SPANSION AM29BL802CB

Am29BL802C
Known Good Die
Data Sheet
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SUPPLEMENT
Am29BL802C Known Good Die
8 Megabit (512 K x 16-Bit)
CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory—Die Revision 1
DISTINCTIVE CHARACTERISTICS
■ 32 words sequential with wrap around (linear
32), bottom boot
■ Minimum 100,000 erase cycle guarantee
per sector
■ One 8 Kword, two 4 Kword, one 48 Kword, three
64 Kword, and two 128 Kword sectors
■ 20-year data retention at 125°C
■ Single power supply operation
— Regulated voltage range: 3.0 to 3.6 volt read and
write operations and for compatibility with high
performance 3.3 volt microprocessors
■ Read access times
22 ns burst access at
extended temperature range
80 ns initial/random access
■ Alterable burst length via BAA# pin
■ Power dissipation (typical)
— Burst Mode Read: 15 mA @ 25 MHz,
20 mA @ 33 MHz, 25 mA @ 40 MHz
— Program/Erase: 20 mA
— Standby mode, CMOS: 22 µA
■ 5 V-tolerant data, address, and control signals
■ Sector Protection
— Implemented using in-system or via
programming equipment
— Temporary Sector Unprotect feature allows code
changes in previously locked sectors
■ Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
■ Embedded Algorithms
■ Compatibility with JEDEC standards
— Pinout and software compatible with singlepower supply Flash
— Superior inadvertent write protection
— Backward-compatible with AMD Am29LV and
Am29F flash memories: powers up in
asynchronous mode for system boot, but can
immediately be placed into burst mode
■ Data# Polling and toggle bits
— Provides a software method of detecting program
or erase operation completion
■ Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion
■ Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
■ Hardware reset pin (RESET#)
— Hardware method to reset the device for reading
array data
■ Tested to datasheet specifications at
temperature
■ Quality and reliability levels equivalent to
standard packaged components
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
Publication# 23694 Rev: A Amendment/+2
Issue Date: September 13, 2002
S U P P L E M E N T
GENERAL DESCRIPTION
The Am29BL802C in Known Good Die (KGD) form is
an 8 Mbit, 3.0 volt-only Flash memory. AMD defines
KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form.
Am29BL802C Features
The Am29BL802C is an 8 Mbit, 3.0 Volt-only burst
mode Flash memory devices organized as 524, 288
words. These devices are designed to be programmed
in-system with the standard system 3.0-volt V CC
supply. A 12.0-volt VPP or 5.0 VCC is not required for
program or erase operations. The device can also be
programmed in standard EPROM programmers.
The device offers an access time of 80 ns, allowing
high speed microprocessors to operate without wait
states. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and
output enable (OE#) controls.
Burst Mode Features
The Am29BL802C offers a Linear Burst mode—a
32 word sequential burst with wrap around—in a
bottom boot configuration only. This devices require
additional control pins for burst operations: Load
Burst Address (LBA#), Burst Address Advance
(BAA#), and Clock (CLK). This implementation allows
easy interface with minimal glue logic to a wide range
of microprocessors/microcontrollers for high performance read operations.
AMD Flash Memory Features
Each device requires only a single 3.0 volt power
supply for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations. The I/O and control
signals are 5V tolerant.
The Am29BL802C is entirely command set compatible
with the JEDEC single-power-supply Flash standard. Commands are written to the command register
using standard microprocessor write timings. Register
contents serve as input to an internal state-machine
that controls the erase and programming circuitry.
Write cycles also internally latch addresses and data
needed for the programming and erase operations.
Reading data out of the device is similar to reading
from other Flash or EPROM devices.
Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase
algorithm—an internal algorithm that automatically pre-
2
programs the array (if it is not already programmed) before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6
(toggle) status bits. After a program or erase cycle
has been completed, the device is ready to read array
data or accept another command.
