ATMEL AT49F1024-70VI 1-megabit 64k x 16 5-volt only flash memory Datasheet

Features
• Single Voltage Operation
•
•
•
•
•
•
•
•
•
– 5V Read
– 5V Reprogramming
Fast Read Access Time - 45 ns
Internal Program Control and Timer
8K word Boot Block With Lockout
Fast Erase Cycle Time - 10 seconds
Word By Word Programming - 10 µs/Word Typical
Hardware Data Protection
DATA Polling For End Of Program Detection
Small 10 x 14 mm VSOP Package
Typical 10,000 Write Cycles
Description
The AT49F1024 and the AT49F1025 are 5-volt-only in-system Flash Memories. Their
1 megabit of memory is organized as 65,536 words by 16 bits. Manufactured with
Atmel’s advanced nonvolatile CMOS technology, the devices offer access times to 45
ns with power dissipation of just 275 mW over the commercial temperature range.
When the device is deselected, the CMOS standby current is less than 100 µA. The
only difference between the AT49F1024 and the AT49F1025 is the pinout. The
AT49F1024 is pin compatable with the AT27C1024, and the AT49F1025 is pin compatable with the AT29C1024.
(continued)
Pin Configurations
Chip Enable
OE
Output Enable
WE
Write Enable
I/O0 - I/O15
Data Inputs/Outputs
NC
No Connect
A9
A10
A11
A12
A13
A14
A15
NC
WE
VCC
NC
CE
I/O15
I/O14
I/O13
I/O12
I/O11
I/O10
I/O9
I/O8
AT49F1025 VSOP Top View
Type 1
10 x 14 mm
10 x 14 mm
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
OE
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/07
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
NC
CE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
GND
A8
A7
A6
A5
A4
A3
A2
A1
A0
OE
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
PLCC Top View
I/O13
I/O14
I/O15
CE
NC
NC
VCC
WE
NC
A15
A14
CE
I/O12
I/O11
I/O10
I/O9
I/O8
GND
NC
I/O7
I/O6
I/O5
I/O4
6
5
4
3
2
1
44
43
42
41
40
Addresses
7
8
9
10
11
12
13
14
15
16
17
39
38
37
36
35
34
33
32
31
30
29
18
19
20
21
22
23
24
25
26
27
28
A0 - A15
A13
A12
A11
A10
A9
GND
NC
A8
A7
A6
A5
Rev. 0765D–09/98
I/O3
I/O2
I/O1
I/O0
OE
DC
A0
A1
A2
A3
A4
Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
AT49F1024
AT49F1025
AT49F1024 VSOP Top View
Type 1
10 x 14 mm
Pin Name
A0
A1
A2
A3
A4
A5
A6
A7
A8
GND
A9
A10
A11
A12
A13
A14
A15
NC
WE
VCC
1-Megabit
(64K x 16)
5-volt Only
Flash Memory
1
To allow for simple in-system reprogrammability, the
AT49F1024/1025 does not require high input voltages for
programming. Five-volt-only commands determine the read
and programming operation of the device. Reading data
out of the device is similar to reading from an EPROM.
Reprogramming the AT49F1024/1025 is performed by
erasing a block of data (entire chip or main memory block)
and then programming on a word by word basis. The typical word programming time is a fast 10 µs. The end of a
program cycle can be optionally detected by the DATA poll-
ing feature. Once the end of a byte program cycle has been
detected, a new access for a read or program can begin.
The typical number of program and erase cycles is in
excess of 10,000 cycles.
The optional 8K words boot block section includes a reprogramming write lock out feature to provide data integrity.
The boot sector is designed to contain user secure code,
and when the feature is enabled, the boot sector is permanently protected from being erased or reprogrammed.
Block Diagram
DATA INPUTS/OUTPUTS
I/O15 - I/O0
VCC
GND
OE
WE
CE
16
OE, CE, AND WE
LOGIC
ADDRESS
INPUTS
DATA LATCH
INPUT/OUTPUT
BUFFERS
Y DECODER
Y-GATING
X DECODER
MAIN MEMORY
(56K WORDS)
1FFFH
OPTIONAL BOOT
BLOCK (8K WORDS)
0000H
Device Operation
READ: The AT49F1024/1025 is accessed like an
EPROM. When CE and OE are low and WE is high, the
data stored at the memory location determined by the
address pins is asserted on the outputs. The outputs are
put in the high impedance state whenever CE or OE is
high. This dual-line control gives designers flexibility in preventing bus contention.
