Anpec APL3517ABAI-TRG Compact, small package 100ma power-distribution switch Datasheet

APL3517/A/B
Compact, Small Package 100mA Power-Distribution Switches
General Description
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
High Side N-MOSFET with Internal Charge Pump
0.1A Continuous Current
The APL3517/A/B is a power-distribution switch with current- limiting function and output OVP protections that can
Built-in Soft-Start
Wide Supply Voltage Range
deliver current up to 0.1A. The device incorporates a
250mΩ N-channel MOSFET power switch.
Current-Limit Protection
Input Voltage Under Voltage Lockout Protection
The device integrates some protection features, including current-limit protection, output over-voltage protection,
Reverse Current Blocking when Switch Disabled
Output OVP Protection
over-temperature protection and UVLO. The current-limit
protection can protect down-stream devices from cata-
Reverse Current-Limit Protection
Output Discharge
strophic failure by limiting the output current at currentlimit threshold during over-load or short-circuit events.
Over-Temperature Protection
UL Approved-File No.E328191
The output over-voltage protection can prevent current
flowing from VOUT to VIN when an abnormally high volt-
Nemko IEC 60950-1 : 2005(2nd Edition);
Am 1:2009 CB; EN60950-1:2006; A11: 2009; A1:
age exists in VOUT. The over-temperature protection function shuts down the N-channel MOSFET power switch
2010 Scheme Certified, No 65711
Lead Free and Green Devices Available (RoHS
when the junction temperature rises beyond 140 C and
will automatically turns on the power switch when the
Compliant)
temperature drops by 20 C. The UVLO function keeps
the power switch in off state until there is a valid input
o
o
Applications
•
•
•
HDMI Port Protection Switches
voltage present.
The device is available in lead free SOT-23-3 and
Bluetooth Protection Switches
SOT-23-5 packages.
High-side Power Protection Switches
Pin Configuration
Simplified Application Circuit
GND 1
VIN
VOUT
3 VIN
VOUT 2
APL3517
APL3517
SOT-23-3
GND
VIN
GND 1
EN 2
VOUT 3
5 NC
4 VIN
APL3517A
SOT-23-5
VOUT
APL3517A/B
5 NC
GND 1
ENB 2
VOUT 3
EN/ENB
GND
4 VIN
APL3517B
SOT-23-5
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
1
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APL3517/A/B
Ordering and Marking Information
Package Code
A : SOT-23-3 B : SOT-23-5
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Enable Function
Blank : No Enable Function A : Active High
B : Active Low
Assembly Material
G : Halogen and Lead Free Device
APL3517
Assembly Material
Handling Code
Temperature Range
Package Code
Enable Function
APL3517 A:
L17X
X - Date Code
APL3517A B:
L7AX
X - Date Code
APL3517B B:
L7BX
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VIN
VOUT
VEN, VENB
TJ
(Note 1)
Parameter
Rating
Unit
VIN to GND Voltage
-0.3 ~ 6.5
V
VOUT to GND Voltage
-0.3 ~ 6.5
V
EN, ENB to GND Voltage
-0.3 ~ 6.5
Maximum Junction Temperature
TSTG
Storage Temperature
TSDR
Maximum Lead Soldering Temperature (10 Seconds)
V
-40 ~ 150
o
-65 ~ 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics (Note 2)
Symbol
θJA
Parameter
Typical Value
Junction-to-Ambient Resistance in free air (SOT-23-3, SOT-23-5)
Unit
o
260
C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
2
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APL3517/A/B
Recommended Operating Conditions (Note 3)
Symbol
Parameter
Range
Unit
2.7~ 5.25
V
VIN
VIN Input Voltage
IOUT
OUT Output Current
0 ~ 0.1
TA
Ambient Temperature
-40 ~ 85
o
-40 ~ 125
o
TJ
Junction Temperature
A
C
C
Note 3: Refer to the typical application circuit.
Electrical Characteristics
o
VIN=5V, VEN=5V or VENB=0V and TA=25 C (unless otherwise noted).
Symbol
Parameter
APL3517/A/B
Test Conditions
Unit
Min.
Typ.
Max.
