Panasonic AXN312238J Narrow pitch connectors (0.8mm pitch) automatic mounting (excluding 11.5mm version) Datasheet

AXN(1/3/4)
For board-to-board
Narrow pitch connectors
(0.8mm pitch)
3. Ideal for portable devices, the
bellows-type contacts provide a
strong resistance against falling,
impacts, and forced insertions and
removals.
m
m
83
6.
m
m
88
5.
Socket
Header
Bellows-type contacts
Bellows-type contacts resist mating stress
and offer high contact reliability.
RoHS compliant
P8 Series
6. Automatic mounting (excluding 11.5
mm version)
1) Automatic mounting machine is
available with an exclusive mounting
nozzle.
Using the following types of suction
nozzles make the connectors compatible
with automatic mounting without the need
for suction tape.
Ex.: Stacking height of 3.0 mm
The bellows type contacts
are fabricated by bending
thin sheet metal. They
offer a reliable contact
since a rounded corner,
instead of a sharp edge,
is used for tuning fork
type contact.
Round corner makes contact.
FEATURES
1. The product lineup includes low
profile heights of 3.0 mm, 3.5 mm,
4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm,
6.0 mm, 7.0 mm, 8.0 mm, 11.5 mm, and
13.0 mm 14.0 mm.
2. For the 11.5 mm version, both
socket and header have the same
shape.
Simplifies management of stock and
delivery.
A
4. Porosity treatment for improved
resistance against corrosion.
5. Simple lock mechanism
Lock mechanism ensures proper contact
and provides resistance against
vibrations and shocks.
3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm,
5.0 mm, 5.5 mm, 6.0 mm, 7.0 mm,
8.0 mm, 13.0 mm, and 14.0 mm.
Simple locking
mechanism
Suction tape and covers are also
available for compatibility with other types
of mounting machines.
Suction tape (socket)
2) Positioning bosses (without bosses
also available)
B
b
A
a
a
b
B
The simple lock mechanism is not
featured on the 11.5 mm version.
However, proper contact and resistance
against vibrations and shocks are both
ensured by the long mating length.
APPLICATIONS
Digital devices, such as desktop PC,
laptop and digital video cameras
When mated
ACCTB25E 201303-T
Bosses for positioning on the PC board
(those without bosses are also available).
Suitable for both manual and automatic mounting.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AXN(1/3/4)
ORDERING INFORMATION
1. P8 (11.5 mm)
AXN
1
0
1
1
5
1: Narrow Pitch Connector P8 (0.8 mm pitch)
Socket and header are common
Number of pins (2 digits)
Suction cover
Nil: Without suction tape
C: With suction tape
Terminal shape/Mated direction/Mated height
0: For SMD vertical mating, mated height 11.5 mm
Functions
1: With soldering terminals, with positioning bosses
Surface treatment (Contact portion / Terminal portion)
1: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface
Other specifications
5: Part control number
Packing
P: Embossed tape and paper reel × 2
S: Tube package
2. P8 (3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 7.0 mm, 8.0 mm, 13.0 mm, 14.0 mm)
AXN
3: Narrow Pitch Connector P8 (0.8 mm pitch) Socket
4: Narrow Pitch Connector P8 (0.8 mm pitch) Header
Number of pins (2 digits)
Suction tape and cover
Nil: Socket; without suction tape, Header; without suction cover
C: Socket; with suction tape, Header; with suction cover
Mated height
<Socket>
0: For mated height 3.0 mm, 4.0 mm and 5.0 mm
1: For mated height 6.0 mm, 7.0 mm, 8.0 mm, 13.0 mm and 14.0 mm
2: For mated height 3.5 mm, 4.5 mm and 5.5 mm
<Header>
0: For mated height 13.0 mm
1: For mated height 14.0 mm
3: For mated height 3.0 mm, 3.5 mm and 6.0 mm
4: For mated height 4.0 mm, 4.5 mm and 7.0 mm
5: For mated height 5.0 mm, 5.5 mm and 8.0 mm
Functions
3: With positioning bosses
(Except for mated height 13.0 mm header, embossed tape packing)
4: Without positioning bosses
(Mated height 13.0 mm header, embossed tape packing and mated height 14.0 mm header only)
Surface treatment (Contact portion / Terminal portion)
<Socket>
0: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface (Applies to mated heights of 6.0 to 14.0 mm.)