CHIP ERASE: When the boot block programming lockout
feature is not enabled, the boot block and the main memory
block will erase together from the same chip erase command (See command definitions table). If the boot block
lockout function has been enabled, data in the boot section
will not be erased. However, data in the main memory section will be erased. After a chip erase, the device will return
to the read mode.
MAIN MEMORY ERASE: As an alternative to the chip
erase, a main memory block erase can be performed which
will erase all bytes not located in the boot block region to an
FFH. Data located in the boot region will not be changed
during a main memory block erase. The Main Memory
Erase command is a six bus cycle operation. The address
(5555H) is latched on the falling edge of the sixth cycle
while the 30H data input is latched on the rising edge of
2
AT49F1024/1025
WE. The main memory erase starts after the rising edge of
WE of the sixth cycle. Please see Main Memory Erase
cycle waveforms. The Main Memory Erase operation is
internally controlled; it will automatically time to completion.
WORD PROGRAMMING: Once the memory array is
erased, the device is programmed (to a logical “0”) on a
word-by-word basis. Please note that a data “0” cannot be
programmed back to a “1”; only erase operations can convert “0”s to “1”s. Programming is accomplished via the
internal device command register and is a 4 bus cycle
operation (please refer to the Command Definitions table).
The device will automatically generate the required internal
program pulses.
The program cycle has addresses latched on the falling
edge of WE or CE, whichever occurs last, and the data
latched on the rising edge of WE or CE, whichever occurs
first. Programming is completed after the specified tBP cycle
time. The DATA polling feature may also be used to indicate the end of a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT: The device
has one designated block that has a programming lockout
feature. This feature prevents programming of data in the
designated block once the feature has been enabled. The
AT49F1024/1025
size of the block is 8K words. This block, referred to as the
boot block, can contain secure code that is used to bring up
the system. Enabling the lockout feature will allow the boot
code to stay in the device while data in the rest of the
device is updated. This feature does not have to be activated; the boot block’s usage as a write protected region is
optional to the user. The address range of the boot block is
0000H to 1FFFH.
Once the feature is enabled, the data in the boot block can
no longer be erased or programmed. Data in the main
memory block can still be changed through the regular programming method and can be erased using either the chip
erase or the main memory block erase command. To activate the lockout feature, a series of six program commands
to specific addresses with specific data must be performed.
Please refer to the Command Definitions table.
BOOT BLOCK LOCKOUT DETECTION: A software
method is available to determine if programming of the boot
block section is locked out. When the device is in the software product identification mode (see Software Product
Identification Entry and Exit sections) a read from address
location 0002H will show if programming the boot block is
locked out. If the data on I/O0 is low, the boot block can be
programmed; if the data on I/O0 is high, the program lockout feature has been activated and the block cannot be
programmed. The software product identification exit code
should be used to return to standard operation.
PRODUCT IDENTIFICATION: The product identification
mode identifies the device and manufacturer as Atmel. It
may be accessed by hardware or software operation. The
hardware operation mode can be used by an external pro-
grammer to identify the correct programming algorithm for
the Atmel product.
For details, see Operating Modes (for hardware operation)
or Software Product Identification. The manufacturer and
device code is the same for both modes.
DATA POLLING: The AT49F1024/1025 features DATA
polling to indicate the end of a program or erase cycle.
During a program cycle an attempted read of the last byte
loaded will result in the complement of the loaded data on
I/O7. Once the program cycle has been completed, true
data is valid on all outputs and the next cycle may begin.
DATA polling may begin at any time during the program
cycle.
TOGGLE BIT: In addition to DATA polling the
AT49F1024/1025 provides another method for determining
the end of a program or erase cycle. During a program or
erase operation, successive attempts to read data from the
device will result in I/O6 toggling between one and zero.
Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit
may begin at any time during a program cycle.
HARDWARE DATA PROTECTION: Hardware features
protect against inadvertent programs to the
AT49F1024/1025 in the following ways: (a) V CC sense: if
VCC is below 3.8V (typical), the program function is inhibited. (b) Program inhibit: holding any one of OE low, CE
high or WE high inhibits program cycles. (c) Noise filter:
Pulses of less than 15 ns (typical) on the WE or CE inputs
will not initiate a program cycle.
