Anpec APM2700CCCTRL Dual enhancement mode mosfet Datasheet

APM2700C
Dual Enhancement Mode MOSFET (N and P-Channel)
Pin Description
Features
•
N-Channel
20V/1.8A,
RDS(ON)=170mΩ(typ.) @ VGS=4.5V
RDS(ON)=270mΩ(typ.) @ VGS=2.5V
•
P-Channel
Top View of SOT-26
-20V/-1.2A,
RDS(ON)=360mΩ(typ.) @ VGS=-4.5V
RDS(ON)=530mΩ(typ.) @ VGS=-2.5V
•
•
•
(2)
S2
(6)
D1
Super High Dense Cell Design
Reliable and Rugged
(1)
G1
Lead Free Available (RoHS Compliant)
(3)
G2
Applications
•
S1
(5)
Power Management in Notebook Computer,
Portable Equipment and Battery Powered
Systems
N-Channel MOSFET
D2
(4)
P-Channel MOSFET
Ordering and Marking Information
Package Code
C : SO T-26
O perating Junction Tem p. Range
C : -55 to 150°C
Handling Code
TU : Tube
TR : Tape & Reel
Lead Free Code
L : Lead Free Device Blank : O riginal Device
APM2700C
Lead Free Code
Handling Code
Tem p. Range
Package Code
APM2700C C :
M70X
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.
ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
1
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APM2700C
Absolute Maximum Ratings
Symbol
(TA = 25°C unless otherwise noted)
Parameter
N Channel
P Channel
VDSS
Drain-Source Voltage
20
-20
VGSS
Gate-Source Voltage
±8
±8
1.8
-1.2
6
-5
1
-1
ID*
Continuous Drain Current
IDM*
300µs Pulsed Drain Current
IS*
Diode Continuous Forward Current
TJ
Maximum Junction Temperature
TSTG
Storage Temperature Range
PD*
Power Dissipation
RθJA*
VGS=±4.5V
Unit
V
A
A
150
°C
-55 to 150
TA=25°C
0.83
TA=100°C
0.3
Thermal Resistance-Junction to Ambient
W
°C/W
150
Note:
*Surface Mounted on 1in2 pad area, t ≤ 10sec.
Electrical Characteristics
Symbol
Parameter
(TA = 25°C unless otherwise noted)
APM2700C
Test Condition
Min.
Typ.
Max.
Unit
Static Characteristics
Drain-Source Breakdown
Voltage
BVDSS
VGS=0V, IDS=250µA
N-Ch
20
VGS=0V, IDS=-250µA
P-Ch
-20
VDS=16V, VGS=0V
Zero Gate Voltage Drain
Current
IDSS
TJ=85°C
VDS=-16V, VGS=0V
TJ=85°C
VGS(th)
Gate Threshold Voltage
IGSS
RDS(ON)
Gate Leakage Current
a
Drain-Source On-State
Resistance
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
V
1
N-Ch
30
-1
P-Ch
µA
-30
VDS=VGS, IDS=250µA
N-Ch
0.45
0.6
1.2
VDS=VGS, IDS=-250µA
P-Ch
-0.45
-0.6
-1.2
VGS=±8V, VDS=0V
N-Ch
±2
µA
VGS=±8V, VDS=0V
P-Ch
±100
nA
VGS=4.5V, IDS=1.8A
N-Ch
170
220
VGS=-4.5V, IDS=-1.2A
P-Ch
360
470
VGS=2.5V, IDS=0.9A
N-Ch
270
350
VGS=-2.5V, IDS=-0.7A
P-Ch
530
690
2
V
mΩ
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APM2700C
Electrical Characteristics (Cont.)
Symbol
Parameter
(TA = 25°C unless otherwise noted)
APM2700C
Test Condition
Min.
Typ.
Max.
Unit
Static Characteristics (Cont.)
VSD
a
Diode Forward Voltage
Dynamic Characteristics
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer
Capacitance
td(ON)
Turn-on Delay Time
Tr
Turn-on Rise Time
Tf
Turn-off Delay Time
Turn-off Fall Time
Gate Charge Characteristics
0.8
1.3
ISD=-0.5A, VGS=0V
P-Ch
-0.8
-1.3
N-Channel
VGS=0V,
VDS=20V,
Frequency=1.0MHz
N-Ch
130
P-Ch
140
N-Ch
25
P-Channel
VGS=0V,
VDS=-20V,
Frequency=1.0MHz
P-Ch
40
N-Ch
15
P-Ch
30
N-Ch
2
4
P-Ch
3
6
N-Ch
17
32
P-Ch
18
33
N-Ch
4
8
P-Ch
10
19
N-Ch
18
33
P-Ch
20
37
N-Ch
4.2
5.5
P-Ch
7
9
N-Ch
0.6
P-Ch
1.1
N-Ch
0.6
P-Ch
1.1
V
N-Channel
VDD=10V, RL=10Ω,
IDS=1A, VGEN=4.5V,
RG=6Ω
P-Channel
VDD=-10V, RL=10Ω,
IDS=-1A, VGEN=-4.5V,
RG=6Ω
pF
ns
b
Qg
Total Gate Charge
Q gs
Gate-Source Charge
Q gd
N-Ch
b
Ciss
td(OFF)
ISD=0.5A, VGS=0V
Gate-Drain Charge
N-Channel
VDS=10V, VGS=4.5V,
IDS=1.8A
P-Channel
VDS=-10V, VGS=-4.5V,
IDS=-1.2A
nC
Notes:
a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.
b : Guaranteed by design, not subject to production testing.
