ETC AX34063AP Dc-to-dc converter integrate circuit device Datasheet

Page No. : 1/7
AX34063AP / AX34063AS
DC-to-DC Converter Integrate Circuit Devices
8-Lead Plastic DIP-8
Package Code: P
Description
The AX34063A Series is a monolithic control circuit containing the primary functions required
for DC-to-DC converters. These devices consist of an internal temperature compensated
reference, comparator, controlled duty cycle oscillator with an active current limit circuit,
driver and high current output switch. This series was specifically by Avantics
Microelectronics Corp.
•
8-Lead Plastic SO-8
Package Code: S
Features
• 3V to 40V Input Voltage Operation
• Internal 1.6A Peak Current Switch
• Internal ±1.8% Reference
• Low Quiescent Current at 1.6mA
• Frequency Operation from 100Hz~100KHz
• Output Voltage Adjustable
• Active Current Limiting
• Step-Up, Step-Down or Inverting Switching Regulators
Pin Connections
8
1
7
2
6
3
5
4
Pin1: Switch Collector (SWC)
Pin5: Comparator Inverting Input (FB)
Pin2: Switch Emitter (SWE)
Pin6: Voltage Supply (Vcc)
Pin3: Timing Capacitor (TC)
Pin7: Ipk Sense (Ipk)
Pin4: Ground (GND)
Pin8: Voltage Driver Collector (DRC)
Absolute Maxium Rating
Parameter
Power Supply Voltage
Comparator Input Voltage Range
Symbol
Value
Unit
VCC
40
V
Vir
-0.3~+40
V
Switch Collector Voltage
VC(SW)
40
V
Switch Emitter Voltage
VSWE
40
V
Switch Emitter to Collector Voltage
VCE
40
V
VC(DR)
40
V
Switch Current
ISW
1.5
A
Power Dissipation at TJ=20oC
PD
Operating Ambient Temperature Range
Topr
Driver Collector Voltage
Storage Temperature Range
Operating Junction Temperature
Thermal Resistance Junction-ambient
AVANTICS - AX34063AP, AX34063AS
DIP-8
1.25
SO-8
0.625
W
0~+70
o
C
-65~+150
o
C
Topj
120
o
C
θJA
125
Tstg
o
C/W
Specification No.: 050308-FE0007
Page No. : 2/7
Electrical Characteristics (V
=5V,TA=0~70°C, unless otherwise specified)
CC
Parameter
Symbol
Test Condition
Min.
Typ.
Max.
Unit
10
25
40
uA
140
190
240
uA
KHz
Oscillator
Charging Current
VCC=5~40V, Ta=25oC
Ichg
Discharge Current
o
Idischg
Frequency
VCC=5~40V, Ta=25 C
o
fOSC
Discharge to Charge Current Ratio
Current Limit Sense Voltage
VPIN5=0, CT=1nF, Ta=25 C
28
33
40
Idischg/Ichg
VPIN7=VCC, Ta=25oC
5.2
6
7.5
VIPK
Idischg=Ichg, Ta=25oC
250
300
350
mV
-
1
1.3
V
V
Output Switch
Saturation Voltage,
Darlington Connection
Saturation Voltage
DC Current Gain
VCE(sat) 1
ISW=1A, VC(SW)=VC(DR)
VCE(sat) 2
ISW=1A, IC(DR)=50mA
hFE
Collector Off-State Current
ICC(off)
ISW=1A, VCE=5V
VCE=40V, Ta=25oC
-
0.4
0.7
35
120
-
-
10
100
uA
Comparator
Threshold Voltage
VFB
Threshold Voltage Line Regulation
Input Bias Current
1.23
1.25
1.27
V
VCC=5~40V
-
1.5
6
mV
IIB
VIN=0V
-
40
400
nA
ICC
VCC=5~40V, VPIN7=VCC, VPin5>VFB,
CT=0.001uF, Pin7=GND, Remaining
pins open
-
1.6
3
mA
