TDK ATB3225

Wound Chip Baluns
ATB Series
Type:
ATB3225-75011CT (3.22.52.3mm)
ATB3225-75032CT (3.22.52.3mm)
ATB3225-75034CT (3.22.52.3mm)
Issue date:
June 2012
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/6)
Wound Chip Baluns
Conformity to RoHS Directive
ATB Series ATB3225-75011CT
PRODUCT IDENTIFICATION
FEATURES
• Case size of ATB3225 is L3.2 W2.5 H2.3mm.
• This case size is smaller than traditional Balun.
• Frequency band width is 5 to 200MHz.
• Low insertion loss and good balance parameter.
• It is a product conforming to RoHS directive.
ATB
(1)
11 CT
(4) (5)
(1) Series name
(2) Case size
(3) Impedance[at 100MHz]
750: 75
(4) Impedance ratio
11 → 1:1
(5) Type
CT: Center tap
APPLICATIONS
Cable modems
SHAPES AND DIMENSIONS
3.2±0.2
3
3225 - 750
(2)
(3)
4
6
RECOMMENDED SOLDERING CONDITIONS
RECOMMENDED TEMPERATURE PROFILE
FOR LEAD-FREE SOLDER
2.3
6
2
5
3
4
0.18
0.45
0.4
Peak 245˚C max.
0.45
1
–25 to +85°C
–25 to +85°C
0.9
1
Operating
Storage(After mount)
(0.9)
5
1.8
2
2.3±0.1
2.5±0.2
TEMPERATURE RANGES
Mark for direction
Natural
cooling
230˚C
180˚C
150˚C
60 to 120s
10 to 30s
Time (s)
Dimensions in mm
REFLOW PROFILE FOR SOLDER HEAT RESISTANCE
RECOMMENDED PC BORARD PATTERN
1.0
Peak 260˚C max.
2.0
Natural
cooling
0.55
230˚C
2.25
180˚C
0.3
150˚C
60 to 120s
4.0
Dimensions in mm
40s max.
Time (s)
CIRCUIT DIAGRAM
Unbalance port
1
Balance port
3
5
2
6
GND
or
Vcc
4
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
001-02 / 20120628 / e751_woundbalun_atb3225
(2/6)
ELECTRICAL CHARACTERISTICS
Part No.
ATB3225-75011CT
DC
resistance
( )max.
0.7
Impedance
ratio
1:1 (75 :75 )
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Amplitude unbalance
(dB)max.
Phase unbalance
(deg.)
10
0.5
180±5
0
0
50
100
150
Frequency (MHz)
0
50
100
150
Frequency (MHz)
5
10
15
20
25
200
0
50
100
150
Frequency (MHz)
200
PHASE UNBALANCE
Phase unbalance (dB)
Amplitude unbalance (dB)
Return loss
(dB)min.
RETURN LOSS
AMPLITUDE UNBALANCE
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Insertion loss
(dB)
typ.
max.
0.8
1.5
Return loss (dB)
Insertion loss (dB)
FREQUENCY CHARACTERISTICS
INSERTION LOSS
Frequency
range
(MHz)
5 to 200
200
190
188
186
184
182
180
178
176
174
172
170
0
50
100
150
Frequency (MHz)
200
• All specifications are subject to change without notice.
001-02 / 20120628 / e751_woundbalun_atb3225
(3/6)
Wound Chip Baluns
Conformity to RoHS Directive
ATB Series ATB3225-75032CT
PRODUCT IDENTIFICATION
FEATURES
• Case size of ATB3225 is L3.2 W2.5 H2.3mm.
• This case size is smaller than traditional Balun.
• Frequency band width is 5 to 100MHz.
• Low insertion loss and good balance parameter.
• It is a product conforming to RoHS directive.
ATB
(1)
32 CT
(4) (5)
(1) Series name
(2) Case size
(3) Impedance[at 100MHz]
750: 75
(4) Impedance ratio
32 → 3:2
(5) Type
CT: Center tap
APPLICATIONS
Cable modems
SHAPES AND DIMENSIONS
3.2±0.2
3
3225 - 750
(2)
(3)
4
6
RECOMMENDED SOLDERING CONDITIONS
RECOMMENDED TEMPERATURE PROFILE
FOR LEAD-FREE SOLDER
2.3
6
2
5
3
4
0.18
0.45
0.4
Peak 245˚C max.
0.45
1
–25 to +85°C
–25 to +85°C
0.9
1
Operating
Storage(After mount)
(0.9)
5
1.8
2
2.3±0.1
2.5±0.2
TEMPERATURE RANGES
Mark for direction
Natural
cooling
230˚C
180˚C
150˚C
60 to 120s
10 to 30s
Time (s)
Dimensions in mm
REFLOW PROFILE FOR SOLDER HEAT RESISTANCE
RECOMMENDED PC BORARD PATTERN
1.0
Peak 260˚C max.
