APM3195PU P-Channel Enhancement Mode MOSFET Features • Pin Description -30V/-11.8A , RDS(ON)=100mΩ (typ.) @ VGS=-10V RDS(ON)=170mΩ (typ.) @ VGS=-4.5V • • • G Super High Dense Cell Design D S Reliable and Rugged Top View of TO-252 Lead Free Available (RoHS Compliant) S Applications • Power Management in Desktop Computer or DC/DC Converters G D P-Channel MOSFET Ordering and Marking Information Package Code U : TO-252 Operating Junction Temp. Range C : -55 to 150 °C Handling Code TU : Tube TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device APM3195P Lead Free Code Handling Code Temp. Range Package Code APM3195P U : APM3195P XXXXX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 1 www.anpec.com.tw APM3195PU Absolute Maximum Ratings Symbol Parameter Rating Unit Common Ratings (TA = 25°C) VDSS Drain-Source Voltage -30 VGSS Gate-Source Voltage ±20 Maximum Junction Temperature 150 °C -55 to 150 °C TC=25°C -8 A TC=25°C -20 TC=100°C -15 TC=25°C -11.8 TC=100°C -7.5 TC=25°C 50 TC=100°C 20 TJ TSTG IS Storage Temperature Range Diode Continuous Forward Current V Mounted on Large Heat Sink IDP 300µs Pulse Drain Current Tested ID Continuous Drain Current PD Maximum Power Dissipation RθJC 2.5 Thermal Resistance-Junction to Case A A W °C/W 2 Mounted on PCB of 1in Pad Area IDP 300µs Pulse Drain Current Tested ID Continuous Drain Current PD Maximum Power Dissipation RθJA TA=25°C -20 TA=100°C -15 TA=25°C -3 TA=100°C -2 TA=25°C 2.5 TA=100°C 1 Thermal Resistance-Junction to Ambient 50 A A W °C/W Mounted on PCB of Minimum Footprint IDP 300µs Pulse Drain Current Tested ID Continuous Drain Current PD Maximum Power Dissipation RθJA Thermal Resistance-Junction to Ambient Copyright ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 2 TA=25°C -50 TA=100°C -30 TA=25°C -2 TA=100°C -1 TA=25°C 1.6 TA=100°C 0.6 75 A A W °C/W www.anpec.com.tw APM3195PU Electrical Characteristics Symbol Parameter (TA = 25°C unless otherwise noted) Test Condition APM3195PU Min. Typ. Max. Unit Static Characteristics BVDSS Drain-Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current -30 V VDS=-24V, VGS=0V -1 -30 TJ=85°C VGS(th) IGSS RDS(ON) VGS=0V, IDS=-250µA a Gate Threshold Voltage VDS=VGS, IDS=-250µA Gate Leakage Current VGS=±20V, VDS=0V Drain-Source On-state Resistance -1 -1.5 µA -2 V ±100 nA VGS=-10V, IDS=-4A 100 240 VGS=-4.5V, IDS=-3A 170 460 ISD=-0.5A, VGS=0V -0.8 -1.3 mΩ Diode Characteristics VSD a Diode Forward Voltage V Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance td(ON) Turn-on Delay Time Tr Turn-on Rise Time td(OFF) Turn-off Delay Time Tf 510 pF 70 36 10 20 8 20 25 50 5 15 8.1 10.5 ns b Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge Notes: VDD=-15V, RL=15Ω, IDS=-1A, VGEN=-10V, RG=6Ω Turn-off Fall Time Gate Charge Characteristics Qg VGS=0V VDS=-25V Frequency=1.0MHz Ω 11 VDS=-15V, VGS=-10V, IDS=-4A 2 nC 1.1 a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing. Copyright ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 3 www.anpec.com.tw APM3195PU Typical Characteristics Drain Current Power Dissipation 60 14 12 -ID - Drain Current (A) Ptot - Power (W) 50 40 30 20 10 10 8 6 4 2 o TC=25 C,VG=-10V o 0 TC=25 C 0 0 20 40 60 80 100 120 140 160 180 20 40 60 80 100 120 140 160 180 Tj - Junction Temperature (°C) Tj - Junction Temperature (°C) Safe Operation Area Thermal Transient Impedance 10ms Rd s(o n) 10 Normalized Transient Thermal Resistance Lim it 50 -ID - Drain Current (A) 0 100ms 1s DC 1 o TC=25 C 0.1 0.1 1 10 Rev. B.2 - Oct., 2005 1 Duty = 0.5 0.2 0.1 0.05 0.1 0.02 0.01 Single Pulse 2 0.01 1E-4 100 Mounted on 1in pad o RθJA :50 C/W 1E-3 0.01 0.1 1 10 100 Square Wave