8: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface (Applies to mated heights of 3.0 to 5.5 mm.)
<Header>
0: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface
Packing
J: 1,500 pieces embossed tape and paper reel × 2
P: 1,000 pieces embossed tape and paper reel × 2
S: Tube package
Notes: 1. The tape width for 100-pin embossed tape packaging is non-JIS standard. Please inquire.
2. The depth of the embossed tape for headers with 13 mm and 14 mm mated heights is non-JIS standard. Please test with your mounter before using.
3. Models possible for “J” packaging are as follows:
Socket mated heights: 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, 5.0 mm, and 5.5 mm
Headers: Mated heights 3.0 mm, 3.5 mm, and 6.0 mm
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB25E 201303-T
AXN(1/3/4)
PRODUCT TYPES
Stick package
Mated
height
3.0 mm
3.5 mm
4.0 mm
4.5 mm
5.0 mm
5.5 mm
6.0 mm
7.0 mm
No. of
pins
16
20
24
26
30
40
50
60
80
100
16
24
26
30
60
16
20
26
30
40
50
60
80
100
16
26
30
60
12
14
20
24
26
30
40
50
60
80
100
12
24
26
30
60
20
24
26
30
40
50
60
64
80
100
20
22
26
30
40
50
60
80
100
ACCTB25E 201303-T
Part No.
Socket
Header
AXN316038S
AXN320038S
AXN324038S
AXN326038S
AXN330038S
AXN340038S
AXN350038S
AXN360038S
AXN380038S
AXN300038S
AXN316238S
AXN324238S
AXN326238S
AXN330238S
AXN360238S
AXN316038S
AXN320038S
AXN326038S
AXN330038S
AXN340038S
AXN350038S
AXN360038S
AXN380038S
AXN300038S
AXN316238S
AXN326238S
AXN330238S
AXN360238S
AXN312038S
AXN314038S
AXN320038S
AXN324038S
AXN326038S
AXN330038S
AXN340038S
AXN350038S
AXN360038S
AXN380038S
AXN300038S
AXN312238S
AXN324238S
AXN326238S
AXN330238S
AXN360238S
AXN320130S
AXN324130S
AXN326130S
AXN330130S
AXN340130S
AXN350130S
AXN360130S
AXN364130S
AXN380130S
AXN300130S
AXN320130S
AXN322130S
AXN326130S
AXN330130S
AXN340130S
AXN350130S
AXN360130S
AXN380130S
AXN300130S
AXN416330S
AXN420330S
AXN424330S
AXN426330S
AXN430330S
AXN440330S
AXN450330S
AXN460330S
AXN480330S
AXN400330S
AXN416330S
AXN424330S
AXN426330S
AXN430330S
AXN460330S
AXN416430S
AXN420430S
AXN426430S
AXN430430S
AXN440430S
AXN450430S
AXN460430S
AXN480430S
AXN400430S
AXN416430S
AXN426430S
AXN430430S
AXN460430S
AXN412530S
AXN414530S
AXN420530S
AXN424530S
AXN426530S
AXN430530S
AXN440530S
AXN450530S
AXN460530S
AXN480530S
AXN400530S
AXN412530S
AXN424530S
AXN426530S
AXN430530S
AXN460530S
AXN420330S
AXN424330S
AXN426330S
AXN430330S
AXN440330S
AXN450330S
AXN460330S
AXN464330S
AXN480330S
AXN400330S
AXN420430S
AXN422430S
AXN426430S
AXN430430S
AXN440430S
AXN450430S
AXN460430S
AXN480430S
AXN400430S
Packing quantity
Outer
Stick
carton
50 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
25 pcs.
300 pcs.
20 pcs.
300 pcs.
15 pcs.
300 pcs.
