DIODES AP9050FDB

AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
Description
Pin Assignments
(Top View)
NEW PRODUCT
AP9050 is designed to protect the latest generation of PMICs
for portable applications such as UMPCs, smartphones and
others utilizing battery power.
1
6
8
The integrated LDO allows the PMIC to power up and
determine whether the connected power supply (USB or
AC-DC wall adapter) is valid and a safe operation can be
performed.
2
5
7
3
The PMIC controls the operation of the integrated n-channel
MOSFET to either pass the line voltage or disconnect the line
from the PMIC to protect its internal circuits in the event of an
over-voltage.
4
U-DFN2020-6
The AP9050 is available in a low-profile U-DFN2020-6
package.
Features
Applications
•
Input Supply Range from 3V to 30V
•
Power Interface for New Generation PMICs
•
Lower Power Dissipation and Higher Efficiency as
compared to a Zener Shunt Regulator
•
Charger Front End Protection
•
Smartphone
LDO is stable without a bypass capacitor on the output
and operates across the temperature range
•
Cell Phone
•
Ultra Mobile PC
Available in a U-DFN2020-6 package with a typical
height of 0.575mm
•
Tablets
•
•
Note:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
http://www.diodes.com/products/lead_free.html.
Typical Application Circuit
Figure 1. Typical Application Circuit
AP9050
Document number: DS35283 Rev. 1 - 2
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March 2011
© Diodes Incorporated
AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
NEW PRODUCT
Pin Descriptions
Pin #
Name
1
Source
Description
Source of the n-channel power FET. Pass-switch’s output pin.
2
Gate
3, 7
VIN
Gate of the FET switch. Pass-switch’s control pin.
4
Ground
5
VOUT
Output of the LDO.
6, 8
Drain
Drain of the power FET. Pass-switch’s input pin.
Input voltage to the internal LDO.
LDO ground connection.
Functional Block Diagram
Figure 2. Functional Block Diagram
AP9050
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AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
Absolute Maximum Ratings (Note 2, 3)
NEW PRODUCT
Symbol
Parameter
Rating
Unit
VIN
Supply Voltage
−0.3 to 30
V
VGS
Gate-to-Source Voltage
±12
V
IDpk
Drain Current, Peak (10µs pulse)
19
A
Drain Current, Continuous
(Note 4, Steady-State)
TA = 25ºC
3.7
2.7
A
750
mW
Junction Temperature Range
−40 to +125
°C
TJ
Non-operating Temperature Range
−55 to +150
°C
TL
Maximum Lead Temperature for Soldering
Purposes
260
°C
ID
TA = 85ºC
Pmax
TJ
Total Power Dissipation @ TA = 25°C
(Note 3, 4)
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and
transporting these devices.
Notes:
2. Exceeding these ratings may damage the device.
2
3. Mounted on FR4 Board using 30 mm , 2 oz Cu.
4. Dual die operation (equally−heated).
Thermal Resistance
Symbol
Note:
Parameter
θJA
Junction to Ambient (Note 5)
θJC
Junction to Case
Rating
Unit
132
°C/W
13
°C/W
2
5. Test condition for DFN2020-6: Mounted on FR4 Board using 30 mm , 2 oz Cu.
Recommended Operating Conditions (Note 6)
Symbol
Note:
Parameter
VIN
Supply Voltage
TA
Operating Ambient Temperature Range
Min
Max
Unit
3
30
V
−40
+85
°C
6. The device function is not guaranteed outside of the recommended operating conditions.
AP9050
Document number: DS35283 Rev. 1 - 2
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© Diodes Incorporated
AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
Electrical Characteristics (VIN (OVP_SENSE) = 5.0V, TJ = +25°C, unless otherwise noted)
Symbol
Parameter
Test Conditions
Min
Typ.