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
3
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APM2700C
Typical Characteristics
N-Channel
Drain Current
1.0
2.0
0.8
1.6
ID - Drain Current (A)
Ptot - Power (W)
Power Dissipation
0.6
0.4
0.2
0.0
0.8
0.4
0
20
40
60
0.0
80 100 120 140 160
20
40
60
80 100 120 140 160
Tj - Junction Temperature (°C)
Safe Operation Area
Thermal Transient Impedance
Normalized Transient Thermal Resistance
10
it
im
)L
n
o
s(
Rd
300µs
1
1ms
10ms
0.1
100ms
1s
DC
o
TA=25 C
0.02
0.1
0
Tj - Junction Temperature (°C)
20
ID - Drain Current (A)
1.2
1
10
1
Duty = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
Single Pulse
2
1E-3
1E-4 1E-3 0.01
50
VDS - Drain - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
2
Mounted on 1in pad
o
RθJA : 150 C/W
0.1
1
10
100
Square Wave Pulse Duration (sec)
4
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APM2700C
Typical Characteristics (Cont.)
N-Channel
Output Characteristics
Drain-Source On Resistance
350
4.5
VGS= 4,5,6,7,8,9,10V
4.0
RDS(ON) - On - Resistance (mΩ)
3V
ID - Drain Current (A)
3.5
3.0
2.5V
2.5
2.0
1.5
2V
1.0
0.5
VGS=2.5V
300
250
200
VGS=4.5V
150
1.5V
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
100
0
1
2
3
4
5
VDS - Drain - Source Voltage (V)
ID - Drain Current (A)
Transfer Characteristics
Gate Threshold Voltage
6
6
1.4
IDS=250µA
Normalized Threshold Voltage
ID - Drain Current (A)
5
o
Tj=-55 C
4
o
3
Tj=125 C
2
o
1
Tj=25 C
0
0.0
0.8
1.6
2.4
3.2
1.0
0.8
0.6
0.4
-50 -25
4.0
VGS - Gate - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
1.2
0
25
50
75
100 125 150
Tj - Junction Temperature (°C)
5
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APM2700C
Typical Characteristics (Cont.)
N-Channel
Drain-Source On Resistance
Source-Drain Diode Forward
1.75
6
VGS = 4.5V
1.50
o
IS - Source Current (A)
Normalized On Resistance
IDS = 1.8A
1.25
1.00
0.75
Tj=150 C
1
o
Tj=25 C
0.1
o
RON@Tj=25 C: 170mΩ
0.50
-50 -25
0
25
50
75
0.01
0.0
100 125 150
0.6
0.8
1.0
1.2
1.4
VSD - Source - Drain Voltage (V)
Capacitance
Gate Charge
1.6
5
Frequency=1MHz
VGS - Gate - source Voltage (V)
VDS=10V
160
C - Capacitance (pF)
0.4
Tj - Junction Temperature (°C)
200
Ciss
120
80
40
Coss
Crss
0
0.2
0
4
8
12
16
4
3
2
1
0
20
0
1
2
3
4
5
QG - Gate Charge (nC)
VDS - Drain - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
IDS =1.8A
6
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APM2700C
Typical Characteristics
P-Channel
Drain Current
1.0
1.5
0.8
1.2
-ID - Drain Current (A)
Ptot - Power (W)
Power Dissipation
0.6
0.4
0.2
0
20
40
60
80
0.0
100 120 140 160
20
40
60
80
100 120 140 160
Tj - Junction Temperature (°C)
Safe Operation Area
Thermal Transient Impedance
10
Rd
)L
on
s(
im
it
300µs
1
1ms
10ms
0.1
100ms
1s
DC
o
TA=25 C
0.01
0.1
0
Tj - Junction Temperature (°C)
20
-ID - Drain Current (A)
0.6
0.3
Normalized Transient Thermal Resistance
0.0
0.9
1
10
Duty = 0.5
1
0.2
0.1
0.1
0.05
0.02
0.01
0.01
Single Pulse
2
1E-3
1E-4 1E-3
50
-VDS - Drain - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
2
Mounted on 1in pad
o
RθJA : 150 C/W
0.01
0.1
1
10
100
Square Wave Pulse Duration (sec)
7
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APM2700C
Typical Characteristics (Cont.)