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low VCC
detector that automatically inhibits write operations during power transitions. The hardware sector protection
feature disables both program and erase operations in
any combination of the sectors of memory. This can be
achieved in-system or via programming equipment.
The Erase Suspend/Erase Resume feature enables
the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is
not selected for erasure. True background erase can
thus be achieved.
The hardware RESET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the standby
mode. Power consumption is greatly reduced in both
these modes.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effectiveness.
The device electrically erases all bits within a sector
simultaneously via Fowler-Nordheim tunneling. The
data is programmed using hot electron injection.
Electrical Specifications
Refer to the Am29BL802C data sheet, publication
number 22371, for full electrical specifications on the
Am29BL802C in KGD form.
Am29BL802C Known Good Die
S U P P L E M E N T
PRODUCT SELECTOR GUIDE
Family Part Number
Speed (ns)
Am29BL802C
Regulated Voltage Range: VCC =3.0–3.6 V
80R
Max access time, ns (tACC, tIACC)
80
Max CE# access time, ns (tCE)
80
Max OE# access time, ns (tOE)
22 (at 30 pF loading)
Am29BL802C Known Good Die
3
S U P P L E M E N T
AC CHARACTERISTICS
Burst Mode Read
Speed Options and Temperature
Ranges
Parameter
JEDEC
Std.
Description
80R
Unit
Max
80
ns
Max
24
ns
Initial Access Time
tIACC
tBACC
LBA# Valid Clock to Output Delay
(See Note)
Burst Access Time
BAA# Valid Clock to Output Delay
tLBAS
LBA# Setup Time
Min
6
ns
tLBAH
LBA# Hold Time
Min
2
ns
tBAAS
BAA# Setup Time
Min
6
ns
tBAAH
BAA# Hold Time
Min
2
ns
tBDH
Data Hold Time from Next Clock Cycle
Max
4
ns
tACS
Address Setup Time to CLK
(See Note)
Min
6
ns
tACH
Address Hold Time from CLK
(See Note)
Min
2
ns
tOE
Output Enable to Output Valid
Max
24
ns
tOEZ
Output Enable to Output High Z
Max
25
ns
tCEZ
Chip Enable to Output High Z
Min
25
ns
tCES
CE# Setup Time to Clock
Min
6
ns
Note: Initial valid data will be output after second clock rising edge of LBA# assertion.
4
Am29BL802C Known Good Die
S U P P L E M E N T
AC CHARACTERISTICS
Erase/Program Operations
Parameter
Speed Options
JEDEC
Std
Description
80R
Unit
tAVAV
tWC
Write Cycle Time (Note 1)
Min
80
ns
tAVWL
tAS
Address Setup Time
Min
tWLAX
tAH
Address Hold Time
Min
45
ns
tDVWH
tDS
Data Setup Time
Min
35
ns
tWHDX
tDH
Data Hold Time
Min
0
ns
tOES
Output Enable Setup Time
Min
0
ns
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
ns
tGHWL
tGHWL
tELWL
tCS
CE# Setup Time
Min
0
ns
tWHEH
tCH
CE# Hold Time
Min
0
ns
tWLWH
tWP
Write Pulse Width
Min
35
ns
tWHWL
tWPH
Write Pulse Width High
Min
30
ns
tWHWH1
tWHWH1
Programming Operation (Note 2)
Typ
9
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
Typ
3
sec
tVCS
VCC Setup Time (Note 1)
Min
50
µs
tRB
Recovery Time from RY/BY#
Min
0
ns
Program/Erase Valid to RY/BY# Delay
Min
90
ns
tBUSY
Notes:
