AP98T06GP
RoHS-compliant Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Simple Drive Requirement
D
▼ Lower Gate Charge
▼ Fast Switching Characteristic
G
BVDSS
60V
RDS(ON)
5mΩ
ID
80A
S
Description
Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
G
D
TO-220(P)
S
The TO-220 package is widely preferred for commercial-industrial
through-hole applications.
Absolute Maximum Ratings
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID@TC=25℃
3
Continuous Drain Current, VGS @ 10V
1
Rating
Units
60
V
+20
V
80
A
320
A
250
W
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Rthj-c
Maximum Thermal Resistance, Junction-case
Rthj-a
Maixmum Thermal Resistance, Junction-ambient
Data and specifications subject to change without notice
Value
Units
0.5
℃/W
62
℃/W
1
200910282
AP98T06GP
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=1mA
60
-
-
V
RDS(ON)
Static Drain-Source On-Resistance2
VGS=10V, ID=40A
-
-
5
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
4
V
gfs
Forward Transconductance
VDS=10V, ID=40A
-
82
-
S
IDSS
Drain-Source Leakage Current
VDS=48V, VGS=0V
-
-
25
uA
Drain-Source Leakage Current (T j=125 C) VDS=48V ,VGS=0V
-
-
250
uA
Gate-Source Leakage
VGS= +20V, VDS=0V
-
-
+100
nA
ID=40A
-
92
150
nC
o
IGSS
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=48V
-
12
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
45
-
nC
VDS=30V
-
17
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=40A
-
75
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω,VGS=10V
-
45
-
ns
tf
Fall Time
RD=0.75Ω
-
85
-
ns
Ciss
Input Capacitance
VGS=0V
-
3950 6300
pF
Coss
Output Capacitance
VDS=25V
-
1080
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
460
-
pF
Min.
Typ.
IS=40A, VGS=0V
-
-
1.3
V
IS=40A, VGS=0V
-
70
-
ns
dI/dt=100A/µs
-
160
-
nC
Source-Drain Diode
Symbol
VSD
Parameter
2
Forward On Voltage
2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
Max. Units
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Package limitation current is 80A, calculated continuous current
based on maximum allowable junction temperature is 171A.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP98T06GP
300
160
ID , Drain Current (A)
250
ID , Drain Current (A)
T C = 150 o C
10 V
8.0 V
7.0 V
6.0 V
T C = 25 o C
200
150
V G = 5 .0V
100
10 V
8.0 V
7.0 V
6.0 V
120
V G = 5.0 V
80
40
50
0
0
0
2
4
6
0
8
1
2
3
4
5
6
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
8
2.4
I D =40A
I D =40A
V G =10V
T C =25 o C
2.0
Normalized RDS(ON)
RDS(ON) (mΩ)
7
6
1.6
1.2
5
0.8
4
0.4
2
4
6
8
10
-50
50
100
150
T j , Junction Temperature ( C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.6
Normalized VGS(th) (V)
40
30
IS(A)
0
o
V GS Gate-to-Source Voltage (V)
T j =150 o C
T j =25 o C
20
1.2
0.8
0.4
10
0.0
0
0
0.2
0.4
0.6
0.8
1
1.2
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.4
-50
0
50
100
150
o
T j , Junction Temperature ( C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP98T06GP
f=1.0MHz
10000
12
C iss
8
I D = 40 A
V DS = 48 V
C (pF)
VGS , Gate to Source Voltage (V)
10
6
1000
C oss
C rss
4
2
0
100
0
20
40
60
80
100
1
120
5
Q G , Total Gate Charge (nC)
9
13
17
21
25
29
V DS ,Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
Operation in this area
limited by RDS(ON)
Normalized Thermal Response (Rthjc)
1000
100us
ID (A)
100
1ms
10ms
100ms
10
DC
o
T c =25 C
Single Pulse
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
1
0.01
0.1
1
10
100
1000
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
10V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4