P-Channel
Output Characteristics
Drain-Source On Resistance
10
800
-ID - Drain Current (A)
8
RDS(ON) - On - Resistance (mΩ)
VGS= -5,-6,-7,-8,-9,-10V
-4V
6
-3V
-2V
4
2
0
0
1
2
3
600
500
VGS= -4.5V
400
300
200
100
4
VGS= -2.5V
700
0
1
2
3
4
5
-VDS - Drain - Source Voltage (V)
-ID - Drain Current (A)
Transfer Characteristics
Gate Threshold Voltage
6
1.4
6
IDS=-250µA
Normalized Threshold Voltage
-ID - Drain Current (A)
5
o
Tj=-55 C
4
o
3
Tj=125 C
2
o
Tj=25 C
1
0
0
1
2
3
1.0
0.8
0.6
0.4
-50 -25
4
-VGS - Gate - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
1.2
0
25
50
75
100 125 150
Tj - Junction Temperature (°C)
8
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APM2700C
Typical Characteristics (Cont.)
P-Channel
Drain-Source On Resistance
Source-Drain Diode Forward
6
1.8
IDS = -1.2A
1.6
o
Tj=150 C
-IS - Source Current (A)
Normalized On Resistance
V GS = -4.5V
1.4
1.2
1.0
0.8
o
Tj=25 C
1
0.6
o
R ON@T j=25 C: 360m Ω
0.4
-50
-25
0
25
50
75
0.3
0.0
100 125 150
0.6
0.8
1.0
1.2
1.4
1.6
-VSD - Source - Drain Voltage (V)
Capacitance
Gate Charge
5
V DS= -10V
-VGS - Gate - source Voltage (V)
Frequency=1MHz
200
C - Capacitance (nC)
0.4
Tj - Junction Temperature (°C)
250
Ciss
150
100
Coss
50
Crss
0
0.2
0
4
8
12
16
3
2
1
0
20
0
1
2
3
4
5
6
7
8
QG - Gate Charge (nC)
-VDS - Drain - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
IDS= -1.2A
4
9
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APM2700C
Packaging Information
SOT-23-6
D
6
4
5
E
1
2
H
3
S1
e
D
A
α
A2
A1
D im
A
A1
A2
b
D
E
e
H
L
L1
L2
α
S1
L2
M i ll im et er s
Min.
1.00
0.00
0.70
0.35
2.70
1.40
Max.
1.45
0.15
1.25
0.55
3.10
1.80
1 . 9 0 B SC
2.60
0.30
0.08
3.00
0.25
0.60 REF
0°
0.85
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
10°
1.05
10
L1
L
In c h e s
Min.
Max.
0.0394
0.0571
0.0000
0.0591
0.0276
0.0492
0.0138
0.0217
0.1063
0.1220
0.50551
0.0709
0.07480 BSC
0.1024
0 . 11 8 1
0 0 0 11 8
0.0031
0.0098
0.024 REF
0°
10°
0.0335
0.0413
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APM2700C
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
C ritical Zone
T L to T P
T e m p e ra tu re
R am p-up
TL
tL
T sm ax
T sm in
R am p-down
ts
Preheat
25
t 25 °C to Peak
T im e
Classificatin Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
11
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APM2700C
Classificatin Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Tem peratures
3
3
Package Thickness
Volum e m m
Volum e m m
<350
≥350
<2.5 m m
240 +0/-5°C
225 +0/-5°C
≥2.5 m m
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Tem peratures
3
3
3
Package Thickness
Volum e mm
Volum e mm
Volum e mm
<350
350-2000
>2000
<1.6 m m
260 +0°C*
260 +0°C*
260 +0°C*
1.6 m m – 2.5 m m
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 m m
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and
including the stated classification tem perature (this m eans Peak reflow tem perature +0°C.
For exam ple 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
Method
MIL-STD-883D-2003
MIL-STD 883D-1005.7
JESD-22-B, A102
MIL-STD 883D-1011.9
Description
245°C,5 SEC
1000 Hrs Bias @ 125°C
168 Hrs, 100% RH, 121°C
-65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t
E
P
Po
D
P1
Bo
F
W
Ao
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
D1
12
Ko
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APM2700C
Carrier Tape & Reel Dimensions(Cont.)
T2
J
C
A
B
T1
Application
A
178±1
SOT-23-6
F
B
C
J
72 ± 1.0 13.0 + 0.2 2.5 ± 0.15
D
3.5 ± 0.05 1.5 +0.1
D1
Po
1.5 +0.1
4.0 ± 0.1
T1
T2
P
E
1.5± 0.3
W
8.0+ 0.3
- 0.3
8.4 ± 2
4 ± 0.1
1.75± 0.1
P1
Ao
Bo
Ko
t
1.4± 0.1
0.2±0.03
2.0 ± 0.1 3.15 ± 0.1 3.2± 0.1
(mm)
Cover Tape Dimensions
Application
SOT-23-6
Carrier Width
8
Cover Tape Width
5.3
Devices Per Reel
3000
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
13
www.anpec.com.tw
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