3
Command Definition (in Hex)
Command
Sequence
1st Bus
Cycle
Bus
Cycles
Addr
Data
Read
1
Addr
DOUT
Chip Erase
6
5555
Main Memory Erase
6
Word Program
2nd Bus
Cycle
3rd Bus
Cycle
4th Bus
Cycle
5th Bus
Cycle
6th Bus
Cycle
Addr
Data
Addr
Data
Addr
Data
Addr
Data
Addr
Data
AA
2AAA
55
5555
80
5555
AA
2AAA
55
5555
10
5555
AA
2AAA
55
5555
80
5555
AA
2AAA
55
5555
30
4
5555
AA
2AAA
55
5555
A0
Addr
DIN
6
5555
AA
2AAA
55
5555
80
5555
AA
2AAA
55
5555
40
Product ID Entry
3
5555
AA
2AAA
55
5555
90
(3)
3
5555
AA
2AAA
55
5555
F0
Boot Block Lockout
Product ID Exit
(2)
Product ID Exit(3)
1
xxxx
F0
Notes: 1. The DATA FORMAT in each bus cycle is as follows: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex).
2. The 8K word boot sector has the address range 00000H to 1FFFH.
3. Either one of the Product ID Exit commands can be used.
Absolute Maximum Ratings*
Temperature Under Bias ................................ -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to VCC + 0.6V
Voltage on OE
with Respect to Ground ...................................-0.6V to +13.5V
4
AT49F1024/1025
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
AT49F1024/1025
DCand AC Operating Range
Operating
Temperature (Case)
AT49F1024/1025-45
AT49F1024/1025-55
AT49F1024/1025-70
AT49F1024/1025-90
0°C - 70°C
0°C - 70°C
0°C - 70°C
0°C - 70°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
5V ± 10%
5V ± 10%
5V ± 10%
Com.
Ind.
VCC Power Supply
5V ± 10%
Operating Modes
Mode
Read
Program
(2)
Standby/Write Inhibit
CE
OE
WE
Ai
I/O
VIL
VIL
VIH
Ai
DOUT
VIL
VIH
VIL
Ai
DIN
X
X
High Z
(1)
VIH
X
Program Inhibit
X
X
VIH
Program Inhibit
X
VIL
X
Output Disable
X
VIH
X
High Z
Product Identification
Hardware
VIL
VIL
VIH
A1 - A15 = VIL, A9 = VH,(3)
A0 = VIL
Manufacturer Code(4)
A1 - A15 = VIL, A9 = VH,(3)
A0 = VIH
Device Code(4)
Software(5)
Notes:
A0 = VIL, A1 - A15 = VIL
Manufacturer Code(4)
A0 = VIH, A1 - A15 = VIL
Device Code(4)
1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
3. VH = 12.0V ± 0.5V.
4. Manufacturer Code: 1FH, Device Code: 87H.
5. See details under Software Product Identification Entry/Exit.
DC Characteristics
Symbol
Parameter
Condition
ILI
Input Load Current
ILO
Max
Units
VIN = 0V to VCC
10
µA
Output Leakage Current
VI/O = 0V to VCC
10
µA
Com.
100
µA
ISB1
VCC Standby Current CMOS
CE = VCC - 0.3V to VCC
Ind.
300
µA
ISB2
VCC Standby Current TTL
CE = 2.0V to VCC
3
mA
VCC Active Current
f = 5 MHz; IOUT = 0 mA
50
mA
0.8
V
ICC
(1)
Min
VIL
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 2.1 mA
VOH1
Output High Voltage
IOH = -400 µA
2.4
V
Output High Voltage CMOS
IOH = -100 µA; VCC = 4.5V
4.2
V
VOH2
Note:
2.0
V
0.45
V
1. In the erase mode, ICC is 90 mA.
5
AC Read Characteristics
AT49F1024-45
AT49F1024-55
AT49F1024-70
AT49F1024-90
AT49F1025-45
AT49F1025-55
AT49F1025-70
AT49F1025-90
Min
Min
Min
Min
Symbol
Parameter
Max
Max
tACC
Address to Output Delay
45
55
tCE(1)
CE to Output Delay
45
tOE(2)
OE to Output Delay
0
30
tDF(3)(4)
CE or OE to Output Float
0
25
tOH
Output Hold from OE, CE or Address, whichever
occurred first
0
0
Max
Units
70
90
ns
55
70
90
ns
30
35
0
40
ns
25
0
25
ns
25
0
0
Max
0
0
ns
AC Read Waveforms(1)(2)(3)(4)
Notes:
1.
