ETC AX1117M-FIX 1.2a low dropout positive voltage regulator Datasheet

Page No. : 1/7
AX1117 Series
AX1117 Series Pin Assignment
3-Lead Plastic SOT-89
Package Code: M
Pin 1: ADJ/GND
Pin 2: VOUT
Pin 3: VIN
1.2A Low Dropout Positive Voltage Regulator
1
Features
2
3
Tab
• Low Dropout Voltage 1.2V at 1.2A
• Adjustable or Fixed Voltage (1.8V, 2.5V, 3.3V, 5V)
• Over Current Protection
• Thermal Overload Protection
• Maximum Line Regulation 0.45%
• Maximum Load Regulation 0.4%
• Adjust Pin Current Less Than 90 uA
3-Lead Plastic SOT-223
Package Code: SJ
Pin 1: ADJ/GND
Pin 2 & Tab: VOUT
Pin 3: VIN
3
1 2
Tab
Applications
1
• SCSI-2 Active Termination
• High Efficiency Linear Regulators
• 5V to 3.3V Voltage Converter
• Battery Charger
• Battery Management Circuits For Notebook And Palmtop PCs
• Core Voltage Supply: FPGA, PLD, DSP, CPU
2
3-Lead Plastic TO-252
Package Code: J
Pin 1: ADJ/GND
Pin 2 & Tab: VOUT
Pin 3: VIN
3
Tab
3-Lead Plastic TO-220AB
Package Code: E
Pin 1: ADJ/GND
Pin 2 & Tab: VOUT
Pin 3: VIN
1
General Description
2
3
The AX1117 Series are available in fixed and adjustable output voltage versions. Over current and thermal overload protection
are integrated onto the chip. Output current will decrease while it reaches the preset current or temperature limit. The dropout
voltage is specified at 1.2V Maximum at full rated output current. AX1117 Series provide excellent regulation over variations due
to changes in line, load and temperature. AX1117 Series are three terminal regulators and available in popular packages.
Device Selection Guide
Device
Output Voltage
AX1117M-Adj
1.3V to 4V
AX1117M-Fix
1.8V, 2.5V, 3.3V, 5V
AX1117SJ-Adj
1.3V to 4V
AX1117SJ-Fix
1.8V, 2.5V, 3.3V, 5V
Package
SOT-89
SOT-223
Device
Output Voltage
AX1117J-Adj
1.3V to 4V
AX1117J-Fix
1.8V, 2.5V, 3.3V, 5V
AX1117E-Adj
1.3V to 4V
AX1117E-Fix
1.8V, 2.5V, 3.3V, 5V
Package
TO-252
TO-220AB
Absolute Maximum Ratings
Parameter
Input Voltage
Power Dissipation
Symbol
Maximum
Units
VIN
20
V
PD
Internally Limited *
W
Operating Junction Temperature Range
TOPR
0 To +125
°C
Storage Temperature Range
TSTG
-65 To +150
°C
Lead Temperature (Soldering) 5 Sec
TLEAD
260
°C
2
KV/Min
Electrostatic Discharge Sensitivity
*: SOT-223: 0.9W(Max.), SOT-89: 0.6W(Max.), TO-252: 0.9W(Max.), TO-220: 2.1W(Max.)
AVANTICS - AX1117 Series
Specification No.: 050309-FE0005
Page No. : 2/7
Electrical Characteristics (C =10uF, C
i
O
Parameter
=100uF, unless otherwise noted.)
Test Conditions
Min.
Typ.
Max.
