ALSC ASM3P1819N-08-TR Low power mobile vga emi reduction ic Datasheet

ASM3P1819N
August 2005
rev 0.2
Low Power Mobile VGA EMI Reduction IC
Features
The ASM3P1819N reduces electromagnetic interference
ƒ
FCC approved method of EMI attenuation
(EMI) at the clock source, allowing a system wide EMI
ƒ
Provides up to 15dB EMI reduction
reduction for all the down stream clocks and data
ƒ
Generates a low EMI spread spectrum clock
dependent signals. The ASM3P1819N allows significant
and a non-spread Reference Clock of the input
system cost savings by reducing the number of circuit
frequency
board layers, ferrite beads, shielding, and other passive
Optimized for frequency range from 20MHz to
ƒ
components that are traditionally required to pass EMI
40MHz
regulations.
Internal loop filter minimizes external components
The ASM3P1819N modulates the output of a single PLL in
and board space
order to “spread” the bandwidth of a synthesized clock,
ƒ
Down Spread Deviation: -1.25%
thereby decreasing the peak amplitude of its harmonics.
ƒ
Low inherent Cycle-to-Cycle jitter
This result in significantly lower system EMI compared to
ƒ
3.3V Operating Voltage
the typical narrow band signal produced by oscillators and
ƒ
CMOS/TTL compatible inputs and outputs
most clock generators.
ƒ
Low power CMOS design
ƒ
Supports notebook VGA and other LCD timing
ƒ
Lowering EMI by increasing a signal’s bandwidth is called
“spread spectrum clock generation”. The ASM3P1819N
controller applications
uses the most efficient and optimized modulation profile
ƒ
Power Down function for mobile application
ƒ
Products are available for industrial temperature
range.
Available in 8 pin SOIC and TSSOP Packages
ƒ
ASM3P1819N
is
a
proprietary all digital method
Applications
Functional Description
The
approved by the FCC and is implemented by using a
The ASM3P1819N is targeted towards EMI management
versatile
spread
spectrum
for memory and LVDS interfaces in mobile graphic chipsets
frequency modulator designed specifically for a wide range
and high-speed digital applications such as PC peripheral
of input clock frequencies from 20 to 40MHz. The
devices, consumer electronics and embedded controller
ASM3P1819N can generate an EMI reduced clock from
system.
crystal, ceramic resonator, or system clock.
Block Diagram
PD#
PLL
Modulation
XIN
Crystal
Oscillator
XOUT
VDD
Frequency
Divider
Feedback
Divider
Phase
Detector
Loop
Filter
VCO
Output
Divider
ModOUT
REF
VSS
Alliance Semiconductor
2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com
Notice: The information in this document is subject to change without notice.
ASM3P1819N
August 2005
rev 0.2
Pin Configuration
8
XOUT
7
VDD
3
6
PD#
4
5
REF
XIN
1
VSS
2
NC
ModOUT
ASM3P1819N
Pin Description
Pin#
Pin Name
Type
Description
1
XIN
I
Connect to externally generated Clock signal or Crystal.
2
VSS
P
Ground Connection. Connect to system ground.
3
NC
-
No Connect.
4
ModOUT
O
Spread spectrum clock output.
5
REF
O
Non-modulated Reference clock output of the input frequency.
6
PD#
I
Power down control pin. Pull LOW to enable Power-Down mode. This pin
has an internal pull-up resistor.
7
VDD
P
Connect to +3.3V.
8
XOUT
I
Connect to crystal. No connect if externally generated clock signal is used.
