Anpec APL5537JCCTI-TRG Dual channel 300ma low dropout linear regulator Datasheet

APL5537
Dual Channel 300mA Low Dropout Linear Regulator
Features
General Description
•
The APL5537 is a dual channel low dropout linear
regulator, which operates from 2.5V to 5.5V input voltage
Dual Regulator Outputs
•
Low Dropout Voltage: Typical 240mV at 300mA
•
Wide Input Voltage Range: 2.5V to 5.5V
•
Low Quiescent Current: Typical 58µA
•
High PSRR: 70dB at 1kHz
and delivers up to 300mA output current at each channel.
Typical dropout voltage is only 240mV at 300mA.
The APL5537 with low quiescent current, high PSRR, and
low noise is ideal for battery powered system appliances.
•
Low Shutdown Current: <1µA
•
Shutdown Function
•
Output Current-Limit Protection
•
Short-Circuit Current-Limit Protection
current-limit protection to ensure specified output current.
The APL5537 is available in the TSOT-23-6A and TDFN
•
Over-Temperature Protection
1.6x1.6-6 packages.
•
Lead Free and Green Devices Available
Other features include logic-controlled shutdown mode,
over-temperature protection, short-circuit current-limit, and
Pin Configurations
(RoHS Compliant)
Applications
VOUT2 1
•
Mobile Phone
•
GPS Navigation
•
Blue Tooth Headset
6 VOUT1
GND 2
5 VIN
EN2 3
4 EN1
TSOT-23-6A
(Top View)
VIN 1
EN1 2
EN2 3
EP
6 VOUT1
5 VOUT2
4 GND
TDFN1.6x1.6-6
(Top View)
Ordering and Marking Information
Voltage Code
See Voltage Code Table
Package Code
CT : TSOT-23-6A
QB : TDFN1.6x1.6-6
Operating Ambient Temperature Range
I : -40 to 85oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5537
Assembly Material
Handling Code
Temperature Range
Package Code
Voltage Code
APL5537-VVCT:
7VVX
APL5537-VVQB:
7VV
X
VV - Voltage Code
X - Date Code
VV - Voltage Code
X - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2011
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APL5537
Voltage Code Table
Output Voltage
Output Voltage
Voltage Code
Voltage Code
VOUT1 (V)
VOUT2 (V)
VOUT1 (V)
VOUT2 (V)
1.30
2.80
7M
1.20
2.80
5M
1.85
1.85
bb
1.85
1.50
b9
1.50
1.50
99
1.50
2.80
9M
1.80
1.20
C5
1.80
2.60
CK
2.50
1.80
JC
1.80
3.30
CR
2.50
3.00
JO
2.50
2.80
JM
2.80
2.85
Ud
2.50
3.30
JR
2.85
2.85
dd
2.85
1.85
db
2.80
1.80
MC
2.85
1.80
dC
2.80
3.30
MR
2.80
2.80
MM
2.80
3.00
MO
3.00
1.80
OC
3.30
2.85
Rd
3.00
3.00
OO
3.30
3.30
RR
3.30
3.00
RO
3.15
2.80
eM
3.30
3.10
RP
Available Voltage Version
Code
5
7
9
A
C
b
D
E
F
J
K
Voltage
1.20
1.30
1.50
1.60
1.80
1.85
1.90
2.00
2.10
2.50
2.60
Code
c
L
M
d
N
O
P
e
Q
R
Voltage
2.65
2.70
2.80
2.85
2.90
3.00
3.10
3.15
3.20
3.30
Absolute Maximum Ratings
Symbol
VIN
VEN1, VEN2
TJ
(Note 1)
Rating
Unit
VIN Input Voltage (VIN to GND)
Parameter
-0.3 ~ 7
V
EN1, EN2 to GND Voltage
-0.3 ~ 7
Maximum Junction Temperature
TSTG
Storage Temperature
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
V
150
o
-65 ~ 150
o
260
o
C
C
C
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
Parameter
Typical Value
Unit
Junction-to-Ambient Resistance in Free Air (Note 2)
θJA
TSOT-23-6A
220
TDFN1.6x1.6-6
165
o
C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2011
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APL5537
Recommended Operating Conditions
Symbol
VIN
VEN1, VEN2
(Note 3)
Parameter
VIN Input Voltage (VIN to GND)
Range
Unit
2.5 ~ 5.5
V
EN1, EN2 to GND Voltage
0 ~ 5.5
V
IOUT
VOUT Output Current
0 ~ 300
mA
TA
Ambient Temperature
-40 ~ 85
o
-40 ~ 125
o
TJ
Junction Temperature
C
C
Note 3: Refer to the typical application circuit
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=VOUT+1V, VEN1= VEN2=5V and TA= -40 to 85 oC. Typical values are
at TA=25oC.