12 pcs.
300 pcs.
12 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
15 pcs.
300 pcs.
50 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
25 pcs.
300 pcs.
20 pcs.
300 pcs.
15 pcs.
300 pcs.
12 pcs.
300 pcs.
12 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
15 pcs.
300 pcs.
50 pcs.
300 pcs.
50 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
25 pcs.
300 pcs.
20 pcs.
300 pcs.
15 pcs.
300 pcs.
12 pcs.
300 pcs.
12 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
15 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
25 pcs.
300 pcs.
20 pcs.
300 pcs.
15 pcs.
300 pcs.
15 pcs.
300 pcs.
12 pcs.
300 pcs.
12 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
25 pcs.
300 pcs.
20 pcs.
300 pcs.
15 pcs.
300 pcs.
12 pcs.
300 pcs.
12 pcs.
300 pcs.
Panasonic Corporation
Embossed tape package
Packing quantity
Inner carton
Header
Outer carton
(1 reel)
AXN416330*
AXN420330*
AXN424330*
AXN426330*
AXN430330*
AXN440330*
AXN450330*
AXN460330*
AXN480330*
—
AXN416330*
AXN424330*
AXN426330*
AXN430330*
AXN460330*
AXN416430P
AXN420430P
AXN426430P
AXN430430P
AXN440430P
AXN450430P
AXN460430P
AXN480430P
—
AXN416430P
AXN426430P
AXN430430P
AXN460430P
AXN412530P
AXN414530P
Note 1)
Note 1)
“Asterisk” mark on “Asterisk” mark on
AXN420530P
end of part No.;
end of part No.;
AXN424530P
J: 1,500 pieces
J: 3,000 pieces
AXN426530P
(recommendation) (recommendation)
P: 1,000 pieces
P: 2,000 pieces
AXN430530P
Part No.
Socket
AXN316038*
AXN320038*
AXN324038*
AXN326038*
AXN330038*
AXN340038*
AXN350038*
AXN360038*
AXN380038*
—
AXN316238*
AXN324238*
AXN326238*
AXN330238*
AXN360238*
AXN316038*
AXN320038*
AXN326038*
AXN330038*
AXN340038*
AXN350038*
AXN360038*
AXN380038*
—
AXN316238*
AXN326238*
AXN330238*
AXN360238*
AXN312038*
AXN314038*
AXN320038*
AXN324038*
AXN326038*
AXN330038*
AXN340038*
AXN350038*
AXN360038*
AXN380038*
—
AXN312238*
AXN324238*
AXN326238*
AXN330238*
AXN360238*
AXN320130P
AXN324130P
AXN326130P
AXN330130P
AXN340130P
AXN350130P
AXN360130P
AXN364130P
AXN380130P
—
AXN320130P
AXN322130P
AXN326130P
AXN330130P
AXN340130P
AXN350130P
AXN360130P
AXN380130P
—
AXN440530P
AXN450530P
AXN460530P
AXN480530P
—
AXN412530P
AXN424530P
AXN426530P
AXN430530P
AXN460530P
AXN420330*
AXN424330*
AXN426330*
AXN430330*
AXN440330*
AXN450330*
AXN460330*
AXN464330*
AXN480330*
—
AXN420430P
AXN422430P
AXN426430P
AXN430430P
AXN440430P
AXN450430P
AXN460430P
AXN480430P
—
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AXN(1/3/4)
Stick package
Mated
height
No. of
pins
Part No.
20
22
24
26
30
34
40
50
60
80
100
30
40
50
80
100
20
30
40
50
60
80
AXN320130S
AXN420530S
AXN322130S
AXN422530S
AXN324130S
AXN424530S
AXN326130S
AXN426530S
AXN330130S
AXN430530S
AXN334130S
AXN434530S
AXN340130S
AXN440530S
AXN350130S
AXN450530S
AXN360130S
AXN460530S
AXN380130S
AXN480530S
AXN300130S
AXN400530S
AXN1300115S (Socket, Header)
AXN1400115S (Socket, Header)
AXN1500115S (Socket, Header)
AXN1800115S (Socket, Header)
AXN1000115S (Socket, Header)
AXN320130S
AXN420030S
AXN330130S
AXN430030S
AXN340130S
AXN440030S
AXN350130S
AXN450030S
AXN360130S
AXN460030S
AXN380130S
AXN480030S
Packing quantity
Outer
Stick
carton
50 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
30 pcs.