Units
Output Voltage
AX1117-1.8
IO=0mA, VIN=3.3V
1.782
1.8
1.818
V
AX1117-2.5
IO =0mA, VIN =4V
2.475
2.5
2.525
V
AX1117-3.3
IO =0mA, VIN =4.8V
3.27
3.3
3.33
V
AX1117-5
IO =0mA, VIN =6.5V
4.95
5
5.05
V
IO =10mA, VIN -VO=3V
1.238
1.25
1.262
V
AX1117-1.8
IO=0mA, VIN=3.3~10V
-
1
6
mV
AX1117-2.5
IO =0mA, VIN =4~10V
-
1
7
mV
AX1117-3.3
IO =0mA, VIN =4.8~10V
-
2
7
mV
AX1117-5
IO =0mA, VIN =6.5~10V
-
3
10
mV
AX1117-Adj
IO =10mA, VIN -VO=1.5~10V
-
0.1
0.4
%
IO=0~800mA, VIN=3.3V, TJ=25oC
-
-
0.4
%
IO=0~1200mA, VIN=3.3V, NOTE1
-
-
1
%
IO=0~800mA, VIN=4V, TJ=25 C
-
-
0.4
%
IO=0~1200mA, VIN=4V, NOTE1
-
-
1
%
IO=0~800mA, VIN=4.8V, TJ=25 C
-
-
0.4
%
IO=0~1200mA, VIN=4.8V, NOTE1
-
-
1
%
IO=0~800mA, VIN=6.5V, TJ=25 C
-
-
0.4
%
IO=0~1200mA, VIN=6.5V, NOTE1
-
-
1
%
IO=0~800mA, VIN=2.75V, TJ=25 C
-
-
0.4
%
IO=0~1200mA, VIN=2.75V, NOTE1
-
-
1
%
IO=100mA, TJ=25oC
-
1.05
1.15
V
Reference Voltage
AX1117-Adj
Line Regulation
Load Regulation
AX1117-1.8
o
AX1117-2.5
o
AX1117-3.3
o
AX1117-5
o
AX1117-Adj
Dropout Voltage
NOTE3
o
All AX1117 Series
IO=500mA, TJ=25 C
-
1.1
1.15
V
IO=1200mA, TJ=25oC
-
1.2
1.3
V
IO=1200mA
-
1.2
1.55
V
2000
2600
3200
mA
VIN -VO=13.75V NOTE1 & NOTE2
-
1.7
5
mA
VIN -VO=5V NOTE1
-
6
10
mA
Current Limit
All AX1117 Series
VIN -VO=1.5V
Minimum Load Current
AX1117-ADJ NOTE1 & NOTE2
Quiescent Current
AX1117-Fix NOTE1
Adjust Pin Current
NOTE1 & NOTE2
Adjust Pin Current Change
IO =10mA, VIN -VO=1.5V
NOTE1 & NOTE2
-
50
120
uA
IO =10mA, VIN -VO=1.4V~10V
-
0.5
5
uA
f=120MHz, VIN -VO=3V+1.5Vpp, CO=22uF
-
62
-
dB
TJ=0~25oC
-
0.5
-
%
-
2
-
%
Ripple Rejection
All AX1117 Series
Temperature Drift
AX1117-Fix
AX1117-Adj
o
TJ=0~25 C
Note: 1. Specification applies over the full operating junction temperature range, 0~125oC
2. AX1117-Adj require a minimum load current for ±3% regulation
3. Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
AVANTICS - AX1117 Series
Specification No.: 050309-FE0005
Page No. : 3/7
Characteristics Curve
Ripple Rejection & Frequency
Current Range
70
50
Output Voltage(V)
Ripple Rejection (dB)...
60
40
30
20
Vin -Vout=3VDC
o
Tj=25 C
Vin-Vout(ic)=3VDC+1Vrm s
Iout=100mA
o
Tj=25 C
10
0
10
100
1000
Frequency (Hz)
10000
0.0
100000
0.5
1.0
1.5
2.0
Ouput Current(A)
Output Voltage Change & Temperature
2.5
3.0
Start Time
0.6
8
7
0.4
Vinput
6
∆V/Vout (%)
0.2
5
0
4
0mA, Voutput
3
-0.2
2
1A, Voutput
-0.4
1
Iout=10mA
-0.6
0
50
100
o
150
0
200
100
200
Temperature ( C)
Dropout Voltage & Output Current
400
500
Load Transient Response
0.6
1.20
0.5
1.0
0.4
0.5
0.3
0
Output Voltage Deviation (V)...
