Panasonic AXK7L50223G Narrow pitch connectors (0.4mm pitch) easy to design product circuit Datasheet

AXK7L, 8L
For board-to-FPC
F4 Series
Narrow pitch connectors
(0.4mm pitch)
FEATURES
m
1m
4.
m
0m
5.
Socket
Header
RoHS compliant
1. 0.9 mm mated height low profile
two-piece type connectors
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
3. Improved mating strength between
the socket and header
The simple locking structures provided
for the soldering terminals and the
contact points improve the mating
strength and provide tactile feedback
when locked.
Socket
4. Easy to design product circuits
An insulating wall prevents contact
between the PC board enabling patterns
and the soldering terminals.
<Socket>
<Header>
Pattern wiring under the connector is possible.
Header
APPLICATIONS
Locking structure of the soldering terminals
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
ORDERING INFORMATION
AXK
G
AXK: Narrow Pitch Connector Series
Series name;
7L: F4 (0.4 mm pitch) Socket
8L: F4 (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket>
2: For mated height 0.9 mm
<Header>
1: For mated height 0.9 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
3: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
4: Ni plating on base, Au plating on surface
Other specifications
<Header>
Note 1
B: Soldering terminals with fork type terminal
Packing
G: 3,000 pieces embossed tape and plastic reel × 2
Notes: 1. “B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting,
and a construction that makes it difficult when mounting for excess solder to interfere with the socket.
Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern.
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB28E 201211-T
AXK7L, 8L
PRODUCT TYPES
Part number
Mated height
Number of pins
0.9 mm
10
16
20
22
24
26
30
34
40
44
50
54
60
70
80
Packing
Socket
Header
Inner carton
(1 reel)
AXK7L10223G
AXK7L16223G
AXK7L20223G
AXK7L22223G
AXK7L24223G
AXK7L26223G
AXK7L30223G
AXK7L34223G
AXK7L40223G
AXK7L44223G
AXK7L50223G
AXK7L54223G
AXK7L60223G
AXK7L70223G
AXK7L80223G
AXK8L10124BG
AXK8L16124BG
AXK8L20124BG
AXK8L22124BG
AXK8L24124BG
AXK8L26124BG
AXK8L30124BG
AXK8L34124BG
AXK8L40124BG
AXK8L44124BG
AXK8L50124BG
AXK8L54124BG
AXK8L60124BG
AXK8L70124BG
AXK8L80124BG
3,000 pieces
Outer carton
6,000 pieces
(2 reels)
Notes: 1. Regarding ordering units;
During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please contact us.
Samples: Available. Please contact us.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. Please contact us regarding different number of pins.
4. “B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting, and a
construction that makes it difficult when mounting for excess solder to interfere with the socket.
Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Breakdown voltage
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (Initial)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Soldering terminal holding force
(Header soldering terminal)
Ambient temperature
Max. 1.70N/pin contacts × pin contacts (initial)
Min. 0.098N/pin contacts × pin contacts
Soldering heat resistance
Storage temperature
Conditions
—
—
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
Measuring the maximum force.
As the soldering terminal is axially pull out.
No freezing at low temperatures
Min. 0.49N/pin contacts
Min. 0.49N
–55°C to +85°C
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec, 350°C within 3 sec.
–55°C to +85°C (Product only)
–40°C to +50°C (Emboss packing)
Infrared reflow soldering
Soldering iron
No freezing at low temperatures
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
H2S resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
Insertion and removal life
50 times
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
ACCTB28E 201211-T
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
20 pin contacts; Socket: 0.03g Header: 0.01g
Panasonic Corporation
Automation Controls Business Unit
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Temperature 40±2°C,
humidity 90 to 95% R.H.