300 pcs.
25 pcs.
300 pcs.
20 pcs.
300 pcs.
15 pcs.
300 pcs.
12 pcs.
300 pcs.
12 pcs.
300 pcs.
30 pcs.
300 pcs.
25 pcs.
300 pcs.
20 pcs.
300 pcs.
12 pcs.
300 pcs.
12 pcs.
300 pcs.
50 pcs.
300 pcs.
30 pcs.
300 pcs.
25 pcs.
300 pcs.
20 pcs.
300 pcs.
15 pcs.
300 pcs.
12 pcs.
300 pcs.
20
AXN320130S
50 pcs.
Socket
8.0 mm
11.5 mm
13.0 mm
14.0 mm
Header
AXN420130S
300 pcs.
Embossed tape package
Packing quantity
Inner carton
Socket
Header
Outer carton
(1 reel)
AXN320130P
AXN420530P
AXN322130P
AXN422530P
AXN324130P
AXN424530P
AXN326130P
AXN426530P
AXN330130P
AXN430530P
1,000 pcs.
2,000 pcs.
AXN334130P
AXN434530P
AXN340130P
AXN440530P
AXN350130P
AXN450530P
AXN360130P
AXN460530P
AXN380130P
AXN480530P
—
—
—
—
AXN1300115P (Socket, Header)
350 pcs.
700 pcs.
AXN1400115P (Socket, Header)
350 pcs.
700 pcs.
AXN1500115P (Socket, Header)
350 pcs.
700 pcs.
AXN1800115P (Socket, Header)
250 pcs.
500 pcs.
—
—
—
AXN320130P
AXN420040P Note 6)
AXN330130P
AXN430040P Note 6)
AXN340130P
AXN440040P Note 6) Socket: 1,000 pcs. Socket: 2,000 pcs.
Header: 1,000 pcs.
AXN350130P
AXN450040P Note 6) Header: 500 pcs.
Part No.
AXN360130P
AXN380130P
AXN460040P Note 6)
AXN480040P Note 6)
AXN320130P
AXN420130P
Socket: 1,000 pcs.
Header: 400 pcs.
Socket: 2,000 pcs.
Header: 800 pcs.
Notes: 1. Please add following suffix at * marked positions.
J: Inner carton (1 reel) 1,500 pcs. (Outer carton: 3,000 pcs.)
P: Inner carton (1 reel) 1,000 pcs. (Outer carton: 2,000 pcs.)
In order to reduce the amount of packaging materials used to help protect the global environment, it is recommended that each packaging box contains 1,500 units
with the “J” product number suffix.
As for the part No. P is suffixed, only 1,000 pcs. reel is available.
2. Regarding ordering units: During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please contact our sales office.
Samples: Small lot orders are possible. Change the suffix “J” to the suffix “P.”
3. Connectors with suction tape and suction cover are also available. Socket: Suction tape, Header: Suction cover. For this type of connector, insert the letter “C”
between the 6th and 7th column of the ordering number.
Example: For a 20 pin contact socket with 3mm mated height (embossed tape package): AXN320C038P
4. The standard type comes with positioning bosses. Connectors without positioning bosses are available for on-demand production (3,000 pcs./lot or more). Please
inquire.
5. Since the embossed tape width of 100 pin contact connectors packaged with embossed tape exceeds the JIS standard, please consult us.