2.35
2.5
2.65
V
-
0.1
-
V
No load,
VEN = Low (or VENB = High)
-
-
1
µA
No load,
VEN =High (or VENB = High)
-
100
150
µA
OUT Leakage Current
VOUT tied to ground,
VEN =Low (or VENB = High)
-
-
1
µA
OUT Input Current
VOUT=5V, VIN = 0V, no matter VEN =
Low or High
-
-
1
µA
IOUT=0.1A, TJ=25oC
-
250
350
mΩ
IOUT=0.1A, TJ=-40~125oC
-
-
400
mΩ
0.25
0.37
0.5
A
0.20
-
-
A
80
190
300
mA
UNDER-VOLTAGE LOCKOUT
VIN UVLO Threshold Voltage
VIN rising
VIN UVLO Hysteresis
SUPPLY CURRENT
ICC
VIN Supply Current
POWER SWITCH
RDS(ON)
Power Switch On Resistance
CURRENT-LIMIT PROTECTIONS
ILIM
Current-Limit Threshold
TJ=25oC,
o
TJ=-40~125 C
OUTPUT OVER-VOLTAGE PROTECTS
IRV
Reverse Current Blocking Threshold
VOUT - VIN=1V, TJ=25oC
tRVDEG
Reverse Current Blocking Deglitch Time Guaranteed by Design
VOVP
Output OVP Threshold
-
0.7
-
ms
5.3
5.45
5.6
V
TOVD
Output OVP Delay Time
-
20
-
µs
1
2.5
4
ms
-
40
-
Ω
2
-
-
V
Input Logic Low
-
-
0.8
V
EN, ENB Input Current
-
-
1
µA
SOFT-START CONTROL PIN
tSS
Soft-Start Time
OUTPUT DISCHARGE AND ENABLE
VOUT Discharge Resistance
VIN=5V, VEN=Low(or VENB=High),
VOUT=1V
Input Logic High
VEN, VENB
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
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APL3517/A/B
Electrical Characteristics (Cont.)
o
VIN=5V, VEN=5V or VENB=0V and TA=25 C (unless otherwise noted).
Symbol
Parameter
APL3517/A/B
Test Conditions
Unit
Min.
Typ.
Max.
-
140
-
°C
-
20
-
°C
OUTPUT TEMPERATURE PROTECTION (OTP)
TOTP
Over-Temperature Threshold
TJ rising
Over-Temperature Hysteresis
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
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APL3517/A/B
Typical Operating Characteristics
UVLO Threshold Voltage vs .
Junction Temperature
Supply Current vs.
Junction Temperature
160
VIN = 5V
2.60
150
2.55
Supply Current, ICC (µA)
UVLO Threshold Voltage, VUVLO (V)
2.65
VIN Increasing
2.50
2.45
VIN Decreasing
2.40
140
130
120
110
2.35
-50
-25
0
25
50
75
100
100
-50
125
-25
Junction Temperature, TJ (oC)
75
100
125
Switch On Resistance vs.
Input Voltage
300
VIN = 5V
I OUT = 100mA
Switch On Resistance, RDS(ON) (mΩ)
Switch On Resistance, RDS( ON) (mΩ)
50
Junction Temperature, TJ ( C)
330
290
270
250
230
210
-50
-25
0
25
50
75
100
IOUT = 100mA
290 TJ = 25 oC
280
270
260
250
240
230
220
210
200
125
2.5
o
3.0
3.5
4.0
4.5
5.0
Input Voltage, VIN (V)
Junction Temperature, TJ ( C)
Current Limit Threshold vs .
Input Voltage
Current Limit Threshold vs .
Junction Temperature
500
Current Limit Threshold, ILIM (mA)
500
Current Limit Threshold, ILIM (mA)
25
o
Switch On Resistance vs.
Junction Temperature
310
0
V IN = 5 V
450
400
350
300
250
200
-50
-25
0
25
50
75
400
350
300
250
200
100 125
2.5
Junction Temperature, TJ (oC)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
450
3.0
3.5
4.0
4.5
5.0
Input Voltage, VIN (V)
5
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APL3517/A/B
Typical Operating Characteristics
Reverse Current Blocking Threshold
vs. Junction Temperature
Output OVP Threshold vs .
Junction Temperature
300
5.60
Reverse Current Blocking Threshold,
IRV (mA)
Output OVP Threshold, VOVP (V)
VIN = 5V
5.55
5.50
5.45
5.40
5.35
5.30
-50
-25
0
25
50
75
280
260
VOUT = 5V
240
220
200
180
160
140
120
100
80
-50
100 125
o
-25
0
25
50
75
100 125
o
Junction Temperature, TJ ( C)
Junction Temperature, TJ ( C)
Reverse Current Blocking Threshold
vs. Output Voltage
EN pin Threshold Voltage vs .
Input Voltage
300
2.0
1.9
1.8
1.7
1.6
1.5
Reverse Current Blocking Threshold,
IRV (mA)
EN pin Threshold Voltage , VEN (V)
VIN = 3V
VEN Increasing
1.4
1.3
1.2
1.1
VEN Decreasing
1.0
0.9
0.8
V IN = 4V
250
200
150
100
50
0
2.5
3.0
3.5
4.0
4.5
4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2
5.0
Output Voltage, VOUT (V)
Input Voltage, VIN (V)
Current-Limit Response vs.