∆VFB
Total Device
Supply Current
Block Diagram
DRI
Pin8: Driver Collector
SC
Pin1: 1.6A Switch Collector
Q
Q2
Q1
S
R
80Ω
SE
Pin2: Darlington Switch Emitter
IPK
CT
Oscillator
TC
Pin3: Oscilletor Timing Capacitor
Comparator
1.25V
Reference Voltage
GND
Pin4: Power GND
AVANTICS - AX34063AP, AX34063AS
IPK
Pin7: Highside Current Sense
Input, VCC-VIPK=300mV
VCC
Pin6: Power Supply Input
+
FB
Pin5: Feedback Comparator
Inverting Input
Specification No.: 050308-FE0007
Page No. : 3/7
Application Information
Design Formula Table
Calculation
Step-Down
Step-Up
Voltage-Inverting
ton/toff
(Vout+VF)/(Vin(min) -Vsat-Vout)
(Vout+VF-Vin(min))/(Vin(min)-Vsat)
(|Vout|+VF)/(Vin(max)-Vsat)
(ton+toff) max
1/Fmin
1/Fmin
1/Fmin
-5
-5
CT
4*10 ton
4*10 ton
4*10-5ton
IC(sw)
2*Iout(max)
2*Iout(max)(ton+toff/toff)
2*Iout(max)(ton+toff/toff)
RS
0.3/IC(sw)
0.3/IC(sw)
0.3/IC(sw)
L(min)
(Vin(min)-Vsat/Ipk(sw))*ton(max)
(Vin(min)-Vsat/Ipk(sw))*ton(max)
(Vin(min)-Vsat/Ipk(sw))*ton(max)
CO
(Ipk(sw)*(ton+toff))/(8*Vripple(P-P))
Iout*ton/Vripple(P-P)
Iout*ton/Vripple(P-P)
Vsat: Saturation voltage of the output switch.
VF: Forward voltage drop of the ringback rectifier.
The following power supply characteristics must be chosen:
Vin: Nominal input voltage.
Vout: Desired output voltage. |Vout|=1.25*(1+RB/RA)
Iout: Desired output current
Fmin: Minimum desired output switching frequency at the selected values for Vin and Iout.
Vripple(P-P): Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due to the capacitor
equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it will directly effect the line
and load regulation.
AVANTICS - AX34063AP, AX34063AS
Specification No.: 050308-FE0007
Page No. : 4/7
Application Information (Continuos)
Fig.2 Step-Up Converter
D1
L1
Vout
28V / 200mA
200uH
R1
150Ω
H1N5819
AX34063A
RSC
0.22
Vin
C1
100uF
8
1
7
2
6
3
5
4
Cout
220uF
CT
680pF
RB
RA
2.2kΩ
47kΩ
Line Regulation: 100mV (Vin=8V~16V, @IO=200mA)
Load Regulation: 5mV (Vin=12V, @IO=80mA~200mA)
Fig.3 Step-Up Converter With External NPN Switch
L1
R1
RSC
Vin
C1
Vout
D1
AX34063A
8
1
7
2
6
3
5
4
Q1
CT
Cout
R2
RB
RA
Fig.4 Step-Down Converter
L1
200uH
AX34063A
RSC
0.25
Vin
C1
100uF
8
1
7
2
6
3
5
4
D1
H1N5819
Vout
5V / 500mA
Cout
470uF
CT
470pF
RB
3.6kΩ
RA
1.2kΩ
Line Regulation: 40mV (Vin=10V~20V, @IO=500mA)
Load Regulation: 5mV (Vin=15V, @IO=10mA~500mA)
Short Circuit Current: 1.3A (Vin=15V, @RL=0.1Ω
AVANTICS - AX34063AP, AX34063AS
Specification No.: 050308-FE0007
Page No. : 5/7
Fig.5 Step-Down Converter With External PNP Saturation Switch
AX34063A
RSC
Vin
8
1
7
2
6
3
5
4
R2
R1
Q1
L1
CT
Vout
D1
Cout
RB
C1
RA
Fig.6 Voltage Inverting Converter
D1
Vout
-12V / 100mA
AX34063A
RSC
0.25
Vin
4.5V-6V
8
1
7
2
6
3
5
4
C1
100uF
H1N5819
L1
100uH
Cout
470uF
CT
680pF
RA
953Ω
RB
8.2kΩ