1. Not 100% tested.
Am29BL802C Known Good Die
5
S U P P L E M E N T
AC CHARACTERISTICS
Alternate CE# Controlled Erase/Program Operations
Parameter
Speed Options
JEDEC
Std
Description
tAVAV
tWC
Write Cycle Time (Note 1)
Min
tAVEL
tAS
Address Setup Time
Min
tELAX
tAH
Address Hold Time
Min
45
ns
tDVEH
tDS
Data Setup Time
Min
35
ns
tEHDX
tDH
Data Hold Time
Min
0
ns
tOES
Output Enable Setup Time
Min
0
ns
tGHEL
tGHEL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
0
ns
tELEH
tCP
CE# Pulse Width
Min
35
ns
tEHEL
tCPH
CE# Pulse Width High
Min
30
ns
tWHWsH1
tWHWH1
Programming Operation (Note 2)
Typ
9
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
Typ
3
sec
Notes:
1. Not 100% tested.
2. See the “Erase and Programming Performance” section for more information.
6
Am29BL802C Known Good Die
80R
Unit
80
ns
ns
S U P P L E M E N T
DIE PHOTOGRAPH
DIE PAD LOCATIONS
14 13 12 11 10
9
8
7
6
5
4
3
2
1
51 50 49 48 47 46 45 44 43 42 41 40
AMD logo location
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
Am29BL802C Known Good Die
7
S U P P L E M E N T
PAD DESCRIPTION
Pads relative to die center.
Pad
Signal
Pad Center (mils)
X
Y
Pad Center
(millimeters)
X
Y
Pad
Signal
Pad Center (mils)
X
Y
Pad Center
(millimeters)
X
Y
1
WE#
–3.11
98.18
–0.0790
2.4938
26
CLK
–24.43
–94.14
–0.6205
2
RESET#
–13.41
98.18
–0.3406
2.4938
27
BAA#
–14.38
–94.14
–0.3653
–2.3912
3
RY/BY#
–23.34
98.18
–0.5929
2.4938
28
IND#
25.76
–94.14
0.6543
–2.3912
4
A18
–33.39
98.18
–0.8482
2.4938
29
VCC
42.04
–94.14
1.0678
–2.3912
5
A17
–43.44
98.18
–1.1034
2.4938
30
VCC
50.19
–94.14
1.2749
–2.3912
6
A7
–53.49
98.18
–1.3587
2.4938
31
DQ4
57.06
–94.14
1.4493
–2.3912
7
A6
–63.54
98.18
–1.6140
2.4938
32
DQ12
66.70
–94.14
1.6942
–2.3912
8
A5
–73.59
98.18
–1.8692
2.4938
33
DQ5
75.27
–94.14
1.9118
–2.3912
9
A4
–83.64
98.18
–2.1245
2.4938
34
DQ13
84.91
–94.14
2.1567
–2.3912
10
A3
–93.69
98.18
–2.3798
2.4938
35
DQ6
93.47
–94.14
2.3742
–2.3912
11
A2
–102.32
98.18
–2.5988
2.4938
36
DQ14
103.12
–94.14
2.6192
–2.3912
12
A1
–110.94
98.18
–2.8179
2.4938
37
DQ7
111.68
–94.14
2.8367
–2.3912
13
A0
–119.57
98.18
–3.0370
2.4938
38
DQ15
121.32
–94.14
3.0816
–2.3912
14
CE#
–128.19
98.18
–3.2560
2.4938
39
VSS
128.19
–94.14
3.2560
–2.3912
15
VSS
–128.19
–94.14
–3.2560
–2.3912
40
NC
128.19
98.18
3.2560
2.4938
16
OE#
–114.94
–94.14
–2.9194
–2.3912
41
A16
119.57
98.18
3.0370
2.4938
17
DQ0
–106.36
–94.14
–2.7015
–2.3912
42
A15
110.94
98.18
2.8179
2.4938
18
DQ8
–96.72
–94.14
–2.4566
–2.3912
43
A14
102.32
98.18
2.5988
2.4938
19
DQ1
–88.15
–94.14
–2.2391
–2.3912
44
A13
93.69
98.18
2.3798
2.4938
20
DQ9
–78.51
–94.14
–1.9941
–2.3912
45
A12
83.64
98.18
2.1245
2.4938
21
DQ2
–69.94
–94.14
–1.7766
–2.3912
46
A11
73.59
98.18
1.8692
2.4938
22
DQ10
–60.30
–94.14
–1.5317
–2.3912
47
A10
63.54
98.18
1.6140
2.4938
23
DQ3
–51.74
–94.14
–1.3141
–2.3912
48
A9
53.49
98.18
1.3587
2.4938
24
DQ11
–42.10
–94.14
–1.0692
–2.3912
49
A8
43.20
98.18
1.0972
2.4938
25
VSS
–34.48
–94.14
–0.8758
–2.3912
50
VCC
23.10
98.18
0.5866
2.4938
51
LBA#
14.94
98.18
0.3795
2.4938
Note: The coordinates above are relative to the die center and can be used to operate wire bonding equipment.