1.22
1.18
Dropout Voltage (V)
300
Time (uS)
1.16
1.14
1.12
1.10
0.2
0.1
0.0
Vin-Vout=1.5V
o
Tj=25 C
-0.1
1.08
Load Current (A)
0
-0.2
1.06
0
200
400
AVANTICS - AX1117 Series
600
800
Iout (mA)
1000
1200
1400
0
5
10
15
20
25
30
35
40
45
50
Time (uS)
Specification No.: 050309-FE0005
Page No. : 4/7
Applications Description
• Output Voltage Adjustment
Like most regulators, AX1117 series regulate the output by
comparing the output voltage to an internally generated reference
voltage. On the adjustable version, the VREF is available externally as
1.25V between VOUT and ADJ. The voltage ratio formed by R1 and R2
should be set to conduct 10mA (minimum output load). The output
voltage is given by the following equation: VOUT =VREF (1+R2/R1) + IADJ
R2
On fixed versions of AX1117 series, the voltage divider is provided
internally.
In
V IN
Out
V OUT
ADJ
V REF
R1
I ADJ
10uA
R2
• Thermal Protection
AX1117 series have thermal protection which limits junction
temperature to 150°C. However, device functionality is only
guaranteed to a maximum junction temperature of +125°C.
The power dissipation and junction temperature for AX1117 in all
packages given by
PD=(VIN - VOUT) IOUT, TJUNCTION=TAMBIENT+(PDxθJA), Note: TJUNCTION must
not exceed 125°C
VOUT =VREF (1+R2/R1) + IADJ R2
• Current Limit Protection
AX1117 series are protected against overload conditions. Current protection is triggered at typically 1.5A.
• Stability And Load Regulation
AX1117 series require a capacitor from VOUT to GND to provide
compensation feedback to the internal gain stage. This is to ensure
stability at the output terminal. Typically, a 10uF tantalum or 50uF
aluminum electrolytic is sufficient.
Note : It is important that the ESR for this capacitor does not exceed
0.5Ω.
The output capacitor does not have a theoretical upper limit and
increasing its value will increase stability. COUT = 100 uF or more is
typical for high current regulator design.
AX1117 series load regulation are limited by the resistance of the
wire connecting it to the load(RP). For the adjustable version, the best
load regulation is accomplished when the top of the resistor divider(R1)
is connected directly to the output pin of the AX1117 series. When so
connected, RP is not multiplied by the divider ratio. For fixed output
versions, the top of R1 is internally connected to the output and
ground pin can be connected to low side of the load as a negative
side sense if, so desired.
RP
Parasitic
Line Resistance
In
V IN
Out
Adj
R1
Connect
R1 to Case
RL
R2
Connect
R2 to Load
• Thermal Consideration
The AX1117 series contain thermal limiting circuitry designed to protect itself for over-temperature conditions. Even for normal load
conditions, maximum junction temperature ratings must not be exceeded. As mention in thermal protection section, we need to
consider all sources of thermal resistance between junction and ambient. It contains junction-to-case, case-to-heat-sink interface and
heat sink resistance itself. An additional heat sink is applied externally sometimes. It can increase the maximum power dissipation. For
example, the equivalent junction temperature of 300mA output current is 115°C without external heat sink. Under the same junction
temperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink is recommended.
Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. The bonding
wires are appending paths. The former is the lowest resistance path. Proper mounting is required to ensure the best possible thermal
flow this area of the package to the heat sink. Thermal compound at the case-to-heat-sink interface is strongly recommended. The
case of all devices in this series is electrically connected to the output. Therefore, if the case of the device must be electrically isolated,
a thermally conductive spacer can be used, as long its thermal resistance is considered.
• Protection Diode
(The figure is shown as Regulator with Reverse Diode Protection in advanced applications)
In general operation, AX1117 series don’t need any protection diodes. From the cross-section structure of AX1117 sries, the output
pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reverse diode between them. It can
handle microsecond surge currents of 5A to 10A. Even with large output capacitance, it is very difficult to get those values of surge
currents in normal operation. Only with high value output capacitors, such as 1000uF. And with the input pin instantaneously shorted to
ground. can damage occur. A crowbar circuit at the input of the AX1117 series can generate those kinds of currents, and a diode from
output to input is recommended. Normal power supply cycling or even plugging and unplugging in the system will not generate
currents large enough to do any damage.