Output Peak Current
Current-Limit Response (µs)
25
V IN=5V, TJ=25o C
C IN=330µF, C OUT =0µF
20
15
10
5
0
0
2
4
6
8
10
Output Peak Current (A)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
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APL3517/A/B
Operating Waveforms
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Power Off
Power On
V IN
VIN
1
1
VOUT
V OUT
2
2
IOUT
I OUT
3
3
CIN=0.1µF, COUT=0.1µF, ROUT=50Ω
CH1: VIN, 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH3: IOUT , 50mA/Div, DC
TIME: 5ms/Div
CIN=0.1µF, COUT=0.1µF, ROUT=50Ω
CH1: VIN, 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH3: IOUT , 50mA/Div, DC
TIME: 2ms/Div
Over-Current Protection
Short Circuit Response
VIN
1
VIN
1
VOUT
VOUT
2
2
IOUT
IOUT
3
3
CIN=330µF, COUT=0µF, ROUT=Open → 0Ω
CH1: VIN, 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH3: IOUT , 5A/Div, DC
TIME: 400ns/Div
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
CIN=0.1µF, COUT=0.1µF, IOUT = 50Ω to 10Ω
CH1: VIN, 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH3: IOUT , 200mA/Div, DC
TIME: 50µs/Div
7
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APL3517/A/B
Operating Waveforms
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Reverse Current Protection
Output Over-Voltage Protection
IOUT
3
3
IOUT
VIN
VIN
1
1
VOUT
VOUT
2
2
CIN=0.1µF, COUT =0.1µF
VIN=4.5V ,VOUT =open →5V
CH1: VIN, 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH3: IOUT , 0.5A/Div, DC
TIME: 0.2ms/Div
CIN=0.1µF, COUT =0.1µF, VOUT =open → 6V
CH1: VIN, 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH3: IOUT , 1A/Div, DC
TIME: 20µs/Div
Enable Response
Shutdown Response
APL3517 B
APL3517B
VOUT
VOUT
1
1
VENB
VENB
2
2
IOUT
IOUT
3
3
VENB=5 to 0V, CIN=0.1µF, COUT =0.1µF, ROUT =50Ω
CH1: VOUT , 2V/Div, DC
CH2: VENB , 5V/Div, DC
CH3: IOUT , 100mA/Div, DC
TIME: 1ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
VENB=0 to 5V, CIN=0.1µF, COUT =0.1µF, ROUT =50Ω
CH1: VOUT , 2V/Div, DC
CH2: VENB, 5V/Div, DC
CH3: IOUT , 100mA/Div, DC
TIME: 40µs/Div
8
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APL3517/A/B
Pin Description
PIN
FUNCTION
NO.
NAME
SOT-23-3
SOT-23-5
1
1
GND
2
3
VOUT
3
4
VIN
-
2
EN/ENB
-
5
NC
Ground.
Output Voltage Pin. The output voltage follows the input voltage. When EN is low or
VIN is UVLO, the output voltage is discharged by an internal resistor.
Power Supply Input Connect this pin to external DC supply.
Pulling the ENB above 2V or EN below 0.8V will disable the device, and pulling ENB
pin below 0.8V or EN above 2V will enable the device.
The EN and ENB pins cannot be left floating.
Not Connected Internally.
Block Diagram
VOUT
VIN
UVLO
Charge
Pump
CurrentLimit
Gate Driver and
Control Logic
OVP
EN / ENB
(SOT-23-5)
OTP
GND
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
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APL3517/A/B
Typical Application Circuit
SOT-23-5
SOT-23-3
VIN
0.1µF
3
VIN
VOUT
2
APL3517
VIN
VOUT
4
VIN
3
VOUT
0.1µF
0.1µF
0.1µF
VOUT
APL3517A
GND
On
1
Off
2
EN
GND
1
SOT-23-5
VIN
4
3
VIN
VOUT
VOUT
0.1µF
0.1µF
APL3517B
Off
On
2
ENB
GND
1
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
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APL3517/A/B
Function Description
VIN Under-voltage Lockout (UVLO)
Output Discharge
The APL3517/A/B power switch has a built-in under-volt-
When the input voltage is under VIN UVLO Threshold or
age lockout circuit to keep the output shut off until internal
circuitry is operating properly. The UVLO circuit has hys-
VEN=Low or VENB=High, the output discharge device is
turned on to discharge the output voltage.
teresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When input volt-
Enable/Disable (SOT-23-5)
age exceeds the UVLO threshold, the output voltage starts
a soft-start to reduce the inrush current.
