Panasonic AYF312915 Fpc connectors (0.3mm pitch) front lock with fpc tabs easy-to-handle front lock structure Datasheet

AYF31
For FPC
FPC connectors
(0.3mm pitch)
Front lock with FPC tabs
Y3FT Series
FEATURES
1. Low-profile, space-saving design
(pitch: 0.3mm)
The 0.9mm height, 3.0mm depth
contributes to the miniaturization and
thickness reduction of target products.
* The total depth including the lever is 3.2mm.
3. Soldering terminals for higher
mounting strength
4. Easy-to-handle front lock structure
5. Wiring patterns can be placed
underneath the connector.
6. Ni barrier with high resistance to
solder creep
APPLICATIONS
.35
(51
pin
0.9
17
co
nta
cts
Mobile devices, such as cellular
phones, smartphones, digital still
cameras and digital video cameras.
3.0
)
Unit: mm
2. FPC with tabs ensures high
reliability through secure
connectibility
Thanks to a design in which the FPC tab
portion attaches to the protruding resin
part, depth is reduced making the
product more compact. Also makes it
possible to securely position the FPC
during insertion and prevent diagonal
insertion. (Y3F is compatible with FPC
without tabs.)
FPC tabs to prevent diagonal
insertion and ensure reliable holding
Soldering terminals
resistant to twisting
RoHS compliant
ORDERING INFORMATION
AYF 3
1
1
5
31: FPC Connector 0.3 mm pitch
(Front lock, ZIF type with FPC tabs)
Number of pins (2 digits)
Contact direction
1: Bottom contact
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au flash plating (Ni barrier)
ACCTB9E 201204-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
AYF31
PRODUCT TYPES
Height
Number of pins
Part number
0.9 mm
11
13
15
17
23
25
27
29
31
33
35
39
41
45
51
AYF311115
AYF311315
AYF311515
AYF311715
AYF312315
AYF312515
AYF312715
AYF312915
AYF313115
AYF313315
AYF313515
AYF313915
AYF314115
AYF314515
AYF315115
Packing
Inner carton
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit;
For volume production: 1-inner carton (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Insulation resistance
Specifications
0.2A/pin contact
50V AC/DC
Min. 1,000MΩ (initial)
Breakdown voltage
150V AC for 1 min.
Contact resistance
Max. 80mΩ
FPC holding force
Min. 0.23N/pin contacts × pin contacts (initial)
Ambient temperature
–55°C to +85°C
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Storage temperature
Conditions
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(with FPC inserted)
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
Environmental
characteristics
Humidity resistance
(with FPC inserted)
Saltwater spray resistance
(with FPC inserted)
H2S resistance
(with FPC inserted)
Soldering heat resistance
Lifetime
characteristics
Unit weight
Insertion and removal life
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
48 hours,
contact resistance max. 80mΩ
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
30 times
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Reflow soldering
Soldering iron
Repeated insertion and removal: min. 10 sec./time
51 pin contact type: 0.09 g
2. Material and surface treatment
Part name
Molded portion
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Contact
Copper alloy
Soldering terminals portion
Copper alloy
Panasonic Corporation
Automation Controls Business Unit
Surface treatment
—
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Base: Ni plating, Surface: Au plating
industrial.panasonic.com/ac/e/
ACCTB9E 201204-T
AYF31
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
A
0.60±0.10 (Terminal pitch)
°)
(140
(1.50)
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
0.30±0.10 (Terminal pitch)
0.60±0.10 (Terminal pitch)
3.20
Terminal coplanarity 0.20
5.35
2.40
3.00
4.40
13
15
17
23
25
27
29
31
33
35
39
41
45
51
5.95
6.55
7.15
8.95
9.55
10.15
10.75
11.35
11.95
12.55
13.75
14.35
15.55
17.35
3.00
3.60
4.20
6.00
6.60
7.20
7.80
8.40
9.00
9.60
10.80
11.40
12.60
14.40
3.60
4.20
4.80
6.60
7.20
7.80
8.40
9.00
9.60
10.20
11.40
12.00
13.20
15.00
5.00
5.60
6.20
8.00
8.60
9.20
9.80
10.40
11.00
11.60
12.80
13.40
14.60
16.40
3.00
A
B
C
D
(FPC
insertion
depth)
0.53
D±0.20
C±0.20
Number of pins/
dimension
11
0.30
(2.07)
0.1
(Contact and
soldering terminals)
0.90±0.10
1.12 (Suction area)
When the lever is opened
(0.15)
(0.12)
0.30
(0.12)
B±0.20
A
B
C
D
RECOMMENDED FPC DIMENSIONS
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
0.48±0.15
1.70±0.15
1.60±0.15
1.50±0.15
1.05±0.15
0.85±0.15
R
0.