AVANTICS - AX1117 Series
Specification No.: 050309-FE0005
Page No. : 5/7
SOT-223 Dimension
Marking:
A
Pb Free Mark
Pb-Free: " . " (Note) A X
Normal: None
1 1 1 7 -
S J
Product Series
(ADJ,1.8,2.5,3.3,5)
B
C
1
2
Control Code
Date Code
3
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
D
E
F
H
G
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
a1
I
DIM
A
B
C
D
E
F
G
H
I
a1
a2
Min.
2.90
6.70
3.30
0.60
*2.30
6.30
1.40
0.25
0.02
*13o
0o
Max.
3.10
7.30
3.70
0.80
6.70
1.80
0.35
0.10
10 o
*: Typical, Unit: mm
a2
3-Lead SOT-223 Plastic
Surface Mounted Package
AVANTICS Package Code: SJ
SOT-89 Dimension
C
Marking:
H
Date Code
Control Code
Pb Free Mark
AX1 1 1 7
D
B
1
2
F
Product Series
3
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
I
E
Pb-Free: " . " (Note)
Normal: None
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
G
A
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
Min.
4.40
4.05
1.50
2.40
0.36
*1.50
*3.00
1.40
0.35
Max.
4.60
4.25
1.70
2.60
0.51
1.60
0.41
*: Typical, Unit: mm
3-Lead SOT-89 Plastic
Surface Mounted Package
AVANTICS Package Code: M
AVANTICS - AX1117 Series
Specification No.: 050309-FE0005
Page No. : 6/7
TO-252 Dimension
A
C
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
AX
Normal: None
D
B
J
Product Series
1 1 1 7
G
F
L
Date Code
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
H
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
2
K
Control Code
Note: Green label is used for pb-free packing
3
E
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
I
DIM
A
B
C
D
E
F
G
H
I
J
K
L
Min.
0.45
1.70
0.90
0.45
6.40
5.40
2.20
0.70
5.20
1.40
Max.
0.55
1.90
1.50
0.60
6.80
5.80
2.80
*2.30
0.90
0.90
5.50
1.60
*: Typical, Unit: mm
1
J
3-Lead TO-252 Plastic
Surface Mount Package
AVANTICS Package Code: J
TO-220AB Dimension
Marking:
A
F
B
Pb Free Mark
E
Pb-Free: " . " (Note)
Normal: None
AX
C
D
1117
Date Code
E
Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
Control Code
H
M
I
K
3
G
N
2
1
Tab
O
P
J
L
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2(Tab).VOUT 3.VIN
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
3.00
0.75
2.54
1.14
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
AVANTICS Package Code: E
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
• AVANTICS reserves the right to make changes to its products without notice.
• AVANTICS semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• AVANTICS assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office:
• AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China
Tel: 86-021-58955599 Fax: 86-021-58558038
AVANTICS - AX1117 Series
Specification No.: 050309-FE0005
Page No. : 7/7
Soldering Methods for AVANTICS’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
tS
Preheat
25
Ramp-down
t 25oC to Peak
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
<3oC/sec
<3oC/sec
- Temperature Min (Tsmin)
100oC
150oC
- Temperature Max (Tsmax)
150oC
200oC
60~120 sec
60~180 sec
<3oC/sec
<3oC/sec
183oC
217oC
Average ramp-up rate (TL to TP)
Preheat
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
60~150 sec
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
o
o
60~150 sec
240 C +0/-5 C
260oC +0/-5oC
10~30 sec
20~40 sec
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
Peak temperature
Dipping time
245 C ±5 C
5sec ±1sec
260oC +0/-5oC
5sec ±1sec
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
AVANTICS - AX1117 Series
o
o
Specification No.: 050309-FE0005
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