8
–2.3912
Am29BL802C Known Good Die
S U P P L E M E N T
PAD DESCRIPTION
Pads relative to VCC.
Pad
Signal
Pad Center (mils)
X
Y
Pad Center
(millimeters)
X
Y
Pad
Signal
Pad Center (mils)
X
Y
Pad Center
(millimeters)
X
Y
1
WE#
–26.21
0.00
–0.6656
0.0000
26
CLK
–47.53
–192.32
–1.2071
–4.8850
2
RESET#
–36.51
0.00
–0.9272
0.0000
27
BAA#
–37.48
–192.32
–0.9519
–4.8850
3
RY/BY#
–46.44
0.00
–1.1795
0.0000
28
IND#
2.66
–192.32
0.0677
–4.8850
4
A18
–56.49
0.00
–1.4348
0.0000
29
VCC
18.94
–192.32
0.4812
–4.8850
5
A17
–66.54
0.00
–1.6900
0.0000
30
VCC
27.09
–192.32
0.6883
–4.8850
6
A7
–76.59
0.00
–1.9453
0.0000
31
DQ4
33.96
–192.32
0.8627
–4.8850
7
A6
–86.64
0.00
–2.2006
0.0000
32
DQ12
43.60
–192.32
1.1076
–4.8850
8
A5
–96.69
0.00
–2.4558
0.0000
33
DQ5
52.17
–192.32
1.3252
–4.8850
9
A4
–106.74
0.00
–2.7111
0.0000
34
DQ13
61.81
–192.32
1.5701
–4.8850
10
A3
–116.79
0.00
–2.9664
0.0000
35
DQ6
70.37
–192.32
1.7876
–4.8850
11
A2
–125.42
0.00
–3.1854
0.0000
36
DQ14
80.02
–192.32
2.0326
s–4.8850
12
A1
–134.04
0.00
–3.4045
0.0000
37
DQ7
88.58
–192.32
2.2501
–4.8850
13
A0
–142.67
0.00
–3.6236
0.0000
38
DQ15
98.22
–192.32
2.4950
–4.8850
14
CE#
–151.29
0.00
–3.8426
0.0000
39
VSS
105.09
–192.32
2.6694
–4.8850
15
VSS
–151.29
–192.32
–3.8426
–4.8850
40
NC
105.09
0.00
2.6694
0.0000
16
OE#
–138.04
–192.32
–3.5060
–4.8850
41
A16
96.47
0.00
2.4504
0.0000
17
DQ0
–129.46
–192.32
–3.2881
–4.8850
42
A15
87.84
0.00
2.2313
0.0000
18
DQ8
–119.82
–192.32
–3.0432
–4.8850
43
A14
79.22
0.00
2.0122
0.0000
19
DQ1
–111.25
–192.32
–2.8257
–4.8850
44
A13
70.59
0.00
1.7932
0.0000
20
DQ9
–101.61
–192.32
–2.5807
–4.8850
45
A12
60.54
0.00
1.5379
0.0000
21
DQ2
–93.04
–192.32
–2.3632
–4.8850
46
A11
50.49
0.00
1.2826
0.0000
22
DQ10
–83.40
–192.32
–2.1183
–4.8850
47
A10
40.44
0.00
1.0274
0.0000
23
DQ3
–74.84
–192.32
–1.9007
–4.8850
48
A9
30.39
0.00
0.7721
0.0000
24
DQ11
–65.20
–192.32
–1.6558
–4.8850
49
A8
20.10
0.00
0.5106
0.0000
25
VSS
–57.58
–192.32
–1.4624
–4.8850
50
VCC
0.00
0.00
0.0000
0.0000
51
LBA#
–8.16
0.00
–0.2071
0.0000
Note: The coordinates above are relative to the VCC location and can be used to operate wire bonding equipment.
