Panasonic AYF332335 Fpc connectors (0.3mm pitch) back lock y3b/y3bw sery Datasheet

AYF33
For FPC
FPC connectors
(0.3mm pitch)
Back lock
Y3B/Y3BW
Series
FEATURES
New Y3BW is added.
1. Slim and low profile design (Pitch:
0.3 mm)
Back lock type and the slim body with a
3.15 mm depth (with the lever).
0.9
Y3B
7. Y3BW features advanced
functionality, including a structure to
temporarily hold the FPC and a higher
holding force.
The FPC holding contacts located on
both ends of the connector facilitate
positioning of FPC and further enhance
the FPC holding force.
Structure to lock
notches on both
ends of the
FPC with
holding
contacts
5
3.1
Unit: mm
Y3BW
2. Mechanical design freedom is
achieved with double top and bottom
contacts
Top and bottom double contacts
eliminate the need of using different
connectors (with either top or bottom
contacts) depending on the FPC wiring
conditions.
3. Easy-to-handle back lock structure
4. Man-hours of assembly time can be
reduced by delivering the connectors
with their levers opened.
5. Wiring patterns can be placed
underneath the connector.
6. Ni barrier with high resistance to
solder creepage
RoHS compliant
Applicable
FPC shapes
(1) The inserted FPC can be temporarily
held until the lever is closed.
(2) When the lever is closed, the holding
contacts lock the FPC by its notches,
enhancing the FPC holding force.
APPLICATIONS
Mobile devices, such as cellular
phones, smartphones, digital still
cameras and digital video cameras.
ORDERING INFORMATION
AYF 3
3
5
33: FPC Connector 0.3 mm pitch
(Back lock)
Number of pins (2 digits)
Contact direction
3: Top and bottom double contacts (Y3B)
6: Top and bottom double contacts, lock holding type (Y3BW)
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
ACCTB47E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AYF33
PRODUCT TYPES
Y3B
Height
Number of pins
Part number
0.9 mm
7
8
9
11
13
15
17
21
23
25
27
31
33
35
37
39
45
51
61
AYF330735
AYF330835
AYF330935
AYF331135
AYF331335
AYF331535
AYF331735
AYF332135
AYF332335
AYF332535
AYF332735
AYF333135
AYF333335
AYF333535
AYF333735
AYF333935
AYF334535
AYF335135
AYF336135
Height
Number of pins
Part number
0.9 mm
11
25
51
AYF331165
AYF332565
AYF335165
Packing
Inner carton
Outer carton
5,000 pieces
10,000 pieces
Y3BW
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units.
Samples for mounting check: 50-connector units. Please contact our sales office.
Samples: Small lot orders are possible. Please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Item
Rated current
Rated voltage
Insulation resistance
Specifications
0.2A/pin contact
50V AC/DC
Min. 1,000MΩ (initial)
Breakdown voltage
150V AC for 1 min.
Contact resistance
Mechanical
characteristics
FPC holding force
Ambient temperature
Storage temperature
Conditions
Using 250V DC megger (applied for 1 min.)
Max. 100mΩ
Y3B: Min. 0.13N/pin contacts × pin contacts (initial)
Y3BW: Min. 0.13N/pin contacts × pin contacts +
1.00N (initial)
–55°C to +85°C
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(with FPC mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
Environmental
characteristics
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
H2S resistance
(with FPC mated)
Soldering heat resistance
Lifetime
characteristics
Insertion and removal life
Unit weight
Panasonic Corporation
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
48 hours,
contact resistance max. 100mΩ
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
20 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Reflow soldering
Soldering iron
Repeated insertion and removal: min. 10 sec./time
Y3B: 61 pin contact type: 0.10 g
Y3BW: 51 pin contact type: 0.09 g
Automation Controls Business Division