6. Headers that have 13.0 mm mated height and embossed tape packaging do not come with positioning bosses.
The depth of the embossed tape for headers with 13.0 mm and 14.0 mm mated heights is non-JIS compliant. Please test with your mounter before using.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB25E 201303-T
AXN(1/3/4)
SPECIFICATIONS
1. Characteristics
Item
Electrical
characteristics
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Specifications
3mm, 3.5mm, 4mm, 4.5mm,
11.5mm type
5.0mm, 5.5mm, 6.0mm, 7.0mm,
8.0mm, 13.0mm, 14.0mm type
0.5A
60V AC/DC
250V AC for 1 minute
Min. 1,000MΩ
Contact resistance
Composite insertion force
Composite removal force
Mechanical
characteristics
Contact holding force
Ambient temperature
Soldering heat resistance
Storage temperature
Conditions
Detection current: 1mA
Using 500V DC megger
Based on the contact resistance
measurement method specified by
JIS C 5402.
Max. 60mΩ
Max. 50mΩ
Max. 43.1N (30 pin contacts)
Min. 6.37N (30 pin contacts)
Max. 0.785N × no. of pins (initial)
Min. 0.127N × no. of pins
40 pin contacts or less:
Min. 1.96N
50 pin contacts or more:
Min. 0.981N
–55°C to +85°C
Measuring the maximum force.
As the contact is axially pull out.
Min. 1.96N
No freezing at low temperatures
Max. peak temperature of 245°C (on the surface of the PC board
around the connector terminals)
300°C within 5 seconds
–55°C to +85°C (product only)
–40°C to +50°C (standard packing)
5 cycles,
Thermal shock resistance
(header and socket mated)
insulation resistance
min. 100MΩ,
contact resistance
max. 60mΩ
5 cycles,
insulation resistance
min. 100MΩ,
contact resistance
max. 50mΩ
Environmental
characteristics
120 hours, insulation resistance
min. 100MΩ,
contact resistance
max. 60mΩ
24 hours, insulation resistance
min. 100MΩ,
contact resistance
max. 60mΩ
240 hours, insulation resistance
min. 100MΩ,
contact resistance
max. 50mΩ
48 hours, insulation resistance
min. 100MΩ,
contact resistance
max. 50mΩ
H2S resistance
(header and socket mated)
48 hours, contact resistance
max. 60mΩ
96 hours, contact resistance
max. 50mΩ
SO2 resistance
(header and socket mated)
48 hours, contact resistance
max. 60mΩ
96 hours, contact resistance
max. 50mΩ
50 times
100 times
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Insertion and removal life
Infrared reflow soldering
Soldering iron
No freezing at low temperatures.
No dew condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwarter concentration 5±1%
Bath temperature 40±2°C,
gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Bath temperature 40±2°C,
gas concentration 10±3 ppm,
humidity 90 to 95% R.H.
Repeated insertion and removal speed of
max. 200 times/hours
Mated height 3mm 30 pin contacts; Socket: 0.26g Header: 0.26g
50 pin contacts; Socket: 0.40g Header: 0.44g
Unit weight
2. Material and surface treatment
Part name
3.0mm, 3.5mm, 4.0mm, 4.5mm, 5.0mm, 5.5mm,
6.0mm, 7.0mm, 8.0mm, 13.0mm, 14.0mm type
Material
Surface treatment
Bracket
Heat-resistant resin
(UL94V-0)
—
Contact
Copper alloy
Molded portion
ACCTB25E 201303-T
—
—
Contact portion:
Ni plating on base, Au plating on surface
Terminal portion:
Ni plating on base, Au plating on surface
(Except for thick of terminal)
Panasonic Corporation
11.5mm type
Material
LCP resin
(UL94V-0)
Copper alloy
Copper alloy
Automation Controls Business Division
Surface treatment
—
Cu plating on base, Sn plating on surface
Contact portion:
Ni plating on base, Au plating on surface
Terminal portion:
Ni plating on base, Au plating on surface
(Except for thick of terminal)
industrial.panasonic.com/ac/e/
AXN(1/3/4)
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
• Mated height 3.0mm, 4.0mm, 4.5mm, 5.0mm, 5.5mm, 6.0mm, 7.0mm, 8.0mm, 13.0mm, 14.0mm type
1) Socket
CAD Data
6.30
4.00
7.10
7.90
9.50
10.30
11.10
11.90
13.50
15.10
17.50
21.50
25.50
27.10
33.50
41.50
7.10
7.90
9.50
10.30
11.10
11.90
13.50
15.10
17.50
21.50
25.50
27.10
33.50
41.50
4.80
5.60
7.20
8.00
8.80
9.60
11.20
12.80
15.20
19.20
23.20
24.80
31.20
39.20
E
Mated height
3.0mm, 4.0mm, 5.0mm common
3.5mm, 4.5mm, 5.5mm common
6.0mm, 7.0mm, 8.0mm, 13.0mm, 14.0mm common
F
0.8±0.05 dia.
