ATS ATS-51230D-C2-R0 Ultra high performance bga cooling Datasheet

Ultra High Performance BGA Cooling
Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-51230D-C2-R0
Features & Benefits
»
maxiFLOW™ design features a low profile, spread fin
array that maximizes surface area for more effective
convection (air) cooling
»
maxiGRIP™ attachment applies steady, even pressure to
the component and does not require holes in the PCB
»
Meets Telcordia GR-63-Core Office Vibration; ETSI 300
019 Transportation Vibration; and MIL-STD-810 Shock and
Unpackaged Drop Testing standards
»
Comes preassembled with high performance, phase
changing, thermal interface material
»
Designed for low profile components from 1.5 to 2.99mm
D
C
B
Thermal Performance
A
*Image above is for illustration purposes only.
Air Velocity
Thermal Resistance
FT/MIN
M/S
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
200
1.0
11
7.5
300
1.5
8.9
400
2.0
7.7
500
2.5
6.9
600
3.0
6.3
700
3.5
5.8
800
4.0
5.4
Product Details
DIMENSION A
DIMENSION B
DIMENSION C
DIMENSION D
INTERFACE MATERIAL
FINISH
23 mm
23 mm
9.5 mm
37.5 mm
Saint-gobain C1100F
BLACK- ANODIZED
Notes:
1)
2)
3)
4)
5)
6)
Dimension C = heat sink height from bottom of the base to the top of the fin field.
ATS-51230D-C1-R0 is a subsitute item available utilizing an equivalent phase change
material (Chomerics T766).
Thermal performance data are provided for reference only. Actual performance may vary
by application.
ATS reserves the right to update or change its products without notice to improve the
design or performance.
Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT230
Contact ATS to learn about custom options available.
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV1_0908
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