Symbol
Parameter
APL5537
Test Conditions
Unit
Min.
Typ.
Max.
1.9
2.2
2.45
V
-
0.1
-
V
No load, VEN1= VEN2=5V
-
58
90
µA
No load, VEN1= VEN2=0V
-
-
1
µA
UNDER-VOLTAGE LOCKOUT (UVLO) AND SUPPLY CURRENT
VIN UVLO Threshold Voltage
VIN rising, TA= -40 to 85 oC
VIN UVLO Hysteresis
IQ
VIN Supply Current
OUTPUT VOLTAGE (REGULATOR1 AND REGULATOR2)
Output Voltage Accuracy
IOUT=1mA to 300mA, TA= -40 oC to 85 oC
-3.5
-
+3.5
%
Line Regulation
IOUT=1mA, VIN=VOUT+0.3V to 5.5V, or
VIN=2.5V to 5.5V
-
-
0.2
%/V
IOUT=1mA to 300mA
-
-
0.6
%
mV
Load Regulation
VDROP
PSRR
Dropout Voltage
(Note 4)
Power Supply Rejection Ratio
IOUT=300mA
IOUT=50mA, COUT=2.2µF
-
240
330
f=100Hz
-
70
-
f=1kHz
-
70
-
f=10kHz
-
60
-
f=100kHz
-
35
-
dB
Output Noise
IOUT=1mA, BW=10 to 100kHz, COUT=10µF
-
100
-
µVRMS
VOUT Discharge Resistance
VEN1= VEN2=0V
-
0.7
-
kΩ
-
-
V
ENABLE/DISABLE (EN1 AND EN2)
VIH
VIL
EN Input Logic HIGH
VIN=2.5V to 5.5V
1.5
EN Input Logic LOW
VIN=2.5V to 5.5V
-
-
0.4
V
EN Input Current
VEN1= VEN2=5V
-
0.2
-
µA
330
450
750
mA
PROTECTIONS (REGULATOR1 AND REGULATOR2)
ILIMIT
ISHORT
Current Limit Threshold
Short-Circuit Output Current
-
50
-
mA
Over-Temperature Threshold
-
160
-
°C
Over-Temperature Hysteresis
-
40
-
°C
Soft-Start Time
-
60
-
µs
Note 4: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 1V.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2011
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APL5537
Typical Operating Characteristics
Output Voltage vs. Temperature
Output Voltage vs. Temperature
1.90
3.10
APL5537-OC
VOUT2
3.05
Output Voltage (V)
Output Voltage (V)
APL5537-OC
VOUT1
3.00
2.95
2.90
-40 -25
1.85
1.80
1.75
1.70
0
25
50
Temperature
75
100
-40 -25
125
25
50
75
Quiescent Current vs. Temperature
100
125
( oC)
Temperature
Dropout Voltage vs. Output Current
350
65
APL5537-OC
VIN=VEN=4.2V
TJ=125oC
300
Dropout Voltage (mV)
Quiescent Current (µA)
0
(oC)
60
55
50
250
TJ=25oC
200
150
TJ=-40oC
100
50
45
-40 -25
0
25
50
75
100
0
125
0
50
Temperature (oC)
150
200
250
300
Noise
PSRR vs. Frequency
200
0
IOUT1=50mA
IOUT=50mA
VIN=VEN=4.2V (Battery)
150
-20
100
Noise (µV)
PSRR (dB)
100
Output Current (mA)
-40
-60
50
0
-50
-100
-80
-150
-100
100
1k
10k
100k
-200
1M
20m
40m
60m
80m
100m
Time (sec)
Frequency (Hz)
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APL5537
Operating Waveforms
Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified.
