AOS Semiconductor Product Reliability Report AOZ8105CI, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOZ8105CI. Reviewing of the electrical test results confirm that AOZ8105CI pass AOS quality and reliability requirements. The continuous qualification testing and reliability monitoring program ensure that all outgoing products will continue to meet AOS quality and reliability standards. Table of Contents: I. II. III. IV. Product Description Package and Die information Qualification Tests Result Reliability Evaluation I. Product Description: The AOZ8105CI is a transient voltage suppressor array designed to protect high speed data lines such as HDMI and Gigabit Ethernet from damaging ESD events. -ROHS compliant -Halogen free . Details please refer to the datasheet. II. Package and Die Information: Product ID Process Package Type Lead Frame Die attach material Die bond wire MSL level AOZ8105CI HV031A1 SOT23 Cu 84-1MISR4 Cu, 1 mil Up to Level 1 2 III. Qualification Tests Result: Test Item Test Condition Test Duration Sample Size Pre-Conditioning 168hrs @85 °C /85%RH+3 cyc reflow@260°C - JESD22-A113 22 lots (Sum of TC,PCT and HAST) HTRB Vdd= 80% Vbr max. Temp = 150°C 168hrs 500hrs 7 lots 2 lots Temperature Cycle '-65 °C to +150 °C, air to air 500cycles 77pcs/lot 19 lots Standard JESD22-A108 JESD22-A110 77pcs/lot Pressure Pot 121°C, 29.7psi, RH= 100% 96hrs 22 lots JESD22-A102 77pcs/lot HAST '130 +/- 2°C, 85%RH, 33.3 psi, at VCC min power dissipation. 100hrs 20 lots JESD22-A104 55pcs/lot IV. Reliability Evaluation FIT rate (per billion): 21 MTTF = 5393 years The presentation of FIT rate for the individual product reliability is restricted by the actual HTRB sample size of the selected product. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion device hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2x (7x77x168+2x77x500) x258] = 21 MTTF = 109 / FIT = 4.72 x107hrs= 5393 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB tests H = Duration of HTRB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg 115 deg 130 deg 150 deg C C C C Af 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3