C±0.1
Recommended PC board pattern
(TOP VIEW)
General tolerance: ±0.3
0.10
E±0.05
0.80±0.05
0.80±0.05
0.50±0.05
0.15
Min.6.38
6.30
4.80
5.60
7.20
8.00
8.80
9.60
11.20
12.80
15.20
19.20
23.20
24.80
31.20
39.20
D
3.32±0.1
4.00
8.20
9.00
10.60
11.40
12.20
13.00
14.60
16.20
18.60
23.40
27.40
29.00
35.40
43.40
C
1.95±0.1
7.40
14
16
20
22
24
26
30
34
40
50
60
64
80
100
B
0.40+0.2
–0.1
No. of
pins
12
5.88
4.93
0
1.
C
G
Dimension table (mm)
A
1.95±0.1
0.98
Terminal coplanarity
F
A
B±0.15
0.80±0.1
0.80±0.1
0.35±0.1
D±0.05
2-0.9+0.1
0 dia. hole
G
2.20
2.70
5.20
2) Header
CAD Data
G
1.95±0.1
Terminal coplanarity
F
A
B±0.15
0.80±0.1
0.80±0.1
0.35±0.1
0.8±0.05 dia.
C±0.1
0.10
General tolerance: ±0.3
D±0.05
E±0.05
0.80±0.05
0.80±0.05
0.50±0.05
Note)
0.15
Note: The 13 mm mated height (20 to 80 pin contacts) terminal
flatness is 0.1 mm.
Mated height
3.0mm, 3.5mm, 6.0mm common
4.0mm, 4.5mm, 7.0mm common
5.0mm, 5.5mm, 8.0mm common
13.0mm
14.0mm
Recommended PC board pattern
(TOP VIEW)
Min.7.33
4.80
5.60
7.20
8.00
8.80
9.60
11.20
12.80
15.20
19.20
23.20
24.80
31.20
39.20
F
4.43±0.1
4.00
7.10
7.90
9.50
10.30
11.10
11.90
13.50
15.10
17.50
21.50
25.50
27.10
33.50
41.50
E
1.95±0.1
6.30
7.10
7.90
9.50
10.30
11.10
11.90
13.50
15.10
17.50
21.50
25.50
27.10
33.50
41.50
D
5.23
6.83
6.30
4.80
5.60
7.20
8.00
8.80
9.60
11.20
12.80
15.20
19.20
23.20
24.80
31.20
39.20
C
0.40+0.2
–0.1
4.00
9.25
10.05
11.65
12.45
13.25
14.05
15.65
17.25
19.65
25.85
29.85
31.45
37.85
45.85
B
10
8.45
14
16
20
22
24
26
30
34
40
50
60
64
80
100
A
1.
C
No. of
pins
12
5.95
Dimension table (mm)
2-0.9+0.1
0 dia. hole
G
2.72
3.72
4.72
10.14
11.14
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ACCTB25E 201303-T
AXN(1/3/4)
3) Socket and header are mated
6.83
B +0.3
–0
Dimension table (mm)
No. of pins
12
14
16
20
22
24
26
30
34
40
50
60
64
80
100
A
A
8.45
9.25
10.05
11.65
12.45
13.25
14.05
15.65
17.25
19.65
25.85
29.85
31.45
37.85
45.85
Mated height
3.0mm
3.5mm
4.0mm
4.5mm
5.0mm
5.5mm
6.0mm
7.0mm
8.0mm
13.0mm
14.0mm
B
3.00
3.50
4.00
4.50
5.00
5.50
6.00
7.00
8.00
13.00
14.00
Note: Common for all mated
heights.