CE may be delayed up to tACC - tCE after the address transition without impact on tACC.
2.
OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change
without impact on tACC.
3.
tDF is specified from OE or CE whichever occurs first (CL = 5 pF).
4.
This parameter is characterized and is not 100% tested.
Input Test Waveforms and
Measurement Level
Output Test Load
45/55/70 ns
90/120 ns
5.0V
5.0V
1.8K
1.8K
OUTPUT
PIN
1.3K
tR, tF < 5 ns
30 pF
OUTPUT
PIN
1.3K
100 pF
Pin Capacitance
f = 1 MHz, T = 25°C(1)
Typ
Max
Units
Conditions
CIN
4
6
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
6
1. This parameter is characterized and is not 100% tested.
AT49F1024/1025
AT49F1024/1025
AC Word Load Characteristics
Symbol
Parameter
Min
Max
Units
tAS, tOES
Address, OE Set-up Time
0
ns
tAH
Address Hold Time
50
ns
tCS
Chip Select Set-up Time
0
ns
tCH
Chip Select Hold Time
0
ns
tWP
Write Pulse Width (WE or CE)
90
ns
tDS
Data Set-up Time
50
ns
tDH, tOEH
Data, OE Hold Time
0
ns
tWPH
Write Pulse Width High
90
ns
AC Word Load Waveforms
WE Controlled
OE
tOES
tOEH
ADDRESS
CE
WE
tAS
tAH
tCH
tCS
tWPH
tWP
tDH
tDS
DATA
IN
CE Controlled
OE
tOES
tOEH
ADDRESS
tAS
tAH
tCH
WE
tCS
CE
tWPH
tWP
tDS
DATA
tDH
IN
7
Program Cycle Characteristics
Symbol
Parameter
Min
Typ
Max
Units
tBP
Word Programming Time
10
50
µs
tAS
Address Set-up Time
0
ns
tAH
Address Hold Time
50
ns
tDS
Data Set-up Time
50
ns
tDH
Data Hold Time
0
ns
tWP
Write Pulse Width
90
ns
tWPH
Write Pulse Width High
90
ns
tEC
Erase Cycle Time
10
Program Cycle Waveforms
A0-A15
Main Memory or Chip Erase Cycle Waveforms
OE
CE
t WP
t WPH
WE
t AS
A0-A15
t AH
t DH
5555
5555
5555
2AAA
5555
2AAA
t EC
t DS
DATA
AA
WORD 0
Notes:
8
55
WORD 1
80
WORD 2
AA
55
NOTE 3
WORD 3
WORD 4
WORD 5
1.
OE must be high only when WE and CE are both low.
2.
For chip erase, the address should be 10H. For a main memory erase the data should be 30H.
AT49F1024/1025
seconds
AT49F1024/1025
Data Polling Characteristics(1)
Symbol
Parameter
tDH
Data Hold Time
tOEH
OE Hold Time
Min
Max
OE to Output Delay
tWR
Write Recovery Time
Units
10
ns
10
ns
(2)
tOE
Notes:
Typ
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
Data Polling Waveforms
Toggle Bit Characteristics(1)
Symbol
Parameter
tDH
Data Hold Time
10
ns
tOEH
OE Hold Time
10
ns
tOE
OE to Output Delay(2)
tOEHP
OE High Pulse
tWR
Write Recovery Time
Notes:
Min
Typ
Max
Units
ns
150
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
Toggle Bit Waveforms(1)(2)(3)
Notes:
1.
Toggling either OE or CE or both OE and CE will operate toggle bit. The tOEHP specification must be met by the toggling
input(s).
2.
Beginning and ending state of I/O6 will vary.
3.
Any address location may be used but the address should not vary.