Max
Unit
TJ = 85°C
1.0
10
µA
80
nA
0.9
1.2
V
53
68
mΩ
NEW PRODUCT
Power FET
VDS = 24V, VGS = 0V
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-to-Source Leakage Current
VDS = 0V, VGS = ±8V
VGS(th)
Gate Threshold Voltage
VGS = VDS, ID = 250µA
RDS(on)
Drain-to-Source On-Resistance
(Note 7)
VGS = 4.5V, ID = 2.0A
VGS = 2.5V, ID = 2.0A
41
55
Forward Transconductance
VDS = 5V, ID = 2.0A
8
S
CISS
Input Capacitance
VDS = 15V, VGS = 0V,
f = 1MHz
500
pF
COSS
Output Capacitance
VDS = 15V, VGS = 0V,
f = 1MHz
65
pF
CRSS
Reverse Transfer Capacitance
VDS = 15V, VGS = 0V,
f = 1MHz
50
pF
gFS
0.62
LDO (unless otherwise noted, TJ = 25ºC, VIN = 5.0V)
VOUT
Regulated Output Voltage
VIN = 5.5V, IOUT = 1mA
4.6
5.0
VIN − VOUT, IOUT = 1.2mA,
Vhead
Headroom
VIN = 4.6V
VIN − VOUT, IOUT = 10mA,
VIN = 4.8V, TJ = −40 to +125°C
5.3
V
150
mV
1000
mV
Response to Input Transient
tpulse
Vpk
Time signal is above 5.5V
VIN 0 to 30V, < 1µs rise time,
5.0kΩ resistive load (Note 8)
5.0
µs
Peak Voltage
VIN 0 to 30V, < 1µs rise time,
5.0kΩ resistive load (Note 8)
9.0
V
Input Bias Current
VIN = 5.5V
850
µA
3.0
V
Total Device
Ibias
VIN_min
Notes:
Minimum Operating Voltage
110
7. Pulse test width 300µs, duty cycle 2%
8. Guaranteed by design
AP9050
Document number: DS35283 Rev. 1 - 2
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AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
Typical Performance Characteristics
1.6
NEW PRODUCT
Normalised RDS(on)
1.5
VGS=4.5V
ID=2A
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
-50
-25
0
25
50
75
100
Junction Temperature (ºC)
125
150
Figure 3. RDS(ON) variation over junction temperature
20
VGS=10V
18
VGS=2.5V
Drain Current (A)
16
14
VGS=3V
12
10
VGS=2V
8
6
4
2
VGS=1.5V
0
0
1
2
3
Drain-Source Voltage (V)
4
5
Figure 4. RDS(ON) Characteristics
5.2
Output Voltage (V)
5.15
5.1
5.05
5
4.95
4.9
4.85
4.8
-50
-25
0
25
50
75
100
Junction Temperature (ºC)
125
150
Figure 5. Output voltage variation over junction temperature
AP9050
Document number: DS35283 Rev. 1 - 2
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March 2011
© Diodes Incorporated
AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
NEW PRODUCT
Applications Information
Theory of Operation
External Capacitors
The AP9050 was designed to work in close relationship
with a PMIC (Power Management IC). To protect the
PMIC from an overvoltage situation the AP9050 powers up
a detection circuit within the connected PMIC. (See Figure
2 as reference)
AP9050 was specified to reduce board space and external
component count, by designing the LDO to be stable
without an external bypass capacitor.
This detection circuit determines if a valid input source is
connected (ex. VIN < 8V). If a valid input source is detected
the power MOSFET will be turned on and the supply
current to the PMIC will be turned on. The overvoltage
detection is continuous, if an overvoltage occurs at a later
state the Power MOSFET will be turned off.
A low ESR 1nF to 10nF external capacitor can be used to
improve behavior with fast ac transients or other switching
currents that might be present.
To improve noise immunity and ac impedance from long
input traces a 1nF capacitor can be added to the input VIN
of the LDO.
PCB Layout
The AP9050 was designed utilizing two process
technologies to provide best performance and a cost
effective solution.
1
6
8
2
5
7
3
4
Figure 6. Package Pin Out
Both die are packaged side by side in the U-DFN2020-6
package and are mounted on two separate exposed pads.
These pads are not required for electrical functionality, but
to aid with the thermal performance of AP9050.
Attention should be paid in the layout of the PCB (Printed
Circuit Board) that PAD7 is connected to VIN of the LDO,
pin 3, while PAD8 is connected to the Drain of the Power
MOSFET, pin 6 of the package. For best thermal
performance large copper areas connected to the two
exposed pads should be used to transfer heat away from
the AP9050.
AP9050
Document number: DS35283 Rev. 1 - 2
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March 2011
© Diodes Incorporated
AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
Ordering Information
NEW PRODUCT
AP9050FDB-7
Package
Packing
U-DFN2020-6
FDB
7” Tape and Reel
Part Number Suffix
Device
Package
Code
Packaging
(Note 10)
Quantity
AP9050FDB-7
FDB
U-DFN2020-6
3000/Tape & Reel
Note:
-7
10. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
Marking Information
U-DFN2020-6
( Top View )
XX
YW X
AP9050
Document number: DS35283 Rev. 1 - 2
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Internal code
Device
Package
Identification Code
AP9050FDB
U-DFN2020-6
BZ
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AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
Package Outline Dimensions (All Dimensions in mm)
0.43mon.
Marking
0.13Typ.
0.05 C
0.15 C
B
1.95/2.075
2x-0.5/0.7
Seating plane
C
A
0.45
0.25/0.35
2x-0.9/1.1
1.95/2.075
n
Pi
.15 D
R0 #1 I
2x-
6x-0.3
.1
R0
0.15 C
1.05
2x-0.70
C
L
6x-0.45
2x
0/0.05
0.08 C
(Active area depth)
2x-1.10
1.7
NEW PRODUCT
0.545/0.605
U-DFN2020-6
C
L
0.65
Top View
0.65nom.
0.2/0.3
Land Pattern Recommendation
unit:mm
0.05 M C A B
Bottom View
AP9050
Document number: DS35283 Rev. 1 - 2
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AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
IMPORTANT NOTICE
NEW PRODUCT
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DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
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in the labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
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notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further,
Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes
Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
AP9050
Document number: DS35283 Rev. 1 - 2
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