• Mated height 11.5mm type (Socket and Header)
(30 pin contacts, 40 pin contacts, 50 pin contacts)
CAD Data
D
E±0.15
0.80±0.1
0.80±0.1
X 0.35±0.1
8.35
6.20
8.60
9.00
0.70
Y
Recommended PC board pattern
(TOP VIEW)
1.1±0.1 dia. 0.8±0.1 dia.
C±0.15
0.50±0.05
0.80±0.05
0.80±0.05
H±0.1
2.00±0.1
2.30±0.1
1.2+0.1
0 dia. hole
General tolerance: ±0.3
X-Y cross section
0.9+0.1
0 dia. hole
9.00±0.1
9.60±0.1
4.20±0.1
F±0.05
G±0.05
5.20±0.1
A
B
Stacking mated diagram
8.35
Dimension table (mm)
11.5
No. of
pins
30
A
B
C
D
E
F
G
H
18.90
15.30
14.00
18.90
11.20
14.00
11.20
19.50
40
50
22.90
26.90
19.30
23.30
18.00
22.00
22.90
26.90
15.20
19.20
18.00
22.00
15.20
19.20
23.50
27.50
ACCTB25E 201303-T
Panasonic Corporation
0.7
1.2
8.6
0.15
Terminal coplanarity
Automation Controls Business Division
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AXN(1/3/4)
D
E±0.15
0.80±0.1
0.80±0.1
0.35±0.1
Y
Recommended PC board pattern
(TOP VIEW)
C±0.15
9.60±0.1
4.20±0.1
F±0.05
G±0.05
0.8±0.1 dia.
0.50±0.05
0.80±0.05
0.9+0.1
0 dia. hole
9.00±0.1
A
B
1.1±0.1 dia.
0.70
9.00
8.35
6.20
X
8.60
CAD Data
0.80±0.05
5.20±0.1
• Mated height 11.5mm type (Socket and Header)
(80 pin contacts, 100 pin contacts)
H±0.1
2.00±0.1
2.30±0.1
+0.1
1.2 0 dia. hole
General tolerance: ±0.3
Note: Center terminal is removed for
80 and 100 pin contact type
X-Y cross section
Stacking mated diagram
8.35
11.5
Dimension table (mm)
No. of
pins
80
39.70
36.10
34.80
39.70
32.00
34.80
32.00
40.30
100
47.70
44.10
42.80
47.70
40.00
42.80
40.00
48.30
A
B
C
D
E
F
G
0.7
1.2
H
8.6
0.15
Terminal coplanarity
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
A±0.3
E+20
A±0.3
C
B
1.75
4
2
D
1.5+0.1
0 dia.
Panasonic Corporation
C
Pull out direction
Pull out direction
• Paper reel dimensions (Conforming to JIS C 0806-1990)
Label
1.75
Top cover tape
4
2
Emboss carrier tape
F
D
1.5+0.1
0 dia.
Automation Controls Business Division
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ACCTB25E 201303-T
AXN(1/3/4)
Dimension table (mm)
(1) Suffix: J (1 reel, 1,500 pieces embossed tape package)
Mated height
Socket: 3.0mm, 3.5mm, 4.0mm,
4.5mm, 5.0mm, 5.5mm
Header: 3.0mm, 3.5mm, 6.0mm
No. of pins
Type of taping
A
B
C
D
E
F
Quantity per reel
12 to 32
34 to 40
50 to 60
80
Tape I
Tape II
Tape II
Tape II
24.00
32.00
44.00
56.00
—
28.40
40.40
52.40
11.50
14.20
20.20
26.20
12.00
12.00
12.00
12.00
24.40
32.40
44.40
56.40
370 dia.
370 dia.
370 dia.
370 dia.
1,500 pcs.