Absolute Maximum Ratings
Symbol
VDD, VIN
TSTG
Parameter
Rating
Unit
Voltage on any pin with respect to Ground
-0.5 to +7.0
V
Storage temperature
-65 to +125
°C
TA
Operating temperature
0 to 70
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
2
KV
TDV
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Output Frequency and Modulation Rate
Input Frequency Range
(MHz)
Output Frequency Range
(MHz)
Modulation Rate
Spread Deviation
(%)
20 to 40
20 to 40
Input Frequency / 512
-1.25
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
2 of 7
ASM3P1819N
August 2005
rev 0.2
DC Electrical Characteristics
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
Symbol
Parameter
Min
Typ
Max
Unit
VIL
Input Low voltage
VSS – 0.3
-
0.8
V
VIH
Input High voltage
2.0
-
VDD + 0.3
V
IIL
Input Low current
-
-
-20.0
µA
IIH
Input High current
-
-
1.0
µA
IXOL
XOUT Output low current @ 0.4V, VDD = 3.3V
-
3
-
mA
IXOH
XOUT Output high current @ 2.5V, VDD = 3.3V
-
3
-
mA
VOL
Output Low voltage VDD = 3.3V, IOL = 20mA
-
-
0.4
V
VOH
Output High voltage VDD = 3.3V, IOH = 20mA
2.5
-
-
V
ICC
Dynamic Supply current
3.3V and 10pF probe loading
7.1
fIN - min
-
26.9
fIN - max
mA
IDD
Static Supply current
-
4.5
-
mA
VDD
Operating Voltage
-
3.3
-
V
tON
Power up time (First locked clock cycle after power up)
-
0.18
-
mS
ZOUT
Clock Output impedance
-
50
-
Ω
AC Electrical Characteristics
Symbol
Min
Typ
Max
Unit
fIN
Input Frequency
Parameter
20
-
40
MHz
fOUT
Output Frequency
20
-
40
MHz
tLH1
Output Rise time
( Measured from 0.8V to 2.0V )
-
0.69
-
nS
tHL1
Output Fall time
( Measured from 2.0V to 0.8V )
-
0.66
-
nS
tJC
Jitter (Cycle to Cycle)
-200
-
200
pS
tD
Output Duty cycle
45
50
55
%
Note:1. tLH and tHL are measured into a capacitive load of 15pF
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
3 of 7
ASM3P1819N
August 2005
rev 0.2
Package Information
8-Pin (150-mil) SOIC Package
H
E
D
A2
A
C
A1
D
θ
e
L
B
Dimensions
Symbol
Inches
Min
Max
Millimeters
Min
Max
A1
0.004
0.010
0.10
0.25
A
0.053
0.069
1.35
1.75
A2
0.049
0.059
1.25
1.50
B
0.012
0.020
0.31
0.51
C
0.007
0.010
0.18
0.25
D
0.193 BSC
4.90 BSC
E
0.154 BSC
3.91 BSC
e
0.050 BSC
1.27 BSC
H
0.236 BSC
6.00 BSC
L
0.016
0.050
0.41
1.27
θ
0°
8°
0°
8°
Note: Controlling dimensions are millimeters
SOIC – 0.074 grams unit weight
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
4 of 7
ASM3P1819N
August 2005
rev 0.2
8-lead Thin Shrunk Small Outline Package (4.40-MM Body)
H
E
D
A2
A
C
θ
e
A1
L
B
Dimensions
Symbol
Inches
Min
Millimeters
Max
A
Min
Max
0.043
1.10
A1
0.002
0.006
0.05
0.15
A2
0.033
0.037
0.85
0.95
B
0.008
0.012
0.19
0.30
c
0.004
0.008
0.09
0.20
D
0.114
0.122
2.90
3.10
E
0.169
0.177
4.30
4.50
e
0.026 BSC
0.65 BSC
H
0.252 BSC
6.40 BSC
L
0.020
0.028
0.50
0.70
θ
0°
8°
0°
8°
Note: Controlling dimensions are millimeters
TSSOP – 0.0325 grams unit weight
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
5 of 7
ASM3P1819N
August 2005
rev 0.2
Ordering Information
Part number
ASM3P1819N -08-ST
ASM3P1819N -08-SR
ASM3P1819NF-08-ST
ASM3P1819NF-08-SR
ASM3P1819NG-08-ST
ASM3P1819NG-08-SR
ASM3I1819N -08-ST
ASM3I1819N -08-SR
ASM3I1819NF-08-ST
ASM3I1819NF-08-SR
ASM3I1819NG-08-ST
ASM3I1819NG-08-SR
ASM3P1819N -08-TT
ASM3P1819N -08-TR
ASM3P1819NF-08-TT
ASM3P1819NF-08-TR
ASM3P1819NG-08-TT
