AN304 Through-hole IRED/φ5 Type Features φ5 type, Water clear epoxy Package Product features ・Total Output Power : 9mW TYP. (IF=50mA) ・Lead–free soldering compatible ・RoHS compliant Peak Wavelength 950nm Half Intensity Angle 50 deg. Die materials GaAs Rank grouping parameter Sorted by radiant intensity per rank taping Soldering methods TTW (Through The Wave) soldering and manual soldering ※Please refer to Soldering Conditions about soldering. ESD 2kV (HBM) Packing Bulk : 200pcs(MIN.) Recommended Applications Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications 2006.8.31 Page 1 AN304 Through-hole IRED/φ5 Type Absolute Maximum Ratings (Ta=25℃) Item Symbol Absolute Maximum Ratings Unit Power Dissipation Pd 150 mW Forward Current IF 100 mA IFRM 1,000 mA Pulse Forward Current ※1 Derating (Ta=25℃ or higher) ⊿IF 1.33 mA/℃ ⊿IFRM 13.3 mA/℃ Reverse Voltage VR 5 V Operating Temperature Topr -30~+85 ℃ Storage Temperature Tstg -30~+100 ℃ ※1 IFRM Measurement condition : Pulse Width≦100μs, Duty≦1/100 Electro-Optical Characteristics Item Conditions (Ta=25℃) Symbol Characteristics Unit TYP. 1.3 MAX. 1.5 MAX. 10 MIN. 6 TYP. 15 Po TYP. 9 mW IF=50mA λp TYP. 950 nm Spectral Half-width IF=50mA ⊿λ TYP. 45 nm Half Intensity Angle IF=50mA 2θ1/2 TYP. 50 deg. Cut-off Frequency IF=50mA DC±5mA, -3db from 0.1MHz fc MIN. - TYP. 0.5 Response Time IF=50mA tr/tf TYP. 700 Forward Voltage IF=50mA VF Reverse Current VR =5V IR Radiant Intensity IF=50mA IE Total Output Power IF=50mA Peak Wavelength 2004.11.17 V μA mW/sr MHz ns Page 2 AN304 Through-hole IRED/φ5 Type Radiant Intensity Rank (Ta=25℃) IE（mW/s r） R ank Condition MIN. MAX . A 6.0 12.0 B 8.4 16.8 C 12.0 24.0 D 16.8 33.6 E 24.0 - IF = 50mA ※Please contact our sales staff concerning rank designation. 2004.11.17 Page 3 AN304 Through-hole IRED/φ5 Type Technical Data Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 50mA Relative Intensity Condition : Ta = 25℃ Wavelength [nm] Forward Voltage vs. Forward Current Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Pulse Forward Current IFRM(A) Forward Current IF(mA) Condition : Ta = 25℃ Forward Voltage : VF(V) 2004.11.17 Duty Ratio Page 4 AN304 Through-hole IRED/φ5 Type Technical Data Ambient Temperature vs. Forward Current Ambient Temperature vs. Pulse Forward Current Forward Current : IF (mA) Pulse Forward Current IFRM(mA) Condition : tw≦100μs, Duty≦1/100 Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Ambient Temperature vs. Peak Wavelength Condition : IF = 50mA Forward Voltage VF(V) Peak Wavelength λp (nm) Condition : IF = 50mA Ambient Temperature : Ta (℃) 2004.11.17 Ambient Temperature : Ta(℃) Page 5 AN304 Through-hole IRED/φ5 Type Technical Data Ambient Temperature vs. Relative Total Power Forward Current vs. Relative Total Power Condition : IF = 50mA Relative Total Power Relative Total Power Condition : - - Pulse, tw≦100μs, Duty≦1/100, Ta = 25℃ ---DC Forward Current : IF (mA) Ambient Temperature : Ta (℃) Pulse Forward Voltage vs. Pulse Forward Current Pulse Forward Current : IFRM (mA) Condition : Ta=25℃, tw≦100μs, Duty≦1/100 Pulse Forward Voltage : VFM(V) 2004.11.17 Page 6 AN304 Through-hole IRED/φ5 Type Package Dimensions 2004.11.17 (Unit: mm) Page 7 AN304 Through-hole IRED/φ5 Type TTW (Through The Wave) soldering Conditions Pre-heating 100 ℃ (MAX.) Resin surface temperature Solder Bath Temp. 265 ℃ (MAX.) Dipping Time Position 5 s (MAX.) At least 3.0 mm away from the root of lead 1) The dip soldering process shall be twice maximum. 2) The product shall be cooled to normal temperature before the second dipping process. ※The detail is described to LED and Photodetector handling precautions of home page: "Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please. Manual Soldering Conditions Iron tip temp. Soldering time and frequency Position 400 ℃ 3 s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.) At least 3.0 mm away from the root of lead ※The detail is described to LED and Photodetector handling precautions of home page: "Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please. 2007.8.31 Page 8 AN304 Through-hole IRED/φ5 Type Reliability Testing Result Reliability Testing Result Applicable Standard Room Temp. Operating Life Resistance to Soldering Heat EIAJ ED4701/100(101) EIAJ ED4701/300(302) Temperature Cycling EIAJ ED4701/100(105) Wet High Temp. Storage Life High Temp. Storage Life EIAJ ED4701/100(103) EIAJ ED4701/200(201) Low Temp. Storage Life EIAJ ED4701/200(202) EIAJ ED4701/400(401) Lead Tension Vibration, Variable Frequency EIAJ ED4701/400(403) Testing Conditions Duration Ta = 25℃, IF = Maxium Rated Current Failure 1,000 h 0/25 10s 0/25 Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) 5 cycles 0/25 Ta = 60±2℃, RH = 90±5% 1,000 h 0/25 Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Ta = Minimum Rated Storage Temperature 1,000 h 0/25 10N,1time (□0.4 and Flat Package : 5N) 10s 0/10 2h 0/10 265±5℃, 3mm from package base 2 98.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction Failure Criteria Items Symbols Conditions Failure criteria Luminous Intensity Iv IF Value of each product Luminous Intensity Testing Min. Value ＜ Spec. Min. Value x 0.5 Forward Voltage VF IF Value of each product Forward Voltage Testing Max. Value ≧ Spec. Max. Value x 1.2 Reverse Current IR VR = Maximum Rated Reverse Voltage V Testing Max. Value ≧ Spec. Max. Value x 2.5 Cosmetic Appearance - - Occurrence of notable decoloration, deformation and cracking 2007.8.31 Page 9 AN304 Through-hole IRED/φ5 Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2007.8.31 Page 10