10
.25
0.60±0.02
0.60±0.07
0.10 max.
0.20±0.02
0.20±0.02
0.30+0.04
–0.03 (Contact width)
D±0.03
Number of pins/
dimension
11
4.10
3.60
3.00
2.40
13
15
17
23
25
27
29
31
33
35
39
41
45
51
4.70
5.30
5.90
7.70
8.30
8.90
9.50
10.10
10.70
11.30
12.50
13.10
14.30
16.10
4.20
4.80
5.40
7.20
7.80
8.40
9.00
9.60
10.20
10.80
12.00
12.60
13.80
15.60
3.60
4.20
4.80
6.60
7.20
7.80
8.40
9.00
9.60
10.20
11.40
12.00
13.20
15.00
3.00
3.60
4.20
6.00
6.60
7.20
7.80
8.40
9.00
9.60
10.80
11.40
12.60
14.40
0.20±0.03
3.50 min.
(Reinforcing plate)
20
0.
C0
2.20±0.30
(Exposed part of the conductor)
0.30±0.07
R
0.20 max.
0.30±0.07
0.60±0.02
0.30±0.02
0.80±0.10
1.53±0.10
A±0.1
B±0.05
C±0.03
0.30+0.04
–0.03 (Contact width)
(0.10)
Cutting direction
Cut FPC from the copper foil side
to the reinforcing plate side.
0.60±0.07
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type)
• Specifications for taping
di
0
0. .1
0
50 +
(C±1)
Taping reel
(2.0)
(4.0)
Top cover tape
Embossed carrier tape
380 dia.
(2.0)
(4.0)
1.
0
0. .1
0
50 +
A±0.30
1.
A±0.30
(B)
Embossed mounting-hole
8.0
8.0
Leading direction after packaging
di
a.
Tape II
a.
Tape I
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(1.75)
(B)
(1.75)
28.40
• Dimension table (Unit: mm)
Number of pins
Max. 17
23 to 45
51
ACCTB9E 201204-T
Type of taping
Tape I
Tape I
Tape II
Panasonic Corporation
A
16.0
24.0
32.0
B
7.5
11.5
14.2
Automation Controls Business Unit
C
17.4
25.4
33.4
Quantity per reel
5,000
5,000
5,000
industrial.panasonic.com/ac/e/
AYF31
• Connector orientation with respect to embossed tape feeding direction
Type
Y3FT
Direction
of tape progress
NOTES
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.3 mm or 0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.45±0.03
0.70±0.03
Area of exposed
soldering terminal
0.30±0.03
0.60±0.03
Area of exposed
soldering terminal
3.20±0.03
0.50±0.03
0.60±0.03
0.30±0.03
0.70±0.03
0.60±0.03
0.40
0.10±0.03
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
2. Precautions for insertion/removal of
FPC
To open the lever, hold its center and pull
it up. An uneven load applied to the lever
on one side may deform and break the
lever. Do not apply an excessive load to
the lever in the opening direction,
otherwise, the terminals may be
deformed. Don’t further apply an
excessive load to the fully opened lever;
otherwise, the lever may be deformed.
Fully open the lever to insert an FPC.
Since this product connects at the
bottom, please insert the FPC so that its
electrode plane is facing the board to
which it will be mounted. Do not insert the
FPC in the reverse direction of the
contact section; otherwise, operation
failures or malfunctions may be caused.