9
Software Product
Identification Entry(1)
Boot Block
Lockout Enable Algorithm(1)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 90
TO
ADDRESS 5555
LOAD DATA 80
TO
ADDRESS 5555
ENTER PRODUCT
IDENTIFICATION
MODE (2)(3)(5)
LOAD DATA AA
TO
ADDRESS 5555
Software Product
Identifcation Exit(1)
LOAD DATA AA
TO
ADDRESS 5555
O
R
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA F0
TO
ANY ADDRESS
LOAD DATA 40
TO
ADDRESS 5555
EXIT PRODUCT
IDENTIFICATION
MODE(4)
PAUSE 1 second(2)
LOAD DATA F0
TO
ADDRESS 5555
Notes:
1. Data Format: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Boot block lockout feature enabled.
EXIT PRODUCT
IDENTIFICATION
MODE(4)
Notes:
1. Data Format: I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. A1 - A15 = VIL.
Manufacture Code is read for A0 = VIL;
Device Code is read for A0 = VIH.
3. The device does not remain in identification mode if powered down.
4. The device returns to standard operation mode.
5. Manufacturer Code: 1FH
Device Code: 87H
10
AT49F1024/1025
AT49F1024/1025
AT49F1024 Ordering Information(1)
ICC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
45
50
0.1
AT49F1024-45VC
40V
Commercial
(0° to 70°C)
55
50
0.1
AT49F1024-55VC
40V
Commercial
(0° to 70°C)
50
0.3
AT49F1024-55VI
40V
Industrial
(-40° to 85°C)
50
0.1
AT49F1024-70VC
40V
Commercial
(0° to 70°C)
50
0.3
AT49F1024-70VI
40V
Industrial
(-40° to 85°C)
50
0.1
AT49F1024-90VC
40V
Commercial
(0° to 70°C)
50
0.3
AT49F1024-90VI
40V
Industrial
(-40° to 85°C)
70
90
Note:
Operation Range
1. The AT49F1024 has as optional boot block feature. The part number shown in the Ordering Information table is for devices
with the boot block in the lower address range (i.e., 0000H to 1FFFH). Users requiring the boot block to be in the higher
address range should contact Atmel.
Package Type
40V
40-Lead, Thin Small Outline Package (VSOP) (10 mm x 14 mm)
11
AT49F1025 Ordering Information(1)
ICC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
45
50
0.1
AT49F1025-45JC
AT49F1025-45VC
44J
40V
Commercial
(0° to 70°C)
55
50
0.1
AT49F1025-55JC
AT49F1025-55VC
44J
40V
Commercial
(0° to 70°C)
50
0.3
AT49F1025-55JI
AT49F1025-55VI
44J
40V
Industrial
(-40° to 85°C)
50
0.1
AT49F1025-70JC
AT49F1025-70VC
44J
40V
Commercial
(0° to 70°C)
50
0.3
AT49F1025-70JI
AT49F1025-70VI
44J
40V
Industrial
(-40° to 85°C)
50
0.1
AT49F1025-90JC
AT49F1025-90VC
44J
40V
Commercial
(0° to 70°C)
50
0.3
AT49F1025-90JI
AT49F1025-90VI
44J
40V
Industrial
(-40° to 85°C)
70
90
Note:
1. The AT49F1025 has as optional boot block feature. The part number shown in the Ordering Information table is for devices
with the boot block in the lower address range (i.e., 0000H to 1FFFH). Users requiring the boot block to be in the higher
address range should contact Atmel.
Package Type
44J
44-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
40V
40-Lead, Thin Small Outline Package (VSOP) (10 mm x 14 mm)
12
Operation Range
AT49F1024/1025
AT49F1024/1025
Packaging Information
44J, 44-Lead, Plastic J-Leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-018 AC
.045(1.14) X 45°
PIN NO. 1
IDENTIFY
.045(1.14) X 30° - 45°
.012(.305)
.008(.203)
.630(16.0)
.590(15.0)
.656(16.7)
SQ
.650(16.5)
.032(.813)
.026(.660)
.695(17.7)
SQ
.685(17.4)
.050(1.27) TYP
.500(12.7) REF SQ
40V, 40-Lead, Plastic Thin Small Outline
Package (VSOP)
Dimensions in Millimeters and (Inches)*
.021(.533)
.013(.330)
.043(1.09)
.020(.508)
.120(3.05)
.090(2.29)
.180(4.57)
.165(4.19)
.022(.559) X 45° MAX (3X)
*Controlling dimension: millimeters
13
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