Power on
Power off
VIN
VIN
1
1
VOUT1
VOUT1
2
2
VOUT2
VOUT2
3
3
CIN=COUT=1µF, IOUT1=IOUT2=10mA
CH1: VIN, 2V/Div, DC
CH2: VOUT1, 1V/Div, DC
CH3: VOUT2, 1V/Div, DC
TIME: 4ms/Div
CIN=COUT=1µF, IOUT1=IOUT2=10mA
CH1: VIN, 2V/Div, DC
CH2: VOUT1, 1V/Div, DC
CH3: VOUT2, 1V/Div, DC
TIME: 4ms/Div
Enable Response
Disable Response
VEN
VEN
1
1
VOUT1
VOUT1
2
3
2
VOUT2
VOUT2
3
CIN=COUT=1µF, IOUT1=IOUT2=50mA
CH1: VEN, 5V/Div, DC
CH2: VOUT1, 1V/Div, DC
CH3: VOUT2, 1V/Div, DC
TIME: 40µs/Div
CIN=COUT=1µF, IOUT1=IOUT2=10mA
CH1: VEN, 5V/Div, DC
CH2: VOUT1, 1V/Div, DC
CH3: VOUT2, 1V/Div, DC
TIME: 40µs/Div
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APL5537
Operating Waveforms (Cont.)
Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified.
Line Transient Response
Line Transient Response
VIN
VIN
1
2
3
1
VOUT1
VOUT1
2
VOUT2
VOUT2
3
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4µs)
CIN=COUT=1µF, IOUT1=IOUT2=50mA
CH1: VIN, 500mV/Div, DC, Offset=3.8V
CH2: VOUT1, 20mV/Div, DC, Offset=3.0V
CH3: VOUT2, 20mV/Div, DC, Offset=1.8V
TIME:100µs/Div
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4µs)
CIN=COUT=1µF, IOUT1=IOUT2=10mA
CH1: VIN, 500mV/Div, DC, Offset=3.8V
CH2: VOUT1, 20mV/Div, DC, Offset=3.0V
CH3: VOUT2, 20mV/Div, DC, Offset=1.8V
TIME:100µs/Div
Line Transient Response
Load Transient Response
I OUT
VIN
1
1
2
3
VOUT1
VOUT1
2
VOUT2
VOUT2
3
IOUT=10mA to 50mA to 10mA (rise / fall time = 1µs)
CIN=COUT=1µF, VIN=VEN=4.2V
CH1: IOUT, 50mA/Div, DC
CH2: VOUT1, 20mV/Div, DC, Offset=3.0V
CH3: VOUT2, 20mV/Div, DC, Offset=1.8V
TIME:40µs/Div
VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4µs)
CIN=COUT=1µF, IOUT1=IOUT2=100mA
CH1: VIN, 500mV/Div, DC, Offset=3.8V
CH2: VOUT1, 20mV/Div, DC, Offset=3.0V
CH3: VOUT2, 20mV/Div, DC, Offset=1.8V
TIME:100µs/Div
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APL5537
Operating Waveforms (Cont.)
Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified.
Load Transient Response
Load Transient Response
I OUT
IOUT
1
1
VOUT1
VOUT1
2
2
VOUT2
VOUT2
3
3
IOUT=10mA to 200mA to 10mA (rise / fall time = 1µs)
CIN=COUT=1µF, VIN=VEN=4.2V
CH1: IOUT, 100mA/Div, DC
CH2: VOUT1, 50mV/Div, DC, Offset=3.0V
CH3: VOUT2, 50mV/Div, DC, Offset=1.8V
TIME:40µs/Div
IOUT=10mA to 100mA to 10mA (rise / fall time = 1µs)
CIN=COUT=1µF, VIN=VEN=4.2V
CH1: IOUT, 50mA/Div, DC
CH2: VOUT1, 20mV/Div, DC, Offset=3.0V
CH3: VOUT2, 20mV/Div, DC, Offset=1.8V
TIME:40µs/Div
Pin Description
PIN
FUNCTION
NO.
