7
AIC1734

BLOCK DIAGRAM
VIN
VOUT
CURRENT
LIMITING
ERROR
AMP
+
-
+
THERMAL
SHUTDOWN
1.235V
Reference
GND

PIN DESCRIPTIONS
VOUT PIN - Output pin.
GND PIN - Power GND.
VIN PIN
- Power Supply Input.
8
AIC1734

APPLICATION INFORMATION
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output
capacitors to maintain stability. A 1uF aluminum
electrolytic input capacitor with a 1uF aluminum
electrolytic output capacitor is recommended. To
avoid oscillation, it is recommended to follow the
figures of “Region of Stable COUT ESR vs. Load
to
choose
proper
capacitor
Current”
specifications.
POWER DISSIPATION
The AIC1734 obtains thermal-limiting circuitry,
which is designed to protect the device against
overload condition. For continuous load
condition,
maximum
rating
of
junction
temperature must not be exceeded. It is
important to pay more attention in thermal
resistance. It includes junction to case, junction
to ambient. The maximum power dissipation of
AIC1734 depends on the thermal resistance of
its case and circuit board, the temperature
difference between the die junction and ambient
air, and the rate of airflow. The rate of
temperature rise is greatly affected by the
mounting pad configuration on the PCB, the
board material, and the ambient temperature.
When the IC mounting with good thermal
conductivity is used, the junction temperature
will be low even when large power dissipation
applies.
The power dissipation across the device is
P = IOUT (VIN-VOUT).
The maximum power dissipation is:
(T
- TA )
PMAX  J-max
Rθ JA
Where TJ-max is the maximum allowable junction
temperature (125C), and TA is the ambient
temperature suitable in application.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
GND pin performs a dual function for providing
an electrical connection to ground and
channeling heat away. Therefore, connecting
the GND pin to ground with a large pad or
ground plane would increase the power
dissipation and reduce the device temperature.
9
AIC1734

PHYSICAL DIMENSIONS
(unit: mm)
 SOT-23
D
A
A
E
E1
e
e1
SEE VIEW B
WITH PLATING
c
A
A2
b
BASE METAL
0.25
A1
SECTION A-A
GAUGE PLANE
SEATING PLANE
L1
VIEW B
S
Y
M
B
O
L
θ
L
Note: 1. Refer to JEDEC MO-178.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 10 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
SOT-23
MILLIMETERS
MIN.
MAX.
A
0.95
1.45
A1
0.00
0.15
A2
0.90
1.30
b
0.30
0.50
c
0.08
0.22
D
2.80
3.00
E
2.60
3.00
E1
1.50
e
e1
L
1.90 BSC
0.60
0.30
0.60 REF
L1
θ
1.70
0.95 BSC
0°
8°
10
AIC1734
 SOT-89
D
A
C
L
H
E
D1
e
S
Y
M
B
O
L
e1
B1
B
SOT-89
MILLIMETERS
MIN.
MAX.
A
1.40
1.60
B
0.44
0.56
B1
0.36
0.48
C
0.35
0.44
D
4.40
4.60
D1
1.50
1.83
E
2.29
2.60
e
1.50 BSC
e1
3.00 BSC
H
3.94
4.25
L
0.89
1.20
Note: 1. Refer to JEDEC TO-243AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
11
AIC1734
 TO-92 (Straight lead option available in Bag packing type only)
E
b
S
D
S
Y
M
B
O
L
TO-92
MILLIMETERS
MIN.
MAX.
A
4.32
5.33
b
0.36
0.47
D
4.45
5.20
E
3.18
4.19
e
2.42
2.66
e1
1.15
1.39
j
3.43
L
12.70
S
2.03
2.66
L
A
j
Note: 1. Refer to JEDEC TO-226.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "A" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
e1
e
12
AIC1734
 TO-92 (Formed lead option available in Reel packing)
A
W
B
E
F
P1
P
φD
e
T
SYMBOL
W
A
B
E
F
SPEC.
1 8 .0 ± 0 .2
9 .0 ± 0 .2
6 .0 ± 0 .2 0
1 6 .0 ± 0 .5
1 9 .0 ± 0 .5
SYMBOL
P
P1
D
e
T
SPEC.
1 2 .7 B S C
1 2 .7 B S C
4 .0 ± 0 .2
2 .5 B S C
0 .6 ± 0 .1
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry
other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result
from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure
to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in
a significant injury to the user.
13