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ACCTB47E 201303-T
AYF33
2. Material and surface treatment
Part name
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Molded portion
Contact
Surface treatment
—
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Copper alloy
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Y3B
Terminal
coplanarity
0.1
(0.10)
C±0.20
ACCTB47E 201303-T
2.95
(0.30)
(0.10)
(0.40)
(Contact)
B±0.20
Panasonic Corporation
(1.35)
(FPC
insertion
depth)
B
C
3.60
4.20
4.80
5.40
6.00
6.60
7.80
8.40
9.00
9.60
10.80
11.40
12.00
12.60
13.20
15.00
16.80
19.80
1.80
2.40
3.00
3.60
4.20
4.80
6.00
6.60
7.20
7.80
9.00
9.60
10.20
10.80
11.40
13.20
15.00
18.00
1.20
1.80
2.40
3.00
3.60
4.20
5.40
6.00
6.60
7.20
8.40
9.00
9.60
10.20
10.80
12.60
14.40
17.40
Automation Controls Business Division
0.60±0.10 (Terminal pitch)
0.30±0.10 (Contact pitch)
0.60±0.10
(Terminal pitch)
(3.15)
The degree of
terminal flat
0.1
1.80±0.20
(0.10)
(0.10)
1.80±0.20
(Contact) (1.35)
(FPC
insertion
depth)
2.95
industrial.panasonic.com/ac/e/
(1.84)
(3.15)
A
3.90
0.90±0.10
0.90±0.10
0.30±0.10 (Terminal pitch)
0.60±0.10 (Terminal pitch)
Number of
pins/
dimension
7
9
11
13
15
17
21
23
25
27
31
33
35
37
39
45
51
61
(0.40)
0.60±0.10 (Terminal pitch)
CAD Data
(0.30)
A
1.35 (Suction area)
No. of pins: Even number (8 pins)
CAD Data
(1.84)
1.35 (Suction area)
No. of pins: Odd number
AYF33
RECOMMENDED FPC DIMENSIONS
Y3B
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
0.30±0.07
0.60±0.07
Cutting direction*
0.10 max.
*Cut FPC from the copper foil side
0.20±0.02
to the reinforcing plate side.
0.30+0.04
–0.03 (Contact width)
0.60±0.07
0.60±0.02 (Pitch)
No. of pins: Even number (8 pins)
For Top Contacts
B
C
2.40
3.00
3.60
4.20
4.80
5.40
6.60
7.20
7.80
8.40
9.60
10.20
10.80
11.40
12.00
13.80
15.60
18.60
1.80
2.40
3.00
3.60
4.20
4.80
6.00
6.60
7.20
7.80
9.00
9.60
10.20
10.80
11.40
13.20
15.00
18.00
1.20
1.80
2.40
3.00
3.60
4.20
5.40
6.00
6.60
7.20
8.40
9.00
9.60
10.20
10.80
12.60
14.40
17.40
0.10 max.
0.20±0.02
0.60±0.07
0.20±0.03
0.10 max.
0.20±0.02
0.60±0.07
0.60±0.02 (pitch)
2.70±0.05
1.80±0.03
1.80±0.03
0.30±0.07
0.10 max.
0.30 +0.04
−0.03
(Width of contact area)
0.60±0.07
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing board side.
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing board side.
Panasonic Corporation
Automation Controls Business Division
0.20±0.03
3.00±0.50
(Reinforcing board)
0.30±0.07
0.30 +0.04
−0.03
(Width of contact area)
0.30±0.07
0.60±0.02 (pitch)
0.30±0.02 (pitch)
0.30 +0.04
−0.03
(Width of contact area)
2-R
0.2
0
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Conductor exposed area)
2.70±0.05
1.80±0.03
1.80±0.03
3.00±0.50
(Reinforcing board)
0.30 +0.04
−0.03
(Width of contact area)
0.60±0.07
0.60±0.02 (pitch)
A
For Bottom Contacts
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Conductor exposed area)
0.75±0.10
0.65±0.10
0.15 max.
0.30±0.07
0.60±0.02 (pitch)
0.30±0.02 (pitch)
0.10 max.
2-R
0.2
0
0.20±0.03
3.00±0.50
(Reinforcing plate)
0.15 max.
20
0.
R
0.10 max.
0.30+0.04
–0.03 (Contact width)
0.75±0.10
0.65±0.10
0.15 max.
2-
A±0.05
B±0.03
C±0.03
0.60±0.02 (Pitch)
0.30±0.02 (Pitch)
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Exposed part of the conductor)
0.30±0.07
0.65±0.10
0.75±0.10
No. of pins: Odd number
Number of
pins/
dimension
7
9
11
13
15
17
21
23
25
27
31
33
35
37
39
45
51
61
industrial.panasonic.com/ac/e/
ACCTB47E 201303-T
AYF33
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Y3BW
1.35 (Suction area)
CAD Data
A
0.60±0.10 (Contact pitch)
0.30±0.10 (Contact pitch)
0.60±0.10 (Contact pitch)
(3.15)
(1.84)
0.90±0.10
Holding contacts
(The holding contacts cannot be used as conductors.)