Pulling the ENB above 2V or EN below 0.8V will disable
Power Switch
the device, and pulling ENB pin below 0.8V or EN above
2V will enable the device.
The power switch is an N-channel MOSFET with a low
RDS(ON). The internal power MOSFET does not have the
When the IC is disabled the supply current is reduced to
less than 1µA. The enable input is compatible with both
body diode. When IC is in UVLO state, the MOSFET prevents a current flowing from the VOUT back to VIN and
TTL and CMOS logic levels. The EN/ENB pins cannot be
left floating.
VIN to VOUT.
Over-temperature Protection
Current-Limit Protection
o
When the junction temperature exceeds 140 C, the internal thermal sense circuit turns off the power FET and
The APL3517/A/B power switch provides the current-limit
protection function. During current-limit, the devices limit
allows the device to cool down. When the device’s junco
tion temperature cools by 20 C, the internal thermal sense
output current at current-limit threshold. For reliable
operation, the device should not be operated in currentlimit for extended period time.
circuit will enable the device, resulting in a pulsed output
during continuous thermal protection. Thermal protec-
Soft-Start
tion is designed to protect the IC in the event of overtemperature conditions. For normal operation, the junc-
The APLA3517/A/B has a built-in output soft-start control
tion temperature cannot exceed TJ=+125oC.
to limit the current surge during start-up. The soft-start
interval is 2.5ms.
Output Over-Voltage Protection
The output over-voltage protection is implemented by 2
either sensing mechanisms. One is by sensing when
VOUT voltage is above VOVP threshold, the internal power
MOSFET is turned off. The other is by sensing when reverse current, flowing from VOUT to VIN, surpasses IRV.
When the reverse current reachers the reverse current
Blocking threshold, the device limits the reveres current
at IRV threshold level. When the reverse current fault exists for more than 0.7ms, the internal power MOSFET is
turned off. The internal power MOSFET is allowed to turnon once the output voltage gose below VIN-1V.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
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APL3517/A/B
Application Information
Input Capacitor
Recommanded Minimum Footprit
0.1µF ceramic bypass capacitor from VIN to GND, located
near the APL3517/A/B, is strongly recommended to sup-
0.037
0.057
press the ringing during short circuit fault event. Without
the bypass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to
damage internal control circuitry.
0.102
0.024
Layout Consideration
The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop,
droop and EMI. The following guidelines must be
0.074
Unit : Inch
SOT-23-3
considered:
1. Please place the input capacitors near the VIN pin as
close as possible.
0.076
2. Output decoupling capacitors for load must be placed
near the load as close as possible for decoupling high0.1
frequency ripples.
3. Locate APL3517/A/B and output capacitors near the
load to reduce parasitic resistance and inductance for
0.05
excellent load transient performance.
4. The negative pins of the input and output capacitors
and the GND pin must be connected to the ground plane
of the load.
0.038
5. Keep VIN and VOUT traces as wide and short as possible.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
0.02
Unit : Inch
SOT-23-5
12
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APL3517/A/B
Package Information
SOT-23-3
D
e
E
E1
SEE
VIEW A
c
b
0.25
A
L
GAUGE PLANE
SEATING PLANE
0
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-3
INCHES
MILLIMETERS
MIN.
MIN.
MAX.
A
MAX.
1.45
0.057
A1
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
0.071
e
0.95 BSC
0.037 BSC
e1
1.90 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
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APL3517/A/B
Package Information
SOT-23-5
D
e
E
E1
SEE
VIEW A
b
c
0.25
A
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-5
INCHES
MILLIMETERS
MIN.
MIN.
MAX.
A
MAX.
0.057
1.45
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
b
0.30
0.50
0.012
0.020
0.009
A1
c
0.08
0.22
0.003
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
1.80
0.055
0.071
E1
1.40
e
0.95 BSC
e1
0.037 BSC
1.90 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
14
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APL3517/A/B
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOT-23-3
Application
SOT-23-5
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
4.0±0.10
4.0±0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOT-23-3
Tape & Reel
3000
SOT-23-5
Tape & Reel
3000
Copyright  ANPEC Electronics Corp.
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APL3517/A/B
Taping Direction Information
SOT-23-3
USER DIRECTION OF FEED
SOT-23-5
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
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APL3517/A/B
Classification Profile
Supplier Tp≧Tc
User Tp≦Tc
TC
TC -5oC
User tp
Supplier tp
Tp
tp
Temperature
Max. Ramp Up Rate = 3oC/s
Max. Ramp Down Rate = 6oC/s
TL
Tsmax
TC -5oC
t
Preheat Area
Tsmin
tS
25
Time 25oC to Peak
Time
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
17
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APL3517/A/B
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2012
18
www.anpec.com.tw
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