2.0
Natural
cooling
0.55
230˚C
2.25
180˚C
0.3
150˚C
60 to 120s
4.0
Dimensions in mm
40s max.
Time (s)
CIRCUIT DIAGRAM
Unbalance port
1
Balance port
3
5
2
6
GND
or
Vcc
4
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
001-02 / 20120628 / e751_woundbalun_atb3225
(4/6)
ELECTRICAL CHARACTERISTICS
Part No.
ATB3225-75032CT
DC
resistance
( )max.
0.7
Impedance
ratio
3:2 (75 :50 )
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Amplitude unbalance
(dB)max.
Phase unbalance
(deg.)
5
1
180±10
RETURN LOSS
5
10
15
20
25
0
30
10 20 30 40 50 60 70 80 90 100
Frequency (MHz)
0
10 20 30 40 50 60 70 80 90 100
Frequency (MHz)
0
10 20 30 40 50 60 70 80 90 100
Frequency (MHz)
PHASE UNBALANCE
Phase unbalance (dB)
Amplitude unbalance (dB)
Return loss
(dB)min.
0
AMPLITUDE UNBALANCE
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Insertion loss
(dB)
typ.
max.
0.8
2
Return loss (dB)
Insertion loss (dB)
FREQUENCY CHARACTERISTICS
INSERTION LOSS
Frequency
range
(MHz)
5 to 100
190
188
186
184
182
180
178
176
174
172
170
0
10 20 30 40 50 60 70 80 90 100
Frequency (MHz)
• All specifications are subject to change without notice.
001-02 / 20120628 / e751_woundbalun_atb3225
(5/6)
Wound Chip Baluns
Conformity to RoHS Directive
ATB Series ATB3225-75034CT
PRODUCT IDENTIFICATION
FEATURES
• Case size of ATB3225 is L3.2 W2.5 H2.3mm.
• This case size is smaller than traditional Balun.
• Frequency band width is 1 to 100MHz.
• Low insertion loss and good balance parameter.
• It is a product conforming to RoHS directive.
ATB
(1)
34 CT
(4) (5)
(1) Series name
(2) Case size
(3) Impedance[at 100MHz]
750: 75
(4) Impedance ratio
34 → 3:4
(5) Type
CT: Center tap
APPLICATIONS
Cable modems
SHAPES AND DIMENSIONS
3.2±0.2
3
3225 - 750
(2)
(3)
4
6
RECOMMENDED SOLDERING CONDITIONS
RECOMMENDED TEMPERATURE PROFILE
FOR LEAD-FREE SOLDER
2.3
6
2
5
3
4
0.18
0.45
0.4
Peak 245˚C max.
0.45
1
–25 to +85°C
–25 to +85°C
0.9
1
Operating
Storage(After mount)
(0.9)
5
1.8
2
2.3±0.1
2.5±0.2
TEMPERATURE RANGES
Mark for direction
Natural
cooling
230˚C
180˚C
150˚C
60 to 120s
10 to 30s
Time (s)
Dimensions in mm
REFLOW PROFILE FOR SOLDER HEAT RESISTANCE
RECOMMENDED PC BORARD PATTERN
1.0
Peak 260˚C max.
2.0
Natural
cooling
0.55
230˚C
2.25
180˚C
0.3
150˚C
60 to 120s
4.0
Dimensions in mm
40s max.
Time (s)
CIRCUIT DIAGRAM
Unbalance port
1
Balance port
3
5
2
6
GND
or
Vcc
4
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
001-02 / 20120628 / e751_woundbalun_atb3225
(6/6)
ELECTRICAL CHARACTERISTICS
Part No.
ATB3225-75034CT
DC
resistance
( )max.
0.7
Impedance
ratio
3:4 (75 :100 )
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Amplitude unbalance
(dB)max.
Phase unbalance
(deg.)
5
1
180±10
RETURN LOSS
5
10
15
20
25
0
30
10 20 30 40 50 60 70 80 90 100
Frequency (MHz)
0
10 20 30 40 50 60 70 80 90 100
Frequency (MHz)
0
10 20 30 40 50 60 70 80 90 100
Frequency (MHz)
PHASE UNBALANCE
Phase unbalance (dB)
Amplitude unbalance (dB)
Return loss
(dB)min.
0
AMPLITUDE UNBALANCE
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Insertion loss
(dB)
typ.
max.
0.5
2
Return loss (dB)
Insertion loss (dB)
FREQUENCY CHARACTERISTICS
INSERTION LOSS
Frequency
range
(MHz)
1 to 100
185
184
183
182
181
180
179
178
177
176
175
0
10 20 30 40 50 60 70 80 90 100
Frequency (MHz)
• All specifications are subject to change without notice.
001-02 / 20120628 / e751_woundbalun_atb3225