Terminal coplanarity
(1.35) (FPC insertion depth)
0.1
(2.95)
(Contact and holding contact)
(0.40)
B±0.20
(0.10)
General tolerance: ±0.3
(0.10)
A
B
C
D
5.40
3.00
2.40
3.60
25
51
9.60
17.40
7.20
15.00
6.60
14.40
7.80
15.60
A
B
C
(0.30)
C±0.20
(0.10)
Number of pins/
dimension
11
D±0.20
RECOMMENDED FPC DIMENSIONS
Y3BW
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
0.20±0.03
3.00±0.50 (Support plates)
.20
.20
R0
1.45±0.10
0.75±0.05
0.15 max.
0
2
0.
R
2-
R0
0.60±0.07
0.65±0.10
0.75±0.10
1.35±0.15
1.45±0.15
1.55±0.15
2.00±0.30
(Exposed part of the conductor)
0.60±0.07
A±0.05
B±0.03
C±0.03
0.60±0.02 (Pitch)
0.30±0.02 (Pitch)
0.30 +0.04
−0.03 (Contact width)
0.10 max.
0.90±0.07
0.45 +0.03
−0.05
0.90±0.07
0.60±0.02 (Pitch)
ACCTB47E 201303-T
Panasonic Corporation
0.10 max.
0.20±0.02
0.30 +0.04
−0.03 (Contact width)
Cutting direction
Cut FPC from the copper foil side
to the reinforcing plate side.
Automation Controls Business Division
Number of pins/
dimension
11
4.20
3.00
2.40
25
51
8.40
16.20
7.20
15.00
6.60
14.40
industrial.panasonic.com/ac/e/
AYF33
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type)
• Specifications for taping
Tape I
(A±0.3)
(A±0.3)
28.40
(B)
(C±1)
Taping reel
Top cover tape
Embossed carrier tape
380 dia.
(2.0)
(4.0)
(8.0)
(1.75)
(2.0)
(4.0)
(1.75)
(8.0)
Leading direction after packaging
(B)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape II
Embossed mounting-hole
Label
1.5
1.5
.1
+0 .0
00
.1
+0 .0
00
dia
dia
.
.
• Y3B Dimension table (Unit: mm)
Number of pins
7 to 17
21 to 45
51, 61
Type of taping
Tape I
Tape I
Tape II
A
16.00
24.00
32.00
B
7.50
11.50
14.20
C
17.40
25.40
33.40
Quantity per reel
5,000
5,000
5,000
A
16.00
24.00
32.00
B
7.50
11.50
14.20
C
17.40
25.40
33.40
Quantity per reel
5,000
5,000
5,000
• Y3BW Dimension table (Unit: mm)
Number of pins
11
25
51
Type of taping
Tape I
Tape I
Tape II
• Connector orientation with respect to embossed tape feeding direction
Type
Y3B
Direction
of tape progress
Y3BW
NOTES
• Y3B
No. of pins: Odd number
No. of pins: Even number (8 pins)
0.60±0.03
0.23±0.03
0.23±0.03
0.60±0.03
0.60±0.03
0.23±0.03
0.23±0.03
0.60±0.03
Metal mask thickness: When 120µm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.22±0.01
0.60±0.01
Automation Controls Business Division
0.60±0.01
0.22±0.01
0.34±0.01
0.44±0.01
3.15±0.01
Recommended metal mask pattern
Metal mask thickness: When 120µm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.34±0.01
0.44±0.01
3.15±0.01
Recommended metal mask pattern
0.60±0.01
0.22±0.01
Panasonic Corporation
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.34±0.03
0.44±0.03
3.15±0.03
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.34±0.03
0.44±0.03
3.15±0.03
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.3 mm or 0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.22±0.01
0.60±0.01
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ACCTB47E 201303-T
AYF33
• Y3BW
0.60±0.03
0.23±0.03
0.30±0.03
: Insulation
Please refer to the latest product
specifications when designing your
product.
0.34±0.03
0.44±0.03
3.15±0.03
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.23±0.03
0.60±0.03
Recommended metal mask pattern
0.34±0.01
0.44±0.01
3.15±0.01
Metal mask thickness: When 120µm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.60±0.01
0.22±0.01
0.22±0.01
0.60±0.01
ACCTB47E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
Notes on Using FPC Connectors
■ PC board design
Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
■ FPC and equipment design
• Design the FPC based with recommended dimensions to
ensure the required connector performance.