(140°)
Recommended metal mask pattern
0.45±0.01
0.70±0.01
2.26±0.01
2.94±0.01
(0.29)
0.60±0.01
0.27±0.01
0.27±0.01
0.60±0.01
(0.39)
0.60±0.01
0.055±0.01
Metal mask thickness: Here, 120µm
(Front terminal portion opening area ratio: 50%)
(Back terminal portion opening area ratio: 51%)
(Soldering terminal portion opening area ratio: 100%)
This product has a structure to position
an inserted FPC using the FPC tabs.
Therefore, insert an FPC at an angle to
the board. If the FPC is inserted in the
direction parallel to the board, the molded
positioning parts block the FPC, leading
to incomplete insertion. An FPC inserted
at an excessive angle to the board may
cause the deformation of metal parts,
FPC insertion failures, and FPC circuit
breakages.
FPC
FPC positioning part
Insert the FPC to the full depth of the
connector without altering the angle.
When closing the lever, carefuly use the
tip of your finger to push the entire lever
or both sides of it. If pressure to the lever
is applied unevenly, IE: only the edge, it
may deform or break the FPC. Make sure
that the lever is closed completely. Not
doing so will cause a faulty connection.
Avoid applying an excessive load to the
top of the lever during or after closing the
lever. Otherwise, the terminals may be
deformed.
Remove the FPC at an angle with the
lever fully opened. If the lever is closed,
or if the FPC is forcedly pulled into a
direction parallel to the board, the molded
part may break.
After an FPC is inserted, carefully handle
it so as not to apply excessive stress to
the base of the FPC.
Please refer to the latest product
specifications when designing your
product.
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB9E 201204-T
Notes on Using FPC Connectors (Common)
PC board design
Design the recommended foot pattern in
order to secure the mechanical strength
in the soldered areas of the terminal.
FPC and equipment design
Design the FPC based with
recommended dimensions to ensure the
required connector performance.
When back lock type is used, secure
enough space for closing the lever and
for open-close operation of the lever.
Due to the FPC size, weight, or the
reaction force of the routed FPC.
Carefully check the equipment design
and take required measures to prevent
the FPC from being removed due to a fall,
vibration, or other impact.
Connector mounting
Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
Soldering
1) Manual soldering.
• Due to the connector’s compact size, if
an excessive amount of solder is applied
during manual soldering, the solder may
creep up near the contact points, or
solder interference may cause imperfect
contact.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for
printing paste solder.
• To achieve the appropriate soldering
state, make sure that the reflow
temperature, PC board foot pattern,
window size and thickness of metal mask
are recommended condition.
• Note that excess solder on the terminals
prevents complete insertion of the FPC,
and that excess solder on the soldering
terminals prevents the lever from rotating.
Terminal
Paste solder
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature
profile is given in the figure below
Recommended reflow temperature
profile
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Temperature
260°C
230°C
180°C
Peak temperature
Preheating
220°C
200°C
25 sec.
150°C
60 to 120 sec.
70 sec.
Time
• The temperature is measured on the
surface of the PC board near the
connector terminal.
• Certain solder and flux types may cause
serious solder creeping. Solder and flux
characteristics should be taken into
consideration when setting the reflow
soldering conditions.
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive. (Double reflow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise the flux may creep to the
contact parts.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
Do not drop or handle the
connector carelessly. Otherwise, the
terminals may become deformed due
to excessive force or applied
solderability may be during reflow
degrade.
Don’t open/close the lever or insert/
remove an FPC until the connector is
soldered. Forcibly applied external
pressure on the terminals can weaken
the adherence of the terminals to the
molded part or cause the terminals to
lose their evenness. In addition, do
not insert an FPC into the connector
before soldering the connector.
When cutting or bending the PC
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive force.
The soldered areas should not be subjected to force.
Other Notes
When coating the PC board after
soldering the connector (to prevent the
deterioration of insulation), perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
for switching.
Please refer to the latest product
specifications when designing your
product.
PC board foot pattern
ACCTB13E 201204-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
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