(2) Suffix: P (1 reel, 1,000, 500, 350 and 250 pieces embossed tape package)
Mated height
Socket: 3.0mm, 3.5mm, 4.0mm,
4.5mm, 5.0mm, 5.5mm
Header: 3.0mm, 3.5mm, 4.0mm,
4.5mm, 6.0mm, 7.0mm
Socket: 6.0mm, 7.0mm, 8.0mm,
13.0mm, 14.0mm
Header: 5.0mm, 5.5mm, 8.0mm
11.5mm
Header: 13.0mm
Header: 14.0mm
No. of pins
Type of taping
A
B
C
D
E
F
Quantity per reel
12 to 32
34 to 40
50 to 60
80
Tape I
Tape II
Tape II
Tape II
24.00
32.00
44.00
56.00
—
28.40
40.40
52.40
11.50
14.20
20.20
26.20
12.00
12.00
12.00
12.00
24.40
32.40
44.40
56.40
330 dia.
330 dia.
330 dia.
330 dia.
1,000 pcs.
16 to 32
34 to 40
50 to 60
80
30 to 40
50
80
20
30
40
50
60
80
20
Tape I
Tape II
Tape II
Tape II
Tape II
Tape II
Tape II
Tape I
Tape I
Tape II
Tape II
Tape II
Tape II
Tape I
24.00
32.00
44.00
56.00
32.00
44.00
56.00
24.00
24.00
32.00
44.00
44.00
56.00
24.00
—
28.40
40.40
52.40
28.40
40.40
52.40
—
—
28.40
40.40
40.40
52.40
—
11.50
14.20
20.20
26.20
14.20
20.20
26.20
11.50
11.50
14.20
20.20
20.20
26.20
11.50
12.00
12.00
12.00
12.00
24.00
24.00
24.00
16.00
16.00
16.00
16.00
16.00
16.00
16.00
24.40
32.40
44.40
56.40
32.40
44.40
56.40
24.40
24.40
32.40
44.40
44.40
56.40
24.40
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
370 dia.
1,000 pcs.
350 pcs.
350 pcs.
250 pcs.
500 pcs.
500 pcs.
500 pcs.
500 pcs.
500 pcs.
500 pcs.
400 pcs.
Connector orientation with respect to direction of progress of embossed tape
Type
Direction
of tape progress
Mated height: 3.0mm, 3.5mm, 4.0mm, 4.5mm, 5.0mm, 5.5mm,
6.0mm, 7.0mm, 8.0mm, 13.0mm
Socket
Mated height 11.5mm
Socket and header are common
This corner is oriented on the C side.
Header
This corner is oriented on the C side.
NOTES
Note that types having a mated height of
11.5mm cannot be mated with products
having other mated heights even though
the shape of their socket headers is the
same as the rated shape (position of the
positioning boss and arrangement of
mounting pads) is different.
ACCTB25E 201303-T
Please refer to the latest product
specifications when designing your
product.
Panasonic Corporation
Automation Controls Business Division
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Notes on Using Narrow pitch Connectors
Notes on Using Narrow pitch Connectors
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Spacer
Connector
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
ACCTB48E 201303-T
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
Panasonic Corporation
Automation Controls Business Division
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
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Notes on Using Narrow pitch Connectors
Regarding soldering
Terminal
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature 260°C
230°C
180°C
150°C
4) Consult us when using a screenprinting thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Panasonic Corporation
25 sec.
70 sec.
Time
• Narrow pitch connector (P8)
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Temperature
245°C max.
Apply the solder
wire here
Peak temperature
200°C
Preheating
Terminal
60 to 120 sec.
PC board
foot pattern
220°C
200°C
Preheating
60 to 120 sec.
155 to 165°C
Paste
solder
Peak temperature
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
So
ld
iro erin
n g
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
Small angle as
possible up to
45 degrees
Within 30 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder or flux creeping.
Solder and flux characteristics should be
taken into consideration when setting the
reflow soldering conditions.
Automation Controls Business Division
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
industrial.panasonic.com/ac/e/
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
ACCTB48E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
Notes on Using Narrow pitch Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB48E 201303-T
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