• When using back lock type, secure enough space for closing
the lever and for open-close operation of the lever.
• Make sure that connector positioning and FPC length are
appropriate to prevent diagonal insertion of the FPC.
Due to the FPC size, weight, or the reaction force of the routed
FPC, FPC may be removed. Carefully check the equipment
design.
Take required measures to prevent the FPC from being removed
due to a fall, vibration, or other impact.
(Y3BW/Y5BW)
■ The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the contacts,
and the shape of the soldered portions is the same as that of the
other contacts.
Use caution to ensure connect identification.
(Y3BL)
■ Soldering terminal structure
Since soldering terminals touch FPC, note that the short circuit
may occur when the metal parts exposed on side of FPC.
■ Connector mounting
Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
■ Soldering
1) Manual soldering
• Due to the connector’s compact size, if an excessive amount of
solder is applied during manual soldering, the solder may creep
up and flux wicking near the contact points, or solder
interference may cause contact failure.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and cleans off any flux solder use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To achieve the appropriate soldering state, make sure that the
reflow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
• Note that excess solder on the terminals prevents complete
insertion of the FPC, and causes flux climbing up.
• A screen thickness of 120µm is recommended during cream
solder printing.
• Consult us when using a screen-printing thickness other than
that recommended.
• Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
Panasonic Corporation
• The recommended reflow temperature profile is given in the
figure below.
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Temperature
260°C
230°C
180°C
Peak temperature
Preheating
220°C
200°C
25 sec.
150°C
60 to 120 sec.
70 sec.
Time
• The temperature is measured on the surface of the PC board
near the connector terminals.
• Depending on reflow condition, poor contact may occur by
solder and flux wicking.
Please set the reflow conditions that considering the
characteristics of solder and flux. Also please make
consideration in setting the reflow times and O2 concentration to
prevent poor contact by solder and flux wicking.
• When performing reflow soldering on the back of the PC board
after reflow soldering the connector, secure the connector using,
for example, an adhesive.
(Double reflow soldering on the same side is possible.)
Do not touch the lever or apply any load to the lever until the
second reflow soldering. Otherwise, contact deflection occurs
and the terminals may be deformed by reflow heating.
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use a soldering iron with a
flat tip.
Do not add flux, otherwise the flux may creep to the contact
parts.
When adding the solder for reworking, do not add an excessive
solder. Otherwise, solder and flux may creep up and solder
bridges may occur.
• Use a soldering iron whose tip temperature is within the
temperature range specified in the specifications.
■ Do not drop or handle the connector carelessly.
Otherwise, the terminals may become deformed due to
excessive force or applied solderability may be during
reflow degrade.
■ Do not open/close the lever or insert/remove an FPC until
the connector is soldered. Forcibly applied external
pressure on the terminals can weaken the adherence of the
terminals to the molded part or cause the terminals to lose
their evenness. In addition, do not insert an FPC into the
connector before soldering the connector.
■ When cutting or bending the PC board after mounting the
connector, be careful that the soldered sections are
subjected to excessive force.
Automation Controls Business Division
The soldered areas should not be subjected to force.
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ACCTB13E 201303-T
Notes on Using FPC Connectors
■ Precautions for insertion/removal of FPC
<Front-Lock>
• To open the lever, hold its center and pull it up. An uneven load
applied to the lever on one side may deform and break the lever.
Do not apply an excessive load to the lever in the opening
direction, otherwise, the terminals may be deformed.
• Don’t further apply an excessive load to the fully opened lever;
otherwise, the lever may be deformed.
• Fully open the lever to insert an FPC.
• Since this product connects at the bottom, please insert the
FPC so that its electrode plane is facing the board to which it will
be mounted. Do not insert the FPC in the reverse direction of the
contact section; otherwise, operation failures or malfunctions
may be caused.
<Back-Lock>
• Avoid touching the lever (applying any external force) until an
FPC is inserted.
Do not open/close the lever without an FPC inserted. Failure to
follow this instruction will cause the contacts to warp, leading to
the contact tips to interfere with the insertion of an FPC,
deforming the terminals. Failure to follow this instruction may
cause the lever to be removed, terminals to be deformed, and/or
the FPC insertion force to increase.
Without an FPC inserted
(140°)
(Y3FT)
• This product has a structure to position an inserted FPC using
the FPC tabs.