Line Regulation: 20mV (Vin=4.5V~6V, @IO=100mA)
Load Regulation: 100mV (Vin=5V, @IO=10mA~100mA)
Fig.7 Voltage Inverting Converter With External PNP Saturation Switch
AX34063A
RSC
Vin
8
1
7
2
6
3
5
4
RA
R1
R2
Q1
L1
D1
CT
Vout
C1
RB
AVANTICS - AX34063AP, AX34063AS
Cout
Specification No.: 050308-FE0007
Page No. : 6/7
DIP-8 Dimension
Marking:
8
6
7
5
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
A
1
2
3
4
AX
3 4 0 6 3 A
P
Control Code
Date Code
B
J
Note: Green label is used for pb-free packing
Pin Style: 1.SWC 2.SWE 3.TC 4.GND
5.FB 6.VCC 7.Ipk 8.DRC
F
E
C
α1 K
G
Min.
6.29
9.22
3.25
3.17
0.38
2.28
7.49
8.56
0.229
94o
Max.
6.40
9.32
*1.52
*1.27
*0.99
3.35
3.55
0.53
2.79
7.74
*3.00
8.81
0.381
97o
*: Typical, Unit: mm
M
H
D
I
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
α1
L
8-Lead DIP-8
Plastic Package
AVANTICS Package Code: P
SO-8 Dimension
A
Marking:
G
Pb Free Mark
8
7
B
6
2
3
I
5
C
Pin1 Index
Pb-Free: " . " (Note) A X
Normal: None
Pin 1 Index
Date Code
H
Pin Style: 1.SWC 2.SWE 3.TC 4.GND
5.FB 6.VCC 7.Ipk 8.DRC
K
E
Part A
Part A
Control Code
Note: Green label is used for pb-free packing
4
J
D
S
3 4 0 6 3 A
M
F
L
N
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
Min.
4.85
3.85
5.80
1.22
0.37
3.74
1.45
4.80
0.05
0.30
0.19
0.37
0.23
0.08
0.00
Max.
5.10
3.95
6.20
1.32
0.47
3.88
1.65
5.10
0.20
0.70
0.25
0.52
0.28
0.13
0.15
*: Typical, Unit: mm
O
8-Lead SO-8 Plastic
Surface Mounted Package
AVANTICS Package Code: S
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
• AVANTICS reserves the right to make changes to its products without notice.
• AVANTICS semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• AVANTICS assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office:
• AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China
Tel: 86-021-58955599 Fax: 86-021-58558038
AVANTICS - AX34063AP, AX34063AS
Specification No.: 050308-FE0007
Page No. : 7/7
Soldering Methods for AVANTICS’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
tS
Preheat
25
Ramp-down
t 25oC to Peak
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
<3 C/sec
<3oC/sec
- Temperature Min (Tsmin)
100oC
150oC
- Temperature Max (Tsmax)
150oC
200oC
60~120 sec
60~180 sec
<3oC/sec
<3oC/sec
183oC
217oC
Average ramp-up rate (TL to TP)
o
Preheat
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
60~150 sec
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
o
o
60~150 sec
240 C +0/-5 C
260oC +0/-5oC
10~30 sec
20~40 sec
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
Peak temperature
Dipping time
245 C ±5 C
5sec ±1sec
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
AVANTICS - AX34063AP, AX34063AS
o
o
o
o
260 C +0/-5 C
5sec ±1sec
Specification No.: 050308-FE0007
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