NAME
TSOT-23-6A TDFN1.6x1.6-6
Input Supply Pin. VIN can range from 2.5V to 5.5V and should be bypassed with
at least a 1µF capacitor.
5
1
VIN
4
2
EN1
3
3
EN2
Enable Input. Pulling the VEN1/2 above 1.5V enables the respective regulator
output; pulling VEN1/2 below 0.4V disables the respective regulator output.
2
4
GND
Ground.
1
5
VOUT2
6
6
VOUT1
-
-
EP
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2011
Regulator Outputs. Sources up to 300mA. Bypass with at least a 1µF capacitor
to the GND respectively.
Exposed Pad. Connect it to a large ground plane for heatsinking.
7
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APL5537
Block Diagram
VIN
Current
Limit1
UVLO and
Shutdown
Control1
EN1
VREF1
OverTemperature
Protection
VOUT1
Short Circuit
Current Limit1
GND
Current
Limit2
UVLO and
Shutdown
Control2
EN2
VREF2
OverTemperature
Protection
VOUT2
Short Circuit
Current Limit2
Typical Application Circuit
VIN
2.5V to 5.5V
VIN
VOUT1
VOUT1
COUT1
CIN
1µF
1.2V to 3.3V/300mA
1µF
APL5537
ON
EN1
VOUT2
VOUT2
COUT2
OFF
EN2
1.2V to 3.3V/300mA
1µF
GND
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APL5537
Function Description
VIN Under-Voltage Lockout (UVLO)
Over-Temperature Protection
The APL5537 has a built-in under-voltage lockout circuit
to keep the outputs shuting off until internal circuitry is
An over-temperature protection circuitry limits the junction temperature of APL5537. When the junction temperature exceeds +160 oC, the over-temperature protection
operating properly. The UVLO circuit has a hysteresis
and a de-glitch feature so that it will typically ignore undershoot transients on the input.
circuitry disables the LDO outputs, allowing the device to
cool down. The LDO outputs are enabled again after the
Soft-Start (For Each Channel)
junction temperature cools down by 40oC, resulting in a
pulsed output during continuous thermal overload
The APL5537 provides an internal soft-start circuitry to
control rise rate of the output voltage and limit the current
conditions. Over-temperature protection is designed to
protect the IC in the event of over temperature conditions.
surge during start-up. The output voltage starts the softstart at approximate 60µs after the VIN is over the UVLO
For reliable operation, the junction temperature cannot
exceed TJ=+125oC
threshold. The typical soft-start interval is about 60µs.
Current-Limit Protection (For Each Channel)
The APL5537 provides a current-limit protection function.
During current limit, the device limits output current at
current limit threshold. For reliable operation, the device
should not be operated in current limit for extended period.
Short-Circuit Current-Limit Protection (For Each
Channel)
When the output voltage drops below 0.8V, which is
caused by the over load or short circuit, the device limits
the output current down to a safe level. The short circuit
current limit is used to reduce the power dissipation during short circuit conditions. If the junction temperature is
over the over-temperature threshold, the device will enter
the thermal shutdown.
Enable/Disable (For Each Channel)
Pulling the VEN1/2 above 1.5V enables the respective LDO
output, and pulling VEN1/2 below 0.4V disables the respective LDO output. When both the LDO outputs are disabled,
the supply current is reduced to less than 1µA. EN1/2
pins are internally pulled low by resistors. If shutdown
function is not used, connect EN1/2 to VIN for normal
operation. The enable inputs are compatible with both
TTL and CMOS logic levels.
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APL5537
Application Information
Input Capacitor
where (TJ-TA) is the temperature difference between the
The APL5537 requires proper input capacitors to supply
surge current during stepping load transients to prevent
junction and ambient air. θJA is the thermal resistance
between Junction and ambient air. Assuming the TA=25oC
the input rail from dropping. Because the parasitic inductor from the voltage sources or other bulk capacitors to
and maximum TJ=160oC (typical thermal limit threshold),
the maximum power dissipation is calculated as:
the VIN limit the slew rate of the surge current, place the
Input capacitors near VIN as close as possible. Input ca-
PD(max)=(160-25)/165 = 0.82(W)
For normal operation, do not exceed the maximum junc-
pacitors should be larger than 1µF and a minimum ceramic capacitor of 1µF is necessary.