ASM3P1819NG-08-TR
ASM3I1819N -08-TT
ASM3I1819N -08-TR
ASM3I1819NF-08-TT
ASM3I1819NF-08-TR
ASM3I1819NG-08-TT
ASM3I1819NG-08-TR
Marking
3P1819N
3P1819N
3P1819NF
3P1819NF
3P1819NG
3P1819NG
3I1819N
3I1819N
3I1819NF
3I1819NF
3I1819NG
3I1819NG
3P1819N
3P1819N
3P1819NF
3P1819NF
3P1819NG
3P1819NG
3I1819N
3I1819N
3I1819NF
3I1819NF
3I1819NG
3I1819NG
Package Configuration
Temperature Range
8-Pin SOIC,Tube
8-Pin SOIC, Tape and Reel
8-Pin SOIC, Tube, Pb Free
8-Pin SOIC, Tape and Reel, Pb Free
8-Pin SOIC, Tube, Green
8-Pin SOIC, Tape and Reel, Green
8-Pin SOIC, Tube
8-Pin SOIC, Tape and Reel
8-Pin SOIC, Tube, Pb Free
8-Pin SOIC, Tape and Reel, Pb Free
8-Pin SOIC, Tube, Green
8-Pin SOIC, Tape and Reel, Green
8-Pin TSSOP, Tube
8-Pin TSSOP, Tape and Reel
8-Pin TSSOP, Tube, Pb Free
8-Pin TSSOP, Tape and Reel, Pb Free
8-Pin TSSOP, Tube, Green
8-Pin TSSOP, Tape and Reel, Green
8-Pin TSSOP, Tube
8-Pin TSSOP, Tape and Reel
8-Pin TSSOP, Tube, Pb Free
8-Pin TSSOP, Tape and Reel, Pb Free
8-Pin TSSOP, Tube, Green
8-Pin TSSOP, Tape and Reel, Green
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Device Ordering Information
A S M 3 P 1 8 1 9 N F - 0 8 - S R
R = Tape & reel, T = Tube or Tray
O = SOT
S = SOIC
T = TSSOP
A = SSOP
V = TVSOP
B = BGA
Q = QFN
U = MSOP
E = TQFP
L = LQFP
U = MSOP
P = PDIP
D = QSOP
X = SC-70
DEVICE PIN COUNT
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE
PART NUMBER
X= Automotive
I= Industrial
P or n/c = Commercial
(-40C to +125C) (-40C to +85C)
(0C to +70C)
1 = Reserved
2 = Non PLL based
3 = EMI Reduction
4 = DDR support products
5 = STD Zero Delay Buffer
6 = Power Management
7 = Power Management
8 = Power Management
9 = Hi Performance
0 = Reserved
ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
6 of 7
ASM3P1819N
August 2005
rev 0.2
Alliance Semiconductor Corporation
2575 Augustine Drive,
Santa Clara, CA 95054
Tel# 408-855-4900
Fax: 408-855-4999
www.alsc.com
Copyright © Alliance Semiconductor
All Rights Reserved
Part Number: ASM3P1819N
Document Version: 0.2
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are
trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their
respective companies. Alliance reserves the right to make changes to this document and its products at any time without
notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein
represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this
data at any time, without notice. If the product described herein is under development, significant changes to these
specifications are possible. The information in this product data sheet is intended to be general descriptive information for
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or
customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product
described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual
property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance).
All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of
products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any
other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical
components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant
injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer
assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
7 of 7
Similar pages