Temperature 35±2°C,
saltwater concentration 5±1%
Temperature 40±2°C,
gas concentration 3±1 ppm, humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200
times/hours
—
industrial.panasonic.com/ac/e/
AXK7L, 8L
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact/Post
Copper alloy
DIMENSIONS (unit: mm)
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Soldering terminals: Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal)
Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
• Socket (Mated height 0.9 mm)
CAD Data
Dimension table (mm)
Terminal coplanarity
0.08
(Contact and
soldering terminals)
0.87
F
0.40±0.05
C±0.15
4.40
Suction
face
0.80
5.00
F
0.60
Soldering
terminals
This surface
C0.15
Soldering
terminals
5.00
A
B±0.1
0.40±0.05
0.15±0.03
0.10±0.03
0.50
(5.00)
F-F cross section
Number of pins/
Dimensions
10
4.4
1.6
3.0
16
20
22
24
26
30
34
40
44
50
54
60
70
80
5.6
6.4
6.8
7.2
7.6
8.4
9.2
10.4
11.2
12.4
13.2
14.4
16.4
18.4
2.8
3.6
4.0
4.4
4.8
5.6
6.4
7.6
8.4
9.6
10.4
11.6
13.6
15.6
4.2
5.0
5.4
5.8
6.2
7.0
7.8
9.0
9.8
11.0
11.8
13.0
15.0
17.0
A
B
C
A
B
C
General tolerance: ±0.2
• Header (Mated height: 0.9 mm)
CAD Data
Dimension table (mm)
Terminal coplanarity
0.80±0.05
1.20±0.05
Suction face 2.30
0.63
0.08
0.65
(Contact and
soldering terminals)
5
.1
R0
0.08±0.03
R0
.1
5
Soldering
terminals
4.10
3.36
A
B
C±0.1
0.40±0.05
0.15±0.03
0.27
Soldering terminals
General tolerance: ±0.2
Number of pins/
Dimensions
10
4.0
3.74
1.6
16
20
22
24
26
30
34
40
44
50
54
60
70
80
5.2
6.0
6.4
6.8
7.2
8.0
8.8
10.0
10.8
12.0
12.8
14.0
16.0
18.0
4.94
5.74
6.14
6.54
6.94
7.74
8.54
9.74
10.54
11.74
12.54
13.74
15.74
17.74
2.8
3.6
4.0
4.4
4.8
5.6
6.4
7.6
8.4
9.6
10.4
11.6
13.6
15.6
Socket
Header
0.90±0.15
• Socket and header are mated
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB28E 201211-T
AXK7L, 8L
EMBOSSED TAPE DIMENSIONS (unit: mm) (Common for respective contact type, socket and header)
Tape dimensions (Conforming to JIS C 0806-1990. However,
some tapes have mounting hole pitches that do not comply with
the standard.)
Tape I
Tape II
A±0.3
Plastic reel dimensions (Conforming to EIAJ ET–7200B)
A±0.3
C
Top cover tape
4
2
Pull out direction
8.0
1.75
380 dia.
C
4
2
Pull out direction
Taping reel
D±1
B
1.75
Embossed carrier tape
Embossed mounting-hole
8.0
1.5+0.1
0 dia.
1.5+0.1
0 dia.
TABLE OF DIMENSIONS
Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for
socket and header:
0.9mm
Max. 24
26 to 70
80
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
3000
3000
3000
Connector orientation with respect to direction of progress of embossed tape
Type
Common for F4
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
ACCTB28E 201211-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
Notes on Using Narrow-pitch Connectors (Common)
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow-pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Spacer
Connector
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow-pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
Panasonic Corporation
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
Automation Controls Business Unit
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
industrial.panasonic.com/ac/e/
ACCTB48E 201204-T
Notes on Using Narrow-pitch Connectors (Common)
Regarding soldering
Terminal
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature 260°C
230°C
180°C
150°C
220°C
200°C
Preheating
25 sec.
70 sec.
Time
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
• Narrow-pitch connector (P8)
Apply the solder
wire here
Temperature
245°C max.
Peak temperature
200°C
Paste
solder
4) Consult us when using a screenprinting thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Peak temperature
60 to 120 sec.
155 to 165°C
PC board
foot pattern
ACCTB48E 201204-T
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow-pitch connectors
(except P8 type)
Terminal
Small angle as
possible up to
45 degrees
Preheating
60 to 120 sec.
Within 30 sec.
PC board
Time
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder creeping. Solder
and flux characteristics should be taken
into consideration when setting the reflow
soldering conditions.
Panasonic Corporation
So
ld
iro erin
n g
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
Automation Controls Business Unit
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB48E 201204-T
Notes on Using Narrow-pitch Connectors (Common)
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
ACCTB48E 201204-T
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/