tion temperature rating of TJ = 125 oC. The calculated
power dissipation should be less than:
Output Capacitor
PD =(125-25)/165 = 0.61(W)
The GND provides an electrical connection to the ground
The APL5537 needs a proper output capacitor to maintain circuit stability and improve transient response over
and channels heat away. Connect the GND to the ground
by using a large pad or a ground plane.
temperature and current. In order to insure the circuit
stability, the proper output capacitor value should be larger
Layout Consideration
Figure 2 illustrates the layout. Below is a checklist for
your layout:
than 1µF. With X5R and X7R dielectrics, 1µF is sufficient
at all operating temperatures. Large output capacitor
1. Please place the input capacitors close to the VIN.
2. Ceramic capacitors for load must be placed near the
value can reduce noise and improve load-transient response and PSRR, Figure 1 shows the curves of allow-
load as close as possible.
3. To place APL5537 and output capacitors near the load
able ESR range as the function of load current for various
output capacitor values.
is good for performance.
4. Large current paths, the bold lines in figure 2, must
Region of Stable COUT ESR vs. Output Current
Region of Stable COUT ESR (Ω)
10
have wide tracks.
APL5537-OC
VIN=VEN=4.2V
CIN=COUT=1µF/X7R
VIN
VOUT1
VIN
1
Unstable Range
0.1
VOUT1
CIN
COUT1
APL5537
Stable Range
ON
EN1
VOUT2
VOUT2
COUT2
0.01
Stable by Simulation Verify
OFF
EN2
GND
0.001
0
50
100
150
200
250
300
Output Current (mA)
Figure2. Large Current Paths
Figure1. Stable COUT ESR Range
Operation Region and Power Dissipation
The APL5537 maximum power dissipation depends on
the thermal resistance and temperature difference between the die junction and ambient air. The TDFN1.6x
1.6-6 package power dissipation PD across the device is:
PD = (TJ - TA) / θJA
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APL5537
Package Information
TSOT-23-6A
D
e
E
E1
SEE VIEW A
b
c
0.25
A
GAUGE PLANE
SEATING PLANE
L
A1
A2
e1
VIEW A
S
Y
M
B
O
L
TSOT-23-6A
INCHES
MILLIMETERS
MIN.
MAX.
1.00
0.028
0.039
0.01
0.10
0.000
0.004
0.70
0.90
0.028
0.035
0.012
0.020
MIN.
MAX.
0.70
A1
A2
A
b
0.30
0.50
c
0.08
0.20
0.003
0.008
0.122
D
2.70
3.10
0.106
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
0.071
e
0.95 BSC
e1
1.90 BSC
L
0
0.037 BSC
0.075 BSC
0.30
0.60
0°
8°
0.012
0.024
0°
8°
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
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APL5537
Package Information
TDFN1.6x1.6-6
D
E
A
b
Pin 1
A1
D2
E2
A3
L
K
Pin 1 Corner
e
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
A
0.70
0.80
0.028
0.031
A1
0.00
0.05
0.000
0.002
0.20
0.30
0.008
0.012
D
1.55
1.65
0.061
0.065
D2
0.95
1.05
0.037
0.041
TDFN1.6x1.6-6
MILLIMETERS
A3
b
INCHES
0.20 REF
0.008 REF
E
1.55
1.65
0.061
0.065
E2
0.55
0.65
0.022
0.026
e
0.50 BSC
0.020 BSC
K
0.20
-
0.008
-
L
0.19
0.29
0.007
0.011
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APL5537
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TSOT-23-6A
Application
TDFN1.6x1.6-6
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
1.70±0.20
1.70±0.20
0.90±0.20
4.0±0.10
4.0±0.10
(mm)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2011
13
www.anpec.com.tw
APL5537
Devices Per Unit
Package Type
Unit
Quantity
TSOT-23-6A
Tape & Reel
3000
TDFN1.6x1.6-6
Tape & Reel
3000
Taping Direction Information
TSOT-23-6A
USER DIRECTION OF FEED
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
TDFN1.6x1.6-6
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2011
14
www.anpec.com.tw
APL5537
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2011
15
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APL5537
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2011
16
www.anpec.com.tw
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