Therefore, insert an FPC at an angle to the board. If the FPC is
inserted in the direction parallel to the board, the molded
positioning parts block the FPC, leading to incomplete insertion.
Do not insert the FPC at an excessive angle to the board.
Otherwise, it may cause the deformation of metal parts, FPC
insertion failures, and FPC circuit breakages.
FPC
FPC positioning part
(Y3F)
• Completely insert the FPC horizontally. Do not insert the FPC
at an excessive angle to the board. Otherwise, it may cause the
deformation of metal parts, FPC insertion failures, and FPC
circuit breakages.
• The FPC insertion section is on the opposite side of the lever.
Be careful not to make a mistake in the FPC insertion position or
the lever opening/closing position. Otherwise, a contact failure or
connector breakage may occur.
• Do not insert an FPC upside down. Inserting an FPC in a
direction opposite to that you intended may cause an operation
failure or malfunction.
• Insert an FPC with the lever opened at right angle, that is, in
the factory default position.
• Completely insert the FPC horizontally. An FPC inserted at an
excessive angle to the board may cause the deformation of
metal parts, FPC insertion failures, and FPC circuit breakages.
• Insert the FPC to the full depth of the connector without
altering the angle.
• Insert the FPC into the connector after checking the position of
FPC insertion slot and FPC. Do not insert the FPC without
positioning the FPC and connector. Otherwise, it may cause
connector breakages. When it is hard to insert the FPC, do not
insert the FPC on that condition. Confirm the FPC and
connector positioning.
• Do not apply an excessive load to the lever in the opening
direction beyond its open position; otherwise, the lever may be
deformed or removed.
• Do not apply an excessive load to the lever in a direction
perpendicular to the lever rotation axis or in the lever opening
direction; otherwise, the terminals may be deformed, and the
lever may be removed.
FPC
• Insert the FPC to the full depth of the connector without
altering the angle.
• When closing the lever, carefully use the tip of your finger to
push the entire lever or both sides of it. If pressure to the lever is
applied unevenly, IE: only the edge, it may deform or break the
FPC. Make sure that the lever is closed completely. Not doing so
will cause a faulty connection.
• Avoid applying an excessive load to the top of the lever during
or after closing the lever. Otherwise, the terminals may be
deformed.
• Remove the FPC at an angle with the lever fully opened. If the
lever is closed, or if the FPC is forcedly pulled into a direction
parallel to the board, the molded part may break.
ACCTB13E 201303-T
Panasonic Corporation
• To close the lever, turn down the lever by pressing the entire
lever or both sides of the lever with fingers tips. And close the
lever completely. Be careful not to apply partial load to the lever
that may cause its deformation or destruction.
Close the lever completely to prevent contact failure.
• If pressure to the lever is applied unevenly, it may deform or
break the FPC. Make sure that the lever is closed completely.
Not doing so will cause a faulty connection.
• Avoid applying an excessive load to the top of the lever during
or after closing the lever. Otherwise, the terminals may be
deformed.
• When opening the lever to remove the FPC, ensure that the
lever will not go over the initial position; otherwise, the lever may
be removed.
Automation Controls Business Division
industrial.panasonic.com/ac/e/
Notes on Using FPC Connectors
• Remove the FPC at parallel with the lever fully opened. If the
lever is closed, or if the FPC is forcedly pulled, the product or
FPC may break.
• If a lever is accidentally detached during the handling of a
connector, do not use the connector any longer.
■ After an FPC is inserted, carefully handle it so as not to
apply excessive stress to the base of the FPC. When using
FPC with a bent condition, please pay attention to
precautions below; otherwise, in some conditions it may
cause conduction failure, connector breakage, unlocking
lever or FPC disconnection.
• Design so that a load is not applied to connector directly by
FPC bending.
• Avoid sharp FPC bending at the root of FPC insertion part.
• Design so that a load is not applied to the part of FPC bending.
• Fix the FPC if there might be a load on FPC when using the
FPC with cutout, do not apply a bending load to the cutout part
of FPC. Otherwise, it may cause FPC disconnection and
deformation since the cutout part of FPC is subjected to bending
stress.
FPC cutout part
■ Other cautions
• When coating the PC board after soldering the connector (to
prevent the deterioration of insulation), perform the coating in
such a way so that the coating does not get on the connector.
• The connectors are not meant to be used for switching.
• There is no problem on the product quality though the swelling
and the black spot, etc. might be generated in the molding parts.
Please refer to the latest product specifications when
designing your product.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB13E 201303-T
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