Am29BL802C Known Good Die
9
S U P P L E M E N T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29BL802C
B
80R
DP
E
1
DIE REVISION
This number refers to the specific AMD manufacturing process and
product technology reflected in this document. It is entered in the
revision field of AMD standard product nomenclature.
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
E
= Extended (–55°C to +125°C)
H
= Super Extended (–55°C to +145°C)
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP
= Waffle Pack
125 die per 5 tray stack
DG
= Gel-Pak® Die Tray
336 die per 6 tray stack
DT
= Surftape™ (Tape and Reel)
1600 per 7-inch reel
DW = Gel-Pak® Wafer Tray (sawn wafer on frame)
Call AMD sales office for minimum order quantity
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
B
=
Bottom boot sector
DEVICE NUMBER/DESCRIPTION
Am29BL802C Known Good Die
8 Megabit (512 K x 16-Bit) CMOS Flash Memory—Die Revision 1
3.0 Volt-only Program and Erase
Valid Combinations
AM29BL802CB-80R
(30 pF loading)
10
DPI 1, DPE 1, DPH 1
DGI 1, DGE 1, DGH 1
DTI 1, DTE 1, DTH 1
DWI 1, DWE 1, DWH 1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.s
Am29BL802C Known Good Die
S U P P L E M E N T
PACKAGING INFORMATION
Surftape Packaging
Direction of Feed
16 mm
Orientation relative to
leading edge of tape
and reel
AMD logo location
Gel-Pak and Waffle Pack Packaging
Orientation relative to
top left corner of
Gel-Pak
and Waffle Pack
cavity plate
AMD logo location
Am29BL802C Known Good Die
11
S U P P L E M E N T
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29BL802C product qualification database supplement for KGD. AMD implements quality assurance procedures throughout the product test flow. In addition,
Wafer Sort 1
Bake
24 hours at 250°C
Wafer Sort 2
Wafer Sort 3
High Temperature
Packaging for Shipment
an off-line quality monitoring program (QMP) further
guarantees AMD quality standards are met on Known
Good Die products. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in.
DC Parameters
Functionality
Programmability
Erasability
Data Retention
DC Parameters
Functionality
Programmability
Erasability
DC Parameters
Functionality
Programmability
Erasability
Speed
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
Shipment
Figure 1. AMD KGD Product Test Flow
12
Am29BL802C Known Good Die
S U P P L E M E N T
PHYSICAL SPECIFICATIONS
MANUFACTURING INFORMATION
Die dimensions . . . . . . . . . . . 269.7 mils x 214.2 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 6.85 mm x 5.44 mm
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . .500 µm
Bond Pad Size . . . . . . . . . . . . . . 3.74 mils x 3.74 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 µm x 95 µm
Pad Area Free of Passivation . . . . . . . . . .13.99 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Wafer Sort Test . . . . . . . . . . . . Sunnyvale, CA, USA,
. . . . . . . . . . . . . . . . . . . . . . . . and Penang, Malaysia
Manufacturing ID (Bottom Boot) . . . . . . . . . . . . 98H11
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . CS39LS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
SPECIAL HANDLING INSTRUCTIONS
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . . 3.0 V to 3.6 V
Operating Temperature
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C
Super Extended . . . . . . . . . . . . –55°C to +145°C
Processing
Storage
Store at a maximum temperature of 30°C in a nitrogenpurged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
DC PARAMETER EXCEPTIONS
The following specifications replace those given in the Am29BL802 data sheet (publication number 22371):
Parameter
Description
Test Conditions
Typ
Max
Unit
CE#, RESET# = VCC±0.3 V
22
35
µA
22
35
µA
OE# = VIH
30
50
µA
OE# = VIL
30
50
µA
ICC3
VCC Standby Current (Note 3)
ICC4
VCC Standby Current During Reset
RESET# = VSS ± 0.3 V
(Note 3)
ICC5
Automatic Sleep Mode
(Notes 3, 4)
VIH = VCC ± 0.3 V;
VIL = VSS ± 0.3 V
Notes:
3. Maximum ICC specifications are tested with VCC = VCCmax.
4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns.
Am29BL802C Known Good Die
13
S U P P L E M E N T
AC CHARACTERISTICS
Read Operations
Speed Options and
Temperature Ranges
Parameter
JEDEC
Std. Description
Test Setup
80R
Unit
tAVAV
tRC
Read Cycle Time (Note )
Min
80
ns
tAVQV
tACC Address to Output Delay
CE# = VIL
Max
OE# = VIL
80
ns
tELQV
tCE
Chip Enable to Output Delay
OE# = VIL Max
80
ns
tGLQV
tOE
Output Enable to Output Delay
Max
24
ns
tEHQZ
tDF
Chip Enable to Output High Z
(Note )
Max
24
ns
tGHQZ
tDF
Output Enable to Output High Z (Note )
Max
25
ns
Read
Min
0
ns
Toggle and
Data# Polling
Min
10
ns
Min
0
ns
Output Enable
tOEH
Hold Time (Note )
tAXQX
tOH
Output Hold Time From Addresses, CE# or OE#, Whichever
Occurs First (Note )
Not 100% tested.
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Am29BL802C Known Good Die
S U P P L E M E N T
TERMS AND CONDITIONS OF SALE FOR
AMD NON-VOLATILE MEMORY DIE
All transactions relating to unpackaged die under this
agreement shall be subject to AMD’s standard terms
and conditions of sale, or any revisions thereof, which
revisions AMD reserves the right to make at any time
and from time to time. In the event of conflict between
the provisions of AMD’s standard terms and conditions
of sale and this agreement, the terms of this agreement
shall be controlling.
AMD warrants unpackaged die of its manufacture
(“Known Good Die” or “Die”) against defective materials or workmanship for a period of one (1) year from
date of shipment. This warranty does not extend
beyond the first purchaser of said Die. Buyer assumes
full responsibility to ensure compliance with the
appropriate handling, assembly and processing of
Known Good Die (including but not limited to proper
Die preparation, Die attach, wire bonding and related
assembly and test activities), and compliance with all
guidelines set forth in AMD’s specifications for Known
Good Die, and AMD assumes no responsibility for
environmental effects on Known Good Die or for any
activity of Buyer or a third party that damages the Die
due to improper use, abuse, negligence, improper
installation, accident, loss, damage in transit, or unauthorized repair or alteration by a person or entity other
than AMD (“Warranty Exclusions”).
The liability of AMD under this warranty is limited, at
AMD’s option, solely to repair the Die, to send replacement Die, or to make an appropriate credit adjustment
or refund in an amount not to exceed the original purchase price actually paid for the Die returned to AMD,
provided that: (a) AMD is promptly notified by Buyer in
writing during the applicable warranty period of any
defect or nonconformity in the Known Good Die; (b)
Buyer obtains authorization from AMD to return the
defective Die; (c) the defective Die is returned to AMD
by Buyer in accordance with AMD’s shipping instructions set forth below; and (d) Buyer shows to AMD’s
satisfaction that such alleged defect or nonconformity
actually exists and was not caused by any of the
above-referenced Warranty Exclusions. Buyer shall
ship such defective Die to AMD via AMD’s carrier, collect. Risk of loss will transfer to AMD when the defective Die is provided to AMD’s carrier. If Buyer fails to
adhere to these warranty returns guidelines, Buyer
shall assume all risk of loss and shall pay for all freight
to AMD’s specified location. The aforementioned provisions do not extend the original warranty period of
any Known Good Die that has either been repaired or
replaced by AMD.