Pulse Duration (sec) -VDS - Drain - Source Voltage (V) Copyright ANPEC Electronics Corp. 2 4 www.anpec.com.tw APM3195PU Typical Characteristics (Cont.) Drain-Source On Resistance Output Characteristics 300 20 -VGS=7,8,9,10V -6V RDS(ON) - On - Resistance (mΩ) -5V 12 8 -4V 4 0 -3V 0 2 4 6 8 150 VGS=-10V 100 50 0 10 4 8 12 16 -ID - Drain Current (A) Transfer Characteristics Gate Threshold Voltage 20 1.8 18 1.6 20 IDS =-250µA 14 o Tj=-55 C 12 o 10 Tj=25 C o Tj=125 C 8 6 4 1.4 1.2 1.0 0.8 0.6 0.4 0.2 2 0 0 -VDS - Drain - Source Voltage (V) 16 -ID - Drain Current (A) 200 Normalized Threshold Vlotage -ID - Drain Current (A) 16 VGS=-4.5V 250 0 2 4 6 8 0.0 -50 -25 10 Rev. B.2 - Oct., 2005 25 50 75 100 125 150 Tj - Junction Temperature (°C) -VGS - Gate - Source Voltage (V) Copyright ANPEC Electronics Corp. 0 5 www.anpec.com.tw APM3195PU Typical Characteristics (Cont.) Drain-Source On Resistance Source-Drain Diode Forward 20 1.8 VGS = -10V IDS = -4A 10 1.4 -IS - Source Current (A) Normalized On Resistance 1.6 1.2 1.0 0.8 o Tj=150 C o Tj=25 C 1 0.6 o 0.4 -50 -25 RON@Tj=25 C: 100mΩ 0 25 50 0.1 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 75 100 125 150 Tj - Junction Temperature (°C) -VSD - Source - Drain Voltage (V) Capacitance Gate Charge 1000 10 Frequency=1MHz 800 C - Capacitance (pF) VDS=-10V 9 -VGS - Gate-source Voltage (V) 900 700 600 Ciss 500 400 300 200 Coss 100 IDS= -4A 8 7 6 5 4 3 2 1 Crss 0 0 5 10 15 20 25 0 30 Rev. B.2 - Oct., 2005 1 2 3 4 5 6 7 8 9 QG - Gate Charge (nC) -VDS - Drain - Source Voltage (V) Copyright ANPEC Electronics Corp. 0 6 www.anpec.com.tw APM3195PU Package Information TO-252 (Reference JEDEC Registration TO-252) E A b2 C1 L2 D H L1 L b C e1 D1 A1 E1 Dim Millimeters Inches Min. Max. Min. Max. A 2.18 2.39 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.508 0.89 0.020 0.035 b2 5.207 5.461 0.205 0.215 C 0.46 0.58 0.018 0.023 C1 0.46 0.58 0.018 0.023 D 5.334 6.22 0.210 0.245 D1 E 5.2 REF 6.35 E1 0.205 REF 6.73 0.250 5.3 REF 0.265 0.209 REF e1 3.96 5.18 0.156 0.204 H 9.398 10.41 0.370 0.410 L 0.51 L1 0.64 1.02 0.025 0.040 L2 0.89 2.032 0.035 0.080 Copyright ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 0.020 7 www.anpec.com.tw APM3195PU Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone T L to T P Temperature Ramp-up TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25 °C to Peak Time Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (T L) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25°C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 8 www.anpec.com.tw APM3195PU Classification Reflow Profiles(Cont.) Table 1. SnPb Entectic Process – Package Peak Reflow Temperature s Package Thickness Volume mm 3 Volume mm 3 <350 ≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm 3 Volume mm 3 Volume mm 3 <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Reliability Test Program Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 SEC 1000 Hrs Bias @ 125°C 168 Hrs, 100% RH, 121°C -65°C ~ 150°C, 200 Cycles Carrier Tape & Reel Dimensions t E P Po D P1 Bo F W Ao Copyright ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 D1 9 Ko www.anpec.com.tw APM3195PU Carrier Tape & Reel Dimensions (Cont.) T2 J C A B T1 Application TO-252 A B C J 330 ±3 100 ± 2 13 ± 0. 5 2 ± 0.5 F D D1 Po 7.5 ± 0.1 1.5 +0.1 T1 T2 16.4 + 0.3 2.5± 0.5 -0.2 1.5± 0.25 4.0 ± 0.1 W 16+ 0.3 - 0.1 P E 8 ± 0.1 1.75± 0.1 P1 Ao Bo Ko t 2.0 ± 0.1 6.8 ± 0.1 10.4± 0.1 2.5± 0.1 0.3±0.05 (mm) Cover Tape Dimensions Application TO- 252 Carrier Width 16 Cover Tape Width 13.3 Devices Per Reel 2500 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 10 www.anpec.com.tw