Application Note AN3018 Known Good Die Delivery Specification Rev. V2 Scope Visual Inspection This application note describes M/A-COM’s standard Known Good Die (KGD) delivery practices for use in high volume commercial applications. All KGD are electrically tested, visually inspected, and delivered in wafer form. Consult the factory if your application requires special test, inspection, screening, or packaging. All die will be inspected using an automated vision system. Die will be compliant with MIL-STD-883, Method 2010, Class B criteria. Packaging Die will be delivered on wafer tape per Table 1. Unit of measure is die. Quantity per shipping container will vary. Electrical Test All die are functionally tested to the product test plan. Table 1: Packaging Packaging Material Wafer Tape Wafer Diameter 4 inch Part Number Notes Semiconductor Equip. Corp. 18733-10.4 Standard Blue Tape Not UV sensitive, Figure 1 Grip Ring Carrier 4 inch Perfection Products GRP-2620-5 Inside Diameter: 6.689” Outside Diameter: 7.322” Thickness: 0.236”, Figure 1 Grip Ring Shipper 4 inch Perfection Products GRS3970-5b Mechanical and ESD Protection Figure 2 Labeling Carrier and shipper will be marked per Table 2. Barcode format is code 39 using data identifiers per Table 3. Table 2: Labeling Mark Location Carrier Shipper Attribute M/A-COM Wafer ID Human Readable X Barcode X M/A-COM X M/A-Com Part Number Lot Number X X X X Quantity X X Date X Date Code X Country of Origin ESD Warning X Figure 1: Carrier & Label X 1 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 Application Note AN3018 Known Good Die Delivery Specification Rev. V2 Table 3: Barcode Data Identifier Information Part Number Data Identifier (P) Lot Number (1T) Quantity (Q) Defect Identification Noncompliant die will be identified per Table 4. Figure 2: Shipper & Label Table 4: Defect Identification Description Availability Notes Electronic Map Standard Customer / user qualification required Ink Consult Factory Consult factory for die measuring less than 0.5 mm per side Wafer Map Format Electronic Map Availability • • • • Maps will be available for customer down load at the M/ACOM web site: www.macom.com. Consult factory for customer account and login. SEMI E142 compliant XML file format ASCII bin format Map file name is equivalent to the wafer lot number with the “.xml” extension added. 2 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588