WITHOUT LIMITING THE FOREGOING, EXCEPT TO
THE EXTENT THAT AMD EXPRESSLY WARRANTS
TO BUYER IN A SEPARATE AGREEMENT SIGNED
BY AMD, AMD MAKES NO WARRANTY WITH
RESPECT TO THE DIE’S PROCESSING OF DATE
DATA, AND SHALL HAVE NO LIABILITY F OR
DAMAGES OF ANY KIND, UNDER EQUITY, LAW, OR
ANY OTHER THEORY, DUE TO THE FAILURE OF
SUCH KNOWN GOOD DIE TO PROCESS ANY PARTICULAR DATA CONTAINING DATES, INCLUDING
DATES IN AND AFTER THE YEAR 2000, WHETHER
OR NOT AMD RECEIVED NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
THIS WARRANTY IS EXPRESSED IN LIEU OF ALL
OTHER WARRANTIES, EXPRESSED OR IMPLIED,
INCLUDING THE IMPLIED WARRANTY OF FITNESS
FOR A PARTICULAR PURPOSE, THE IMPLIED
WARRANTY OF MERCHANTABILITY AND OF ALL
OTHER OBLIGATIONS OR LIABILITIES ON AMD’s
PART, AND IT NEITHER ASSUMES NOR AUTHORIZES ANY OTHER PERSON TO ASSUME FOR
AMD ANY OTHER LIABILITIES. THE FOREGOING
CONSTITUTES THE BUYER’S SOLE AND EXCLUSIVE REMEDY FOR THE FURNISHING OF DEFECTIVE OR NON CONFORMING KNOWN GOOD DIE
AND AMD SHALL NOT IN ANY EVENT BE LIABLE
FOR INCREASED MANUFACTURING COSTS,
DOWNTIME COSTS, DAMAGES RELATING TO
BUYER’S PROCUREMENT OF SUBSTITUTE DIE
(i.e., “COST OF COVER”), LOSS OF PROFITS, REVENUES OR GOODWILL, LOSS OF USE OF OR
DAMAGE TO ANY ASSOCIATED EQUIPMENT,
OR ANY OTHER INDIRECT, INCIDENTAL, SPECIAL
OR CONSEQUENTIAL DAMAGES BY REASON OF
THE FACT THAT SUCH KNOWN GOOD DIE SHALL
HAVE BEEN DETERMINED TO BE DEFECTIVE OR
NON CONFORMING.
Buyer agrees that it will make no warranty representations to its customers which exceed those given by
AMD to Buyer unless and until Buyer shall agree to
indemnify AMD in writing for any claims which exceed
AMD’s warranty.
Known Good Die are not designed or authorized for
use as components in life support appliances, devices
or systems where malfunction of the Die can reasonably be expected to result in a personal injury. Buyer’s
use of Known Good Die for use in life support applications is at Buyer’s own risk and Buyer agrees to fully
indemnify AMD for any damages resulting in such use
or sale.
Am29BL802C Known Good Die
15
S U P P L E M E N T
REVISION SUMMARY
Revision A (December 19, 2000)
Revision A+2 (September 13, 2002)
Initial release.
Changed title from Boot Sector to Burst Sector.
Revision A+1 (June 27, 2001)
AC Characteristics
Manufacturing Information
Added Read Options, Burst Mode Read, Erase/
Program Operations, and Alternate CE# Controlled
Erase/Program Operations Tables.
Added Penang, Malaysia as a test facility (ACN2016).
Trademarks
Copyright © 2001 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
16
Am29BL802C Known Good Die